Thermal-Structural Analyses of 3-D FPGAs

13 Pages·2009·2.77 MB·English

Thermal-Structural Analyses of 3-D FPGAs
Chunbo(Sam)Zhang,RamachandraKallam,AndrewDeceuster,
AravindDasu,andLeijunLi
MicronResearchCenter
UtahStateUniversity
April16,2009
MeasurementDeviceSetup
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FPGAConfiguration
1 XILINXSPARTANTQG140GQ0737madeinTaiwan.
2 InvestigatetheconfigurationofFPGAforareasonablemodelprototype.
3 IdentifytheconfigurationofFPGA,materialcomponents,and
dimensions.
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FiniteElementModelofOneFPGA
1 Quartersymmetry
2 3-Dthermal-structuralcoupledmodel
3 Conductiveandconvectiveheattransfer
4 Simulationstopsafterthejunctiontemperaturesaturates(steady-state).
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3DTemperatureDistributionofOneFPGA
1 Asaturationphenomenonexistsinthetemperaturedistributionprofileof
theFPGA.
2 Inthesteadystate,ahotzone,whoseshapeandvalueareindependentof
time,isformed.
3 Theobservedtemperaturesaturationandsaturatedjunctiontemperature
revealthethermalconditionoftheactiveFPGAlayer,whichisa
valuablereferencetochipdesigners.
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3DThermalStressDistributionofOneFPGA
1 Thethermalstressconcentratesattheinterfacebetweencopperand
epoxy+silverlayer,andepoxy+silverandsiliconlayers.
2 Themaximumstressislocatedatthegroove-shapedinterfaceofcopper
andepoxypackage.
3 OntheFPGAlayer,thethermalstressconcentratesinthemiddleof
edges,whichareparalleltothecoppergroovedirection.
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EffectsofFPGAParametersonJunctionTemperature
1 Themodelpredictedjunctiontemperatureisshowntolinearlyincrease
withTR,RU,OBuffer,andFrequency.
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FiniteElementModelofTwoFPGAs
1 StackinganotherFPGAlayerontopoftheoriginalFPGAlayer.
2 In-betweentwoFPGAlayers,thesiliconlayerhasthesamethicknessas
theFPGAlayers.
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3DTemperatureandStressDistributionsofTwoFPGAs
1 Forthetwo-layerFPGAs,thetemperatureandthermalstress
distributionskeepthesameshapeasthoseoftheoneFPGA,buthave
doubledvalues.
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ComparisonofTemperatureDistributionsonTwoFPGAs
1 Inthesteadystate,thetemperaturehasthesamedistributionandvalue
onthetopFPGAlayer(left)andbottomFPGAlayer(right).
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