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NIST PUBLICATIONS 7T>T! t'. A11107 3 3N L v 1 REFERENCE ONICS Quantum o JO Il5(» # 73^7 3L06-j The Electronics and Electrical Engineering Laboratory One ofNIST’s seven Measurement and Standards Laboratories, EEEL conducts research, provides measurement services, and helps set standards in support of: the fundamental electronic technologies ofsemiconductors, magnetics, and superconduc- tors; information and communications technologies, such as fiber optics, photonics, microwaves, electronic displays, and electronics manufacturing supply chain collaboration; foren- sics and security measurement instrumentation; fundamental and practical physical standards and measurement services for electrical quantities; maintaining the quality and integrity of electrical power systems; and the development ofnanoscale and microelectromechanical devices. EEEL provides support to law enforcement, corrections, and criminaljustice agencies, including homeland security. EEEL consists offour programmatic divisions and two matrix- managed offices: Semiconductor Electronics Division Optoelectronics Division Quantum Electrical Metrology Division Electromagnetics Division Office ofMicroelectronics Programs Office ofLaw Enforcement Standards This document describes the technical programs ofthe Office ofMicroelectronics Programs. Similar documents describing the other Divisions and Offices are available. Contact NIST/ EEEL. 100 Bureau Drive, MS 8100, Gaithersburg, MD 20899- 8100, Telephone: (301 975-2220, On the Web: ) www.eeel.nist.gov Covercaption: (clockwisefrom lowerleft) ctyogen-freeX-raymicrocalorimeterspectrometerundergoing vibration testingonSEM, environmentalsupportfortheelectronics industry’forthefullproductlifecycle, deep Ultraviolet Twyman GreenInterferometer, andpatternedsilicon wafer; (background) analysis of criticaldimensiondata usingSmallAngleX-rayScatteringyields directmeasurementofsidewallangle. Electronics and Electrical Engineering Laboratory Office of Microelectronics Programs Programs, Activities, and Accomplishments NISTIR 7367 January2007 U.S. DEPARTMENT OF COMMERCE Carlos M. Gutierrez, Secretary TechnologyAdministration Robert Cresanti, UnderSecretary ofCommerce forTechnology National Institute ofStandards and Technology William Jeffrey, Director Disclaimer Disclaimer: Certain commercial equipment and/or software are identified in this report to adequately describe the experimental procedure. Such identification does not imply recom- mendation or endorsement by the National Institute ofStandards and Technology, nor does it imply that the equipment and/or software identified is necessarily the best available for the purpose. References: ReferencesmadetotheInternationalTechnology'RoadmapforSemiconductors (ITRS) apply to the most recent edition, dated 2005. Semiconductor Industry Association. The International Technology Roadmap for Semicon- ductors, 2005 edition. SEMATECH: Austin, TX, 2005. This document is available on-line at URL: http://public.itrs.net or in printed copy by con- tacting SEMATECH, 2706 Montopolis Drive,Austin,TX 78741, ITRS department 860-008, phone: (512) 356-3500. The reader will notice that there are acronyms and abbreviations throughout this document that are not spelled out due to space limitations. We have listed the acronyms and abbrevia- tions in an appendix at the end ofthis document. Contents Welcome and Introduction v Office ofMicroelectronics Programs Organization vii Lithography Metrology Program 1 Metrology Supporting Deep Ultraviolet Lithography 3 Metrology Supporting Extreme Ultraviolet Lithography 9 Polymer Photoresist Fundamentals forNext-Generation Lithography 15 Critical Dimension and Overlay Metrology Program 21 Wafer-Level and Mask Critical Dimension Metrology 22 Scanning Electron Microscope-Based Dimensional Metrology 23 Scatterometry-Based Dimensional Metrology 29 Scanning Probe Microscope-Based Dimensional Metrology 33 Small Angle X-Ray Scattering-Based Dimensional Metrology 39 CD Fabrication and Calibration Metrology for Single-Crystal Reference Materials ..43 Optical-Based Photomask Dimensional Metrology 49 Model-Based Linewidth Metrology 53 Atom-Based Dimensional Metrology 57 Wafer-Level and Overlay Metrology 61 Front-End Processing Metrology Program 67 Wafer and Chuck Flatness Metrology 69 Modeling, Measurements, and Standards forWafer Surface Inspection 73 Front-End Materials Characterization 77 Interconnect and Packaging Metrology Program 87 Atomic Layer Deposition- Process Models and Metrology 89 Superconformal Deposition: Copper andAdvanced Interconnect Materials 95 Interconnect Materials and Reliability Metrology 98 Basic Materials Properties 99 Test Structures ForInterconnect Metrology and Modeling 107 Solders and Solderability Measurements for Microelectronics 113 Process Metrology Program 117 Gas Property Data and Flow Standards for Improved Gas Delivery Systems 119 Low Concentration ofHumidity Standards 123 Temperature Measurements and Standards for Semiconductor Processing 129 Plasma Process Metrology 133 Assessment ofMeasurements and Standards for Gas Phase Processes in Semiconductor Device Manufacturing 139 Semiconductor Microelectronics and Nanoelectronics Programs iii 1 Analysis Tools and Techniques Program 141 Thin-Film X-Ray Metrology for Microelectronics 143 Electron Microscope Tomography ofElectronic Materials 149 High-Resolution MicrocalorimeterX-Ray Spectrometer for Chemical Analysis 15 Device Design and Characterization Program 157 Device Characterization and Reliability 159 Nanoelectronic Device Metrology 165 Power Semiconductor Device Metrology 171 Organic Electronics Metrology 175 Micro- andNano-Electro-Mechanical Technology Metrology 179 NIST’s Center forNanoscale Science and Technology Nanofab 183 Metrology for Spintronic Devices 185 BioElectronics Metrology 191 System Design and Test Metrology Program 195 Metrology for System-on-a-Chip 197 At-Speed Test ofDigital Integrated Circuits 201 Thermal Measurements and Packaging Reliability 205 Manufacturing Support Program 211 Factory Time Synchronization Standards Development for E-Manufacturing 213 E-Diagnostics Security 215 Engineering Chain Management in the Semiconductor Industry 217 NIST/SEMATECH E-Handbook ofStatistical Methods 219 Abbreviations andAcronyms 220 Technical Contacts 224 Welcome and Introduction Welcome The microelectronics industry supplies vital components to the electronics industry and to the U.S. economy, enablingrapid improvements in productivity and in new high technology growth industries such as electronic commerce and biotechnology. TheNational Institute of StandardsandTechnology,NIST, in fulfilling itsmissionofstrengtheningtheU.S. economy, works with industry to develop and apply technology, measurements and standards; and ap- plies substantial efforts on behalfofthe semiconductor industry and its infrastructure. This report describes the many projects being conducted at NIST that constitute that effort. Historical Perspective NIST’s predecessor, theNational Bureau ofStandards (NBS), began work in themid-1950s to meet themeasurementneedsofthe infant semiconductorindustry. While thiswas initially focusedontransistorapplicationsinothergovernmentagencies, intheearly 1960stheBureau sought industry guidance from theAmerican Society forTesting and Materials (ASTM) and theU.S. Electronic IndustriesAssociation (EIA).ASTM'stopprioritywasthe accuratemea- surement ofsilicon resistivity. NBS scientists developed a practical nondestructive method ten times more precise than previous destructive methods. The method is the basis for five industrial standards and for resistivity standard reference materials widely used to calibrate the industry’smeasurementinstruments.Thesecondproject,recommendedbyapanelofEIA experts, addressed the “second breakdown” failure mechanism oftransistors. The results of this project have been widely applied, including solving a problem in main engine control responsible for delaying the launch ofa space shuttle. Fromthesebeginnings,by 1980the semiconductormetrologyprogramhadgrowntoemploy a staffof60 with a $6 million budget, mostly from a variety ofother government agencies. CongressionalfundinginthatyeargaveNBStheinternalmeanstomaintainitssemiconductor metrology work. Meeting industrial needs remained the most important guide for managing the program. Industrial Metrology Needs Bythelate 1980s,NBS (nowNIST)recognizedthatthesemiconductorindustrywasapplying a much wider range ofscience and engineeringtechnology than the existing NIST program was designed to cover. The necessary expertise existed at NIST, but in other parts ofthe organization. In 1991, NIST established the Office ofMicroelectronics Programs (OMP) to coordinateandfundmetrologicalresearchanddevelopmentacrosstheagency, andtoprovide the industry with easy single point access to NIST’s widespread projects. Roadmaps devel- oped by the U.S. Semiconductor Industry Association (SIA) have independently identified the broad technological coverage and growing industrial needs for NIST’s semiconductor metrology developments. As the available funding and the scope ofthe activities grew, the collective namebecame theNational SemiconductorMetrologyProgram (NSMP), operated by the OMP. TheNSMPhas stimulateda greater interest in semiconductormetrology, motivatingmostof NIST’s laboratoriestolaunchadditionalprojectsoftheirownandtocost-share OMP-funded projects.Theprojectsdescribedinthisbookrepresentthisbroaderportfolioofmicroelectron- ics projects. Most, but not all, ofthe projects described are partially funded by the NSMP, which is providing a $12 million budget in fiscal year2006. Semiconductor Microelectronics and Nanoelectronics Programs Fostering NIST's Relationships with the Industry NIST’srelationshipswiththeSIA, SEMATECHanditssubsidiary. International SEMATECH ManufacturingInitiative(ISMI),andthe SemiconductorResearchCorporation(SRC)arealso coordinated through the OMR Stafffrom OMP and NIST Laboratories represents NIST on the SIAcommitteesthat developthe International Technology Roadmap for Semiconductors (ITRS), as well as on numerous SRC Technical Advisory Boards. NIST staffis also active in the semiconductor standards development work oftheASTM, the International National Electronics Manufacturers Initiative (iNEMI), the EIA, the International Organization for Standardization (ISO), and Semiconductor Equipment and Materials International (SEMI). Learn More About Semiconductor Metrology at NIST This publication provides summaries ofNIST’s metrology projects for the silicon semicon- ductor industry and their suppliers ofmaterials and manufacturing equipment. Each project responds to one or more metrology requirements identified by the industry in sources such as the ITRS. NIST is committed to listening to the needs ofindustry, working with industry representativestoestablishpriorities,andrespondingwhereresourcespermitwitheffectivemea- surement technology and services. For further information, please contactNIST as follows: Office ofMicroelectronic Programs National Institute ofStandards and Technology 00 Bureau Drive 1 Building 225, Room A317, Mail Stop 8101 MD Gaithersburg, 20899-8101 Telephone: (301) 975-4400 Fax: (301) 975-6513 e-mail: [email protected] Internet: http://www.eeel.nist.gov/omp Office of Microelectronics Programs Organization KNIGHT, Stephen (Director) [email protected] (301) 975-2871 MARTINEZ DE PINILLOS, Joaquin V. (Senior Scientist) [email protected] (301) 975-8125 BUCKLEY, Michele L. (Secretary) [email protected] (301)975-4400 Fromlefttoright: JoaquinMartinezdePinillos. StephenKnight, andMicheleBuckley. Semiconductor Microelectronics and Nanoelectronics Programs vii

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