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Package Information Datasheet for Mature Altera Devices DS-PKG-16.8 Thisdatasheetprovidespackageandthermalresistanceinformationformature Altera®devices.Packageinformationincludestheorderingcodereference,package acronym,leadframematerial,leadfinish(plating),JEDECoutlinereference,lead coplanarity,weight,moisturesensitivitylevel,andotherspecialinformation.The thermalresistanceinformationincludesdevicepincount,packagename,and resistancevalues. Thisdatasheetincludesthefollowingsections: ■ “DeviceandPackageCrossReference”onpage1 ■ “ThermalResistance”onpage23 ■ “PackageOutlines”onpage44 f FormorepackageandthermalresistanceinformationaboutAlteradevicesthatare notlistedinthisdatasheet,refertothePackageandThermalResistancepageofthe Alterawebsite. f Forinformationabouttrays,tubes,anddrypacks,refertoAN71:Guidelinesfor HandlingJ-Lead,QFP,andBGADevices. f RoHS-compliantdevicesarecompatiblewithleaded-reflowtemperatures.Formore information,refertoAltera’sRoHS-CompliantDevicesliteraturepage. Device and Package Cross Reference Table2throughTable22liststhedevice,packagetype,andnumberofpinsforeach Alteradevicelistedinthisdatasheet.Alteradeviceslistedinthisdatasheetare availableinthefollowingpackages: ■ Ball-GridArray(BGA) ■ CeramicPin-GridArray(PGA) ■ FineLineBGA(FBGA) ■ HybridFineLineBGA(HBGA) ■ PlasticDualIn-LinePackage(PDIP) ■ PlasticEnhancedQuadFlatPack(EQFP) ■ PlasticJ-LeadChipCarrier(PLCC) ■ PlasticQuadFlatPack(PQFP) ■ PowerQuadFlatPack(RQFP) ■ ThinQuadFlatPack(TQFP) ■ UltraFineLineBGA(UBGA) ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 2 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table1liststheAlteradevicesandtheassociatedtablelocations. Table1.MatureAlteraDeviceandPackageCrossReference AlteraDevice Tablelocations Arria®seriesFPGAs ■ ArriaGXDevices:Table2onpage3 ■ StratixIIDevices:Table3onpage3 Stratix®seriesFPGAs ■ StratixDevices:Table4onpage5 ■ CycloneIIDevices:Table5onpage7 Cyclone®seriesFPGAs ■ CycloneDevices:Table6onpage8 ■ MAX9000Devices:Table7onpage8 MAX®seriesCPLDs ■ MAX7000Devices:Table8onpage9 ■ MAX3000ADevices:Table9onpage10 ■ HardCopyIIDevices:Table10onpage11 HardCopy®seriesASICs ■ HardCopyDevices:Table11onpage11 ■ HardCopyAPEXDevices:Table12onpage12 ■ APEXIIDevices:Table13onpage13 ■ APEX20KEDevices:Table14onpage13 APEX™seriesFPGAs ■ APEX20KCDevices:Table15onpage15 ■ APEX20KDevices:Table16onpage15 ACEX®1KFPGAs ACEX1KDevices:Table17onpage16 Mercury™FPGAs MercuryDevices:Table18onpage17 ■ FLEX10KADevices:Table19onpage17 FLEX®seriesFPGAs ■ FLEX10KSDevices:Table20onpage18 ■ FLEX10KEDevices:Table21onpage18 Excalibur™FPGAs ExcaliburDevices:Table22onpage21 Configurationdevices ConfigurationDevices:Table23onpage22 Enhancedconfigurationdevices EnhancedConfigurationDevices:Table24onpage22 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 3 DeviceandPackageCrossReference Arria GX Devices Table2liststhedevicename,packagetype,andnumberofpinsfortheArriaGX devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table2.ArriaGXDevices Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP1AGX20 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP1AGX35 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 ChannelLid:FBGA,FlipChip,Option1 484 Dual-PieceLid:FBGA,FlipChip,Option1 780 EP1AGX50 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 ChannelLid:FBGA,FlipChip,Option1 484 Dual-PieceLid:FBGA,FlipChip,Option1 780 EP1AGX60 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP1AGX90 1152 Single-PieceLid:FBGA,FlipChip,Option2 Stratix II Devices Table3liststhedevicename,packagetype,andnumberofpinsfortheStratixII devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table3.StratixIIDevices (Part1of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP2S15 Dual-PieceLid:FBGA,FlipChip,Option1 672 Single-PieceLid:FBGA,FlipChip,Option4 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 4 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table3.StratixIIDevices (Part2of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP2S30 Dual-PieceLid:FBGA,FlipChip,Option1 672 Single-PieceLid:FBGA,FlipChip,Option4 Dual-PieceLid:FBGA,FlipChip,Option1 484 Dual-PieceLid:FBGA,FlipChip,Option1 672 EP2S60 Single-PieceLid:FBGA,FlipChip,Option4 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,option2 ChannelLid:HBGA,FlipChip 484 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 EP2S90 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 ChannelLid:FBGA,FlipChip,Option1 780 Dual-PieceLid:FBGA,FlipChip,Option1 1020 EP2S130 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 EP2S180 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP2SGX30 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 EP2SGX60 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 EP2SGX90 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP2SGX130 1508 Single-PieceLid:FBGA,FlipChip,Option2 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 5 DeviceandPackageCrossReference Stratix Devices Table4liststhedevicename,packagetype,andnumberofpinsfortheStratixdevice family. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table4.StratixDevices (Part1of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 EP1SGX10 672 Single-PieceLid:FBGA,FlipChip,Option4 Dual-PieceLid:FBGA,FlipChip,Option1 672 Single-PieceLid:FBGA,FlipChip,Option4 EP1SGX25 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP1SGX40 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 BGA,WireBond 672 EP1S10 FBGA,WireBond,Option2 672 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 BGA,WireBond 672 EP1S20 FBGA,WireBond,Option2 672 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 BGA,WireBond 672 FBGA,WireBond,Option2 672 Dual-PieceLid:FBGA,FlipChip,Option1 EP1S25 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:BGA,FlipChip,Option1 EP1S30 956 Single-PieceLid:BGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 6 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table4.StratixDevices (Part2of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:BGA,FlipChip,Option1 956 Single-PieceLid:BGA,FlipChip,Option2 EP1S40 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:BGA,FlipChip,Option1 956 Single-PieceLid:BGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP1S60 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:BGA,FlipChip,Option1 956 Single-PieceLid:BGA,FlipChip,Option2 EP1S80 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 7 DeviceandPackageCrossReference Cyclone II Devices Table5liststhedevicename,packagetype,andnumberofpinsfortheCycloneII devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table5.CycloneIIDevices Device Package Pins TQFP,WireBond 144 EP2C5 PQFP,WireBond 208 FBGA,WireBond,Option2,Thin 256 TQFP,WireBond 144 EP2C8 PQFP,WireBond 208 FBGA,WireBond,Option2,Thin 256 EP2C8A FBGA,WireBond,Option2,Thin 256 FBGA,WireBond,Option2,Thin 256 EP2C15A FBGA,WireBond,A:2.40 484 PQFP,WireBond 240 EP2C20 FBGA,WireBond,Option2,Thin 256 FBGA,WireBond,A:2.40 484 FBGA,WireBond,Option2,Thin 256 EP2C20A FBGA,WireBond,A:2.40 484 FBGA,WireBond,A:2.40 484 EP2C35 UBGA,WireBond 484 FBGA,WireBond,A:2.40 672 FBGA,WireBond,A:2.40 484 EP2C50 UBGA,WireBond 484 FBGA,WireBond,A:2.40 672 FBGA,WireBond,A:2.40 672 EP2C70 FBGA,WireBond,A:2.40 896 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 8 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Cyclone Devices Table6liststhedevicename,packagetype,andnumberofpinsfortheCyclone devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table6.CycloneDevices Device Package Pins TQFP,WireBond 100 EP1C3 TQFP,WireBond 144 FBGA,WireBond,Option1 324 EP1C4 FBGA,WireBond 400 TQFP,WireBond 144 EP1C6 PQFP,WireBond 240 FBGA,WireBond,Option1 256 PQFP,WireBond 240 EP1C12 FBGA,WireBond,Option1 256 FBGA,WireBond,Option1 324 FBGA,WireBond,Option1 324 EP1C20 FBGA,WireBond 400 MAX 9000 Devices Table7liststhedevicename,packagetype,andnumberofpinsfortheMAX9000 devicefamily. Table7.MAX9000Devices Device Package Pins EPM9320 BGA,WireBond 356 EPM9320A BGA,WireBond 356 EPM9560 BGA,WireBond 356 MAX 7000 Devices Table8liststhedevicename,packagetype,andnumberofpinsfortheMAX7000 devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 9 DeviceandPackageCrossReference Table8.MAX7000Devices (Part1of2) Device Package Pins PLCC,WireBond 44 EPM7032B TQFP,WireBond 44 UBGA,WireBond 49 TQFP,WireBond 44 UBGA,WireBond 49 EPM7064B FBGA,WireBond,Option1 100 TQFP,WireBond 100 UBGA,WireBond 49 TQFP,WireBond 100 FBGA,WireBond,Option1 100 EPM7128B TQFP,WireBond 144 UBGA,WireBond 169 FBGA,WireBond,Option1 256 TQFP,WireBond 100 TQFP,WireBond 144 EPM7256B UBGA,WireBond 169 PQFP,WireBond 208 FBGA,WireBond,Option1 256 TQFP,WireBond 144 UBGA,WireBond 169 EPM7512B PQFP,WireBond 208 FBGA,WireBond,Option1 256 BGA,WireBond,Option1 256 PLCC,WireBond 44 EPM7032AE TQFP,WireBond 44 PLCC,WireBond 44 UBGA,WireBond 49 FBGA,WireBond,Option1 100 EPM7064AE TQFP,WireBond 44 TQFP,WireBond 100 FBGA,WireBond,Option1 256 PLCC,WireBond 84 FBGA,WireBond,Option1 100 TQFP,WireBond 100 EPM7128AE TQFP,WireBond 144 UBGA,WireBond 169 FBGA,WireBond,Option1 256 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 10 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table8.MAX7000Devices (Part2of2) Device Package Pins TQFP,WireBond 100 FBGA,WireBond,Option1 100 EPM7256AE TQFP,WireBond 144 PQFP,WireBond 208 FBGA,WireBond,Option1 256 TQFP,WireBond 144 PQFP,WireBond 208 EPM7512AE BGA,WireBond,Option1 256 FBGA,WireBond,Option1 256 PLCC,WireBond 44 EPM7032A TQFP,WireBond 44 PLCC,WireBond 84 TQFP,WireBond 100 EPM7128A FBGA,WireBond 100 TQFP,WireBond 144 FBGA,WireBond,Option1 256 TQFP,WireBond 100 TQFP,WireBond 144 EPM7256A PQFP,WireBond 208 FBGA,WireBond,Option1 256 EPM7192E PGA,WireBond 160 PQFP,WireBond 160 MAX 3000A Devices Table8liststhedevicename,packagetype,andnumberofpinsfortheMAX3000A devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table9.MAX3000ADevices (Part1of2) Device Package Pins PLCC,WireBond 44 EPM3032A TQFP,WireBond 44 TQFP,WireBond 44 EPM3064A PLCC,WireBond 44 TQFP,WireBond 100 EPM3128A TQFP,WireBond 100 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation

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HardCopy Devices: Table 11 on page 11. □ HardCopy APEX Devices: Table 12 on page 12. APEX™ series FPGAs. □ APEX II Devices: Table 13 on
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Package Information Datasheet for Altera Devices PDF

182 Pages·2011·2 MB·English
by  Altera Corporation
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Package Information Datasheet for Mature Altera Devices DS-PKG-16.8 Thisdatasheetprovidespackageandthermalresistanceinformationformature Altera®devices.Packageinformationincludestheorderingcodereference,package acronym,leadframematerial,leadfinish(plating),JEDECoutlinereference,lead coplanarity,weight,moisturesensitivitylevel,andotherspecialinformation.The thermalresistanceinformationincludesdevicepincount,packagename,and resistancevalues. Thisdatasheetincludesthefollowingsections: ■ “DeviceandPackageCrossReference”onpage1 ■ “ThermalResistance”onpage23 ■ “PackageOutlines”onpage44 f FormorepackageandthermalresistanceinformationaboutAlteradevicesthatare notlistedinthisdatasheet,refertothePackageandThermalResistancepageofthe Alterawebsite. f Forinformationabouttrays,tubes,anddrypacks,refertoAN71:Guidelinesfor HandlingJ-Lead,QFP,andBGADevices. f RoHS-compliantdevicesarecompatiblewithleaded-reflowtemperatures.Formore information,refertoAltera’sRoHS-CompliantDevicesliteraturepage. Device and Package Cross Reference Table2throughTable22liststhedevice,packagetype,andnumberofpinsforeach Alteradevicelistedinthisdatasheet.Alteradeviceslistedinthisdatasheetare availableinthefollowingpackages: ■ Ball-GridArray(BGA) ■ CeramicPin-GridArray(PGA) ■ FineLineBGA(FBGA) ■ HybridFineLineBGA(HBGA) ■ PlasticDualIn-LinePackage(PDIP) ■ PlasticEnhancedQuadFlatPack(EQFP) ■ PlasticJ-LeadChipCarrier(PLCC) ■ PlasticQuadFlatPack(PQFP) ■ PowerQuadFlatPack(RQFP) ■ ThinQuadFlatPack(TQFP) ■ UltraFineLineBGA(UBGA) ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 2 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table1liststheAlteradevicesandtheassociatedtablelocations. Table1.MatureAlteraDeviceandPackageCrossReference AlteraDevice Tablelocations Arria®seriesFPGAs ■ ArriaGXDevices:Table2onpage3 ■ StratixIIDevices:Table3onpage3 Stratix®seriesFPGAs ■ StratixDevices:Table4onpage5 ■ CycloneIIDevices:Table5onpage7 Cyclone®seriesFPGAs ■ CycloneDevices:Table6onpage8 ■ MAX9000Devices:Table7onpage8 MAX®seriesCPLDs ■ MAX7000Devices:Table8onpage9 ■ MAX3000ADevices:Table9onpage10 ■ HardCopyIIDevices:Table10onpage11 HardCopy®seriesASICs ■ HardCopyDevices:Table11onpage11 ■ HardCopyAPEXDevices:Table12onpage12 ■ APEXIIDevices:Table13onpage13 ■ APEX20KEDevices:Table14onpage13 APEX™seriesFPGAs ■ APEX20KCDevices:Table15onpage15 ■ APEX20KDevices:Table16onpage15 ACEX®1KFPGAs ACEX1KDevices:Table17onpage16 Mercury™FPGAs MercuryDevices:Table18onpage17 ■ FLEX10KADevices:Table19onpage17 FLEX®seriesFPGAs ■ FLEX10KSDevices:Table20onpage18 ■ FLEX10KEDevices:Table21onpage18 Excalibur™FPGAs ExcaliburDevices:Table22onpage21 Configurationdevices ConfigurationDevices:Table23onpage22 Enhancedconfigurationdevices EnhancedConfigurationDevices:Table24onpage22 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 3 DeviceandPackageCrossReference Arria GX Devices Table2liststhedevicename,packagetype,andnumberofpinsfortheArriaGX devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table2.ArriaGXDevices Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP1AGX20 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP1AGX35 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 ChannelLid:FBGA,FlipChip,Option1 484 Dual-PieceLid:FBGA,FlipChip,Option1 780 EP1AGX50 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 ChannelLid:FBGA,FlipChip,Option1 484 Dual-PieceLid:FBGA,FlipChip,Option1 780 EP1AGX60 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP1AGX90 1152 Single-PieceLid:FBGA,FlipChip,Option2 Stratix II Devices Table3liststhedevicename,packagetype,andnumberofpinsfortheStratixII devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table3.StratixIIDevices (Part1of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP2S15 Dual-PieceLid:FBGA,FlipChip,Option1 672 Single-PieceLid:FBGA,FlipChip,Option4 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 4 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table3.StratixIIDevices (Part2of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 EP2S30 Dual-PieceLid:FBGA,FlipChip,Option1 672 Single-PieceLid:FBGA,FlipChip,Option4 Dual-PieceLid:FBGA,FlipChip,Option1 484 Dual-PieceLid:FBGA,FlipChip,Option1 672 EP2S60 Single-PieceLid:FBGA,FlipChip,Option4 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,option2 ChannelLid:HBGA,FlipChip 484 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 EP2S90 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 ChannelLid:FBGA,FlipChip,Option1 780 Dual-PieceLid:FBGA,FlipChip,Option1 1020 EP2S130 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 EP2S180 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP2SGX30 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 EP2SGX60 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1152 Single-PieceLid:FBGA,FlipChip,Option2 EP2SGX90 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP2SGX130 1508 Single-PieceLid:FBGA,FlipChip,Option2 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 5 DeviceandPackageCrossReference Stratix Devices Table4liststhedevicename,packagetype,andnumberofpinsfortheStratixdevice family. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table4.StratixDevices (Part1of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 EP1SGX10 672 Single-PieceLid:FBGA,FlipChip,Option4 Dual-PieceLid:FBGA,FlipChip,Option1 672 Single-PieceLid:FBGA,FlipChip,Option4 EP1SGX25 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP1SGX40 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 BGA,WireBond 672 EP1S10 FBGA,WireBond,Option2 672 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 484 Single-PieceLid:FBGA,FlipChip,Option4 BGA,WireBond 672 EP1S20 FBGA,WireBond,Option2 672 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 BGA,WireBond 672 FBGA,WireBond,Option2 672 Dual-PieceLid:FBGA,FlipChip,Option1 EP1S25 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:BGA,FlipChip,Option1 EP1S30 956 Single-PieceLid:BGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 6 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table4.StratixDevices (Part2of2) Device Package Pins Dual-PieceLid:FBGA,FlipChip,Option1 780 Single-PieceLid:FBGA,FlipChip,Option3 Dual-PieceLid:BGA,FlipChip,Option1 956 Single-PieceLid:BGA,FlipChip,Option2 EP1S40 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:BGA,FlipChip,Option1 956 Single-PieceLid:BGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 EP1S60 1020 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 Dual-PieceLid:BGA,FlipChip,Option1 956 Single-PieceLid:BGA,FlipChip,Option2 EP1S80 Dual-PieceLid:FBGA,FlipChip,Option1 1020 Dual-PieceLid:FBGA,FlipChip,Option1 1508 Single-PieceLid:FBGA,FlipChip,Option2 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 7 DeviceandPackageCrossReference Cyclone II Devices Table5liststhedevicename,packagetype,andnumberofpinsfortheCycloneII devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table5.CycloneIIDevices Device Package Pins TQFP,WireBond 144 EP2C5 PQFP,WireBond 208 FBGA,WireBond,Option2,Thin 256 TQFP,WireBond 144 EP2C8 PQFP,WireBond 208 FBGA,WireBond,Option2,Thin 256 EP2C8A FBGA,WireBond,Option2,Thin 256 FBGA,WireBond,Option2,Thin 256 EP2C15A FBGA,WireBond,A:2.40 484 PQFP,WireBond 240 EP2C20 FBGA,WireBond,Option2,Thin 256 FBGA,WireBond,A:2.40 484 FBGA,WireBond,Option2,Thin 256 EP2C20A FBGA,WireBond,A:2.40 484 FBGA,WireBond,A:2.40 484 EP2C35 UBGA,WireBond 484 FBGA,WireBond,A:2.40 672 FBGA,WireBond,A:2.40 484 EP2C50 UBGA,WireBond 484 FBGA,WireBond,A:2.40 672 FBGA,WireBond,A:2.40 672 EP2C70 FBGA,WireBond,A:2.40 896 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 8 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Cyclone Devices Table6liststhedevicename,packagetype,andnumberofpinsfortheCyclone devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table6.CycloneDevices Device Package Pins TQFP,WireBond 100 EP1C3 TQFP,WireBond 144 FBGA,WireBond,Option1 324 EP1C4 FBGA,WireBond 400 TQFP,WireBond 144 EP1C6 PQFP,WireBond 240 FBGA,WireBond,Option1 256 PQFP,WireBond 240 EP1C12 FBGA,WireBond,Option1 256 FBGA,WireBond,Option1 324 FBGA,WireBond,Option1 324 EP1C20 FBGA,WireBond 400 MAX 9000 Devices Table7liststhedevicename,packagetype,andnumberofpinsfortheMAX9000 devicefamily. Table7.MAX9000Devices Device Package Pins EPM9320 BGA,WireBond 356 EPM9320A BGA,WireBond 356 EPM9560 BGA,WireBond 356 MAX 7000 Devices Table8liststhedevicename,packagetype,andnumberofpinsfortheMAX7000 devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 9 DeviceandPackageCrossReference Table8.MAX7000Devices (Part1of2) Device Package Pins PLCC,WireBond 44 EPM7032B TQFP,WireBond 44 UBGA,WireBond 49 TQFP,WireBond 44 UBGA,WireBond 49 EPM7064B FBGA,WireBond,Option1 100 TQFP,WireBond 100 UBGA,WireBond 49 TQFP,WireBond 100 FBGA,WireBond,Option1 100 EPM7128B TQFP,WireBond 144 UBGA,WireBond 169 FBGA,WireBond,Option1 256 TQFP,WireBond 100 TQFP,WireBond 144 EPM7256B UBGA,WireBond 169 PQFP,WireBond 208 FBGA,WireBond,Option1 256 TQFP,WireBond 144 UBGA,WireBond 169 EPM7512B PQFP,WireBond 208 FBGA,WireBond,Option1 256 BGA,WireBond,Option1 256 PLCC,WireBond 44 EPM7032AE TQFP,WireBond 44 PLCC,WireBond 44 UBGA,WireBond 49 FBGA,WireBond,Option1 100 EPM7064AE TQFP,WireBond 44 TQFP,WireBond 100 FBGA,WireBond,Option1 256 PLCC,WireBond 84 FBGA,WireBond,Option1 100 TQFP,WireBond 100 EPM7128AE TQFP,WireBond 144 UBGA,WireBond 169 FBGA,WireBond,Option1 256 ©December2011 AlteraCorporation PackageInformationDatasheetforMatureAlteraDevices 10 PackageInformationDatasheetforMatureAlteraDevices DeviceandPackageCrossReference Table8.MAX7000Devices (Part2of2) Device Package Pins TQFP,WireBond 100 FBGA,WireBond,Option1 100 EPM7256AE TQFP,WireBond 144 PQFP,WireBond 208 FBGA,WireBond,Option1 256 TQFP,WireBond 144 PQFP,WireBond 208 EPM7512AE BGA,WireBond,Option1 256 FBGA,WireBond,Option1 256 PLCC,WireBond 44 EPM7032A TQFP,WireBond 44 PLCC,WireBond 84 TQFP,WireBond 100 EPM7128A FBGA,WireBond 100 TQFP,WireBond 144 FBGA,WireBond,Option1 256 TQFP,WireBond 100 TQFP,WireBond 144 EPM7256A PQFP,WireBond 208 FBGA,WireBond,Option1 256 EPM7192E PGA,WireBond 160 PQFP,WireBond 160 MAX 3000A Devices Table8liststhedevicename,packagetype,andnumberofpinsfortheMAX3000A devicefamily. 1 Thepackagetypeentrieswith“Option#”refertoinstanceswheremultiplepackage optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe specifictypeusedbythecorrespondingdevicedensity. Table9.MAX3000ADevices (Part1of2) Device Package Pins PLCC,WireBond 44 EPM3032A TQFP,WireBond 44 TQFP,WireBond 44 EPM3064A PLCC,WireBond 44 TQFP,WireBond 100 EPM3128A TQFP,WireBond 100 PackageInformationDatasheetforMatureAlteraDevices ©December2011 AlteraCorporation

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HardCopy Devices: Table 11 on page 11. □ HardCopy APEX Devices: Table 12 on page 12. APEX™ series FPGAs. □ APEX II Devices: Table 13 on
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