Lumped Elements for RF and Microwave Circuits

593 Pages·2022·40.026 MB·English

by  Inder J. Bahl

(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page i — #1
(cid:1) (cid:1)
Lumped Elements for RF
and Microwave Circuits
Second Edition
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page ii — #2
(cid:1) (cid:1)
ForalistingofrecenttitlesintheArtechMicrowaveLibrary,
turntothebackofthisbook.
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page iii — #3
(cid:1) (cid:1)
Lumped Elements for RF
and Microwave Circuits
Second Edition
Inder J. Bahl
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page iv — #4
(cid:1) (cid:1)
LibraryofCongressCataloging-in-PublicationData
AcatalogrecordofthisbookisavailablefromtheU.S.LibraryofCongress.
BritishLibraryCataloguinginPublicationData
AcatalogrecordforthisbookisavailablefromtheBritishBritishLibrary.
ISBN978-1-63081-932-3
CoverdesignbyMarkBergeron
©2023ARTECHHOUSE
685CantonStreet
Norwood,MA02062
All rights reserved. Printed and bound in the United States of America. No part of this book
maybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,including
photocopying,recording,orbyanyinformationstorageandretrievalsystem,withoutpermission
inwritingfromthepublisher.
All terms mentioned in this book that are known to be trademarks or service marks have
beenappropriatelycapitalized.ArtechHousecannotattesttotheaccuracyofthisinformation.
Useofaterminthisbookshouldnotberegardedasaffectingthevalidityofanytrademarkor
servicemark.
10 9 8 7 6 5 4 3 2 1
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page v — #5
(cid:1) (cid:1)
Tomyadorablegrandsons,KaranandRohanKaushal,withwhomIplay,cry,
andlaugh,andwhohaveprovidedmewiththeideaandinspirationto
writethisbook
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page vi — #6
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page vii — #7
(cid:1) (cid:1)
C H A P T E R 0
C H A P T E R 0
Contents
Preface xvii
CHAPTER 1
Introduction 1
1.1 HistoryofLumpedElements 1
1.2 WhyUseLumpedElementsforRFandMicrowaveCircuits? 1
1.3 L,C,RCircuitElements 3
1.4 BasicDesignofLumpedElements 4
1.4.1 Capacitor 6
1.4.2 Inductor 6
1.4.3 Resistor 7
1.5 Lumped-ElementModeling 7
1.6 Fabrication 9
1.7 Applications 10
References 10
CHAPTER 2
Inductors 13
2.1 Introduction 13
2.2 BasicDefinitions 13
2.2.1 Inductance 14
2.2.2 MagneticEnergy 14
2.2.3 MutualInductance 15
2.2.4 EffectiveInductance 16
2.2.5 Impedance 16
2.2.6 TimeConstant 16
2.2.7 QualityFactor 17
2.2.8 Self-ResonantFrequency 18
2.2.9 MaximumCurrentRating 18
2.2.10 MaximumPowerRating 18
2.2.11 OtherParameters 18
2.3 InductorConfigurations 18
2.4 InductorModels 19
2.4.1 AnalyticalModels 20
2.4.2 Coupled-LineApproach 22
2.4.3 MutualInductanceApproach 27
vii
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page viii — #8
(cid:1) (cid:1)
viii Contents
2.4.4 NumericalApproach 29
2.4.5 Measurement-BasedModel 29
2.5 CouplingBetweenInductors 35
2.5.1 Low-ResistivitySubstrates 36
2.5.2 High-ResistivitySubstrates 37
2.6 ElectricalRepresentations 40
2.6.1 SeriesandParallelRepresentations 40
2.6.2 NetworkRepresentations 40
References 41
CHAPTER 3
Printed Inductors 45
3.1 InductorsonSiSubstrate 45
3.1.1 ConductorLoss 47
3.1.2 SubstrateLoss 50
3.1.3 LayoutConsiderations 51
3.1.4 InductorModel 53
3.1.5 Q-EnhancementTechniques 55
3.1.6 Stacked-CoilInductor 64
3.1.7 TemperatureDependence 67
3.2 InductorsonGaAsSubstrate 69
3.2.1 InductorModels 70
3.2.2 FigureofMerit 72
3.2.3 ComprehensiveInductorData 72
3.2.4 Q-EnhancementTechniques 85
3.2.5 CompactInductors 90
3.2.6 HighCurrentHandlingCapabilityInductors 94
3.3 PrintedCircuitBoardInductors 94
3.4 HybridIntegratedCircuitInductors 98
3.4.1 Thin-FilmInductors 98
3.4.2 Thick-FilmInductors 100
3.4.3 LTCCInductors 102
3.5 FerromagneticInductors 103
References 104
CHAPTER 4
Wire Inductors 109
4.1 Wire-WoundInductors 109
4.1.1 AnalyticalExpressions 109
4.1.2 CompactHigh-FrequencyInductors 114
4.2 BondWireInductor 117
4.2.1 SingleandMultipleWires 117
4.2.2 WireNearaCorner 120
4.2.3 WireonaSubstrateBackedbyaGroundPlane 120
4.2.4 WireAboveaSubstrateBackedbyaGroundPlane 122
(cid:1) (cid:1)
(cid:1) (cid:1)
(cid:1) (cid:1)
“FM” — 2022/11/8 — 10:15 — page ix — #9
(cid:1) (cid:1)
Contents ix
4.2.5 CurvedWireConnectingSubstrates 123
4.2.6 TwistedWire 124
4.2.7 MaximumCurrentHandlingofWires 124
4.3 WireModels 125
4.3.1 NumericalMethodsforBondWires 125
4.3.2 Measurement-BasedModelforAirCoreInductors 125
4.3.3 Measurement-BasedModelforBondWires 127
4.4 BroadbandInductors 127
4.5 MagneticMaterials 129
References 130
CHAPTER 5
Capacitors 133
5.1 Introduction 133
5.2 CapacitorParameters 134
5.2.1 CapacitorValue 134
5.2.2 EffectiveCapacitance 135
5.2.3 Tolerances 135
5.2.4 TemperatureCoefficient 135
5.2.5 QualityFactor 135
5.2.6 EquivalentSeriesResistance 136
5.2.7 SeriesandParallelResonances 137
5.2.8 DissipationFactororLossTangent 138
5.2.9 TimeConstant 138
5.2.10 RatedVoltage 138
5.2.11 RatedCurrent 138
5.3 ChipCapacitorTypes 139
5.3.1 MultilayerDielectricCapacitor 139
5.3.2 MultiplateCapacitor 140
5.4 DiscreteParallelPlateCapacitorAnalysis 140
5.4.1 VerticallyMountedSeriesCapacitor 141
5.4.2 Flat-MountedSeriesCapacitor 142
5.4.3 Flat-MountedShuntCapacitor 144
5.4.4 Measurement-BasedModel 145
5.5 VoltageandCurrentRatings 147
5.5.1 MaximumVoltageRating 147
5.5.2 MaximumRFCurrentRating 148
5.5.3 MaximumPowerDissipation 148
5.6 CapacitorElectricalRepresentation 151
5.6.1 SeriesandShuntConnections 151
5.6.2 NetworkRepresentations 152
References 153
CHAPTER 6
Monolithic Capacitors 155
6.1 MIMCapacitorModels 156
(cid:1) (cid:1)
(cid:1) (cid:1)