The Electronic Packaging Handbook (Electronics Handbook Series)

607 Pages·1999·13.18 MB·English

by  Glenn R. Blackwell

“Frontmatter”
The Electronic Packaging Handbook
Ed. Blackwell, G.R.
Boca Raton: CRC Press LLC, 2000
Library of Congress Cataloging-in-Publication Data
The electronic packaging handbook / edited by Glenn R. Blackwell.
p. cm. — (The electrical engineers handbook series)
Includes bibliographical references.
ISBN 0-8493-8591-1 (alk. paper)
1. Electronic packaging Handbooks, manuals, etc. I. Blackwell,
Glenn R. II. Series.
TK7870.15.E44 1999
621.381′046—dc21 99-41244
CIP
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International Standard Book Number 0-8493-8591-1
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Printed in the United States of America 1 2 3 4 5 6 7 8 9 0
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Preface
The Electronic Packaging Handbook is intended for engineers and technicians involved in the design,
manufacturing, and testing of electronic assemblies. The handbook covers a range of applied technologies
and concepts that are necessary to allow the user to follow reasonable steps to reach a defined goal. The
user is encouraged to follow the steps of concurrent engineering, which considers aspects of design,
manufacturing, and testing during the design phase of a project and/or product.
Each chapter begins with an introduction, which includes a Where Else? section. Because the topics
considered in this handbook are interactive, this section guides the reader of a particular chapter to other
sections of the handbook where similar issues are discussed.
The Electronic Packaging Handbook is the latest in a series of major electrical/electronics engineering
handbooks from CRC Press, including several that are published jointly with the IEEE Press:
• The Electronics Handbook, Jerry C. Whitaker
• The Electrical Engineering Handbook, 2nd ed., Richard C. Dorf
• The Circuits and Filters Handbook, Wai-Kai Chen
• The Control Handbook, William S. Devine
• The Mobile Communications Handbook, Jerry D. Gibson
• The Transforms and Applications Handbook, Alexander D. Poularikas
This handbook covers a subset of the topics that exist in Whitaker’s The Electronics Handbook, and as
such covers the included topics in more detail than that handbook, while restricting coverage to only
topics directly related to electronics packaging. Electronics packaging continues to include expanding
and evolving topics and technologies, as the demands for smaller, faster, and lighter products continue
without signs of abatement. These demands mean that individuals in each of the specialty areas involved
in electronics packaging, such as electronic, mechanical, and thermal designers, and manufacturing and
test engineers, are all interdependent on each other’s knowledge. This handbook will assist each group
in understanding other areas.
Organization
The two introductory chapters of this handbook are intended to provide an overview to the topics of
project management and quality, and to surface mount technology generally. Following chapters then
present more detailed information about topics needed to successfully design, manufacture, and test the
packaging for an electronic product:
1. Fundamentals of the Design Process
2. Surface Mount Technology
3. Integrated Circuit Packages
© 2000 by CRC Press LLC
4. Direct Chip Attach
5. Circuit Boards
6. EMC and Printed Circuit Board Design
7. Hybrid Assemblies
8. Interconnects
9. Design for Test
10. Adhesive and Its Application
11. Thermal Management
12. Testing
13. Inspection
14. Package/Enclosure
15. Electronics Package Reliability and Failure Analysis
16. Product Safety and Third-Party Certification
The last two chapters cover reliability and failure analysis issues, which are necessary to understand both
failure mechanisms, and also analysis of failed products and the safety issues that must be considered
for any product that is intended to be sold to corporate or public consumers.
The index is complete and was developed by the chapter authors. This index will be of great value to
the reader in identifying areas of the book that cover the topics of interest.
This handbook represents a multi-year effort by the authors. It is hoped that the reader will both
benefit and learn from their work.
Glenn R. Blackwell
© 2000 by CRC Press LLC
Contributors
Bruce C. Beihoff Steli Loznen Ray Prasad
Rockwell Automation The Standards Institution of Israel Ray Prasad Consultancy, Inc.
Allen Bradley Tel Aviv, Israel Portland, OR
Milwaukee, WI
Janet K. Lumpp
Glenn R. Blackwell Michael C. Shaw
University of Kentucky
Purdue University Design and Reliability
Lexington, KY
W. Lafayette, IN Department
Rockwell Science Center
Victor Meeldijk
Constantin Bolintineanu Thousand Oaks, CA
Diagnostic/Retrieval Systems Inc.
Digital Security Controls, Ltd.
Oakland, NJ
Toronto, Ontario, Canada
Peter M. Stipan
Garry Grzelak Mark I. Montrose Rockwell Automation
Teradyne Telecommunications Montrose Compliance Services, Inc. Allen-Bradley
Deerfield, IL Santa Clara, CA Milwaukee, WI
© 2000 by CRC Press LLC
Contents
1
Fundamentals of the Design Process
Glenn R. Blackwell
2
Surface Mount Technology
Glenn R. Blackwell
3
Integrated Circuit Packages
Victor Meeldijk
4
Direct Chip Attach
Glenn R. Blackwell
5
Circuit Boards
Glenn R. Blackwell
6
EMC and Printed Circuit Board Design
Mark I. Montrose
7
Hybrid Assemblies
Janet K. Lumpp
8
Interconnects
Glenn R. Blackwell
9
Design for Test
Glenn R. Blackwell
10
Adhesive and Its Application
Ray Prasad
11
Thermal Management
Glenn R. Blackwell
12
Testing
Garry Grzelak and Glenn R. Blackwell
© 2000 by CRC Press LLC
13
Inspection
Glenn R. Blackwell
14
Package/Enclosure
Glenn R. Blackwell
15
Electronics Package Reliability and Failure Analysis: A
Micromechanics-Based Approach
Peter M. Stipan, Bruce C. Beihoff, and Michael C. Shaw
16
Product Safety and Third-Party Certification
Constantin Bolintineanu and Steli Loznen
Appendix A: Definitions
© 2000 by CRC Press LLC
Blackwell, G.R. “Fundamentals of the Design Process”
The Electronic Packaging Handbook
Ed. Blackwell, G.R.
Boca Raton: CRC Press LLC, 2000
1
Fundamentals of the
Design Process
Glenn R. Blackwell 1.1 Handbook Introduction
Purdue University 1.2 Concurrent Engineering
1.3 Systems Engineering
1.4 Quality Concepts
1.5 Engineering Documentation
1.6 Design for Manufacturability
1.7 ISO9000
1.8 Bids and Specifications
1.9 Reference and Standards Organizations
1.1 Handbook Introduction
This handbook is written for the practicing engineer who needs current information on electronic
packaging at the circuit level. The intended audience includes engineers and technicians involved in any
or all aspects of design, production, testing, and packaging of electronic products regardless of whether
those products are commercial or industrial in nature. This means that circuit designers participating in
concurrent engineering teams, circuit board designers and fabricators, test engineers and technicians,
and others will find this handbook of value.
1.2 Concurrent Engineering*
In its simplest definition, concurrent engineering requires that a design team consider all appropriate
issues of design, manufacturability, and testability during the design phase of a project/product. Other
definitions will include repairability and marketability. Each user must define the included elements to
best fit the specific needs.
1.2.1 Introduction
Concurrent engineering (CE) is a present-day method used to shorten the time to market for new or
improved products. Let it be assumed that a product will, upon reaching the marketplace, be competitive
in nearly every respect, such as quality and cost, for example. But the marketplace has shown that
products, even though competitive, must not be late to market, because market share, and therefore
*Adapted from Whitaker, J., The Electronics Engineering Handbook, Chapter 146, “Concurrent Engineering,” by
Francis Long, CRC/IEEE Press, 1997.
© 2000 by CRC Press LLC