Microsystems and Nanotechnology

44 Pages·2005·1.64 MB·English

Unified release of ANSYS,
ANSYS CFX and ANSYS ICEM
CFD software offers advances
Industry Spotlight:
Microsystems and
Nanotechnology
Century Dynamics software
helps oil and gas industries
develop better systems
Cylinder example demonstrates
nonlinear effects, follower forces
and modeling techniques used
for buckling analysis

Contents
Industry Spotlight Departments
5 Microsystems and
Nanotechnology Editorial
Thinking outside of the box 2
..............................................................
A continuing series on the value
of engineering simulation in Industry News
specific industries Announcements and Upcoming Events 3
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CAE Community
College Design Engineering Award 20
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Features CFD Update
What’s New in Computational Fluid Dynamics 22
....
10 Highlights of Simulation at Work
ANSYS 10.0 Personal Rapid Transit Vehicles...............................................30
Unified release of ANSYS, Guest Commentary
ANSYS CFX and ANSYS ICEM Forefront of Product Development 32
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CFD software offers advances
Tech File
Meshing in Workbench 34
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14 Designing Safe and Tips and Techniques
Efficient Drill Rigs Modal Analysis of Models with Friction 36
. . . . . . . . . . . . . . . . . . . . . . . .
Century Dynamics software Hardware Update
helps oil and gas industries ANSYS CFX Performance and Scaling 38
develop better systems . . . . . . . . . . . . . . . . . . . . . . . . .
17 Comparing ANSYS
About the cover
Shell Elements for
Buckling Analysis Industry Spotlight article
beginning on page 5
Cylinder example demonstrates discusses how engineering
nonlinear effects, follower forces simulation is used in
and modeling techniques used developing microsystems
for buckling analysis and nanotechnology
products.
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Editorial Director Designers Ad Sales Manager Editorial Advisor
John Krouse Miller Creative Group Beth Mazurak Kelly Wall
[email protected] [email protected] [email protected] [email protected]
Managing Editor Art Director Circulation Manager CFD Update Advisor
Jennifer Hucko Dan Hart Elaine Travers Chris Reeves
[email protected] [email protected] [email protected] [email protected]
ANSYS Solutionsis published for ANSYS, Inc. customers, partners and others interested in the field of design and analysis applications.
Neither ANSYS, Inc. nor Miller Creative Group guarantees or warrants accuracy or completeness of the material contained in this publication. ANSYS, ANSYS Workbench, CFX,
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www.ansys.com ANSYS Solutions | Summer 2005
Editorial
2 Innovation: The New Competitive Necessity
Thinking outside of the box to fully leverage simulation technology
in product development
Time-to-market, cost and In a growing number of industries, such
quality traditionally have advanced technologies are becoming indispensable
been the major competitive tools in developing innovative products. State-of-the-
issues for manufacturers. art multiphysics software, for example, is a must-have
Companies that launched in determining the effect of stress, deformation and
products faster than competi- temperature distribution on tiny micron-size structures
tors, made them better and of Micro-Electro-Mechanical Systems (MEMS)
had the lowest prices were discussed in the fascinating Industry Spotlight article
generally the most successful “Microsystems and Nanotechnology” beginning
in the market. These remain on page 5.
critical requirements, of Often product development teams use simulation
By John Krouse
Editorial Director course. But in today’s com- in navigating through uncharted territory in their drive
ANSYS Solutions petitive business climate, toward innovation. Take a look at the CAE Community
[email protected] faster–better–cheaper isn’t department on page 20 to learn how a student design
good enough anymore. team from the University of Washington boosted
Now the competitive output of a micropump design threefold using ANSYS
edge goes to firms that meet these criteria while tools. These students are probably the first to use CFD
delivering killer products with innovative designs that coupled to an optimizer to determine the best design
customers flock to buy. Design innovation differenti- of the pump’s microvalve concept and also the first to
ates manufacturers, builds brand value and drives stack micropumps in parallel to increase flow rate.
top-line revenue growth. Innovative products stand In striving for innovation, evaluating and changing
out from the crowd in terms of value, performance, well-entrenched corporate practices to fully leverage
size or capacity. In some cases, a company may come simulation technology often present enormous
out with an entirely new class of never-before-seen challenges. As Charles Foundyller points out in his
product such as the SkyWeb Express personal rapid guest commentary “CAE Moves to the Forefront of
transit vehicle, where critical joints connecting the Product Development” on page 32, technical issues
cabin to the chassis were evaluated with ANSYS tools pale in comparison to confronting cultural, organiza-
as covered in the Simulation at Work department tional and procedural issues. His cow path concept
beginning on page 30. hits the mark exactly in showing how process chains
Analysis can play a key role in developing these often bend and wander in a convoluted trail that
types of innovative designs by leveraging the expertise companies follow because things have been done that
of a company’s technical professionals, from whom way for decades.
creative ideas and concepts originate. The tools can The difficulties in confronting these organizational
be applied in a simulation-driven development issues are daunting, of course, which is why many
approach by identifying and correcting problems up timid companies may never get off square one in
front, optimizing designs early, evaluating alternatives, making necessary changes. Rather than merely plug
studying tradeoffs and analyzing product performance the technology into existing procedures, forward-
not practical by building and testing physical looking companies closely examine their ways of
prototypes. operating and think outside the box in terms of
As described in the article “Highlights of ANSYS when simulation is performed, what tools are used,
10.0” on page 10, the latest release of ANSYS soft- where refinements are made and how analysis fits into
ware offers major advances in analysis core a company’s overall business strategy. These smart
technology within an integrated simulation enterprises know full well the critical value of innova-
environment. The ANSYS Workbench platform is the tion, have the fortitude to break new ground in product
backbone for unprecedented levels of CAE integration development and will likely be among the world’s
as well as process automation features for capturing, manufacturing superstars in the coming years. ■
streamlining and standardizing simulation operations.
Product and process innovation go hand in hand, and
ANSYS, Inc. is at the forefront of providing tools
for both.
www.ansys.com ANSYS Solutions | Summer 2005
Industry News
Recent Announcements
3
and Upcoming Events
Now Available! ANSYS Parametric Design ence materials and code-check various structures
Language Customization Guide against international standards. For example, engi-
neers in the nuclear industry can analyze stress on a
Phoenix Analysis and Design Technologies (PADT) is structure design and then conduct a code check of a
pleased to announce the release of its Guide to welding to ensure it meets the code of the particular
ANSYS Customization with APDL.This guide is a country in which it is being built — all before creating
compilation of course notes from PADT’s very popular a sketch in any CAD program.
“ANSYS Customization with APDL” class. By popular
demand, PADT has turned the notes into a 288-page The integration also offers a convenient way for engi-
guide that steps new and experienced ANSYS users neers to manage their projects, since they are able to
through all of the details of APDL scripting. Its 12 compile all information and track their progress on a
chapters include reference information, examples, tips project in one location. Because ESOP is an Excel-
and hints and eight workshops. This guide, available based program, the technology is also easy to use.
in hardcopy only, is an invaluable resource to anyone
who wants to start using APDL or become an ANSYS To learn more, visit the news section at www.ansys.com.
“power user.” Priced at $75, it will quickly pay for itself
by saving you hours of research and trial-and-error.
For more information, visit www.padtinc.com/ Save the Date for 2006 International
support/techguides or call 1-800-293-PADT. ANSYS Conference
Continuing what avid ANSYS users consider a CAE
ANSYS and RoboBAT Announce an Integrated tradition, preparations are under way for the 2006
Structural Engineering Solution International ANSYS Conference to be held May 2 – 4
at a new venue this year — the David L. Lawrence
ANSYS, Inc. recently announced a partnership with Convention Center — with training April 30 – May 1
RoboBAT, a leading supplier of analytical and CAD at the Westin Convention Center, in Pittsburgh,
software solutions for the structural engineer, to inte- Pennsylvania, USA. The event brings together
grate their solutions in order to streamline customers’ engineers and analysts worldwide from all disciplines
product development processes. of computer-aided engineering.
The integration of RoboBAT’s Engineering System Since 1983, ANSYS, Inc. has hosted the International
Open Platform (ESOP) software with ANSYS Work- ANSYS Conference to showcase the advances in
bench expands users’ access to structural engineering computer-aided engineering and related technologies.
applications and increases their productivity. Users The three-day conference addresses the complete
have access to more than 100 engineering applica- spectrum of engineering professionals including
tions as well as the ability to write their own modules, engineers, analysts and engineering managers.
either stand-alone or integrated with ANSYS Work- Conference attendees have the opportunity to
bench models (for example, writing pre- and/or post- network with peers, interact with ANSYS professionals
processors for Workbench). and participate in a variety of technical sessions.
Through ESOP for Workbench, users can assess For more information and to sign up for email updates,
structures quickly and easily. They have a central loca- visit www.ansys.com/conf2006.
tion where they can conduct calculations and analyses
in the pre-design phase, access databases of refer-
www.ansys.com ANSYS Solutions | Summer 2005
Industry News
Partner Announcements
Upcoming Events
4
ISABE
September 4 – 9
Matereality v.2.1 Features New Products,
Munich, Germany
Functionality, Content
www.isabe2005.com
Matereality, L.L.C., USA, the developer of the first-of-
its-kind complete material data management (MDM)
Nuclear Energy for New Europe
system in TrueDigital™ format, announces the release
September 5 – 8
of Matereality®Version 2.1.
Bled, Slovenia
www.drustvo-js.si/bled2005
The much awaited Version 2.1 release of the Matereal-
ity material data management platform brings a num-
ber of advances to this rapidly developing field. In
Offshore Europe 2005 Oil & Gas
addition to creating the flagship line that provides a
Exhibition & Conference
Web-based resource for the storage and selective
September 6 – 9
deployment of material property data, the company
Aberdeen, UK
now has two new products. Material Data Server has
www.offshore-europe.co.uk
been created to enable manufacturing enterprises to
store all their material property data on all their materials
on a single extensible platform within their intranets
German Fuel Cell Congress 2005
and maintain complete control over who has access to
September 26 – 28
it. With this, companies can now finally go paperless
Stuttgart, Germany
with the storage of all their test data, cradle to grave.
www.f-cell.de
The Materials Databases product line provides
material suppliers with a ready-to-deploy technology
German Aerospace Congress 2005
to enhance their customer support with one powerful
September 26 – 29
secure platform for material selection data as well
Friedrichshafen, Germany
as design properties, 365/24/7 globally! For more
www.dglr.de
information, visit www.matereality.com.
Automobile & Engine Technology
Durability & Fatigue Seminars from Safe Technology
Colloquium
October 4 – 6
Noted fatigue & durability authority, Professor John
Aachen, Germany
Draper of Safe Technology Ltd (UK ),will be visiting
www.rwth-aachen.de/ac-kolloquium/index_e.htm
Downers Grove, Chicago, Ill., September 12 - 16, to
present a series offatigue and durability seminars
hosted and sponsored by Belcan Corporation.
SNAME Maritime Technology Conference
& Expo and Ship Production Symposium
A regular speaker at conferences worldwide, Profes-
October 19 – 21
sor Draper has over 25 years' experiencein fatigue
Houston, TX, USA
design and life assessment in the aerospace and
www.sname.org/AM2005/
ground-vehicle industries.
These courses will provide an introduction to modern
Visit www.ansys.com for more events.
theories of metal fatigue and their practical application
through worked examples and interaction/discussion.
There is a strong emphasis on what is possible and the
pitfalls to avoid. A professional volume of course notes
forms a self-contained reference book.
For a complete listing of courses, visit
www.safetechnology.com. ■
www.ansys.com ANSYS Solutions | Summer 2005
Industry Spotlight
5
Microsystems
and
Nanotechnology
A continuing series on the value
of engineering simulation in
specific industries
A rapidly growing number of products in many
industries contain miniature sensors, actuators and
other Micro-Electro-Mechanical System (MEMS)
devices made of small parts measured in microns
(millionths of a meter). Complete devices typically
are on the order of a few millimeters across, with
individual components less than 10 µm thick, and
frequently are combined with integrated circuits on
a single chip to provide built-in intelligence and
signal processing.
www.ansys.com ANSYS Solutions | Summer 2005
Industry Spotlight
6 MEMS devices must perform accurately and
reliably, often in hostile environments. Therefore,
engineers rely extensively on engineering simulation
software to study these microstructures in
determining stress, deformation, resonance,
temperature distribution, piezoelectric response,
electromagnetic interference and electrical properties.
Multiphysics analysis tools, in particular, are
essential in accounting for these effects, which can
have such huge impact on delicate microstructures.
Most of the commercially deployed devices are
used in automotive applications such as accelerome-
ters for deploying airbags and sensors for monitoring
manifold pressures, roll-over and fuel injection
systems, for example. Biomedical is another large
market, with MEMS in disposable blood pressure
sensors, as another example. The technology also
Electrostatic-structural analysis of a comb drive MEMS
is used for ink-jet printer heads, display devices, resonator commonly used in electromechanical bandpass
hard disk drives and other electronic equipment filters shows voltage iso-surfaces in the device.
applications.
Clearly, MEMS technology is past the buzzword
stage of the late 1990s and now represents a growing
industry producing millions of products each year.
Industry analysts estimate the total worldwide MEMS Design Challenges
market at nearly $7 billion and expect it to undergo a
One of the most formidable tasks in MEMS
compound annual growth rate in the range of 20
development is designing the microscopic parts to
percent for the next several years as implementation
best fit together and operate properly, often in
of the devices expands. The use of MEMS in automo-
environments hostile to delicate mechanical
biles is predicted to double by 2007.
components and sensitive electronic circuitry.
Developing internal interconnects, circuitry and
Small, Accurate and Economical
packaging so that MEMS devices operate flawlessly
The attraction of MEMS for such applications is their for years in these demanding applications is a tough
relatively low cost and high performance in a compact engineering challenge. Semiconductors must resist
package. Produced through the same semiconductor damaging internal heat build-up while withstanding
fabrication methods as integrated circuits (ICs), thou- a wide range of structural loads and ambient
sands of MEMS can be mass-produced on a single temperature swings. Parts such as diaphragms,
silicon wafer along with associated electronic circuits. valves, membranes, beams and other microstructures
Using well-proven semiconductor fabrication on the same silicon chip also must survive severe
technology, including bulk micromachining or surface shock and vibration to adequately perform their
deposition, MEMS can be produced and sold for mechanical functions.
a fraction of the cost of conventional sensing or Traditional electromechanical products have
actuation devices. Conventional blood pressure these same requirements. But designing MEMS is
transducers costing $600, for example, can be particularly challenging because of the tremendous
replaced by MEMS intravenous sensors selling for difference in size and overall sensitivity of the devices’
about $10. internal components compared to their surroundings.
The ability to easily integrate MEMS transducers A MEMS sensor that measures gas pressures in
with signal processing electronics and the precise the range of 0.15 psi by detecting a few microns
manufacturing tolerances inherent in the semi- deflection of a microbeam, for example, often must
conductor fabrication process allow manufacturers to undergo several Gs of shock and vibration while in
meet (and in many cases exceed) the performance of service on a piece of factory-floor equipment. The task
equivalent macroscopic transducers. of the MEMS sensor in this application is equivalent to
detecting a sneeze in the middle of an earthquake!
www.ansys.com ANSYS Solutions | Summer 2005
7
A MEMS designer has further challenges in the Such cycles were cumbersome, error-prone and time-
packaging of the device. Packaging, typically a form of consuming and required users to learn and maintain
plastic encapsulation similar to ICs, often impacts several different software codes. These issues are
device operation, reliability and accuracy. being addressed by multiphysics solutions that
Because many of these effects are inter- automatically combine the effects of two or more
dependent, predicting output and performance of interrelated physics within one unified environment.
MEMS devices is generally a complex problem that These solutions automatically manage data exchange
often defies intuitive approaches used in developing between the different physics to perform coupled
traditional transducer technology. analysis without requiring users to spend time
Developers of MEMS also have greater obstacles manually performing these tasks. As a result, coupled
to overcome in the area of prototype testing. Whereas analyses can be performed in a fraction of the time
physical mock-ups of conventional electromechanical otherwise required.
devices may undergo several test and re-design Possibly the original and most comprehensive
cycles where parts are modified and switched around, multiphysics solution is provided by ANSYS, Inc.
the initial semiconductor fabrication setup for MEMS ANSYS Multiphysics offers the widest range of
is so time-intensive that prototype testing simply multiphysics disciplines in a single unified
verifies a design, and physical design interactions are environment: structural, thermal, fluid and electro-
largely replaced by virtual prototyping. magnetic. Another major strength is that ANSYS
Multiphysics is fully integrated with many ANSYS
Multiphysics Solutions analysis tools such as parametric modeling
capabilities, design optimization and probabilistic
To meet these many design challenges, MEMS
design functionality, and both ECAD and MCAD
engineers universally rely on engineering simulation to
import features. ANSYS Multiphysics also has an
create and performance-test virtual prototypes of the
advanced fluid structure interaction capability realized
devices. Multiphysics simulation is used extensively in
through bi-directional interface with the ANSYS CFX
the development of MEMS because of the inherent
computational fluid dynamics code.
multiple interrelated physical phenomena at play,
Unlike many other commercial FEA codes that
such as stress, temperature, electrostatics, piezo-
provide either direct or iterative multi-field approaches,
electrics, fluidic damping, thermoelastic effects
ANSYS Multiphysics provides both. Direct coupled
and electromagnetism.
field analysis solves all of the physics field’s degrees of
Previously, solving such coupled applications
freedom in one solution phase. In iterative coupling,
meant enduring numerous manual file transfers
results of a single FEA solver iteration of one physics
and problem setups for each physics analysis.
SilMach uses ANSYS Multiphysics in the development of electromagnetic actuators and research into a variety of MEMS-based actuators
and systems such as these unmanned airborne vehicles with flapping wing propulsion systems.
www.ansys.com ANSYS Solutions | Summer 2005
Industry Spotlight
8
field are passed as loads to the next physics field, sion systems for artificial insects and nanometer-scale
iterating between all active physics fields until unmanned airborne vehicles (UAVs).
convergence criteria in the transferred loads are met. The software is also used by RTI International in
The ANSYS Multi-field solver automatically handles the development of advanced imaging systems. A
the data exchanged in these iterations. Users only particular challenge is simulating the effect of
have to set up the problem initially. 25-100THz infrared waves interacting with a periodic
array reflective structure. The problem was considered
Analysis in Action unsolvable using traditional FEA methods, which
would have required a model size approaching 100
A growing number of organizations use ANSYS
million degrees of freedom.
Multiphysics for analyzing MEMS devices. Today,
ANSYS Multiphysics was used to perform a full
hundreds of companies and research institutions use
wave electromagnetics harmonic scattering analysis
the software in developing leading-edge MEMS
on the device. Reflection coefficients were computed
technologies globally.
for the entire frequency range. The analysis took into
SilMach, for example, develops highly integrated
account the skin depth and loss of RF energy through
silicon-based actuators and systems. By using
joule heating of the materials. A fully parametric model
ANSYS Multiphysics, the company has the ability to
enabled rapid changes in materials, geometry and
solve complex coupled physics to create sensors and
excitation. The numerical problem size was reduced
actuators within arrays and predict their performance
considerably through the use of the periodic boundary
before committing to manufacture. Coupled physics
condition.
such as mechanical deformation and nonlinear
This approach provided RTI with the ability
contact effects with acoustic, electrostatic, thermal
to validate experimental results and quickly improve
and fluid damping can be achieved using the software.
RTI modeled a unit cell (left) and obtained results of the scattered plane wave (right) using ANSYS Multiphysics in the development of
a periodic array reflective structure.
ANSYS Multiphysics has enabled SilMach to device performance by investigating various structure
create more efficient MEMS devices such as an parameter changes. The software contributed to a
electromagnetic actuator producing 100 Watts per better scientific understanding of experimental results
gram compared to 1 Watt per gram for standard because researchers could actually visualize the
devices. The company also continues to research electric field within and around the structure. ANSYS
other advanced technologies, including MEMS-based Multiphysics also allowed RTl to analyze results at dis-
gas micro-turbines, MEMS-based flap-arrays for crete frequency points, which will help plan future
active control of turbulence and flapping-wing propul- equipment purchases for their experimental work. ■
www.ansys.com ANSYS Solutions | Summer 2005