Linear CMOS RF Power Amplifiers A Complete Design Workflow

191 Pages·2014·23.64 MB·English

by  Hector Solar Ruiz

LineaI CMOS RF PoweI An1plifieIs
HectoI SolaI Ruiz . Roc eIengueI PeIez
В
Linear CMOS RF
Power Amplifiers
Complete Design W orkflow
А
~ Springer
Hector Solar Ruiz
Roc Berenguer Perez
E1ectronics and Communication Department
Centre of Technica1 Research (CEIT)
and University of Navarra (Теспип)
San Sebastian
Spain
ISBN 978-1-4614-8656-5 ISBN 978-1-4614-8657-2 (eBook)
DOI 10.1007/978-1-4614-8657-2
Springer New У ork Heidelberg Dordrecht London
Library of Congress Control Number: 2013945144
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Preface
The great spread of wireless technologies that is now observed reflects the interest
in greater connectivity and pushes the development of portable devices that аге
аЫе to connect to these emerging wireless technologies. Portable devices, then,
need to offer increasing connectivity capabilities while maintaining their perfor
тапсе in terms of size and autonomy. Therefore, portable devices must further
reduce not опlу their power consumption but also the size of their electronics. In
other words, high регfопnапсе, 10w cost, and highly integrated Radio Frequency
Integrated Circuits (RF ICs) аге increasingly required Ьу the consumer electronics
industry.
CMOS integrated technology has played ап important гоlе in this wireless
explosion due to its high functionality, integration capabilities, and 10w cost.
Consequently, power amplifiers (PAs) implemented in standard CMOS processes,
which offer performance close to that found in тоге expensive technologies, such
as GaAs, аге highly attractive. This is not опlу because CMOS technologies аге
extensively currently used in RF ICs implementations but also because CMOS
Р As тау offer 10w cost and high integration characteristics.
However, the РА is still ап RF component that has not Ьееп completely inte
grated within the whole transceiver due to the existing trade-off between high
performance and high integration characteristics. If high-performance Р As аге
required, designers focus оп expensi уе processes that prevent Р As from being
implemented in 10w cost, highly integrated devices. Conversely, ifhigh integration
is desired, achieving high-linearity and high-efficiency CMOS PAs is still а
challenge. In addition to this, Р As have а direct impact оп transcei уег performance
because the РА power consumption тау easily make up 50 % of the оуегаll power
consumption of the transceiver, meaning that а high-performance РА is crucial.
This work, then, focuses оп design techniques for high-performance, fully
integrated Епеаг CMOS PAs for wireless applications. The work provides а
complete flow for the design of the CMOS Р А Ьу describing the steps from the
уегу beginning of the design process. The book provides ап overview of the
metrics that quantify the performance of the РА in order to obtain the РА
requirements. In Chap. 3, the linearity and efficiency metrics of PAs сап Ье found
along with the metrics of PAs that handle digitally modulated channels. Stability
and power capability parameters have Ьееп also included.
VH
Preface
Уlll
Оп се the specific requirements of те РА Ьауе Ьееп established, this work
provides designers with а РА model to Ьеlр anticipate the expected performance of
the РА. Based оп те most important design parameters such as biasing, supply
voltage, inductor quality factors, current consumption, etc., the model provides the
expected metrics of the РА in terms of efficiency, linearity, and output power
levels. This model proves, then, to Ье а useful starting point in те first design
steps. ТЬе model description сап Ье found in СЬар. б.
Оп се parameters such as current consumption, supply voltage, ог the required
inductor quality factors Ьауе Ьееп quantified, the book discusses the optimization
process of а11 те РА stages. Based оп а Епеаг CMOS РА ехатрlе, the output
matching network, output, and driver amplifying stages, the input matching net
work, and те interstage matching network аге detailed. In addition, the main
issues that must Ье considered in the РА layout design process in order to avoid
performance degradation аге also presented. Special attention is paid to те issues
of integrated inductors in PAs, along with те extra considerations that designers
must know in order to optimize inductor performance. ТЬе details for the РА and
the integrated inductor optimization process аге also found in СЬар. б.
ТЬе test setups and procedures required to characterize а РА аге described in
СЬар. 7. In order to fu11y characterize РА performance, single-tone test and tests
based оп digital channels should Ье performed. ТЬе book presents Ьот types of
tests, along with results based оп the aforementioned Епеаг CMOS РА ехатрlе. In
addition, test setups and procedures for measuring inductors for PAs аге included.
ТЬе book also provides ап introductory overview of the impact of the Р А in the
transceiver quantified for modern communication standards in СЬар. 1. Chapter 2
addresses the issues and limitations that CMOS processes impose оп the design of
high-performance Епеаг PAs such as the 10w supply voltage that is available in
modern submicron CMOS processes ог 10w transistor transconductance. This
chapter also details several other aspects of CMOS processes, such as substrate
10sses, impedance transformation, ог stability and reliability issues.
Fundamentals of PAs, i.e., the classification of PAs into different classes, as
сuпепt source ог as switch-type PAs, аге also presented in СЬар. 4. ТЬе practical
uses of the different РА classes in implementing а Епеаг РА architecture аге also
presented; examples might Ье using class С PAs in Епеаг Doherty PAs ог сот­
bining class D Р As to implement ап outphasing Р А architecture.
Fina11y, СЬар. 5 is devoted to РА architectures that аге of interest for building
fu11y integrated Р As in order to асшеуе higher output power levels, enhanced
linearity, ог better efficiency. Power combined PAs and the Doherty architecture,
along with dynamic supply, adaptive biasing ог digital predistortion techniques,
and те use of cascode transistors аге а11 interesting solutions to boost РА linearity,
efficiency, ог output power levels in CMOS processes with limited supply voltage.
Contents
1 Introduction.................................... ... .
ТЬе Power Amplifier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... .
Impact of РА оп Integrated Transceivers . . . . . . . . . . . . . . . . . . . . . 1
Requirements of Modem Wireless Standards . . . . . . . . . . . . . . . . 2
CMOS Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Organization of the Book. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2 Power Amplifier Fundamentals: Metrics. . . . . . . . . . . . . . . . . . . . 11
АМ-АМ Distortion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Saturated Power and One dB Compression Point . . . . . . . . . . . . . 11
Third-Order Intercept Point . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
АМ-РМ Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Digital Channel Metrics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Spectral Regrowth. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Епor Vector Magnitude. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Efficiency Metrics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Drain Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Power-Added Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Power Back-Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Transmit Power Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Power Capability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3 Power Amplifier Fundamentals: Classes . . . . . . . . . . . . . . . . . . . . 29
Сuпепt Source Р As. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Transconductance Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Кnee V oltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Class А PAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Class АВ Р As. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Class В PAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Class С PAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
ix
Contents
х
Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Switch-Type PAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Class D PAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Class Е PAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Harmonic Tuning: Class F PAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4 CMOS Performance Issues. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Low Supply V oltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Effect of the Knee Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Load Transformation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Reliability Issues. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Oxide Breakdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Hot Сапiеr Degradation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Reliability Projection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Reliability Under RF Stress . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Transistor Parasitics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Substrate Issues. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Stability Issues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
5 Enhancement Techniques for CMOS Linear PAs . . . . . . . . . . . . . 75
Cascode PAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Thick Oxide Cascode Р As . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Self-Biased Cascode PAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Multiple Stacked Cascode Р As . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Combined Р As . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Integrated Transformer Power Combining . . . . . . . . . . . . . . . . . . 80
Simple Parallel Combination . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Doherty Р As. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Predistorted Р As . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Dynamic Supply or Envelope Tracking . . . . . . . . . . . . . . . . . . . . . . 88
Adaptive Biasing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
6 Power Amplifier Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 101
А Model for the Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . .. 101
Model Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 101
Output Power, Drain Efficiency and РАЕ . . . . . . . . . . . . . . . . .. 111
Model-В ased Anal yses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 113
Starting Point Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 118
Contents xi
Measurement Comparisons. . . . . . . . . . . . . . . . . . . . . . . . . . . .. 119
Power Amp1ifier Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 120
Schematic Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . .. 120
Design Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 121
Power Inductor Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 129
Тор Meta1 Layer Width Considerations . . . . . . . . . . . . . . . . . . .. 130
Mu1tip1e Meta1 Layer Considerations. . . . . . . . . . . . . . . . . . . . .. 131
Inductor Geometry Considerations. . . . . . . . . . . . . . . . . . . . . . .. 132
Accuracy Ana1ysis of the E1ectromagnetic Simu1ator. . . . . . . . . .. 133
Power Inductor Design Flow . . . . . . . . . . . . . . . . . . . . . . . . . .. 137
Layout Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 141
Circuit Iso1ation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 141
Differentia1 Design Considerations . . . . . . . . . . . . . . . . . . . . . .. 141
Passive Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 145
Stage Iso1ation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 147
Pad Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 148
Conc1usions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 150
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 150
7 Test Setups апд Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 153
Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 153
Inductor Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 153
Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 154
Prior Steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 155
Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 157
De-Embedding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 158
Results. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 160
Р А Characterization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 164
Single-Топе Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 165
Digital Channel Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 170
Reliability and Maximum Rating . . . . . . . . . . . . . . . . . . . . . . .. 175
Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 177
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 178
8 Conclusion.......................................... 179
Highlights. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 179
Main Contributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 181
А Complete Design Flow for а CMOS Linear РА. . . . . . . . . . . .. 181
Useful Enhancement Techniques for Linear CMOS PAs . . . . . . .. 181
Design and Characterization of Power Inductors. . . . . . . . . . . . .. 181
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 183