Theory and Practice of Thermal Transient Testing of Electronic Components PDF
Preview Theory and Practice of Thermal Transient Testing of Electronic Components
Márta Rencz Gábor Farkas András Poppe Editors Theory and Practice of Thermal Transient Testing of Electronic Components Theory and Practice of Thermal Transient Testing of Electronic Components ThiSisaFMBlankPage á (cid:129) á (cid:129) á M rta Rencz G bor Farkas Andr s Poppe Editors Theory and Practice of Thermal Transient Testing of Electronic Components Editors MártaRencz GáborFarkas SiemensDigitalIndustrySoftwareSTS SiemensDigitalIndustrySoftwareSTS Budapest,Hungary Budapest,Hungary BudapestUniversityofTechnology andEconomics Budapest,Hungary AndrásPoppe SiemensDigitalIndustrySoftwareSTS Budapest,Hungary BudapestUniversityofTechnology andEconomics Budapest,Hungary ISBN978-3-030-86173-5 ISBN978-3-030-86174-2 (eBook) https://doi.org/10.1007/978-3-030-86174-2 ©TheEditor(s)(ifapplicable)andTheAuthor(s),underexclusivelicensetoSpringerNatureSwitzerland AG2022 Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeorpartofthe materialisconcerned,specificallytherightsoftranslation,reprinting,reuseofillustrations,recitation, broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,andtransmissionorinformation storageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilarmethodology nowknownorhereafterdeveloped. Theuseofgeneraldescriptivenames,registerednames,trademarks,servicemarks,etc.inthispublication doesnotimply,evenintheabsenceofaspecificstatement,thatsuchnamesareexemptfromtherelevant protectivelawsandregulationsandthereforefreeforgeneraluse. The publisher, the authors, and the editorsare safeto assume that the adviceand informationin this bookarebelievedtobetrueandaccurateatthedateofpublication.Neitherthepublishernortheauthorsor theeditorsgiveawarranty,expressedorimplied,withrespecttothematerialcontainedhereinorforany errorsoromissionsthatmayhavebeenmade.Thepublisherremainsneutralwithregardtojurisdictional claimsinpublishedmapsandinstitutionalaffiliations. ThisSpringerimprintispublishedbytheregisteredcompanySpringerNatureSwitzerlandAG Theregisteredcompanyaddressis:Gewerbestrasse11,6330Cham,Switzerland This book is dedicated to the memory of Vladimír Székely, who was the founder of the network identification by deconvolution method, and who was the teacher of all the authors. The authors wish to acknowledge the support of the Budapest University of Technology and Economics and Siemens Digital Industries, which were invaluable in the preparation of this book. Gábor Farkas András Poppe Márta Rencz Zoltán Sárkány András Vass-Várnai “Heat, like gravity, penetrates every substance of the universe, its rays occupy all parts of space.” Motivation for the research of heat equations, by Joseph Fourier, inThe AnalyticalTheory of Heat,1822 [1] “The force of the current in a galvanic circuitisproportionaldirectly tothesumof all the tensions, and inversely to the entire reduced length of the circuit.” Firstformulationofanequationdescribing a discretized electric system, by Georg Simon Ohm, in The galvanic circuit investigated mathematically, 1827 [2] Contents 1 WhyWasWrittenandHowtoReadThisBook. . . . . . . . . . . . . . . . 1 MártaRenczandGáborFarkas 2 TheoreticalBackgroundofThermalTransientMeasurements. . . . . 7 GáborFarkas,AndrásPoppe,andMártaRencz 3 ThermalMetrics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 AndrásPoppeandGáborFarkas 4 Temperature-DependentElectricalCharacteristics ofSemiconductorDevices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 GáborFarkas 5 FundamentalsofThermalTransientMeasurements. . . . . . . . . . . . . 171 GáborFarkas 6 ThermalTransientMeasurementsonVariousElectronic Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209 GáborFarkas,AndrásPoppe,ZoltánSárkány, andAndrásVass-Várnai 7 TheUseofThermalTransientTesting. . . . . . . . . . . . . . . . . . . . . . . 319 MártaRencz,GáborFarkas,ZoltánSárkány, andAndrásVass-Várnai 8 OntheAccuracyandRepeatabilityofThermalTransient Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353 AndrásPoppeandMártaRencz References. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371 Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 ix Chapter 1 Why Was Written and How to Read This Book MártaRenczandGáborFarkas Thermal transient measurements have become the most important characterization method of the thermal behavior of electronic systems in the last decades. This development is mainly due to the emergence of a new methodology, the structure function method, which is based on the network identification by deconvolution, introducedbyV.Székely.Thismethodologyinitsmatureformoffersa“lookinside thestructure”ofanelectroniccomponentwithasingle electricalmeasurementand the subsequent automated evaluation in software. It helps reveal data about the partial thermal resistances and capacitances inside the structure at all levels of an assembly,startingatachipinadevicepackageormodule,throughthermalinterface andothermateriallayersandvariouscoolingmounts.Themethodmayevenprovide temperature data on internal surfaces in the heat-conducting path which are other- wisenotaccessiblefortemperaturemeasurements. Theusersofthemethodsoonunderstoodthatitisnotpuremagic,andtobeable to fully exploit the capabilities of the methodology, a large amount of advanced knowledge is needed about the operation and the structure of the devices that are tested. In this book the authors, who are electrical engineers and university pro- fessors, tried to collect all information that is needed to fully understand the capabilitiesandthespecialtiesofthethermaltransientmeasurementtechnique. Thebookisverytimelynow.Theprimarychallengeinpresentengineeringtasks iscopingwiththegrowingpowerlevelinelectronicsystems.Powercontrollerunits of electric cars and locomotives switch hundreds and thousands of amperes and forward many kilowatts toward the engine in order to bring tons of weight into M.Rencz(*) SiemensDigitalIndustrySoftwareSTS,Budapest,Hungary BudapestUniversityofTechnologyandEconomics,Budapest,Hungary e-mail:[email protected] G.Farkas SiemensDigitalIndustrySoftwareSTS,Budapest,Hungary ©TheAuthor(s),underexclusivelicensetoSpringerNatureSwitzerlandAG2022 1 M.Renczetal.(eds.),TheoryandPracticeofThermalTransientTesting ofElectronicComponents,https://doi.org/10.1007/978-3-030-86174-2_1 2 M.RenczandG.Farkas motion. Solid-state lighting luminaires now operate in dozens and may dissipate hundreds of watts. Wind turbines and their power conversion units operate in the kilowatt to megawatt range, some high-voltage direct current electricity grid links are already in operation worldwide, and many new ones in Europe are under construction with a planned capacity of 1400 MW. The power density further increases in most of the systems in electronics. Processors run now at aggressive clock frequencies and dissipate hundreds of watts in a small box, video projectors which were formerly of suitcase size now resemble a pocketbook, and mobile phones produce although a few watts only but in a densely packed very thin case withnoventilationatall.Thesehigh-powerlevelsrepresentanincreaseddangerof overheatinganddamagingthedevices. Many of the power electronic systems work in extremely harsh environments. Automotive electronics, for example, must operate in the -30 to +80 °C external temperaturerange;thisissimilarforwindturbines,automotivelightingsolutions,or streetlightingluminaires. Traditionally,thetemperatureoftheinternalsemiconductordeviceshasbeenthe principal factor which limited the system operability and influenced the system’s reliability and lifetime. Due to the moderate cost and mature manufacturing tech- nologiessemiconductorpowerdevicestodayarestillmostlyproducedfromsilicon. Under the above-outlined environmental conditions, they sometimes reach their operation limits around 150 °C or 175 °C. With the advent of revolutionary wide bandgapsemiconductormaterials,thisisexpectedtochangesoon,andthestructural materials of the device package will represent the new bottleneck in the system construction. With increasingly sophisticated engineering and with the help of new thermal design methods based on measurements and simulation, the overheating of critical components can be prevented. Failure analysis shows that nowadays systems are correctlydesignedinthisrespect;thetypicalcomponentbreakdowniscausedbythe repeatedthermaltransients.Heatingandcoolinginduceshearstressatthematerial interfaces inthestructure, mostly atthe dieattach, orthesolderjoints, resultingin delamination, tear-off, etc. The poorer heat removal through a diminished surface cancausethenthermalrunaway. The theory of heat propagation in materials was elaborated as early as the first decadesofthenineteenthcentury.Sincethen,weknowthattheheatflowsfromthe heatsourcetowardtheambient,andtheactualtemperatureofanypointinbetween dependsonthegeometricalstructure andthematerialpropertiesofthepartswhere the heat flows through. Knowing the structure and the material parameters, the temperature distribution and the heat flow paths can be determined, if the heating sourcesare known.This calculationis doneby thermal simulation.Thermal simu- lation can also reveal the time dependence of the temperature at any point in the structure. Inthecaseofthermaltransienttesting,theoppositeisdone.Thetimedependence of the temperature change is measured at a well-selected point in the system, resulting from a sudden change in the amount of the generated heat, and if the structure and the material composition of the system are known, the resulting and
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