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ADS1118
SBAS457E–OCTOBER2010–REVISEDOCTOBER2015
ADS1118 Ultrasmall, Low-Power, SPI™-Compatible, 16-Bit
Analog-to-Digital Converter with Internal Reference and Temperature Sensor
1 Features 3 Description
• UltrasmallX2QFNPackage: The ADS1118 is a precision, low power, 16-bit
1 analog-to-digital converter (ADC) that provides all
2mm×1.5mm ×0.4mm
features necessary to measure the most common
• WideSupplyRange:2Vto5.5V
sensor signals in an ultra-small, leadless X2QFN-10
• LowCurrentConsumption: package or a VSSOP-10 package. The ADS1118
– ContinuousMode:Only150 μA integrates a programmable gain amplifier (PGA),
voltage reference, oscillator and high-accuracy
– Single-ShotMode:AutomaticPowerDown
temperature sensor. These features, along with a
• ProgrammableDataRate: wide power supply range from 2 V to 5.5 V, make the
8SPS to860SPS ADS1118 ideally suited for power- and space-
• Single-CycleSettling constrained,sensor-measurementapplications.
• InternalLow-DriftVoltageReference The ADS1118 can perform conversions at data rates
upto860samplespersecond(SPS). ThePGA offers
• InternalTemperatureSensor:
input ranges from ±256 mV to ±6.144 V, allowing
0.5°C(Maximum)Error:0°Cto70°C
both large and small signals to be measured with
• InternalOscillator
high resolution. An input multiplexer (MUX) allows to
• InternalPGA measure two differential or four single-ended inputs.
• FourSingle-EndedorTwoDifferentialInputs The high-accuracy temperature sensor can be used
for system-level temperature monitoring or cold-
junctioncompensationfor thermocouples.
2 Applications
The ADS1118 operates either in continuous-
• TemperatureMeasurement:
conversion mode, or in a single-shot mode that
– ThermocoupleMeasurement
automatically powers down after a conversion.
– Cold-JunctionCompensation Single-shot mode significantly reduces current
consumption during idle periods. Data are transferred
– ThermistorMeasurement
through a serial peripheral interface (SPI™). The
• PortableInstrumentation
ADS1118isspecifiedfrom–40°Cto+125°C.
• FactoryAutomationandProcessControls
DeviceInformation(1)
PARTNUMBER PACKAGE BODYSIZE(NOM)
X2QFN(10) 1.50mm×2.00mm
ADS1118
VSSOP(10) 3.00mm×3.00mm
(1) For all available packages, see the orderable addendum at
theendofthedatasheet.
K-TypeThermocoupleMeasurement
UsingIntegrated TemperatureSensorforCold-JunctionCompensation
3.3 V
3.3 V 0.1 (cid:29)F
AIN0 VDD
ADS1118
Voltage
AIN1 Reference
SCLK
16-bit Digital Filter CS
Mux PGA ß(cid:8)(cid:3) and
3.3 V ADC Interface DOUT/DRDY
DIN
AIN2
Temperature
Oscillator
AIN3 Sensor
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.
ADS1118
SBAS457E–OCTOBER2010–REVISEDOCTOBER2015 www.ti.com
Table of Contents
1 Features.................................................................. 1 9.3 FeatureDescription.................................................17
2 Applications........................................................... 1 9.4 DeviceFunctionalModes........................................21
3 Description............................................................. 1 9.5 Programming...........................................................22
9.6 RegisterMaps.........................................................25
4 RevisionHistory..................................................... 2
10 ApplicationandImplementation........................ 27
5 DeviceComparisonTable..................................... 4
10.1 ApplicationInformation..........................................27
6 PinConfigurationandFunctions......................... 4
10.2 TypicalApplication ...............................................32
7 Specifications......................................................... 5
11 PowerSupplyRecommendations..................... 35
7.1 AbsoluteMaximumRatings......................................5
11.1 Power-SupplySequencing....................................35
7.2 ESDRatings..............................................................5
11.2 Power-SupplyDecoupling.....................................35
7.3 RecommendedOperatingConditions.......................5
12 Layout................................................................... 36
7.4 ThermalInformation..................................................5
12.1 LayoutGuidelines.................................................36
7.5 ElectricalCharacteristics...........................................6
12.2 LayoutExample....................................................37
7.6 TimingRequirements:SerialInterface......................8
13 DeviceandDocumentationSupport................. 38
7.7 SwitchingCharacteristics:SerialInterface................8
7.8 TypicalCharacteristics..............................................9 13.1 DocumentationSupport........................................38
13.2 CommunityResource............................................38
8 ParameterMeasurementInformation................15
13.3 Trademarks...........................................................38
8.1 NoisePerformance.................................................15
13.4 ElectrostaticDischargeCaution............................38
9 DetailedDescription............................................ 16
13.5 Glossary................................................................38
9.1 Overview.................................................................16
14 Mechanical,Packaging,andOrderable
9.2 FunctionalBlockDiagram.......................................16
Information........................................................... 38
4 Revision History
NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion.
ChangesfromRevisionD(October2013)toRevisionE Page
• AddedESDRatingstable,FeatureDescriptionsection,NoisePerformancesection,DeviceFunctionalModes
section,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device
andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1
• Changedtitle,Descriptionsection,Featuressection,andblockdiagramonfrontpage....................................................... 1
• ChangedtitlefromProductFamilytoDeviceComparisonTableanddeletedPackageDesignatorcolumn........................4
• UpdateddescriptionsandchangednameofI/OcolumninPinConfigurationsandFunctionstable.................................... 4
• ChangeddigitalinputvoltagerangeandaddedminimumspecificationforT inAbsoluteMaximumRatingstable............5
J
• AddedDifferentialinputimpedancespecificationinElectricalCharacteristics...................................................................... 6
• ChangedConditionstatementinTimingRequirements:SerialInterface ............................................................................. 8
• Movedt ,t ,andt parametersfromTimingRequirementstoSwitchingCharacteristics ................................ 8
CSDOD DOPD CSDOZ
• Movedt andt valuesfromMINcolumntoMAXcolumn....................................................................................... 8
CSDOD CSDOZ
• DeletedNoisevsInputSignal,NoisevsSupplyVoltage,andNoisevsInputSignalplots................................................... 9
• UpdatedOverviewsectionanddeleted"Gain=2/3,1,2,4,8,or16"fromFunctionalBlockDiagram ............................. 16
• UpdatedAnalogInputssection............................................................................................................................................. 18
• UpdatedFull-ScaleRange(FSR)andLSBSizesection..................................................................................................... 19
• UpdatedResetandPowerUpsection................................................................................................................................. 21
• Updated32-BitDataTransmissionCyclesection................................................................................................................ 24
• UpdatedRegisterMapssection........................................................................................................................................... 25
• UpdatedApplicationInformationsection.............................................................................................................................. 27
• UpdatedFigure48................................................................................................................................................................ 30
• DeletedThermocoupleMeasurementWithColdJunctionTemperaturesection,andmovedFigure50toTypical
Applicationsection................................................................................................................................................................ 32
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ChangesfromRevisionC(February2013)toRevisionD Page
• Deleteddevicegraphic........................................................................................................................................................... 1
• Changedbit1toNOP0inFigure44.................................................................................................................................... 25
• ChangedNOPbitdescriptioninFigure44:changesbits[2:0]tobits[2:1]andchangedNOPtoNOP[1:0]........................ 26
ChangesfromRevisionB(August2012)toRevisionC Page
• Changeddocumenttocurrentstandards............................................................................................................................... 1
• ChangedSingle-ShotModesub-bulletinLowCurrentConsumptionFeaturesbullet........................................................... 1
• ChangedInternalTemperatureSensorFeaturesbullet......................................................................................................... 1
• ChangedDescriptionsection.................................................................................................................................................. 1
• ChangedProductFamilytable............................................................................................................................................... 4
• ChangedFunctioncolumnnameinPinDescriptionstable.................................................................................................... 4
• ChangedAnalogInput,Full-scaleinputvoltagerangeparameterrowinElectricalCharacteristicstable............................. 5
• Changedfootnotes1and2inElectricalCharacteristicstable............................................................................................... 5
• ChangedconditionsforElectricalCharacteristicstable......................................................................................................... 6
• ChangedSystemPerformance,IntegralnonlinearityandGainErrortestconditionsinElectricalCharacteristicstable.......6
• ChangedfirsttwoTemperatureSensor,TemperaturesensoraccuracyparametertestconditionsinElectrical
Characteristicstable............................................................................................................................................................... 6
• ChangedPower-SupplyRequirements,SupplycurrentparametertestconditionsinElectricalCharacteristicstable..........7
• Changedfootnote3ofTimingRequirements:SerialInterfaceTimingtable.......................................................................... 8
• UpdatedFigure3.................................................................................................................................................................... 9
• UpdatedFigure9.................................................................................................................................................................... 9
• ChangedtitleofFigure11toFigure14.................................................................................................................................. 9
• UpdatedFigure15andFigure33........................................................................................................................................ 10
• ChangedconditionsinFigure21toFigure25..................................................................................................................... 11
• UpdatedFigure20................................................................................................................................................................ 12
• ChangedcommentsinFigure27toFigure31..................................................................................................................... 12
• ChangedOverviewsection................................................................................................................................................... 16
• UpdatedMultiplexersection................................................................................................................................................. 17
• ChangedFull-ScaleInputsection......................................................................................................................................... 19
• ChangedVoltageReferencesection.................................................................................................................................... 19
• ChangedOscillatorsection................................................................................................................................................... 19
• AddedmultiplicationpointstoexampleequationsinConvertingfromDigitalCodestoTemperaturesection....................20
• ChangedSerialInterface,ChipSelect,SerialClock,DataInput,andDataOutputandDataReadysections...................22
• ChangedDataRetrievalsection........................................................................................................................................... 23
• ChangedRegisterssection.................................................................................................................................................. 25
• ChangedAliasing,ResetandPowerUp,OperatingModes,andDutyCyclingforLowPowersections............................ 28
• UpdatedFigure50................................................................................................................................................................ 32
ChangesfromRevisionA(July2011)toRevisionB Page
• Added(VSSOP)totitlesofFigure20toFigure25.............................................................................................................. 12
• AddedFigure26toFigure31............................................................................................................................................... 13
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5 Device Comparison Table
MAXIMUMSAMPLE INPUTCHANNELS
RESOLUTION SPECIAL
DEVICE RATE Differential PGA INTERFACE
(Bits) FEATURES
(SPS) (Single-Ended)
ADS1118 16 860 2(4) Yes SPI Temperaturesensor
ADS1018 12 3300 2(4) Yes SPI Temperaturesensor
ADS1115 16 860 2(4) Yes I2C Comparator
ADS1114 16 860 1(1) Yes I2C Comparator
ADS1113 16 860 1(1) No I2C None
ADS1015 12 3300 2(4) Yes I2C Comparator
ADS1014 12 3300 1(1) Yes I2C Comparator
ADS1013 12 3300 1(1) No I2C None
6 Pin Configuration and Functions
RUGPackage DGSPackage
10-PinX2QFN 10-PinVSSOP
TopView TopView
DIN DIN
10
SCLK 1 10 DIN
DOUT/
SCLK 1 9
DRDY DOUT/
CS 2 9
CS 2 8 VDD DRDY
GND 3 8 VDD
GND 3 7 AIN3
AIN0 4 7 AIN3
AIN0 4 6 AIN2
AIN1 5 6 AIN2
5
AIN1 AIN1
PinFunctions
PIN
TYPE DESCRIPTION
NO. NAME
1 SCLK Digitalinput Serialclockinput
2 CS Digitalinput Chipselect;activelow.ConnecttoGNDifnotused.
3 GND Supply Ground
4 AIN0 Analoginput Analoginput0.LeaveunconnectedortietoVDDifnotused.
5 AIN1 Analoginput Analoginput1.LeaveunconnectedortietoVDDifnotused.
6 AIN2 Analoginput Analoginput2.LeaveunconnectedortietoVDDifnotused.
7 AIN3 Analoginput Analoginput3.LeaveunconnectedortietoVDDifnotused.
8 VDD Supply Powersupply.Connecta100-nFpowersupplydecouplingcapacitortoGND.
9 DOUT/DRDY Digitaloutput Serialdataoutputcombinedwithdataready;activelow
10 DIN Digitalinput Serialdatainput
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7 Specifications
7.1 Absolute Maximum Ratings
overoperatingambienttemperaturerange(unlessotherwisenoted)(1)
MIN MAX UNIT
Power-supplyvoltage VDDtoGND –0.3 5.5 V
Analoginputvoltage AIN0,AIN1,AIN2,AIN3 GND–0.3 VDD+0.3 V
Digitalinputvoltage DIN,DOUT/DRDY,SCLK,CS GND–0.3 VDD+0.3 V
Inputcurrent,continuous Anypinexceptpowersupplypins –10 10 mA
Junction,T –40 150
J
Temperature °C
Storage,T –60 150
stg
(1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings
only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended
OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.
7.2 ESD Ratings
VALUE UNIT
Electrostatic Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±4000
V V
(ESD) discharge Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±1000
(1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.
(2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.
7.3 Recommended Operating Conditions
overoperatingambienttemperaturerange(unlessotherwisenoted)
MIN NOM MAX UNIT
POWERSUPPLY
VDD Powersupply VDDtoGND 2 5.5 V
ANALOGINPUTS(1)
FSR Full-scaleinputvoltagerange(2) V =V -V SeeTable3
IN (AINP) (AINN)
V Absoluteinputvoltage GND VDD V
(AINx)
DIGITALINPUTS
Inputvoltage GND VDD V
TEMPERATURERANGE
T Operatingambienttemperature –40 125 °C
A
(1) AINPandAINNdenotetheselectedpositiveandnegativeinputs.AINxdenotesoneofthefouravailableanaloginputs.
(2) Thisparameterexpressesthefull-scalerangeoftheADCscaling.NomorethanVDD+0.3Vor5.5V(whicheverissmaller)mustbe
appliedtothisdevice.
7.4 Thermal Information
ADS1118
THERMALMETRIC(1) DGS(VSSOP) RUG(X2QFN) UNIT
10PINS 10PINS
R Junction-to-ambientthermalresistance 186.8 245.2 °C/W
θJA
R Junction-to-case(top)thermalresistance 51.5 69.3 °C/W
θJC(top)
R Junction-to-boardthermalresistance 108.4 172 °C/W
θJB
ψ Junction-to-topcharacterizationparameter 2.7 8.2 °C/W
JT
ψ Junction-to-boardcharacterizationparameter 106.5 170.8 °C/W
JB
R Junction-to-case(bottom)thermalresistance n/a n/a °C/W
θJC(bot)
(1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication
report,SPRA953.
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7.5 Electrical Characteristics
MaximumandminimumspecificationsapplyfromT =–40°Cto+125°C.TypicalspecificationsareatT =25°C.
A A
AllspecificationsareatVDD=3.3V,datarate=8SPS,andfull-scalerange(FSR)=±2.048V(unlessotherwisenoted).
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
ANALOGINPUTS
FSR=±6.144V(1) 8
FSR=±4.096V(1),FSR=±2.048V 6
Common-modeinputimpedance MΩ
FSR=±1.024V 3
FSR=±0.512V,FSR=±0.256V 100
FSR=±6.144V(1) 22
FSR=±4.096V(1) 15
MΩ
Differentialinputimpedance FSR=±2.048V 4.9
FSR=±1.024V 2.4
FSR=±0.512V,FSR=±0.256V 710 kΩ
SYSTEMPERFORMANCE
Resolution(Nomissingcodes) 16 Bits
DR Datarate 8,16,32,64,128,250,475,860 SPS
Dataratevariation Alldatarates –10% 10%
Outputnoise SeeNoisePerformancesection
INL Integralnonlinearity DR=8SPS,FSR=±2.048V(2) 1 LSB
FSR=±2.048V,differentialinputs ±0.1 ±2
Offseterror LSB
FSR=±2.048V,single-endedinputs ±0.25
Offsetdrift FSR=±2.048V 0.002 LSB/°C
Offsetpower-supplyrejection FSR=±2.048V,DCsupplyvariation 0.2 LSB/V
Offsetchannelmatch Matchbetweenanytwoinputs 0.6 LSB
Gainerror(3) FSR=±2.048V,T =25°C 0.01% 0.15%
A
FSR=±0.256V 7
Gaindrift(3)(4) FSR=±2.048V 5 40 ppm/°C
FSR=±6.144V(1) 5
Gainpower-supplyrejection 10 ppm/V
Gainmatch(3) Matchbetweenanytwogains 0.01% 0.1%
Gainchannelmatch Matchbetweenanytwoinputs 0.01% 0.1%
AtDC,FSR=±0.256V 105
AtDC,FSR=±2.048V 100
CMRR Common-moderejectionratio AtDC,FSR=±6.144V(1) 90 dB
f =50Hz,DR=860SPS 105
CM
f =60Hz,DR=860SPS 105
CM
TEMPERATURESENSOR
Temperaturerange –40 125 °C
Temperatureresolution 0.03125 °C/LSB
T =0°Cto70°C 0.2 ±0.5
A
°C
Accuracy T =–40°Cto+125°C 0.4 ±1
A
vssupply 0.03125 ±0.25 °C/V
(1) Thisparameterexpressesthefull-scalerangeoftheADCscaling.NomorethanVDD+0.3Vor5.5V(whicheverissmaller)mustbe
appliedtothisdevice.
(2) Best-fitINL;covers99%offull-scale.
(3) IncludesallerrorsfromonboardPGAandvoltagereference.
(4) Maximumvaluespecifiedbycharacterization.
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Electrical Characteristics (continued)
MaximumandminimumspecificationsapplyfromT =–40°Cto+125°C.TypicalspecificationsareatT =25°C.
A A
AllspecificationsareatVDD=3.3V,datarate=8SPS,andfull-scalerange(FSR)=±2.048V(unlessotherwisenoted).
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
DIGITALINPUTS/OUTPUTS
V High-levelinputvoltage 0.7VDD VDD V
IH
V Low-levelinputvoltage GND 0.2VDD V
IL
V High-leveloutputvoltage I =1mA 0.8VDD V
OH OH
V Low-leveloutputvoltage I =1mA GND 0.2VDD V
OL OL
I Inputleakage,high V =5.5V –10 10 μA
H IH
I Inputleakage,low V =GND –10 10 μA
L IL
POWERSUPPLY
Powerdown,T =25°C 0.5 2
A
Powerdown 5
I Supplycurrent μA
VDD
Operating,T =25°C 150 200
A
Operating 300
VDD=5V 0.9
P Powerdissipation VDD=3.3V 0.5 mW
D
VDD=2V 0.3
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7.6 Timing Requirements: Serial Interface
OveroperatingambienttemperaturerangeandVDD=2Vto5.5V(unlessotherwisenoted)
MIN MAX UNIT
t Delaytime,CSfallingedgetofirstSCLKrisingedge(1) 100 ns
CSSC
t Delaytime,finalSCLKfallingedgetoCSrisingedge 100 ns
SCCS
t Pulseduration,CShigh 200 ns
CSH
t SCLKperiod 250 ns
SCLK
t Pulseduration,SCLKhigh 100 ns
SPWH
100 ns
t Pulseduration,SCLKlow(2)
SPWL
28 ms
t Setuptime,DINvalidbeforeSCLKfallingedge 50 ns
DIST
t Holdtime,DINvalidafterSCLKfallingedge 50 ns
DIHD
t Holdtime,SCLKrisingedgetoDOUTinvalid 0 ns
DOHD
(1) CScanbetiedlowpermanentlyincasetheserialbusisnotsharedwithanyotherdevice.
(2) HoldingSCLKlowlongerthan28msresetstheSPIinterface.
7.7 Switching Characteristics: Serial Interface
Overoperatingambienttemperaturerange(unlessotherwisenoted)
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
Propagationdelaytime,
t DOUTload=20pF||100kΩtoGND 100 ns
CSDOD CSfallingedgetoDOUTdriven
Propagationdelaytime,
t DOUTload=20pF||100kΩtoGND 0 50 ns
DOPD SCLKrisingedgetovalidnewDOUT
Propagationdelaytime,
t DOUTload=20pF||100kΩtoGND 100 ns
CSDOZ CSrisingedgetoDOUThighimpedance
t
CS CSH
tCSSC tSCLK tSPWH tSCCS
SCLK
tDIST tDIHD tSPWL tSCSC
DIN
t
t t DOHD t
CSDOD DOPD CSDOZ
Hi-Z Hi-Z
DOUT
Figure1. SerialInterfaceTiming
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7.8 Typical Characteristics
AtT =25°C,VDD=3.3V,FSR=±2.048V(unlessotherwisenoted).
A
4 4
VDD = 2.0 V
3 3 VDD = 3.3 V
VDD = 5.0 V
2 %) 2
Error (mV) 10 Rate Error ( 01
otal -1 ata −1
T D −2
-2
−3
-3
−4
-4 −60 −40 −20 0 20 40 60 80 100 120 140
-2.048 -1.024 0 1.024 2.048 Temperature (°C) G028
Input Signal (V)
DR=860SPS,diffinputs,includesnoise,offsetandgainerror
Figure2.TotalErrorvsInputSignal Figure3.DataRatevsTemperature
15 5
FSR = ±0.256 V T =−40°C
4 A
FSR = ±0.512 V T =25°C
12.5 A
m) FSR = ±2.048 V m) 3 TA=125°C
Nonlinearity (pp 71.05 FSR = ±6.144 V Nonlinearity (pp −1012
Integral 2.55 Integral −−32
−4
0 −5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2
Supply Voltage (V) G010 Input Signal (V)
FSR=±2.048V,DR=8SPS,VDD=3.3V,bestfit
Figure4.INLvsSupplyVoltage Figure5.INLvsInputSignal
10 5
T =−40°C T =−40°C
8 A 4 A
T =25°C T =25°C
A A
m) 6 TA=125°C m) 3 TA=125°C
p p
y (p 4 y (p 2
arit 2 arit 1
e e
n 0 n 0
nli nli
No −2 No −1
gral −4 gral −2
e e
nt −6 nt −3
I I
−8 −4
−10 −5
−0.5 −0.4 −0.2 −0.1 0 0.1 0.2 0.4 0.5 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2
Input Signal (V) Input Signal (V)
FSR=±0.512V,DR=8SPS,VDD=3.3V,bestfit FSR=±2.048V,DR=8SPS,VDD=5V,bestfit
Figure6.INLvsInputSignal Figure7.INLvsInputSignal
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Typical Characteristics (continued)
AtT =25°C,VDD=3.3V,FSR=±2.048V(unlessotherwisenoted).
A
10 12
8 TA=−40°C VDD = 2.0 V
TA=25°C 10 VDD = 3.3 V
m) 6 TA=125°C m) VDD = 5.0 V
p p
y (p 4 y (p 8
arit 2 arit
e e
nlin 0 nlin 6
No −2 No
gral −4 gral 4
e e
nt −6 nt
I I 2
−8
−10 0
−0.5 −0.4 −0.2 −0.1 0 0.1 0.2 0.4 0.5 −60 −40 −20 0 20 40 60 80 100 120 140
Input Signal (V) Temperature (°C)
G015
FSR=±0.512V,DR=8SPS,VDD=5V,bestfit FSR=±2.048V,DR=8SPS,bestfit
Figure8.INLvsInputSignal Figure9.INLvsTemperature
16 60
T =−40°C AIN0 to GND
A
14 T =25°C AIN1 to GND
A 40
arity (ppm) 1102 TA=125°C ge (µV) 20 AAIINN23 ttoo GGNNDD
e a
nlin 8 Volt 0
No 6 et
egral 4 Offs −20
Int −40
2
0 −60
88 1166 3322 6644 112288 225500 447755 886600 −40 −20 0 20 40 60 80 100 120
Data Rate (SPS) Temperature (°C) G004
FSR=±2.048V,bestfit
Figure10.INLvsDataRate Figure11.Single-EndedOffsetVoltagevsTemperature
60 40
AIN0 to GND AIN0 toAIN1
AIN1 to GND 30 AIN0 toAIN3
40
AIN2 to GND AIN1 toAIN3
µV) 20 AIN3 to GND µV) 20 AIN2 toAIN3
e ( e ( 10
g g
a a
olt 0 olt 0
V V
et et −10
Offs −20 Offs
−20
−40
−30
−60 −40
2 2.5 3 3.5 4 4.5 5 −40 −20 0 20 40 60 80 100 120
Supply Voltage (V) Temperature (°C)
G005 G006
Figure12.Single-EndedOffsetVoltagevsSupply Figure13.DifferentialOffsetVoltagevsTemperature
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Description:Analog-to-Digital Converter with Internal Reference and Temperature Sensor. 1 Features sensor signals in an ultra-small, leadless X2QFN-10.