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The development of a model builder for a microcircuit substrate PDF

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NAVAL POSTGRADUATE SCHOOL Monterey, California THESIS THE DEVELOPMENT OF A MODEL BUILDER FOR A MICROCIRCUIT SUBSTRATE by Patric Karl Roesch June 1991 Thesis Advisor: A.D. Kraus Approved for public release; distribution unlimited. T256342 Unclassified Security Classification of this page REPORT DOCUMENTATION PAGE la Report Security Classification lb Restrictive Markings Unclassified 2a Security Classification Authority 3 Distribution Availability of Report 2b Declassification/Downgrading Schedule Approved for public release; distribution is unlimited. 4 Performing Organization Report Number(s) 5 Monitoring Organization Report Number(s) 6a Name of Performing Organization 6b Office Symbol 7a Name of Monitoring Organization Naval Postgraduate School (IfApplicable) 32 Naval Postgraduate School 6c Address (city, state, and ZIP code) 7b Address (city, state, and ZIP code) Monterey, CA 93943-5000 Monterey, CA 93943-5000 5a Name of Funding/Sponsoring Organization 8b Office Symbol 9 Procurement Instrument Identification Number (7/Applicable) 8c Address (city, state, and ZIP code) 1 Source of Funding Numbers Program Element Number Project No Task No Work Unit Accession No THE DEVELOPMENT OF A MODEL BUILDER FOR A MICROCIRCUIT li Title(includeSecurityClassification) SUBSTRATE 12 Personal Author(s) Patric K. Roesch 13a Type of Report 13b Time Covered 14 Date of Report (year, month,day) 15 Page Count Master's Thesis From 1991 May 7 101 , 16 SupplementaryNotation The views expressed in this thesis are those of the author and do not reflect the official policy orposition ofthe Department ofDefense or the U.S. Government. 17 Cosati Codes 18 Subject Terms (continue on reverse ifnecessary and identify by block number) Field Group Subgroup Model Builder; Development; Microcircuit; Substrate 19 Abstract (continue on reverse ifnecessary and identify by block number The Naval Postgraduate School is currently in possession ofsoftware designed to perform a thermal analysis ofelectronic components. This software package incorporates a model builder whose primary function is to generate a thermal model. In its present configuration, the model builderrequires an inordinate amount of time for data input and model verification. This thesis describes the development ofa model builderdesigned specifically to reduce the time required to model the substrate, epoxy, and carrierlayers ofa microcircuit assembly. 20 Distribution/Availability of Abstract 21 Abstract Security Classification X| unclassified/unlimited same as report DTICusers Unclassified | J 22a Name of Responsible Individual 22b Telephone (Include Area code) 22c Office Symbol Allan D. Kraus (408) 646-2730 EC/KS DD FORM 1473, 84 MAR 83 APR edition may be used until exhausted security classification of this page Unclassified All other editions are obsolete Approved for public release; distribution is unlimited. The Development of a Model Builder for a Microcircuit Substrate by Patric K. Roesch Lieutenant, United States Navy B.S., University of Florida, 1982 Submitted in partial fulfillment of the requirements for the degree of MASTER OF SCIENCE IN ELECTRICAL ENGINEERING from the NAVAL POSTGRADUATE SCHOOL June 1991 Michael A. Morgan, Chairman, Department of Electrical and Computer Engineering ABSTRACT The Naval Postgraduate School is currently in possession of software designed to perform a thermal analysis of electronic components. This software package incorporates a model builder which contains two programs whose primary function is to generate a thermal model. In its present configuration, the model builder reguires an inordinate amount of time for data input and model verification. This thesis describes the development of a model builder designed specifically to reduce the time reguired to model the substrate, epoxy and carrier layers of a microcircuit assembly. 111 . . ... TABLE OF CONTENTS INTRODUCTION I 1 . II THE REASON FOR THERMAL ANALYSIS 5 A. RELIABILITY 6 B MATERIAL SELECTION 9 C. BIAS STABILIZATION 11 1. Operating in the Forward Bias Region 13 D. CATASTROPHIC THERMAL FAILURE 14 III HEAT TRANSFER 17 A CONDUCTION 17 1. General Equation of Heat Conduction 18 2 Simple Plane Slab 20 . 3 Electrothermal Analog 22 . B CONVECTION 23 1 Electrothermal Analog 25 . C. RADIATION 27 1. Transformation of the General Radiation Equation 29 2. General Problems of Heat Transfer by Radiation 32 IV. FINITE DIFFERENCES 33 A FUNDAMENTAL CONCEPTS 33 . 1. First Derivative Approximation 34 2 Second Derivative Approximation 36 . iv

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