Monolithic 3D IC - 1st International Workshop on Data-Abundant

79 Pages·2014·4.85 MB·English

Monolithic 3D IC:
The Time is Now
Brian Cronquist and Zvi Or-Bach
MonolithIC 3D Inc.

2014 Intl. Workshop on Data-Abundant System Technology, April 2014
Agenda:
 There is a Bright Future for the Semiconductor Industry, yet, we are
reaching an Inflection Point
 Monolithic 3D IC – The next generation technology driver
 What is it?
 Monolithic 3D provides more than just scaling
 Four paths proposed to enable monolithic 3D ICs
 Path 3
 A few near–term applications
 3D FPGA to prototype 2D SoC
 Logic Redundancy
 Memory on Logic

2014 Intl. Workshop on Data-Abundant System Technology, April 2014
The Bright Future
The semiconductor opportunity is growing
$15-34 trillion, annual =>~$5T Semi /year
Source: McKinsey Global Institute Analysis 2013
2014 Intl. Workshop on Data-Abundant System Technology, April 2014
However…
Semiconductor Industry is Facing
an
Inflection Point
Dimensional Scaling has reached Diminishing Returns
The Current 2D-IC is Facing Escalating Challenges
 Lithography is  On-chip interconnect is
 Dominating Fab cost
 Dominating device power
 Dominating device cost and
consumption
diminishing scaling’s benefits
 Dominating device performance
 Dominating device yield
 Penalizing device size and cost
 Dominating IC development costs

2014 Intl. Workshop on Data-Abundant System Technology, April 2014
Cost per transistor
is no longer scaling
Moore’s Law has stopped at 28nm
Embedded SRAM isn’t Scaling Beyond 28nm (1.1x instead off 4x)
eSRAM > 60% of Die Area => End of Dimensional Scaling !
Dinesh Maheshwari, CTO, Memory Products Division at Cypress Semiconductors, ISSCC2014
Monolithic 3D – The next
generation technology driver