Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits PDF
Preview Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN INTEGRATED CIRCUITS THE KLUWER INTERNATIONAL SERIES IN ENGINEERING AND COMPUTER SCIENCE VLSI, COMPUTER ARCHITECTURE AND DIGITAL SIGNAL PROCESSING Consulting Editor Jonathan Allen Other books in the series: MIXED-MODE SIMULATION AND ANALOG MULTILEVEL SIMULATION, Resve Saleh, Shyh-Jou, A. Richard Newton ISBN: 0-7923-9473-9 CADFRAMEWORKS: Principles and Architectures, PietervanderWolf ISBN: 0-7923-9501-8 PIPELINEDADAPTIVEDIGITALFILTERS, Naresh R. Shanbhag, Keshab K. Parhi ISBN: 0-7923-9463-1 TIMEDBOOLEANFUNCTIONS: AUnified Fonnalismfor ExactTimingAnalysis, William K.C. Lam, RobertK. Brayton ISBN: 0-7923-9454-2 AN ANALOGVLSISYSTEM FORSTEREOSCIPIC VISION, MishaMahowald ISBN: 0-7923-944-5 ANALOGDEVICE-LEVELLAYOUTAUTOMATION, JohnM. Cohn, DavidJ. Garrod, Rob A. Rutenbar, L. RichardCarley ISBN: 0-7923-9431-3 VLSI DESIGN METHODOLOGIES FORDIGITALSIGNALPROCESSING ARCHITECTURES, Magdy A. Bayoumi ISBN: 0-7923-9428-3 CIRCUITSYNTHESIS WITHVHDL, Roland Airiau, Jean-Michel Berge, VincentOlive ISBN: 0-7923-9429-1 ASYMPTOTIC WAVEFORMEVALUATION, EliChiprout, Michel S. Nakhla ISBN: 0-7923-9413-5 WAVEPIPELINING:THEORYANDCMOSIMPLEMENTATION, C. ThomasGray, Wentai Liu, Ralph K. Cavin, III ISBN: 0-7923-9398-8 CONNECTIONISTSPEECHRECOGNITION: AHybrid Appoach, H. Bourlard, N. Morgan ISBN: 0-7923-9396-1 BiCMOSTECHNOLOGYANDAPPLICATIONS, SECONDEDITION, A.R. Alvarez ISBN: 0-7923-9384-8 TECHNOLOGYCAD-COMPUTERSIMULATIONOFIC PROCESSES ANDDEVICES, R. Dutton, Z. Yu ISBN: 0-7923-9379 VHDL '92, THE NEW FEATURES OF THE VHDL HARDWARE DESCRIPTION LANGUAGE, J. Berge, A. Fonkoua, S. Maginot, J. Rouillard ISBN: 0-7923-9356-2 APPLICATION DRIVENSYNTHESIS, F. Catthoor, L. Svenson ISBN:0-7923-9355-4 ALGORITHMS FORSYNTHESIS ANDTESTINGOFASYNCHRONOUS CIRCUITS, L. Lavagno, A. Sangiovanni-Vincentelli ISBN: 0-7923-9364-3 HOT-CARRIERRELIABILITYOFMOSVLSICIRCUITS, Y. Leblebici, S. Kang ISBN: 0-7923-9352-X SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN INTEGRATED CIRCUlTS by Nishath K. Verghese Carnegie Mellon University Timothy J. Schmerbeck IBM. Rochester David J. Allstot Carnegie Mellon University SPRINGER SCIENCE+BUSINESS MEDIA, LLC ISBN 978-1-4613-5942-5 ISBN 978-1-4615-2239-3 (eBook) DOI 10.1007/978-1-4615-2239-3 Library of Congress Cataloging-in-Publication Data A C.I.P. Catalogue record for this book is available from the Library of Congress. Copyright @ 1995 by Springer Science+Business Media New York Originally published by Kluwer Academic Publishers in 1995 Softcover reprint ofthe hardcover 1st edition 1995 Second Printing 1995. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, mechanical, photo-copying, recording, or otherwise, without the prior written permission of the publisher, Springer Science+Business Media, LLC. Printed on acid-free paper. ForKazuko -NKV ForRosemary, Katie andKim - TJS For Vickie, Kevin andEmily -DJA Contents List ofFigures xi List ofTables xix Preface xxi 1 Introduction 1 2 Sources ofNoise and Methods of Coupling 5 2.1 SemiconductorDeviceNoiseandPhenomena .5 2.2 Noisefrom SwitchingVoltageandCurrent... 10 2.3 InductiveCoupling 11 2.4 CapacitiveCoupling 30 2.5 SubstrateCoupling .34 2.6 Summary .40 3 Semiconductor Device Simulation 43 3.1 Significance 43 vii SIMULATIONTECHNIQUESANDSOLUTIONSFORMIXED-SIGNALCOUPLINGINIC, 3.2 BasicEquations 44 3.3 BoundaryConditions .45 3.4 ModelsofPhysicalParameters 47 3.5 SpatialDiscretization 53 3.6 SolutionMethods 62 3.7 ARepresentativeExample 67 3.8 Summary 71 4 Simplified Substrate Modeling and Rapid Simulation 77 4.1 SimplifiedEquation 78 4.2 SpatialDiscretization 80 4.3 BoundaryConditions 83 4.4 SolutionMethods 84 4.5 AsymptoticWaveformEvaluation(AWE) 87 4.6 SubstrateAWEMacromodels 92 4.7 TransientSimulationofAWEMacromodels 97 4.8 SubstrateDCMacromodels 100 4.9 MatrixSolution 101 4.10 Results 107 4.11 Summary 114 5 Mesh Generation 117 5.1 AdaptiveMeshRefinement 117 5.2 APrioriMeshRefinement 120 5.3 Summary 124 6 Substrate Modeling in Heavily-Doped Bulk Processes 125 6.1 Motivation 125 6.2 SingleNodeSubstrateModel 127 6.3 ModifiedSingleNodeSubstrateModel 129 viii CONTENTS 6.4 Summary 133 7 Substrate Resistance Extraction for Large Circuits 135 7.1 NestedMacromodeling 135 7.2 InterpolatedMacromodeling 141 7.3 Summary 147 8 Modeling ChiplPackage Power Distribution 149 8.1 EffectofPowerBusStructureonNoisecoupling 149 8.2 Summary 180 9 Controlling Substrate Coupling in Heavily-Doped Bulk Processes 183 9.1 Characterizationofnoisecouplingconcepts 184 9.2 P+BulkWaferCharacterization 188 9.3 EffectofSubstratecontactplacementoncouplednoise .194 9.4 EffectofPackageInductanceonSubstratenoise .196 9.5 NoiseCouplingControlTechniques 203 9.6 Summary 214 10 Controlling Substrate Coupling in Bulk p. Wafers 217 10.1 BulkP-Wafer Characteristics 217 10.2 SubstrateAttenuation Structures 226 10.3 Summary 231 ix SIMULATIONTECHNIQUESANDSOLUTIONSFORMIXED-SIGNALCOUPLINGINICs 11 Chip/Package Shielding and Good Circuit Design Practice 235 11.1 FarFieldRadiatedEmissions 235 11.2 EffectofChipSignalIsolation/ShieldingTechniquesonNoise 240 11.3 EffectofPackagingonNoise 244 11.4 EffectofCardLayoutandReferencingonNoise 248 11.5 EffectofCircuitTopologyonNoise 249 11.6 Summary 252 12 A Design Example 255 12.1 DesignofaMixed-SignalIC 255 12.2 Summary 272 Appendices A Mesh Moments 275 B Convergence Behaviour ofIterative Methods 277 Index 279 x List ofFigures Chapter1 Chapter2 2.1 Blow-upofa5.5mmsquarechipwirebondedintoa68 pin PLCCpackage 12 2.2 Sidecross-sectionofaPlasticDualIn-linePackage(PDIP) with an imbeddedheat-sink.CourtesyofAmkor/Anam 13 2.3 CrosssectionofMQFPIPQFPpackage 14 2.4 SelfInductanceofawireloopinfree spacewithroundconductors 15 2.5 SelfInductanceofaroundconductoroveran idealgroundplane 16 2.6 WIREBONDWIREEXAMPLE-SelfInductancefrom bondpadto leadframefor68PLCC. (comerpin) 17 2.7 Flat,rectangularwireoveragroundplane 18 2.8 Routedsignalandreturm wires .19 2.9 EffectofGroundingthePackageLeads 21 2.10 Thefield fringing factor K 22 Ll 2.11 Mutualinductanceofroundorflat wiresoveragroundplane 23 2.12 Effectiveloopinductancewithopposingcurrentdirections 26 2.13 Effectiveinductancewithopposingcurrentdirections; halfofthe loop..27 2.14 Supplydecouplingcapacitordesignedtofit underneathaPLCC xi
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