Table Of Content

1992 ANNUAL INDEX ARTICLES AND AUTHORS ISSUE PAGE ARTICLES AND AUTHORS ISSUE PAGE Acid Reprocessors—Part 1: Piranha or High Pin Count Wirebonding: The Challenge for Sulphuric Acid Reprocessor Packaging John Davison Rahamat Biden Acid Reprocessors—Part 2: The HF Reprocessor John Davison Joule-Thomson Expansion and Corrosion Active Matrix Liquid Crystal Displays in HCI Systems Part 2: Markets Paul M. Bhadha, Everett R. Greene William C. O’Mara Advanced Copper Metallization Technology for Liquid Crystals for Active Matrix Displays ULSI Interconnects Herbert J. Plach, Paul A. Breddels, Tadahiro Ohmi, Kazuo Tsubouchi Bernhard Rieger The Attenuated Phase-Shifting Mask Liquid Crystal Display Assembly Burn J. Lin John Varney Backend In-Line Systems: Can We Afford to Manufacturing Evaluation of an Endura 5500 PVD Neglect Them? Multichamber System Ron Sato E. Keller, |.B ukhman, S. Gonzales, C. Magnella, BiCMOS Memories: Increasing Speed While J. Nulman, R. Mosely, H. Grunes, A. Tepman Minimizing Complexity Meeting Global MCM Manufacturing Challenges Craig Lage Marla C. Tucker Microlithography for Large Area Fiat Panel Channeling Control for Large Tilt Angle Display Substrates: An Overview implantation in Si <001> David S. Holbrook, James D. McKibben Robert B. Simonton, Dennis E. Kamenitsa Moisture Analysis in Process Gas Streams Andrew M. Ray, Changhae Park, James J. McAndrew, Daniel Boucheron Kevin M. Klein, Al F. Tasch Chemical-Mechanical Wafer Polishing and Particle and Metal Contamination in Gas Cylinders Planarization in Batch Systems Edward T. Flaherty, Lawrence Johns, Anthony F. Amato Robert Kolenkow, Ron Nagahara Planarizing interievel Dielectrics by Contact Recording on Rigid Disks: Chemical-Mechanical Polishing Materials and Materials Analysis Srinivasan Sivaram, Hubert Bath, Robert Leggett, Robert D. Cormia, Don Mann Alvaro Maury, Kenneth Monnig, Robert Tolles Plasma Enhanced CVD for Flat Panel Displays Dry Plasma Resist Stripping Part 1: John L. Crowley Overview of Equipment How Plasma Etching Damages Thin Gate Oxides Daniel L. Flamm Calvin T. Gabriel, James P. McVittie Dry Plasma Resist Stripping Part 2: Plasma immersion lon Implantation: Physical Processes A Cluster Compatible Technology Daniel L. Flamm Carey Pico Dry Plasma Resist Stripping Part 3: Process Control Issues for lon implantation Production Economics Using Large Tilt Angles and Wafer Repositioning Daniel L. Flamm Robert B. Simonton, Dennis E. Kamenitsa, Andrew M. Ray Early Detection and Repair of AMLCD Defects Process Integration issues for Submicron Francois J. Henley BiCMOS Technology Equipment Design for Reduced Wafer Vibration Robert H. Havemann, Robert H. Eklund Halil Tugal Processing of Toxic Hydride Gases Extendibility of X-Ray Lithography to Upcoming for Gas Cylinder Recovery IC Generations—Part 1: Exposure Latitude John F. Jordan, Ram S. Ramachandran, Arnold W. Yanof, Whitson G. Waldo, Karl J. Johnson Mike Pierce, Paul Koo Ahmad D. Katnani, Harbans Sachdev Extendibility of X-Ray Lithography to Upcoming Rapid Thermal Processing for Active Matrix Devices IC Generations— Part 2: More Diffraction Effects James E. Fair Arnold W. Yanof, Whitson G. Waldo, Kari J. Johnson Real-Time Single Particle Composition Detection Ahmad D. Katnani, Harbans Sachdev in Liquids Extendibility of X-Ray Lithography to Upcoming J. Samuel Batchelder IC Generations—Part 3: Manufacturing Issues A Review of IC Isolation Technologies—Part 1 Arnold W. Yanof, Whitson G. Waldo, Karl J. Johnson Stanley Wolf Ahmad D. Katnani, Harbans Sachdev A Review of IC Isolation Technologies—Part 2 Stanley Wolf Hemispherical Grain Silicon for High Density DRAMS A Review of IC isolation Technologies—Part 3 Stanley Wolf, John Y. Chen Hirohito Watanabe, Akira Sakai, Toru Tatsumi, Taeko Niino High-Energy lon Implantation for ULSI: A Review of IC Isolation Technologies—Part 4 Well Engineering and Gettering Stanley Wolf Katsuhiro Tsukamoto, Takashi Kuroi, A Review of IC Isolation Technologies—Part 5 Shigeki Komori, Yoichi Akasaka Stanley Wolf January 1993 Solid State Technology 109 ARTICLES AND AUTHORS ISSUE PAGE ARTICLES AND AUTHORS ISSUE PAGE A Revi of IC Isolation Technologies—Part 6 Tel in the Era of Photonics Stanley W f lan M. Ross Total Organic Carbon Reduction in Silicon-on-insulator Development Ultrapure Water Processing in — Europe and Russia Drew Sinha Bernd Tillack, Rolf Banisch, Eugene |. Givargbizo\ Total System Solution with Advanced BiCMOS Alexander 3 Limanov Ali lranmanesh, Madan Biswal, Bami Bastani Smart Cards from a Manufacturing Point of View Toward a Nationai Strategy: The Strategy Tim B aKker of Leverage Stress in PSG and Nitride Films as Related Richard J. Elkus, Jr to Film Properties and ne A Triple Diffused Approach for Nigh Performance H ym Wu, RichaSr.d R o 0.8-:m BiCMOS Technology Subcontract eae Jelly Bean Services? Shahriar S. Anmed, Walter W. Asakawa, Mark T. Bohr Raiph Ducec Stephen S. Chambers, Tim Deeter, Marty Denham Supercritical Fluids for Single Wafer eee Jeffrey K. Gleason, William W. Holt EdwBoka, Diretedr Ke lch, Kevir Schumacher Richard R. Taylor, lan Young Surface Analysis of Fluorine Sutentution on a Bondpads Uniformity Mapping in lon Implantation: Part 2 san Grman, Roland Hauert, Egor Charlies B. Yarling, Walter H. Johnsor Marku Ametiit7 W. Andrew Keenan, Lawrenc a ar Surface Photovoltage Monitoring of Heavy Metal Wafer Mapping Adds Flexibility to the Contamination in IC Manufacturing Assembly Process ibek Jastrzebski, Worth Henley, Charles J. Neuse Brian Bates, William Seitzinger, Gary Inga 1992 AUTHORS Holbrook, David S e, Mike Hollander, Egor Plach, Herbert Holt, William W Rarr andran, Ram S naa, Gary ranmanesh, Al Rieger, Bernhard Jastyzedski, Lubek Rosler Johns, Lawrence Bat "de: samuel ve Jonnson, Kari Bates Bath, Hubert Bhadhna } 3 Johnson, Walter H Biden. Raham V rs Jordan, John F Sakai, Akira Biswal, Madar Sato, Ror Bohr. Mark Kamenitsa, Dennis E ocnhumacner, Kevin S Seitzinger, Williarr Katnani, Ahmad [ nonton. Robert B Keenan, W. Andrew Kelch, Dieter Keller, E Takast Klein, Kevin M Tasch, A Kolenkow, Robert Tatsumi ru Komori, St igeki Taylor, RichardR KOO, Pau Tepman, A Tillack, Bernd leeter, Tir 33 age, Craig Tolles, Robert Yenham, Marty 33 Larson, Lawrence A Tsubouchi, Kazu Leggett, Robert ukamoto, Katsuhir Limanov, Alexander B Tucker, Marla ( Tugal Halil Magnelia Varney, John Mann, Dor Maury, Alvar Watanabe, Hirohit McAndrew, James J Whitson, Waido G Kibden, James D Vittie, James P ionnig, Kennett losely, R Nagahara, Ror Neuse, Charlies J Niino, Taek« Nulman, J Ihmi, Tadahir Mara, Willian Park, Changhae Yarling, Charles B Py Cvaar©ree y Young, lar