Quality and Reliability Engineering International 1996: Vol 12 Table of Contents

5 Pages·1996·1.6 MB·English

QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL
(Qual. reliab. eng. int.)
CONTENTS
VOLUME 12, ISSUE Nos 1-6
Issue No. 1, January-February
Editorial
Performance of Cusum Charts from the Viewpoint of Change-point Estimation in the
Presence of Autocorrelation: K. Nishina and W. Peng-hsiung
Modelling and Estimation of Wafer Yields and Defect Densities from Microelectronics Test
Structure Data: C. K. Hansen and P. Thyregod
A Data Acquisition System for Machine Tool Condition Monitoring. Part 2—Some of the
Signals Acquired: P. R. Drake, A. D. Jennings and R. |. Grosvenor
Fuzzy Sets Approach to Quality Improvement: E. A. Glushkovsky and R. A. Florescu
Manufacturing Process Problem Analysis using Monte Carlo Simulation: A. Accumolli
Non-destructive Detection and Localization of Defects in Multilayer Ceramic Chip
Capacitors using Electromechanical Resonances: L. Bechou, S. Mejdi, Y. Ousten and
Y. Danto
Responding to Process Changes: R. Caulcutt
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Issue No. 2, March-April
Special Issue on Design of Experiments
Guest Editor: Alan Winterbottom
Editorial: A. Winterbottom
The Role of D.O.E. for Robust Engineering: A Commentary: G. Taguchi
Commentary on Taguchi’s Parameter Design with Dynamic Characteristics: A. Miller and
A Split-plot Experiment in an Automobile Windshield Fracture Resistance Test: W. L.
Gregory and W. Taam
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Indexed or abstracted by Cambridge Scientific Abstracts, Engineering Index, INSPEC, Materials Information,
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ii
VOLUME CONTENTS
Robust Reliability for Light Emitting Diodes using Degradation Measurements: C.-H. Chiao
and M. Hamada
Taguchi Parameter Design by Second-order Response Surfaces: J. Engel and A. F. Huele..
Application of Generalized Linear Models to the Design Improvement of an Engineering
Artefact: H. Su, J. A. Nelder, P. Wolbert and R. Spence
Parameter Design with Dynamic Characteristics: A Regression Perspective: G. S.
Wasserman
Tolerancing and Optimization for Model-based Robust Engineering Design: R. A. Bates and
Design of Experiments for Multi-stage Processes: M. Knof and M. Farrow
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Issue No. 3, May-June
Reflections on the Capability and Maturity Models of Engineering Processes: H. J. Kohoutek
Corrigenda: Short-run Statistical Process Control: O-chart Enhancements and Alternative
Methods: E. Del Castillo and D. C. Montgomery
Response to ‘Short-run Statistical Process Control: Q-chart Enhancements and Alternative
Methods’: C. P. Quesenberry
Response by the Authors to Dr Quesenberry’s Comments: E. Del Castillo and D. C.
Montgomery
Efficient Shift Detection Using Multivariate Exponentially-weighted Moving Average
Control Charts and Principal Components: R. Scranton, G. C. Runger, J. B. Keats and
D. C. Montgomery
Quality Engineering for Continuous Performance Improvement in Products and Processes:
A Review and Reflections: B. M. Dabade and P. K. Ray
Role of Substrate Current in the Reliability Life Testing of GaAs MMICs: K. Christianson,
J. Mittereder, J. Roussos and W. T. Anderson
Process Monitoring in Integrated Circuit Fabrication Using Both Yield and Spatial Statistics:
R. S. Collica, J. G. Ramirez and W. Taam
Statistical Process Monitoring with Principal Components: C. M. Mastrangelo, G. C. Runger
and D. C. Montgomery
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VOLUME CONTENTS
Issue No. 4, July-August
Special Issue: Papers presented at the European Symposium on Reliability
of Electron Devices, Failure Physics and Analysis 1995 (ESREF ’95)
Bordeaux-Arcachon, France, October 1995
Guest Editors: N. Labat and A. Touboul
Editorial
Design Based Failure Analysis and Yield Improvement in CMOS-Circuits: S. Griep, D. Keitel-
Schulz and D. Schmitt-Landsiedel
Improved Understanding of Physical Defect Mechanisms using Fault Simulation: T. C.
Garyet and N. Dickson
New Model for Reliability Prediction of Telecommunication Hardware: K. Edholm
Evaluation on a Two-day Time Scale of High-reliability Electronic Assemblies by /n-situ
Electrical and Opto-mechanical Test Techniques: G. Gregoris, F. Bouton, C. De
Keukeleire, P. Siliprandi, F. Baio, L. De Schepper, W. De Ceuninck, L. Tielemans, T.
Ahrens and M. Krumm
A New Failure Analysis Technique using the Thermo-electromotive Force Induced by Laser
Irradiation: Y. Mashiko, T. Koyama and H. Koyama
Localization of Soft Tungsten Contact Fails with Reliability Implications by Innovative
Reverse Engineering Techniques: J. Touzel, |. Neumann, H. Lorenz, C. Boit, H. Korner and
ESD Monitor Circuit—A Tool to Investigate the Susceptibility and Failure Mechanisms of
the Charged Device Model: P. Egger, H. Gieser, R. Kropf and X. Guggenmos
Reliability Challenges for Low Voltage/Low Power Integrated Circuits: J. M. Galbraith, K. F.
Galloway, R. D. Schrimpf and G. H. Johnson
Investigation of Reliability Measurements with Ramped and Constant Voltage Stress on
MOS Gate Oxides: A. Martin, P. O'Sullivan and A. Mathewson
Physical Mechanisms of Dielectric Breakdown in SiO, for the Range of -150°C to 150°C: W.
W. Abadeer and R.-P. Vollertsen
Comparison of Hot-carriers Effects in SOI and Bulk Devices Using a Photon Emission
Technique: E. Guichard, C. Leroux, D. Blachier, G. Reimbold, S. Cristoloveanu and G.
Plastic-strain of Aluminium Interconnections During Pulsed Operation of IGBT Multichip
Modules: M. Ciappa and P. Malberti
Electromigration of Interconnects of a TiN/Cu/TiN/Ti Structure: F. Braud, G. Tartavel, J.
Palleau, J. Torres, A. Persico and G. Reimbold
Comparison of Conventional and Pseudomorphic HEMTs Performances by Drain Current
Transient Spectroscopy and L. F. Channel Noise: N. Saysset, N. Labat, A. Touboul, Y.
Danto and J. M. Dumas
Highlighting of Two Types of Defects in 1300nm PBC Laser Diodes: B. Bauduin, J. Wallon,
D. Riviere and J. Y. Boulaire
A Study of Side Gate Test Structures in InAlAs/InGaAs HEMTs for Optoelectronic Circuit
Applications: C. Berthelemot, A. Farreng, P. Vigier, J. M. Dumas, A. Clei, R. Palla and
J. C. Harmand
Reliability Issues in Hybrid Optoelectronic Interconnect Systems: C. Pusarla, L. Lin and A.
Christou
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VOLUME CONTENTS
Issue No. 5 September-October
Editorial
Shewart Control Charts to Detect Mean and Standard Deviation Shifts Based on Group
Data: S. H. Steiner, P. L. Geyer and G. O. Wesolowsky
Tolerance Chart Balancing for Machining Process Planning: A. Jeang
Power Converter Failure Rate Prediction by Bayesian Analyses: L. Hart and B. Heller
Integrated Reliability Analysis System (IRAS): G. K6cza and A. Bossche
Economical Experimentation via ‘Lean Design’: T. N. Goh
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Call for Papers
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Report Review
Issue No. 6, November—December
Improving Automotive Dimensional Quality by using Principal Component Analysis: K.
Selecting the Best Defect Reduction Methodology: C. M. Hinckley and P. Barkan
Quality of V-process Moulds through the Taguchi Technique: P. B. Barua, P. Kumar and
J. L. Gaindhar
An Analysis of Failure-time Distributions for Product Design Optimization: D. Field and
EET EE NE Oe RA Aen 5 SNe SEE Tey FR SNIP Mey ND
Quality Improvement for RC06 Chip Resistor: Y.-C. Jeng and S.-M. Guo
Laser Probe Measurements of Quality Evolution of Solder Joints during Thermal Cycling
Ageing Tests: V. Quintard, B. Parmentier, T. Phan, D. Lewis, S. Dilhaire and W. Claeys....
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