Post-Processing Techniques for Integrated MEMS PDF
219 Pages·2005·2.593 MB·English
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Description:
Sedky (physics, The American University, Cairo, Egypt) investigates the possibility of developing high-quality MEMS structural layers at temperatures compatible with the standard CMOS backend. He first reviews MEMS fabrication technologies, then defines the maximum thermal budget that can be accommodated by prefabricated standard electronics. He highlights the features of different materials suitable for MEMS, and discusses the effect of deposition conditions and the type of substrate on the physical properties of the different materials. Silicon germanium as a MEMS structural layer is also discussed in detail.
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