Table Of Content

Qualcomm Technologies, Inc. WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) 80-P0061-1 Rev. D October 5, 2015 Confidential and Proprietary – Qualcomm Technologies, Inc. © 2015 Qualcomm Technologies, Inc. All rights reserved. NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: [email protected]. Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies, Inc. or its affiliated companies without the express approval of Qualcomm Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Technologies, Inc. For additional information or to submit technical questions go to https://createpoint.qti.qualcomm.com Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners. This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited. Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego, CA 92121 U.S.A. Revision history Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions. Revision Date Description A April 10, 2015 Initial release B April 27, 2015  Updated Figure4-1, 39B WLPSP (2.36 × 2.36 × 0.54 mm) outline drawing  Updated source codes in Table4-1, WTR3950 device marking line definitions C May 2015  Added QFE2340 to Section 1.2, WTR3950 introduction  Update revision ID in Table 1-3, Summary of WTR3950 features  Added content to Chapter 3, Electrical specifications (not denoted by change bars)  Added ES sample information to Table 4-2, Device identification code/ordering information details  Updated document reference in Chapter 5, Carrier, storage, and handling information  Updated Section 6.1, RoHS compliance  Updated Figure 6-3, WTR3950 keep-out areas (top view) D October 2015  Table1-1, Primary WTR3950 documentation: Added schematic reference (80-P0061-42)  Table3-5, LTE-U Rx performance specifications:  Removed references to 10 MHz  Updated table to latest specifications for WTR3950  Table4-2, Device identification code/ordering information details: Added CS information  Chapter7, Part reliability: Added information 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 3 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Documentation overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2 WTR3950 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.3 WTR3950 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1.3.1 New features introduced by the WTR3950 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1.3.2 Summary of WTR3950 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1.4 Terms and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.1 I/O parameter definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3 Software-assigned RF ports for different configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.2 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3 Power-supply sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 Digital logic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.5 Support functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.5.1 38.4 MHz XO input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.6 RF receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.6.1 LTE-U receiver performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4 Mechanical information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.1 Device physical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.2 Part marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.2.1 Specification compliant devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.3 Device ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.3.1 Specification compliant devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.3.2 Daisy chain devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.4 Device moisture-sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5 Carrier, storage, and handling information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.1 Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 4 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) Contents 5.1.1 Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.2 Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.2.1 Bagged storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.2.2 Out-of-bag duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.3 Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.3.1 Baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.3.2 Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.4 Barcode label and packing for shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6 PCB mounting guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.2 SMT parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.2.1 Land pad and stencil design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.2.2 Keep-out areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 6.2.3 Reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 6.2.4 SMT peak package body temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 6.2.5 SMT process verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 6.3 Daisy-chain components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 6.4 Board-level reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7 Part reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.1 Reliability qualifications summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.2 Qualification sample description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 5 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) Contents Figures Figure1-1 WTR3950 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure2-1 WTR3950 pin assignments – top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure4-1 39B WLPSP (2.36 × 2.36 × 0.54 mm) outline drawing . . . . . . . . . . . . . . . . . . . . . . 24 Figure4-2 WTR3950 device marking (top view, not to scale) . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure4-3 Device identification code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure5-1 Carrier tape drawing with part orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure5-2 Tape handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure6-1 Stencil printing aperture area ratio (AR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure6-2 Acceptable solder paste geometries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure6-3 WTR3950 keep-out areas (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure6-4 QTI typical SMT reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 6 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) Contents Tables Table1-1 Primary WTR3950 documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table1-2 Summary of supported air interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table1-3 Summary of WTR3950 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table1-4 Terms and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table2-1 I/O description (pad type) parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table2-2 Receiver RF pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table2-3 Receiver baseband pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table2-4 Support functions pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table2-5 Power pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table2-6 Ground pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table2-7 Do not connect pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table3-1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table3-2 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table3-3 Digital I/O characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table3-4 XO input performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table3-5 LTE-U Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table4-1 WTR3950 device marking line definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table4-2 Device identification code/ordering information details . . . . . . . . . . . . . . . . . . . . . . . 26 Table4-3 Source configuration code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table4-4 MSL ratings summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table6-1 QTI typical SMT reflow profile conditions (for reference only) . . . . . . . . . . . . . . . . 34 Table7-1 Silicon reliability results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table7-2 Package reliability results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 7 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 1 Introduction 1.1 Documentation overview Technical information for the WTR3950 wafer-level receiver is primarily covered by the documents listed in Table1-1. All documents should be studied for a thorough understanding of the device and its applications. Released WTR3950 documents are available from the CDMATech Support website at https://createpoint.qti.qualcomm.com. Table1-1 Primary WTR3950 documentation Document Title/description number 80-P0061-1 WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) (this document) Provides all WTR3950 electrical specifications and mechanical information. Additional material includes pin assignments; shipping, storage, and handling instructions; PCB mounting guidelines; and part reliability. This document can be used by company purchasing departments to facilitate procurement. 80-P0061-4 WTR3950 Wafer-level RF Receiver Device Revision Guide Provides a history of WTR3950 revisions, explains how to identify the various device revisions, and discusses known issues (or bugs) for each revision and how to work around them. 80-P0061-5A WTR3950 Wafer-level RF Receiver Design Guidelines/Training Slides  Detailed functional and interface descriptions for the WTR3950 device  Key design guidelines are illustrated and explained, including:  Technology overview  DC power distribution  Interface schematic details  PCB layout guidelines  External-component recommendations  Ground and shielding recommendations 80-P0061-42 WTR3925 + WTR4905 + WTR3950 + Qualcomm RF360 with QFE2340, QFE4345, and QFE4335 3DL CA with LTE-U Design Example Provides a design example using Qualcomm Technologies, Inc. (QTI) 4K power amplifiers. 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 8 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) Introduction This WTR3950 device specification is organized as follows: Chapter1 Provides an overview of the WTR3950 documentation, gives a high-level functional description of the device, lists the device features, and defines marking conventions, terms, and acronyms used throughout this document. Chapter2 Defines the device pin assignments. Chapter3 Defines the device electrical performance specifications, including absolute maximum ratings and recommended operating conditions. Chapter4 Provides IC mechanical information, including dimensions, markings, ordering information, moisture sensitivity, and thermal characteristics. Chapter5 Discusses shipping, storage, and handling of the WTR3950. Chapter6 Presents procedures and specifications for mounting the WTR3950 onto printed circuit boards (PCBs). Chapter7 Presents WTR3950 reliability data, including a definition of the qualification samples and a summary of qualification test results. 1.2 WTR3950 introduction The WTR3950 is a highly integrated RF CMOS receiver IC. When supplemented by the WTR3925 transceiver, it supports LTE-U carrier aggregation in the 5 GHz ISM band. The first Qualcomm Technologies, Inc. (QTI) chipset to use the WTR3925/WTR3950 combination includes:  MSM8996 chipset MSM8996 IC  PM8994 and PMI8994 power management IC  PMK8001 clock generation and distribution IC  QTI RF front-end devices: QFE3320, QFE2340, QFE43xx, QFE3100, QFE10xx, and  QFE2550  MDM9x45 chipset: MDM9x45 IC  PMD9645 power management IC  PMK8001 clock generation and distribution IC  QTI RF front-end devices: QFE3320, QFE2340, QFE43xx, QFE3100, QFE10xx, and  QFE2550 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 9 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR3950 Wafer-level RF Receiver Device Specification (Advance Information) Introduction A high-level block diagram of the WTR3950 device is shown in Figure1-1. VDDs RxLO LDO_CAP LDOs& Supportcircuits circuits f_ref biascircuits (shownasindividual blocks) ef Clock XO_IN RFFE_CLK _r circuits Statusand f MIPI_RFFE RFFE_DATA control GNDs PRX_BBI LPF PRX_IN Quadrature downconverter PRX_BBQ LPF RFreceivers DRX_BBI LPF DRX_IN Quadrature downconverter DRX_BBQ LPF WTR3950 Figure1-1 WTR3950 functional block diagram The WTR3950 device integrates RF receive features into a 2.36 × 2.36 × 0.54 mm package to simplify handset design, minimize parts count, and reduce DC power consumption. Its wide area network (WAN) RF receiver functions support the air interface modes and bands summarized in Table1-2. Table1-2 Summary of supported air interfaces Band name LTE-U UNII-1 252 UNII-3 255 NOTE A chipset’s supported air interface features depend upon the modem IC. For example, the MDM9630 chipset supports GSM, 3GPP, and 3GPP2, whereas the MDM9230 chipset supports GSM and 3GPP (the MDM9230 chipset does not support CDMA 1X and its variants). The chipset’s operating bands are defined by the RF front-end and the WTR3925/WTR3950 transceiver IC combination. As seen in Figure1-1, the WTR3950 is divided into two major functional blocks: RF receivers and support circuits. Most of the information contained in this device specification is organized accordingly – including the circuit groupings within its functional block diagram (Figure1-1), pin descriptions (Chapter2), and detailed electrical specifications (Chapter3). Refer to WTR3950 Wafer-level Design Guidelines/Training Slides (80-P0061-5A) for more detailed descriptions of each RFIC function and interface, plus guidelines for implementing the design. 80-P0061-1 Rev. D Confidential and Proprietary – Qualcomm Technologies, Inc. 10 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION