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The Electronics and Electrical
Engineering Laboratory
One ofNIST’s seven Measurement and Standards Laboratories,
EEEL conducts research, provides measurement services, and
helps set standards in support of: the fundamental electronic
technologies ofsemiconductors, magnetics, and superconduc-
tors; information and communications technologies, such as
fiber optics, photonics, microwaves, electronic displays, and
electronics manufacturing supply chain collaboration; foren-
sics and security measurement instrumentation; fundamental
and practical physical standards and measurement services for
electrical quantities; maintaining the quality and integrity of
electrical power systems; and the development ofnanoscale
and microelectromechanical devices. EEEL provides support
to law enforcement, corrections, and criminaljustice agencies,
including homeland security.
EEEL consists offour programmatic divisions and two matrix-
managed offices:
Semiconductor Electronics Division
Optoelectronics Division
Quantum Electrical Metrology Division
Electromagnetics Division
Office ofMicroelectronics Programs
Office ofLaw Enforcement Standards
This document describes the technical programs ofthe Office
ofMicroelectronics Programs. Similar documents describing
the other Divisions and Offices are available. Contact NIST/
EEEL. 100 Bureau Drive, MS 8100, Gaithersburg, MD 20899-
8100, Telephone: (301 975-2220, On the Web:
)
www.eeel.nist.gov
Covercaption: (clockwisefrom lowerleft) ctyogen-freeX-raymicrocalorimeterspectrometerundergoing
vibration testingonSEM, environmentalsupportfortheelectronics industry’forthefullproductlifecycle,
deep Ultraviolet Twyman GreenInterferometer, andpatternedsilicon wafer; (background) analysis of
criticaldimensiondata usingSmallAngleX-rayScatteringyields directmeasurementofsidewallangle.
Electronics and Electrical
Engineering Laboratory
Office of
Microelectronics
Programs
Programs, Activities, and
Accomplishments
NISTIR 7367
January2007
U.S. DEPARTMENT OF COMMERCE
Carlos M. Gutierrez, Secretary
TechnologyAdministration
Robert Cresanti, UnderSecretary ofCommerce forTechnology
National Institute ofStandards and Technology
William Jeffrey, Director
Disclaimer
Disclaimer: Certain commercial equipment and/or software are identified in this report to
adequately describe the experimental procedure. Such identification does not imply recom-
mendation or endorsement by the National Institute ofStandards and Technology, nor does
it imply that the equipment and/or software identified is necessarily the best available for
the purpose.
References: ReferencesmadetotheInternationalTechnology'RoadmapforSemiconductors
(ITRS) apply to the most recent edition, dated 2005.
Semiconductor Industry Association. The International Technology Roadmap for Semicon-
ductors, 2005 edition. SEMATECH: Austin, TX, 2005.
This document is available on-line at URL: http://public.itrs.net or in printed copy by con-
tacting SEMATECH, 2706 Montopolis Drive,Austin,TX 78741, ITRS department 860-008,
phone: (512) 356-3500.
The reader will notice that there are acronyms and abbreviations throughout this document
that are not spelled out due to space limitations. We have listed the acronyms and abbrevia-
tions in an appendix at the end ofthis document.
Contents
Welcome and Introduction v
Office ofMicroelectronics Programs Organization vii
Lithography Metrology Program 1
Metrology Supporting Deep Ultraviolet Lithography 3
Metrology Supporting Extreme Ultraviolet Lithography 9
Polymer Photoresist Fundamentals forNext-Generation Lithography 15
Critical Dimension and Overlay Metrology Program 21
Wafer-Level and Mask Critical Dimension Metrology 22
Scanning Electron Microscope-Based Dimensional Metrology 23
Scatterometry-Based Dimensional Metrology 29
Scanning Probe Microscope-Based Dimensional Metrology 33
Small Angle X-Ray Scattering-Based Dimensional Metrology 39
CD
Fabrication and Calibration Metrology for Single-Crystal Reference Materials ..43
Optical-Based Photomask Dimensional Metrology 49
Model-Based Linewidth Metrology 53
Atom-Based Dimensional Metrology 57
Wafer-Level and Overlay Metrology 61
Front-End Processing Metrology Program 67
Wafer and Chuck Flatness Metrology 69
Modeling, Measurements, and Standards forWafer Surface Inspection 73
Front-End Materials Characterization 77
Interconnect and Packaging Metrology Program 87
Atomic Layer Deposition- Process Models and Metrology 89
Superconformal Deposition: Copper andAdvanced Interconnect Materials 95
Interconnect Materials and Reliability Metrology 98
Basic Materials Properties 99
Test Structures ForInterconnect Metrology and Modeling 107
Solders and Solderability Measurements for Microelectronics 113
Process Metrology Program 117
Gas Property Data and Flow Standards for Improved Gas Delivery Systems 119
Low Concentration ofHumidity Standards 123
Temperature Measurements and Standards for Semiconductor Processing 129
Plasma Process Metrology 133
Assessment ofMeasurements and Standards for Gas Phase Processes in
Semiconductor Device Manufacturing 139
Semiconductor Microelectronics and Nanoelectronics Programs
iii
1
Analysis Tools and Techniques Program 141
Thin-Film X-Ray Metrology for Microelectronics 143
Electron Microscope Tomography ofElectronic Materials 149
High-Resolution MicrocalorimeterX-Ray Spectrometer for Chemical Analysis 15
Device Design and Characterization Program 157
Device Characterization and Reliability 159
Nanoelectronic Device Metrology 165
Power Semiconductor Device Metrology 171
Organic Electronics Metrology 175
Micro- andNano-Electro-Mechanical Technology Metrology 179
NIST’s Center forNanoscale Science and Technology Nanofab 183
Metrology for Spintronic Devices 185
BioElectronics Metrology 191
System Design and Test Metrology Program 195
Metrology for System-on-a-Chip 197
At-Speed Test ofDigital Integrated Circuits 201
Thermal Measurements and Packaging Reliability 205
Manufacturing Support Program 211
Factory Time Synchronization Standards Development for E-Manufacturing 213
E-Diagnostics Security 215
Engineering Chain Management in the Semiconductor Industry 217
NIST/SEMATECH E-Handbook ofStatistical Methods 219
Abbreviations andAcronyms 220
Technical Contacts 224
Welcome and Introduction
Welcome
The microelectronics industry supplies vital components to the electronics industry and to
the U.S. economy, enablingrapid improvements in productivity and in new high technology
growth industries such as electronic commerce and biotechnology. TheNational Institute of
StandardsandTechnology,NIST, in fulfilling itsmissionofstrengtheningtheU.S. economy,
works with industry to develop and apply technology, measurements and standards; and ap-
plies substantial efforts on behalfofthe semiconductor industry and its infrastructure. This
report describes the many projects being conducted at NIST that constitute that effort.
Historical Perspective
NIST’s predecessor, theNational Bureau ofStandards (NBS), began work in themid-1950s
to meet themeasurementneedsofthe infant semiconductorindustry. While thiswas initially
focusedontransistorapplicationsinothergovernmentagencies, intheearly 1960stheBureau
sought industry guidance from theAmerican Society forTesting and Materials (ASTM) and
theU.S. Electronic IndustriesAssociation (EIA).ASTM'stopprioritywasthe accuratemea-
surement ofsilicon resistivity. NBS scientists developed a practical nondestructive method
ten times more precise than previous destructive methods. The method is the basis for five
industrial standards and for resistivity standard reference materials widely used to calibrate
the industry’smeasurementinstruments.Thesecondproject,recommendedbyapanelofEIA
experts, addressed the “second breakdown” failure mechanism oftransistors. The results of
this project have been widely applied, including solving a problem in main engine control
responsible for delaying the launch ofa space shuttle.
Fromthesebeginnings,by 1980the semiconductormetrologyprogramhadgrowntoemploy
a staffof60 with a $6 million budget, mostly from a variety ofother government agencies.
CongressionalfundinginthatyeargaveNBStheinternalmeanstomaintainitssemiconductor
metrology work. Meeting industrial needs remained the most important guide for managing
the program.
Industrial Metrology Needs
Bythelate 1980s,NBS (nowNIST)recognizedthatthesemiconductorindustrywasapplying
a much wider range ofscience and engineeringtechnology than the existing NIST program
was designed to cover. The necessary expertise existed at NIST, but in other parts ofthe
organization. In 1991, NIST established the Office ofMicroelectronics Programs (OMP) to
coordinateandfundmetrologicalresearchanddevelopmentacrosstheagency, andtoprovide
the industry with easy single point access to NIST’s widespread projects. Roadmaps devel-
oped by the U.S. Semiconductor Industry Association (SIA) have independently identified
the broad technological coverage and growing industrial needs for NIST’s semiconductor
metrology developments. As the available funding and the scope ofthe activities grew, the
collective namebecame theNational SemiconductorMetrologyProgram (NSMP), operated
by the OMP.
TheNSMPhas stimulateda greater interest in semiconductormetrology, motivatingmostof
NIST’s laboratoriestolaunchadditionalprojectsoftheirownandtocost-share OMP-funded
projects.Theprojectsdescribedinthisbookrepresentthisbroaderportfolioofmicroelectron-
ics projects. Most, but not all, ofthe projects described are partially funded by the NSMP,
which is providing a $12 million budget in fiscal year2006.
Semiconductor Microelectronics and Nanoelectronics Programs
Fostering NIST's Relationships with the Industry
NIST’srelationshipswiththeSIA, SEMATECHanditssubsidiary. International SEMATECH
ManufacturingInitiative(ISMI),andthe SemiconductorResearchCorporation(SRC)arealso
coordinated through the OMR Stafffrom OMP and NIST Laboratories represents NIST on
the SIAcommitteesthat developthe International Technology Roadmap for Semiconductors
(ITRS), as well as on numerous SRC Technical Advisory Boards. NIST staffis also active
in the semiconductor standards development work oftheASTM, the International National
Electronics Manufacturers Initiative (iNEMI), the EIA, the International Organization for
Standardization (ISO), and Semiconductor Equipment and Materials International (SEMI).
Learn More About Semiconductor Metrology at NIST
This publication provides summaries ofNIST’s metrology projects for the silicon semicon-
ductor industry and their suppliers ofmaterials and manufacturing equipment. Each project
responds to one or more metrology requirements identified by the industry in sources such
as the ITRS. NIST is committed to listening to the needs ofindustry, working with industry
representativestoestablishpriorities,andrespondingwhereresourcespermitwitheffectivemea-
surement technology and services. For further information, please contactNIST as follows:
Office ofMicroelectronic Programs
National Institute ofStandards and Technology
00 Bureau Drive
1
Building 225, Room A317, Mail Stop 8101
MD
Gaithersburg, 20899-8101
Telephone: (301) 975-4400
Fax: (301) 975-6513
e-mail: nsmp@nist.gov
Internet: http://www.eeel.nist.gov/omp
Office of Microelectronics Programs
Organization
KNIGHT, Stephen (Director) stephen.knight@nist.gov
(301) 975-2871
MARTINEZ DE PINILLOS, Joaquin V. (Senior Scientist) jack.martinez@nist.gov
(301) 975-8125
BUCKLEY, Michele L. (Secretary) michele.buckley@nist.gov
(301)975-4400
Fromlefttoright: JoaquinMartinezdePinillos. StephenKnight, andMicheleBuckley.
Semiconductor Microelectronics and Nanoelectronics Programs vii