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(cid:2) MITIGATING TIN WHISKER RISKS (cid:2) (cid:2) (cid:2) (cid:2) (cid:2) (cid:2) WILEYSERIESONPROCESSINGOFENGINEERINGMATERIALS RandallM.German,Editor Structure-PropertyRelationsinNonferrousMetals AlanM.RussellandKokLoongLee HandbookofMathematicalRelationsInParticulateMaterialsProcessing RandallM.GermanandSeongJinPark ChemistryandPhysicsOfMechanicalHardness JohnJ.Gilman PrinciplesofLaserMaterialsProcessing ElijahKannatey-Asibu,Jr. LectureTopicsinMaterialsThermodynamics Y.AustinChangandW.AlanOates MaterialsThermodynamics Y.AustinChangandW.AlanOates (cid:2) (cid:2) MITIGATING TIN WHISKER RISKS Theory and Practice TAKAHIKOKATO CAROLA.HANDWERKER JASBIRBATH (cid:2) (cid:2) (cid:2) (cid:2) Copyright©2016byJohnWiley&Sons,Inc.Allrightsreserved PublishedbyJohnWiley&Sons,Inc.,Hoboken,NewJersey PublishedsimultaneouslyinCanada Nopartofthispublicationmaybereproduced,storedinaretrievalsystem,ortransmittedinanyformor byanymeans,electronic,mechanical,photocopying,recording,scanning,orotherwise,exceptas permittedunderSection107or108ofthe1976UnitedStatesCopyrightAct,withouteithertheprior writtenpermissionofthePublisher,orauthorizationthroughpaymentoftheappropriateper-copyfeeto theCopyrightClearanceCenter,Inc.,222RosewoodDrive,Danvers,MA01923,(978)750-8400,fax (978)750-4470,oronthewebatwww.copyright.com.RequeststothePublisherforpermissionshould beaddressedtothePermissionsDepartment,JohnWiley&Sons,Inc.,111RiverStreet,Hoboken,NJ 07030,(201)748-6011,fax(201)748-6008,oronlineathttp://www.wiley.com/go/permissions. LimitofLiability/DisclaimerofWarranty:Whilethepublisherandauthorhaveusedtheirbesteffortsin preparingthisbook,theymakenorepresentationsorwarrantieswithrespecttotheaccuracyor completenessofthecontentsofthisbookandspecificallydisclaimanyimpliedwarrantiesof merchantabilityorfitnessforaparticularpurpose.Nowarrantymaybecreatedorextendedbysales (cid:2) (cid:2) representativesorwrittensalesmaterials.Theadviceandstrategiescontainedhereinmaynotbesuitable foryoursituation.Youshouldconsultwithaprofessionalwhereappropriate.Neitherthepublishernor authorshallbeliableforanylossofprofitoranyothercommercialdamages,includingbutnotlimitedto special,incidental,consequential,orotherdamages. Forgeneralinformationonourotherproductsandservicesorfortechnicalsupport,pleasecontactour CustomerCareDepartmentwithintheUnitedStatesat(800)762-2974,outsidetheUnitedStatesat (317)572-3993orfax(317)572-4002. Wileyalsopublishesitsbooksinavarietyofelectronicformats.Somecontentthatappearsinprintmay notbeavailableinelectronicformats.FormoreinformationaboutWileyproducts,visitourwebsiteat www.wiley.com. LibraryofCongressCataloging-in-PublicationDatahasbeenappliedfor Hardback:9780470907238 Typesetin10/12ptTimesLTStdbySPiGlobal,Chennai,India PrintedintheUnitedStatesofAmerica 10987654321 (cid:2) (cid:2) CONTENTS ListofContributors ix (cid:2) Introduction xi (cid:2) 1 APredictiveModelforWhiskerFormationBasedonLocal MicrostructureandGrainBoundaryProperties 1 Pylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, JohnE.BlendellandCarolA.Handwerker 1.1 Introduction, 1 1.2 CharacteristicsofWhiskerandHillockGrowthfromSurfaceGrains, 3 1.3 SummaryandRecommendations, 17 Acknowledgments, 18 References, 19 2 MajorDrivingForcesandGrowthMechanismsforTinWhiskers 21 EricChasonandNitinJadhav 2.1 Introduction, 21 2.2 UnderstandingtheMechanismsBehindImc-InducedStressEvolutionand WhiskerGrowth, 24 2.3 RelationofStresstoWhiskerGrowth, 34 2.4 Conclusions, 39 Acknowledgments, 40 References, 40 (cid:2) (cid:2) vi CONTENTS 3 ApproachesofModelingandSimulationofStressesinSnFinishes 43 PengSuandMinDing 3.1 Introduction, 43 3.2 ConstitutiveModel, 44 3.3 StrainEnergyDensity, 46 3.4 GrainOrientation, 46 3.5 FiniteElementModelingofTriple-GrainJunction, 48 3.6 FiniteElementModelingofSnFinishwithMultipleGrains, 55 References, 66 4 PropertiesandWhiskerFormationBehaviorofTin-BasedAlloy Finishes 69 TakahikoKatoandAsaoNishimura 4.1 Introduction, 69 4.2 GeneralPropertiesofTin-basedAlloyFinishes(AsaoNishimura), 70 4.3 EffectofAlloyingElementsonWhiskerFormationandMitigation(Asao Nishimura), 75 4.4 DependenceofWhiskerPropensityofMatteTin–CopperFinishon CopperLead-FrameMaterial(TakahikoKato), 89 4.5 Conclusions, 118 (cid:2) Acknowledgments, 118 (cid:2) References, 119 5 CharacterizationTechniquesforFilmCharacteristics 125 TakahikoKatoandYukikoMizuguchi 5.1 Introduction, 125 5.2 TEM(TakahikoKato), 125 5.3 SEM(YukikoMizuguchi), 140 5.4 EBSD(YukikoMizuguchi), 146 5.5 Conclusions, 154 Acknowledgments, 155 References, 155 6 OverviewofWhisker-MitigationStrategiesforHigh-Reliability ElectronicSystems 159 DavidPinsky 6.1 OverviewofTinWhiskerRiskManagement, 159 6.2 DetailsofTinWhiskerMitigation, 164 6.3 ManagingTinWhiskerRisksattheSystemLevel, 173 6.4 ControlofSubcontractorsandSuppliers, 183 6.5 Conclusions, 185 References, 185 (cid:2) (cid:2) CONTENTS vii 7 QuantitativeAssessmentofStressRelaxationinTinFilmsbythe FormationofWhiskers,Hillocks,andOtherSurfaceDefects 187 NicholasG.Clore,DennisD.Fritz,Wei-HsunChen,MaureenE.Williams, JohnE.BlendellandCarolA.Handwerker 7.1 Introduction, 187 7.2 Surface-DefectClassificationandMeasurementMethod, 189 7.3 PreparationandStorageConditionsofElectroplatedFilmson Substrates, 194 7.4 SurfaceDefectFormationasaFunctionofTinFilmType,Substrate,and StorageCondition, 195 7.5 Conclusions, 209 Appendix, 209 Acknowledgments, 209 References, 213 8 BoardReflowProcessesandtheirEffectonTinWhiskerGrowth 215 JasbirBath 8.1 Introduction, 215 8.2 TheEffectofReflowedComponentsonTinWhiskerGrowthinTermsof GrainSizeandGrainOrientationDistribution, 215 (cid:2) 8.3 ReflowProfilesandtheEffectonTinWhiskerGrowth, 216 (cid:2) 8.4 InfluenceofReflowAtmosphereandFluxonTinWhiskerGrowth, 219 8.5 EffectofSolderPasteVolumeonComponentTinWhiskerGrowthduring ElectronicsAssembly, 220 8.6 Conclusions, 221 Acknowledgments, 222 References, 222 9 MechanicallyInducedTinWhiskers 225 TadahiroShibutaniandMichaelOsterman 9.1 Introduction, 225 9.2 OverviewofMechanicallyInducedTinWhiskerFormation, 227 9.3 Theory, 228 9.4 CaseStudies, 237 9.5 Conclusions, 245 References, 246 Index 249 (cid:2) (cid:2) (cid:2) (cid:2) (cid:2)

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by  Bath, Jasbir, Handwerker, Carol A., Kato, Takahiko
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(cid:2) MITIGATING TIN WHISKER RISKS (cid:2) (cid:2) (cid:2) (cid:2) (cid:2) (cid:2) WILEYSERIESONPROCESSINGOFENGINEERINGMATERIALS RandallM.German,Editor Structure-PropertyRelationsinNonferrousMetals AlanM.RussellandKokLoongLee HandbookofMathematicalRelationsInParticulateMaterialsProcessing RandallM.GermanandSeongJinPark ChemistryandPhysicsOfMechanicalHardness JohnJ.Gilman PrinciplesofLaserMaterialsProcessing ElijahKannatey-Asibu,Jr. LectureTopicsinMaterialsThermodynamics Y.AustinChangandW.AlanOates MaterialsThermodynamics Y.AustinChangandW.AlanOates (cid:2) (cid:2) MITIGATING TIN WHISKER RISKS Theory and Practice TAKAHIKOKATO CAROLA.HANDWERKER JASBIRBATH (cid:2) (cid:2) (cid:2) (cid:2) Copyright©2016byJohnWiley&Sons,Inc.Allrightsreserved PublishedbyJohnWiley&Sons,Inc.,Hoboken,NewJersey PublishedsimultaneouslyinCanada Nopartofthispublicationmaybereproduced,storedinaretrievalsystem,ortransmittedinanyformor byanymeans,electronic,mechanical,photocopying,recording,scanning,orotherwise,exceptas permittedunderSection107or108ofthe1976UnitedStatesCopyrightAct,withouteithertheprior writtenpermissionofthePublisher,orauthorizationthroughpaymentoftheappropriateper-copyfeeto theCopyrightClearanceCenter,Inc.,222RosewoodDrive,Danvers,MA01923,(978)750-8400,fax (978)750-4470,oronthewebatwww.copyright.com.RequeststothePublisherforpermissionshould beaddressedtothePermissionsDepartment,JohnWiley&Sons,Inc.,111RiverStreet,Hoboken,NJ 07030,(201)748-6011,fax(201)748-6008,oronlineathttp://www.wiley.com/go/permissions. LimitofLiability/DisclaimerofWarranty:Whilethepublisherandauthorhaveusedtheirbesteffortsin preparingthisbook,theymakenorepresentationsorwarrantieswithrespecttotheaccuracyor completenessofthecontentsofthisbookandspecificallydisclaimanyimpliedwarrantiesof merchantabilityorfitnessforaparticularpurpose.Nowarrantymaybecreatedorextendedbysales (cid:2) (cid:2) representativesorwrittensalesmaterials.Theadviceandstrategiescontainedhereinmaynotbesuitable foryoursituation.Youshouldconsultwithaprofessionalwhereappropriate.Neitherthepublishernor authorshallbeliableforanylossofprofitoranyothercommercialdamages,includingbutnotlimitedto special,incidental,consequential,orotherdamages. Forgeneralinformationonourotherproductsandservicesorfortechnicalsupport,pleasecontactour CustomerCareDepartmentwithintheUnitedStatesat(800)762-2974,outsidetheUnitedStatesat (317)572-3993orfax(317)572-4002. Wileyalsopublishesitsbooksinavarietyofelectronicformats.Somecontentthatappearsinprintmay notbeavailableinelectronicformats.FormoreinformationaboutWileyproducts,visitourwebsiteat www.wiley.com. LibraryofCongressCataloging-in-PublicationDatahasbeenappliedfor Hardback:9780470907238 Typesetin10/12ptTimesLTStdbySPiGlobal,Chennai,India PrintedintheUnitedStatesofAmerica 10987654321 (cid:2) (cid:2) CONTENTS ListofContributors ix (cid:2) Introduction xi (cid:2) 1 APredictiveModelforWhiskerFormationBasedonLocal MicrostructureandGrainBoundaryProperties 1 Pylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, JohnE.BlendellandCarolA.Handwerker 1.1 Introduction, 1 1.2 CharacteristicsofWhiskerandHillockGrowthfromSurfaceGrains, 3 1.3 SummaryandRecommendations, 17 Acknowledgments, 18 References, 19 2 MajorDrivingForcesandGrowthMechanismsforTinWhiskers 21 EricChasonandNitinJadhav 2.1 Introduction, 21 2.2 UnderstandingtheMechanismsBehindImc-InducedStressEvolutionand WhiskerGrowth, 24 2.3 RelationofStresstoWhiskerGrowth, 34 2.4 Conclusions, 39 Acknowledgments, 40 References, 40 (cid:2) (cid:2) vi CONTENTS 3 ApproachesofModelingandSimulationofStressesinSnFinishes 43 PengSuandMinDing 3.1 Introduction, 43 3.2 ConstitutiveModel, 44 3.3 StrainEnergyDensity, 46 3.4 GrainOrientation, 46 3.5 FiniteElementModelingofTriple-GrainJunction, 48 3.6 FiniteElementModelingofSnFinishwithMultipleGrains, 55 References, 66 4 PropertiesandWhiskerFormationBehaviorofTin-BasedAlloy Finishes 69 TakahikoKatoandAsaoNishimura 4.1 Introduction, 69 4.2 GeneralPropertiesofTin-basedAlloyFinishes(AsaoNishimura), 70 4.3 EffectofAlloyingElementsonWhiskerFormationandMitigation(Asao Nishimura), 75 4.4 DependenceofWhiskerPropensityofMatteTin–CopperFinishon CopperLead-FrameMaterial(TakahikoKato), 89 4.5 Conclusions, 118 (cid:2) Acknowledgments, 118 (cid:2) References, 119 5 CharacterizationTechniquesforFilmCharacteristics 125 TakahikoKatoandYukikoMizuguchi 5.1 Introduction, 125 5.2 TEM(TakahikoKato), 125 5.3 SEM(YukikoMizuguchi), 140 5.4 EBSD(YukikoMizuguchi), 146 5.5 Conclusions, 154 Acknowledgments, 155 References, 155 6 OverviewofWhisker-MitigationStrategiesforHigh-Reliability ElectronicSystems 159 DavidPinsky 6.1 OverviewofTinWhiskerRiskManagement, 159 6.2 DetailsofTinWhiskerMitigation, 164 6.3 ManagingTinWhiskerRisksattheSystemLevel, 173 6.4 ControlofSubcontractorsandSuppliers, 183 6.5 Conclusions, 185 References, 185 (cid:2) (cid:2) CONTENTS vii 7 QuantitativeAssessmentofStressRelaxationinTinFilmsbythe FormationofWhiskers,Hillocks,andOtherSurfaceDefects 187 NicholasG.Clore,DennisD.Fritz,Wei-HsunChen,MaureenE.Williams, JohnE.BlendellandCarolA.Handwerker 7.1 Introduction, 187 7.2 Surface-DefectClassificationandMeasurementMethod, 189 7.3 PreparationandStorageConditionsofElectroplatedFilmson Substrates, 194 7.4 SurfaceDefectFormationasaFunctionofTinFilmType,Substrate,and StorageCondition, 195 7.5 Conclusions, 209 Appendix, 209 Acknowledgments, 209 References, 213 8 BoardReflowProcessesandtheirEffectonTinWhiskerGrowth 215 JasbirBath 8.1 Introduction, 215 8.2 TheEffectofReflowedComponentsonTinWhiskerGrowthinTermsof GrainSizeandGrainOrientationDistribution, 215 (cid:2) 8.3 ReflowProfilesandtheEffectonTinWhiskerGrowth, 216 (cid:2) 8.4 InfluenceofReflowAtmosphereandFluxonTinWhiskerGrowth, 219 8.5 EffectofSolderPasteVolumeonComponentTinWhiskerGrowthduring ElectronicsAssembly, 220 8.6 Conclusions, 221 Acknowledgments, 222 References, 222 9 MechanicallyInducedTinWhiskers 225 TadahiroShibutaniandMichaelOsterman 9.1 Introduction, 225 9.2 OverviewofMechanicallyInducedTinWhiskerFormation, 227 9.3 Theory, 228 9.4 CaseStudies, 237 9.5 Conclusions, 245 References, 246 Index 249 (cid:2) (cid:2) (cid:2) (cid:2) (cid:2)

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