Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

458 Pages·2015·18.644 MB·English

by  E-H Wong, Y.-W. Mai

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Woodhead Publishing Series in Electronic
and Optical Materials: Number 81
Robust Design of
Microelectronics
Assemblies Against
Mechanical Shock,
Temperature and
Moisture
E.-H. Wong and Y.-W. Mai
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Foreword
The reliability of electronic/photonic components, modules, and systems has been a
criticalissueinthemicroelectronicsindustryfordecades.Althoughtremendousefforts
and resources have been spent on this subject in the past, it continues to be a very
active research area in academia and industry due to the endless demands for higher
performance and better reliability from applications and markets. The main drivers
includemorecomplicatedoperatingenvironments,moremobileconsumerelectronics,
andtightergovernmentlegislationonlead-freeelectronicdevices.Ihavebeenstudy-
ingmicroelectronicsreliabilityforalmost20years.IamverypleasedtoseeDrE.-H.
WongandProf.Y.-W.Mai,whoaremylong-timefriendsandcolleaguesinthesame
research area, publish their book on Robust Design of Microelectronics Assemblies
Against Mechanical Shock, Temperature, and Moisture. This is a timely technical
monographonitsintendedsubjectforbothscientificresearchersandengineeringprac-
titioners.Thereaders ofthis bookwill benefitfromthefundamentaltheories andthe
casestudiesprovidedbytheauthors.Throughtheintroductionandpropagationofthis
book, I look forward to seeing more robust microelectronic products with better
reliability inthe market.
S.W. RickyLee,PhD
FellowofIEEE,ASME,IMAPS
Professorof Mechanical and Aerospace Engineering
Hong Kong University of Science andTechnology
Junior Past-President of IEEE Components
Packaging and Manufacturing Technology Society
Preface
Unlike the cautious design practices of aircraft, the automotive industry, buildings,
bridges, and machinery, microelectronic assemblies are designed to the very limit of
the strength of their constituting materials. Failures of microelectronic assemblies
arenotuncommonandtheyoffergoodlearningopportunities.Scientistsandengineers
in the microelectronic assembly community are presented with numerous opportuni-
ties totest the limit of their designs and learn from the failure analysis, aided by test
structuresbuiltintominiaturisedelectricalcircuitriestoprovidecontinuousmonitoring
ofstructuraldamageasitoccurs.Atthesametime,beingarelativelyyoungengineer-
ingfield,thedesignofmicroelectronicassembliesforrobustnesscantapintothevast
wealthof knowledge accumulated inthe other traditional fields ofengineering.
ThefirstideaforthisbookwasconceivedsoonafterEHWcompletedhisPhDat
theUniversityofSydneyin2006.Sizablematerialsforthisbookweretheresultof
research activities performed while EHW was with the Institute of Microelec-
tronics,Singapore.Whiletheintentofthisbookisprimarilyforthebenefitofprac-
ticing engineers, it is also a valuable textbook for graduate students who are
interestedinthedetailedelaborationgiventothetheoriesandthederivationofana-
lytical solutions.
The presentation of this book reflects the philosophy of the authors in addressing
engineering problems: that it is essential to develop a profound understanding of the
science behind a problem; examine critically the current practices, be ready to chal-
lengethemand,wheneverpossible,developmoreprecisesolutions;thebestsolution
istheonethatisconsistentwiththescienceandcanbeeasilyunderstoodandusedby
the practicing engineers.
Thisbookoffersanumberofimprovedsolutionstoexistingproblemsinthemicro-
electronicsassemblyindustry.Chapter2presentsanimprovedanalyticalsolutionfor
describing thermoelastic stresses in the bonding layer and in discrete solder joints.
Chapter 3 provides a unified equation that presents a simple and consistent method
of modelling the creep-fatigue of solder joints. Chapter 4 summarizes a number of
advancedtechniquesforcharacterizingmoisturediffusivity.Chapter5offersadvanced
techniques for modelling moisture diffusion in microelectronic assemblies using the
thermal-massmodellinganalogy.Chapters6to12presentacomprehensiveapproach
to investigating a new damage driver – the drop impact. In the process, new testing
techniquesareestablished,newmaterialcharacteristicsaregenerated,andnewanalyt-
icalsolutionsaredeveloped.Chapter7describesthedevelopmentofmicro-impacting
and the high speed cyclic bending test techniques; the former has been incorporated