Table Of ContentSIMULATION TECHNIQUES AND
SOLUTIONS FOR MIXED-SIGNAL
COUPLING IN INTEGRATED CIRCUITS
THE KLUWER INTERNATIONAL SERIES
IN ENGINEERING AND COMPUTER SCIENCE
VLSI, COMPUTER ARCHITECTURE AND
DIGITAL SIGNAL PROCESSING
Consulting Editor
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SIMULATION TECHNIQUES AND
SOLUTIONS FOR MIXED-SIGNAL
COUPLING IN INTEGRATED CIRCUlTS
by
Nishath K. Verghese
Carnegie Mellon University
Timothy J. Schmerbeck
IBM. Rochester
David J. Allstot
Carnegie Mellon University
SPRINGER SCIENCE+BUSINESS MEDIA, LLC
ISBN 978-1-4613-5942-5 ISBN 978-1-4615-2239-3 (eBook)
DOI 10.1007/978-1-4615-2239-3
Library of Congress Cataloging-in-Publication Data
A C.I.P. Catalogue record for this book is available
from the Library of Congress.
Copyright @ 1995 by Springer Science+Business Media New York
Originally published by Kluwer Academic Publishers in 1995
Softcover reprint ofthe hardcover 1st edition 1995
Second Printing 1995.
All rights reserved. No part of this publication may be reproduced, stored in
a retrieval system or transmitted in any form or by any means, mechanical,
photo-copying, recording, or otherwise, without the prior written permission of
the publisher, Springer Science+Business Media, LLC.
Printed on acid-free paper.
ForKazuko -NKV
ForRosemary, Katie andKim - TJS
For Vickie, Kevin andEmily -DJA
Contents
List ofFigures xi
List ofTables xix
Preface xxi
1 Introduction 1
2 Sources ofNoise and Methods of Coupling 5
2.1 SemiconductorDeviceNoiseandPhenomena .5
2.2 Noisefrom SwitchingVoltageandCurrent... 10
2.3 InductiveCoupling 11
2.4 CapacitiveCoupling 30
2.5 SubstrateCoupling .34
2.6 Summary .40
3 Semiconductor Device Simulation 43
3.1 Significance 43
vii
SIMULATIONTECHNIQUESANDSOLUTIONSFORMIXED-SIGNALCOUPLINGINIC,
3.2 BasicEquations 44
3.3 BoundaryConditions .45
3.4 ModelsofPhysicalParameters 47
3.5 SpatialDiscretization 53
3.6 SolutionMethods 62
3.7 ARepresentativeExample 67
3.8 Summary 71
4 Simplified Substrate Modeling and Rapid
Simulation 77
4.1 SimplifiedEquation 78
4.2 SpatialDiscretization 80
4.3 BoundaryConditions 83
4.4 SolutionMethods 84
4.5 AsymptoticWaveformEvaluation(AWE) 87
4.6 SubstrateAWEMacromodels 92
4.7 TransientSimulationofAWEMacromodels 97
4.8 SubstrateDCMacromodels 100
4.9 MatrixSolution 101
4.10 Results 107
4.11 Summary 114
5 Mesh Generation 117
5.1 AdaptiveMeshRefinement 117
5.2 APrioriMeshRefinement 120
5.3 Summary 124
6 Substrate Modeling in Heavily-Doped Bulk
Processes 125
6.1 Motivation 125
6.2 SingleNodeSubstrateModel 127
6.3 ModifiedSingleNodeSubstrateModel 129
viii
CONTENTS
6.4 Summary 133
7 Substrate Resistance Extraction for Large
Circuits 135
7.1 NestedMacromodeling 135
7.2 InterpolatedMacromodeling 141
7.3 Summary 147
8 Modeling ChiplPackage Power Distribution 149
8.1 EffectofPowerBusStructureonNoisecoupling 149
8.2 Summary 180
9 Controlling Substrate Coupling in Heavily-Doped
Bulk Processes 183
9.1 Characterizationofnoisecouplingconcepts 184
9.2 P+BulkWaferCharacterization 188
9.3 EffectofSubstratecontactplacementoncouplednoise .194
9.4 EffectofPackageInductanceonSubstratenoise .196
9.5 NoiseCouplingControlTechniques 203
9.6 Summary 214
10 Controlling Substrate Coupling in Bulk
p. Wafers 217
10.1 BulkP-Wafer Characteristics 217
10.2 SubstrateAttenuation Structures 226
10.3 Summary 231
ix
SIMULATIONTECHNIQUESANDSOLUTIONSFORMIXED-SIGNALCOUPLINGINICs
11 Chip/Package Shielding and Good Circuit Design
Practice 235
11.1 FarFieldRadiatedEmissions 235
11.2 EffectofChipSignalIsolation/ShieldingTechniquesonNoise 240
11.3 EffectofPackagingonNoise 244
11.4 EffectofCardLayoutandReferencingonNoise 248
11.5 EffectofCircuitTopologyonNoise 249
11.6 Summary 252
12 A Design Example 255
12.1 DesignofaMixed-SignalIC 255
12.2 Summary 272
Appendices
A Mesh Moments 275
B Convergence Behaviour ofIterative
Methods 277
Index 279
x
List ofFigures
Chapter1
Chapter2
2.1 Blow-upofa5.5mmsquarechipwirebondedintoa68 pin
PLCCpackage 12
2.2 Sidecross-sectionofaPlasticDualIn-linePackage(PDIP) with
an imbeddedheat-sink.CourtesyofAmkor/Anam 13
2.3 CrosssectionofMQFPIPQFPpackage 14
2.4 SelfInductanceofawireloopinfree spacewithroundconductors 15
2.5 SelfInductanceofaroundconductoroveran idealgroundplane 16
2.6 WIREBONDWIREEXAMPLE-SelfInductancefrom bondpadto
leadframefor68PLCC. (comerpin) 17
2.7 Flat,rectangularwireoveragroundplane 18
2.8 Routedsignalandreturm wires .19
2.9 EffectofGroundingthePackageLeads 21
2.10 Thefield fringing factor K 22
Ll
2.11 Mutualinductanceofroundorflat wiresoveragroundplane 23
2.12 Effectiveloopinductancewithopposingcurrentdirections 26
2.13 Effectiveinductancewithopposingcurrentdirections; halfofthe loop..27
2.14 Supplydecouplingcapacitordesignedtofit underneathaPLCC
xi
