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Nitride Semiconductor Technology. Power Electronics and Optoelectronic Devices PDF

454 Pages·2020·17.739 MB·English
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NitrideSemiconductorTechnology Nitride Semiconductor Technology PowerElectronicsandOptoelectronicDevices EditedbyFabrizioRoccaforteandMikeLeszczynski Editors AllbookspublishedbyWiley-VCH arecarefullyproduced.Nevertheless, Dr.FabrizioRoccaforte authors,editors,andpublisherdonot ConsiglioNazionaledelleRicerche- warranttheinformationcontainedin IstitutoperlaMicroelettronicae thesebooks,includingthisbook,to Microsistemi(CNR-IMM) befreeoferrors.Readersareadvised StradaVIII,n.5-ZonaIndustriale tokeepinmindthatstatements,data, 95121Catania illustrations,proceduraldetailsorother Italy itemsmayinadvertentlybeinaccurate. Prof.MikeLeszczynski LibraryofCongressCardNo.:appliedfor InstituteofHighPressurePhysics- PolishAcademyofSciences BritishLibraryCataloguing-in-Publication (Unipress-PAS) Data Sokolowska29/37 Acataloguerecordforthisbookis 01-142Warsaw availablefromtheBritishLibrary. Poland Bibliographicinformationpublishedby CoverImage theDeutscheNationalbibliothek ©FlashMovie/Shutterstock TheDeutscheNationalbibliotheklists thispublicationintheDeutsche Nationalbibliografie;detailed bibliographicdataareavailableonthe Internetat<http://dnb.d-nb.de>. ©2020Wiley-VCHVerlagGmbH& Co.KGaA,Boschstr.12,69469 Weinheim,Germany Allrightsreserved(includingthoseof translationintootherlanguages).No partofthisbookmaybereproducedin anyform–byphotoprinting, microfilm,oranyothermeans–nor transmittedortranslatedintoa machinelanguagewithoutwritten permissionfromthepublishers. Registerednames,trademarks,etc.used inthisbook,evenwhennotspecifically markedassuch,arenottobe consideredunprotectedbylaw. PrintISBN:978-3-527-34710-0 ePDFISBN:978-3-527-82525-7 ePubISBN:978-3-527-82527-1 oBookISBN:978-3-527-82526-4 Typesetting SPiGlobal,Chennai,India PrintingandBinding Printedonacid-freepaper 10 9 8 7 6 5 4 3 2 1 v Contents Preface xi Acknowledgments xv 1 IntroductiontoGalliumNitridePropertiesandApplications 1 FabrizioRoccaforteandMikeLeszczynski 1.1 HistoricalBackground 1 1.2 BasicPropertiesofNitrides 4 1.2.1 MicrostructureandRelatedIssues 7 1.2.2 OpticalProperties 13 1.2.3 ElectricalProperties 16 1.2.4 Two-DimensionalElectronGas(2DEG)inAlGaN/GaN Heterostructures 19 1.3 ApplicationsofGaN-BasedMaterials 23 1.3.1 OptoelectronicDevices 24 1.3.2 Power-andHigh-FrequencyElectronicDevices 26 1.4 Summary 30 Acknowledgments 31 References 31 2 GaN-BasedMaterials:Substrates,MetalorganicVapor-Phase Epitaxy,andQuantumWellProperties 41 FerdinandScholz,MichalBockowski,andEwaGrzanka 2.1 Introduction 41 2.2 BulkGaNGrowth 42 2.2.1 HydrideVapor-PhaseEpitaxy(HVPE) 43 2.2.2 SodiumFluxGrowthMethod 45 2.2.3 AmmonothermalGrowth 46 2.3 MOVPEGrowth 51 2.3.1 BasicsAboutNitrideMOVPE 54 2.3.2 EpitaxyonForeignSubstrates 58 2.3.2.1 SapphireasaForeignSubstrate 58 2.3.2.2 GaNonSiCandSi 60 2.3.3 DefectReductionbyELOG,FACELO,etc. 62 2.3.4 InSituELOGbySiNDeposition 64 vi Contents 2.3.5 DopingofNitrides 64 2.3.6 GrowthofOtherBinaryandTernaryNitrides 67 2.4 InGaNQWs:GrowthandDecomposition 72 2.4.1 GrowthofInGaNQWsonPolar,Nonpolar,andSemipolarGaN Substrates 72 2.4.2 OriginsofInFluctuations 75 2.4.3 HomogenizationofInGaNQWs 78 2.4.4 DecompositionoftheQWs 79 2.5 Summary 82 Acknowledgments 82 References 83 3 GaN-BasedHEMTsforMillimeter-waveApplications 99 KathiaHarroucheandFaridMedjdoub 3.1 Introduction 99 3.2 TargetedApplicationsforGaNMillimeter-waveDevices 99 3.2.1 High-PowerAmplification 100 3.2.2 BroadbandAmplifiers 102 3.2.3 5G 103 3.2.3.1 GaNfor5G 104 3.2.3.2 GaNBaseStationPAs 106 3.2.3.3 MovingForwardto6G 108 3.3 GaN-basedMaterialDesignsforMillimeter-waveApplications 108 3.3.1 IntrinsicCharacteristicsandComparisonwithOtherMaterialsforRF Devices 108 3.3.2 SpecificMaterialSystemsforRFDevices 114 3.4 DeviceDesignandFabricationofMillimeter-waveGaNDevices 116 3.4.1 DescriptionofKeyProcessingStepsforVariousGaNDevice Designs 116 3.4.1.1 DeviceScalingforMillimeterWave 116 3.4.1.2 T-shapedGateDesign 116 3.4.1.3 AdvancedOhmicContactTechnology 117 3.4.1.4 N-polarGaNHEMTs 118 3.4.1.5 AlN-BasedDevicePerformances 119 3.4.1.6 InAlGaN-BasedDevicePerformances 121 3.4.2 State-of-the-artMillimeter-waveGaNTransistors 122 3.5 OverviewofMMICPowerAmplifiers 123 3.5.1 MMICTechnologyUsingIII-NDevices 123 3.5.1.1 III–VMaterial-BasedMMICTechnology 123 3.5.1.2 PowerAmplifiers 124 3.5.1.3 Low-NoiseAmplifier 125 3.5.2 MMICExamplesfromKa-bandtoD-bandFrequencies 125 3.6 Summary 126 References 127 Contents vii 4 TechnologiesforNormally-offGaNHEMTs 137 GiuseppeGreco,PatrickFiorenza,FerdinandoIucolano,andFabrizio Roccaforte 4.1 Introduction 137 4.1.1 ThresholdVoltageinAlGaN/GaNHEMTs 138 4.2 GaNHEMT“Cascode” 140 4.3 “True”Normally-offHEMTTechnologies 142 4.3.1 Recessed-gateHEMT 142 4.3.2 FluorinatedHEMT 145 4.3.3 Recessed-gateHybridMISHEMT 149 4.3.4 p-GaNGateHEMT 155 4.4 OtherApproaches 163 4.5 Summary 164 Acknowledgments 165 References 165 5 VerticalGaNPowerDevices 177 SrabantiChowdhuryandDongJi 5.1 Introduction 177 5.2 VerticalGaNDevicesforPowerConversion 177 5.3 VerticalGaNTransistors 178 5.3.1 CurrentApertureVerticalElectronTransistor(CAVET) 178 5.3.2 VerticalMOSFETs 182 5.4 High-VoltageDiodesinGaN 185 5.5 AvalancheElectroluminescenceinGaNP–NDiodes 186 5.6 ImpactIonizationCoefficientsinGaN 188 5.6.1 ImpactofImpactIonizationStudiesonPredictiveModeling 193 5.7 Summary 193 Acknowledgments 193 References 194 6 ReliabilityIssuesinGaNElectronicDevices 199 MilanTˇapajnaandChristianKoller 6.1 Introduction 199 6.1.1 ReliabilityTestingandFailureAnalysisofGaNHEMTs 200 6.2 ReliabilityofGaNHEMTsforRFApplications 204 6.2.1 AlGaN/GaNHEMTs 204 6.2.1.1 TrappingEffects 204 6.2.1.2 Gate-edgeDegradation 207 6.2.1.3 HotElectronDegradation 209 6.2.2 InAlN/GaNHEMTs 211 6.2.2.1 HotElectronDegradation 212 6.2.2.2 RoleofHotPhonons 214 6.2.3 ThermalIssuesinRFGaNHEMTs 215 viii Contents 6.3 ReliabilityandRobustnessofGaNPowerSwitchingDevices 219 6.3.1 ParasiticEffectsintheCarbon-DopedGaNBuffer 221 6.3.1.1 InsulationofGaNBufferbyCarbonDoping 221 6.3.1.2 Time-Dependent“Dielectric”Breakdown(TDDB)oftheGaN Buffer 223 6.3.1.3 DynamicR DuetoBufferTrapping 225 DS,ON 6.3.2 GateDegradationinp-GaNSwitchingHEMTs 230 6.3.3 V InstabilitiesinGaNMISHEMTs 233 th 6.3.3.1 StudiesofPBTIinMISHEMTs 237 6.4 Summary 241 Acknowledgments 241 References 241 7 Light-EmittingDiodes 253 AmitYadav,HidekiHirayama,andEdikU.Rafailov 7.1 Introduction 253 7.2 State-of-the-ArtGaNLEDs 254 7.2.1 BlueLEDs 258 7.2.2 GreenLEDs 262 7.3 GaNWhiteLEDs:ApproachesandProperties 264 7.3.1 MonolithicLEDs 267 7.3.2 Phosphor-CoveredLEDs 271 7.4 AlGaNDeepUVLEDs 275 7.4.1 GrowthofHigh-QualityAlNandIncreasinginInternalQuantum Efficiency(IQE) 278 7.4.2 AlGaN-basedUVCLEDs 281 7.4.3 IncreasingtheLightExtractionEfficiency(LEE) 282 7.5 Summary 287 Acknowledgments 288 References 288 8 LaserDiodesGrownbyMolecularBeamEpitaxy 301 GregMuziol,HenrykTurski,MarcinSiekacz,MartaSawicka,andCzeslaw Skierbiszewski 8.1 Introduction 301 8.2 III-NGrowthFundamentalsbyPlasma-AssistedMBE 303 8.2.1 RoleofN-FluxforEfficientInGaNQWs 304 8.3 WideInGaNQWs–BeyondQuantum-ConfinedStarkEffect 305 8.4 Long-LivingLaserDiodesonBulkAmmono-GaN 313 8.5 LaserDiodeswithTunnelJunctions 316 8.5.1 StacksofVerticallyInterconnectedLaserDiodes 319 8.5.2 DistributedFeedbackLaserDiodes 321 8.6 Summary 324 Acknowledgments 324 References 325 Contents ix 9 EdgeEmittingLaserDiodesandSuperluminescent Diodes 333 SzymonStanczyk,AnnaKafar,DarioSchiavon,StephenNajda,ThomasSlight, andPiotrPerlin 9.1 LaserDiode:HistoryandDevelopment 333 9.1.1 OptoelectronicsBackground 333 9.1.2 GalliumNitrideTechnologyBreakthroughs 335 9.1.3 DevelopmentofNitrideLaserDiodes 337 9.2 DistributedFeedbackLaserDiodes 342 9.3 SuperluminescentDiodes 348 9.3.1 HistoryofSuperluminescentDiodeDevelopment 348 9.3.2 BasicSLDProperties 351 9.3.3 ChallengesforSLDOptimization 353 9.4 SemiconductorOpticalAmplifiers 354 9.5 Summary 357 References 358 10 GreenandBlueVertical-CavitySurface-EmittingLasers 367 YangMei,Rong-BinXu,HuanXu,andBao-PingZhang 10.1 Introduction 367 10.1.1 PropertiesandApplicationofGaNVCSELs 367 10.1.2 BriefHistoryandCurrentStatusofGaNVCSELs 368 10.1.3 GaNVCSELswithDifferentDBRs 369 10.1.3.1 GaNVCSELswithHybridDBRStructure 370 10.1.3.2 GaNVCSELswithDoubleDielectricDBRStructure 371 10.2 EfficiencyofHeatDissipationofDifferentDeviceStructures 372 10.2.1 SimulationofHeatProfileoftheDevice 372 10.2.2 DependenceofR onCavityLength 373 th 10.3 GreenVCSELsBasedonInGaNQDs 375 10.3.1 AdvantagesofQDsComparedwithQWs 375 10.3.2 GrowthandOpticalPropertiesofInGaNQDs 377 10.3.3 FabricationProcessofVCSELs 379 10.3.4 PropertiesofQDGreenVCSELs 379 10.4 GreenVCSELsBasedonCavity-EnhancedEmissionofLocalized StatesinBlueEmittingInGaNQWs 380 10.4.1 CavityEffect 380 10.4.2 PropertiesofCavity-EnhancedGreenVCSELs 381 10.5 Dual-WavelengthLasingBasedonQD-in-QWActiveStructure 384 10.5.1 CharacteristicsofQD-in-QWStructure 384 10.5.2 LasingCharacteristicsofVCSELs 386 10.6 BlueVCSELswithDifferentLateralConfinements 386 10.6.1 DesignofIndex-GuidedStructure 386 10.6.2 EmissionPropertiesofVCSELswithLateralConfinement 388 10.7 Summary 389 References 390 x Contents 11 Integrationof2DMaterialswithNitridesforNovelElectronic andOptoelectronicApplications 397 FilippoGiannazzo,EmanuelaSchilirò,RaffaellaLoNigro,PawelPrystawko, andYvonCordier 11.1 Introduction 397 11.2 Fabricationof2DMaterialHeterostructureswithNitride Semiconductors 400 11.2.1 Transferof2DMaterialsGrownonaForeignSubstrate 400 11.2.2 DirectGrowthof2DMaterialsonGroupIII-Nitrides 403 11.2.3 2DMaterialsasTemplatesfortheGrowthofNitrideSemiconductor Films 407 11.3 ElectronicDevicesBasedon2DMaterials/GaNHeterojunctions 413 11.3.1 Band-to-bandTunnelingDiodesBasedonMoS /GaN 2 Heterojunctions 413 11.3.2 HotElectronTransistorswithGrapheneBaseandAl(Ga)N/GaN Emitter 414 11.4 OptoelectronicDevicesBasedon2DMaterialJunctionswith GaN 421 11.4.1 GaNLEDswithGraphene-TransparentConductiveElectrodes 421 11.4.2 MoS /GaNDeepUVPhotodetectors 427 2 11.5 ApplicationsofGrapheneforThermalManagementinGaN HEMTs 428 11.6 Summary 431 Acknowledgments 431 References 432 Index 439

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