Smart sensors and MEMS: Intelligent devices and microsystems for industrial applications

556 Pages·2014·51.893 MB·English

by  Stoyan Nihtianov

Smart sensors and MEMS

© Woodhead Publishing Limited, 2014
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© Woodhead Publishing Limited, 2014
Woodhead Publishing Series in Electronic and Optical Materials:
Number 51
Smart sensors and
MEMS
Intelligent devices and
microsystems for industrial
applications
Edited by
Stoyan Nihtianov and
Antonio Luque

Oxford Cambridge Philadelphia New Delhi
© Woodhead Publishing Limited, 2014
Published by Woodhead Publishing Limited,
80 High Street, Sawston, Cambridge CB22 3HJ, UK
www.woodheadpublishing.com
www.woodheadpublishingonline.com

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© Woodhead Publishing Limited, 2014
Contents
Contributor contact details xiii
Woodhead Publishing Series in Electronic and
Optical Materials xvii
Preface xxi
Part I Smart sensors for industrial applications 1
1 What makes sensor devices and microsystems
‘intelligent’ or ‘smart’? 3
R. Taymanov and K. Sapozhnikova, D. I. Mendeleyev
Institute for Metrology, Russia
1.1 Introduction 3
1.2 Interpretation of terms related to sensors 5
1.3 Key trends in the development of sensors (sensor devices)
and MEMS 10
1.4 Suggestions for improving terminology in the fi eld 17
1.5 Conclusion 21
1.6 Acknowledgment 21
1.7 References 21
2 Direct interface circuits for sensors 27
F. Reverter, Universitat Polit è cnica de Catalunya (UPC),
Spain
2.1 Introduction 27
2.2 Sensors 29
2.3 Microcontrollers 34
2.4 Interface circuits 40
2.5 Applications 53
2.6 Future trends 58
v
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vi Contents
2.7 Sources of further information and advice 59
2.8 References 60
3 Capacitive sensors for displacement measurement
in the sub-nanometer range 63
S. Xia, NXP Semiconductors, The Netherlands and
S. Nihtianov, Delft University of Technology, The
Netherlands
3.1 Introduction 63
3.2 Challenges for sub-nanometer displacement measurement
with capacitive sensors 63
3.3 Offset capacitance cancellation technique 65
3.4 Capacitance-to-digital converter (CDC) with offset
capacitance cancellation and calibration functions 67
3.5 Conclusion 74
3.6 References 74
4 Integrated inductive displacement sensors for harsh
industrial environments 76
M. R. Nabavi, Catena Microelectronics BV,
The Netherlands and S. Nihtianov, Delft University of
Technology, The Netherlands
4.1 Introduction 76
4.2 Principles of operation and practical limitations for eddy-
current sensors (ECSs) 78
4.3 Design requirements in precision industrial applications 84
4.4 State-of-the-art ECS interfaces 86
4.5 ECS interfaces with an LC oscillator and ratiometric
measurement 89
4.6 Conclusion 99
4.7 References 100
5 Advanced silicon radiation detectors in the vacuum
ultraviolet (VUV) and the extreme ultraviolet (EUV)
spectral range 102
A. Gottwald and F. Scholze, Physikalisch-Technische
Bundesanstalt, Germany
5.1 Introductory overview 102
5.2 Challenges for radiation detection in the EUV and VUV
spectral ranges 103
© Woodhead Publishing Limited, 2014
Contents vii
5.3 Device solutions for radiation detection in the EUV and
VUV spectral ranges 107
5.4 Methods of radiometric investigation and characterization 111
5.5 Spectral responsivity and radiation hardness of EUV and
VUV radiation detectors 113
5.6 Future trends 120
5.7 References 120
6 Integrated polarization analyzing CMOS image
sensors for detection and signal processing 124
M. Sarkar, Indian Institute of Technology, India and
A. J. P. Theuwissen, Delft University of Technology,
The Netherlands
6.1 Introduction 124
6.2 Polarization vision 127
6.3 Polarization cameras 135
6.4 Design of a polarization sensor 141
6.5 Polarization vision in machine vision applications:
material classifi cation 143
6.6 Conclusion 149
6.7 References 150
7 Advanced interfaces for resistive sensors 153
A. Flammini and A. Depari, University of Brescia, Italy
7.1 Introduction 153
7.2 Resistive sensors 154
7.3 Voltamperometric resistance estimation 160
7.4 Resistance-to-time conversion methods 173
7.5 Conclusion and future trends 201
7.6 References 202
8 Reconfi gurable ultrasonic smart sensor platform for
nondestructive evaluation and imaging applications 205
J. Saniie, E. Oruklu and S. Gilliland, Illinois Institute of
Technology, USA and S. Aslan, Texas State University, USA
8.1 Introduction 205
8.2 Fundamentals of ultrasonic sensing and pulse-echo
measurements 207
8.3 Reconfi gurable ultrasonic smart sensor platform (RUSSP)
design 209
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viii Contents
8.4 Algorithms used in evaluation of RUSSP 215
8.5 Hardware realization of ultrasonic imaging algorithms
using RUSSP 219
8.6 Future trends 226
8.7 Conclusion 227
8.8 Sources of further information and advice 227
8.9 References 227
9 Advanced optical incremental sensors: encoders and
interferometers 230
S. J. A. G. Cosijns and M. J. Jansen, ASML, The Netherlands
9.1 Introduction 230
9.2 Displacement interferometers 231
9.3 Sources of error and compensation methods 243
9.4 Optical encoders 249
9.5 Design considerations 267
9.6 Current and future trends 273
9.7 Conclusion 274
9.8 References 274
Part II Smart micro-electro-mechanical systems (MEMS) for
industrial applications 279
10 Microfabrication technologies used for creating smart
devices for industrial applications 281
J. M. Quero, F. Perdigones and C. Aracil, University of
Seville, Spain
10.1 Introduction 281
10.2 MEMS design and modeling 282
10.3 Materials 283
10.4 Microfabrication processes 287
10.5 Simulation 297
10.6 Conclusion 303
10.7 References 303
11 Microactuators: design and technology 305
L. Li and Z. J. Chew, Swansea University, UK
11.1 Introduction 305
11.2 Driving principles for actuators 307
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Contents ix
11.3 Design and analysis of microactuators 317
11.4 Conclusion 336
11.5 References 337
12 Dynamic behavior of smart MEMS in industrial
applications 349
M. Pustan, C. Birleanu and C. Dudescu, Technical
University of Cluj-Napoca, Romania and J-C. Golinval,
University of Liège, Belgium
12.1 Introduction 349
12.2 Resonant frequency response of smart MEMS vibrating
structures 350
12.3 Quality factor and the loss coeffi cient of smart MEMS
vibrating structures 358
12.4 Industrial applications: resonant accelerometers 364
12.5 References 364
13 MEMS integrating motion and displacement
sensors 366
G. Langfelder and A.Tocchio, Politecnico di
Milano, Italy
13.1 Introduction 366
13.2 Technical description of MEMS motion sensors: MEMS
accelerometer 369
13.3 MEMS gyroscope 380
13.4 MEMS magnetometer 390
13.5 Conclusion and future trends 395
13.6 References 397
14 MEMS print heads for industrial printing 402
S. Lee and J. Choi, Sungkyunkwan University (SKKU),
Republic of Korea
14.1 Introduction 402
14.2 Electro-hydro-dynamics (EHD) print head droplet ejection 407
14.3 EHD smart printing system 413
14.4 Case study: EHD printing applications 423
14.5 Conclusion 427
14.6 References 428
© Woodhead Publishing Limited, 2014
x Contents
15 Photovoltaic and fuel cells in power MEMS for smart
energy management 431
J. Garc Í a and F. J. Delgado, University of Seville, Spain
and P. Ortega and S. Bermejo, Polytechnic University of
Catalonia, Spain
15.1 Introduction 431
15.2 Photovoltaic mini-generators 433
15.3 Applications of photovoltaic mini-generators 445
15.4 Micro-fuel cells 449
15.5 Applications of micro-fuel cells 456
15.6 Smart energy management with sun sensors 457
15.7 Conclusion 468
15.8 References 468
16 Radio frequency (RF)-MEMS for smart communication
microsystems 472
D. Dubuc and K. Grenier, LAAS-CNRS, University of
Toulouse, France
16.1 Introduction 472
16.2 RF-MEMS technology and devices 473
16.3 RF-MEMS-based circuits for smart communication
microsystems 478
16.4 RF-MEMS reliability 482
16.5 RF-MEMS power capability 483
16.6 Co-integration of RF-MEMS-based circuits with integrated
circuits (IC) 485
16.7 Conclusion 487
16.8 References 488
17 Smart acoustic sensor array (SASA) system for
real-time sound processing applications 492
M. Turqueti, E. Oruklu and J. Saniie, Illinois Institute of
Technology, USA
17.1 Introduction 492
17.2 MEMS microphones 494
17.3 Fundamentals of acoustic sensor arrays and applications 495
17.4 Design and implementation of a smart acoustic MEMS
array (AMA) 496
© Woodhead Publishing Limited, 2014