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Light Emitting Silicon for Microphotonics PDF

280 Pages·2003·6.137 MB·English
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1 Introduction: Fundamental Aspects CMOS (Complementary Metal Oxide Semiconductor) circuitry dominates the current semiconductor market due to the astonishing power of silicon electronic integration technology. In contrast to the dominance of silicon in electronics, photonics utilizes a diversity of materials for emitting, guiding, modulatinganddetectinglight.Inthelasttenyearsmuchresearcheffortwas aimed at rendering Si an optically active material so that it can be turned fromanelectronicmaterialtoaphotonicmaterial.ForsomethefutureofSi- basedphotonicsliesin“hybrid”solutions,forothersintheutilizationofmore photonicfunctionsbysiliconitself.Manybreakthroughsinthefieldhavebeen made recently. Nevertheless, the major deficiency in Si based optoelectronic devices remains the lack of suitable light emitters. In this chapter starting fromtheanalysisoftheelectronicandopticalpropertiesofsilicon,compared to other semiconductors, we present the strategies that have been employed to overcome the physical inability of bulk silicon to emit light efficiently. 1.1 Electronic and Optical Properties of Bulk Silicon Silicon, the most important elemental semiconductor, crystallizes in the di- amond structure. The diamond lattice consists of two interpenetrating face- centeredcubicBravaislatticesdisplacedalongthebodydiagonalofthecubic cellbyonequarterofthelengthofthediagonal.ThesymmetrygroupisO7h- Fd3m. The lattice constant is 0.5341 nm. Theenergybandstructureofsolidsdependsnotonlyonthecrystalstruc- turebutalsoonthechemicalspecies,thebondingbetweentheatomsandthe bond lengths. This results in severaldifferences in the electronic band struc- ture ofthe varioussemiconductors.As anexample the bandstructuresof Si, Ge and GaAs are compared in Fig. 1.1, which shows the results of electron energy band calculations within the empirical pseudopotential method [1, 2] (forasurveyonbandstructurecalculationsseeSect.2.1).Notethatwhereas Ge has the same diamond lattice structure of Si, the compound semiconduc- torGaAscrystallizesinthezinc-blendstructure.Inthislatticetheatomsare arrangedas in the diamond case but the two species alternate: the Ga atom StefanoOssicini,LorenzoPavesi, FrancescoPriolo:Light EmittingSiliconfor Microphotonics, STMP194,1–35(2003) (cid:1)c Springer-VerlagBerlinHeidelberg2003 2 1 FundamentalAspects Fig. 1.1. Topleft:BandstructureofGecalculatedwithintheempiricalpseudopo- tentialmethod.Spin–orbitcouplingisincludedinthecalculations.Topright:Band structureofSicalculatedwithintheempiricalpseudopotentialmethod.Tworesults areshown: nonlocal pseudopotential (solid line)and local pseudopotential(dashed line).Spin–orbitcouplingisincludedinthecalculations.Bottom:Bandstructureof GaAscalculatedwithintheempiricalpseudopotentialmethod.Spin–orbitcoupling is included in thecalculations. After [1] occupiestheoriginalsitesofthefacecenteredcubiclattice,whiletheAsatom is located at the tetrahedral site. Qualitatively the bands of all three materials are similar in shape, as ex- pectedfromtheircommoncrystalstructureandclosepositionsintheperiodic table. The main difference in the valence band structure is the degeneracy atthetopofthevalencebandattheΓ point,thecenteroftheBrillouinzone (BZ).TheΓ25(cid:1) pointoftheSicaseissplitbythespin–orbitinteractionatthe Γ andΓ points in the case ofGe andGaAs.The spin–orbitsplitting ∆ at 8 7 0 the zone center is a relativistic effect and increases with the atomic number 1.1 Electronic and Optical Properties of Bulk Silicon 3 of the element. In Si it is negligible (0.044 eV), while in Ge it has the value of about 0.29 eV and in GaAs of 0.34 eV. The two Γ and Γ bands have 8 7 differenteffectivemasses,termedlightandheavyholes,forsmallwavevector. Moreover,attheX point,someofthosestatesthataredoublydegeneratein SiandGearesplitinGaAs,bothinthe valenceandinthe conductionband. The main striking difference is related to the peculiar properties of the conductionbandextremainthethreecases.Thevalencebandsexhibitamax- imumattheΓ pointoftheBrillouinzoneforthethreesemiconductors;while the conduction band for GaAs has an absolute minimum at the Γ point, for Si it lies away from the high symmetry points near the X point along the (cid:1)001(cid:2) directions and for Ge it occurs at the zone boundaries in the (cid:1)111(cid:2) directions. ThedispersionoftheconductionbandinGaAsisparabolicneartheband edges.The effective massforthe electronis about0.067m ,wherem is the 0 0 electron mass in vacuum. The low value of the electron effective mass is one of the reasonsfor the high mobility in GaAs and of its use in high-frequency transistors.InSitheconductionbandhassixsymmetry-relatedminimainthe (cid:1)100(cid:2)directions.Eachoftheseminimagivesrisetoaconductionbandvalley. Theconstant-energysurfacesneartheconductionbandminimaareellipsoids elongated in the (cid:1)100(cid:2) directions (see Fig. 1.2). For each valley a parabolic approximation can be used. Due to symmetry considerations this leads to different effective masses for the electron, one for the longitudinal x-direc- tion, the other for the transverse y- and z-directions. The high anisotropy of the valleys for Si results in very different masses for the longitudinal and transverse mass, 0.916 and 0.19 m . 0 For Ge the minima, which are located at the L points along the (cid:1)111(cid:2) directions,originate in four equivalentvalleys or eighthalf-valleys.Also here the electron effective masses are highly anisotropic, 1.64 and 0.092 m (see 0 Fig. 1.2). Fig. 1.2. Left: Brillouin zone of Ge with constant-energy surfaces for the four equivalent L valleys. Right: Brillouin zone of Si with constant-energy surface for thesix equivalent X valleys 4 1 FundamentalAspects Theenergygap(the energydifferencebetweenthe conductionbandmin- imum and the valence band maximum) is termed direct in the case of GaAs, because an electronic transition between the two extrema can occur without change in wavevector. The energy gap is termed indirect when a change in wavevector is needed, as for Si and Ge. The value of the energy gaps ranges from the infrared (Ge) to the near infrared (Si) to the visible (GaAs). Some general properties of the three semiconductors are given in Table 1.1 [4, 5]. Table 1.1. Properties of Si, Ge, and GaAs Prop- Si Ge GaAs Units Name erty a 0.5431 0.5658 0.5653 nm Lattice constant ρ 2.329 5.323 5.318 g cm−3 Density hω 64 37 36 meV Optical phonon energy LO E 1.12 0.66 1.42 eV Energy gap at 300 K g E 1.17 0.74 1.52 eV Energy gap at 0 K g E(min) X L Γ Conduction band minimum c EΓ 3.5 0.80 1.42 eV Energy gap at Γ c ∆ 0.044 0.296 0.341 eV Spin–orbit splitting 0 χ 4.05 4.01 4.07 eV Electron affinity m 0.49 0.33 0.51 Heavy hole mass hh m 0.16 0.043 0.082 Light hole mass lh mΓ 0.063 Electron mass m 0.916 1.64 Longitudinal electron mass L m 0.19 0.092 Transverse electron mass T µ 0.15 0.39 0.85 m2V−1s−1 Electron mobility at 300 K n µ 0.045 0.19 0.04 m2V−1s−1 Hole mobility at 300 K p (cid:10) 11.7 16.2 12.9 Dielectric constant b n 3.42 4.0 3.3 Static refractive index R 1.1 6.4 7×104 ×10−14 cm3s−1 Radiative recombination coeff. C 16.6 12.6 11.9 ×10−11 dyn cm−2 Elastic constant at 300 K 11 C 6.4 4.4 5.34 ×10−11 dyn cm−2 Elastic constant at 300 K 12 C 7.96 6.77 5.96 ×10−11 dyn cm−2 Elastic constant at 300K 44 T 1685 1210 1513 K Melting temperature m The optical properties reflect the electronic ones. Figure 1.3 shows the real and imaginary parts of the dielectric function of the three considered semiconductors. They have been determined from reflectivity measurements and the use of Kramers–Kronigrelations [3]. They are directly connected to the optical parameters (see Sect. 2.1); the imaginary part is correlated with the absorption coefficient, the real part with the dielectric constant. In the caseof a directbandgapsemiconductor like GaAs the energygapis directly givenbytheopticalthreshold.ThisisnottrueinthecaseofSiandGewhere the onset of absorptionis related to the first direct transition:0.80 eV in Ge 1.1 Electronic and Optical Properties of Bulk Silicon 5 Fig.1.3.Real(cid:10) (thecurvethatalsoshowsnegativevalues)andimaginaryparts(cid:10) 1 2 of the dielectric function (cid:10) between 1.5 and 6 eV. Left: Crystalline Ge. Middle: Crystalline Si. Right: Crystalline GaAs. After [3] and 3.5 eV in Si (see Table 1.1). Moreover for a direct semiconductor the absorptioncoefficientαnear the bandedge has asquarerootdependence on the energy E, whereas a linear dependence of (αE)1/2 versus E is indicative of an indirect band gap semiconductor. InGaAs anelectronwhich has been excited in the conduction band atΓ caneasilydecayradiativelyatthesameΓ pointinthevalencebandproducing a photon of the same energy as the band gap. Under these conditions the radiative recombination rate is large, of the order of 2×107 s−1, and the radiative lifetime is short, of the order of nanoseconds. In the case of Ge and Si, where the minima and maxima occur at different points of the BZ, a phonon must participate in the process in order to conserve the crystal momentum, hence the term indirect transition. The three-particle process (electron, hole and phonon) has for Si a very lowrate,about102s−1,andtherelativeradiativelifetimesareinthemillisec- ondrange.The luminescence efficiency, defined asthe ratio ofthe number of photons emitted to the number of electron–hole pairs excited, is typically of the order 10−4–10−5 in bulk Si; for a direct semiconductor it can be of the orderof10−1.Thus in orderto overcomethe inability ofSito emit lighteffi- ciently one must defeat the tyranny of the k vector,e.g. by trying to reverse the indirect nature of the Si band gap into a direct one. The presence of an indirect gap is not, however, the only reason for the poor luminescence efficiency [6, 7]. The luminescence efficiency, due to the low radiative recombination rate, is determined by the competition among alternateelectron–holerecombinationprocesses.Onecandefinetheradiative efficiency of a semiconductor η as τ η = nr , (1.1) τ +τ r nr where τ is the lifetime of the radiative transition and τ is the lifetime r nr relativeto the recombinationmechanismsthatdo notinvolvethe creationof aphoton.Fromthisequationitisclearthatinordertohavealargeη,τ must r 6 1 FundamentalAspects be much shorter than τ . As stated above, τ for direct gap semiconductors nr r isveryshort(intherangeofns);forSi,τ ismuchlonger(oftheorderofms). r Extremely pure Si is needed to have a long nonradiative lifetime. There are several possible nonradiative recombination processes [8]. Just to cite a few: • Intrinsic defect or impurity recombination that involves the trapping of an electron (or hole) by a deep trap level and the subsequent capture of a hole (or electron), thus originating a recombination process. This mech- anism is usually termed Shockley–Read–Hall recombination. For this, the lifetime depends onthe concentrationsofdeepstatesandisofthe orderof nanoseconds [9]. • Augerrecombinationwhereanelectronrecombineswithaholetransferring its energy and momentum as kinetic energy to another electron and/or hole. Depending on the doping level the radiative lifetime associated with the Auger process ranges between 1 ns and 0.5 ms [10]. • Finally dislocations and surface mediated recombinations are possible. In these cases it is difficult to establish characteristic lifetimes because they vary depending on the quality of the surface. Good surface passivation via a naturally grownoxide removesalmostcompletely these nonradiative recombinations. The totalrecombinationratefor allthe differentnonradiativepathways,τ , nr can be obtained by the sum of the individual rates τnri: (cid:1) 1 1 = . (1.2) τ τ nr i nri For Si, τ is at least of the order of µs, three orders of magnitude smaller nr than the radiative lifetime τ . Bulk silicon has a very low quantum efficiency r and thus it is very unattractive as a light emitting device. 1.1.1 Light Emitting Diode Efficiency In this and the next sections we will discuss light emitting diodes (LEDs) basedonbulkSi.RecentlyareviewonSibasedLEDshasbeenpublished[14]. The performances of light emitting diodes could be given with different pa- rameters: maximum brightness, quantum efficiency, wall plug-in efficiency, peak power, on-set voltage, etc. A classification of the various efficiencies is reported in Table 1.2. Thepracticalperformanceofalightsourceisprimarilyevaluatedthrough itspower efficiency η ,whichistheratiobetweentheradiantfluxP emitted P by the LED and the input electrical power W flowing into the LED.1 The e externalpowerefficiencyissometimesreportedinlumensperwatt.η isalso P 1 The radiant flux P is the power carried by the light beams. Given a flux of photonsΦ,atagivenphotonfrequencyν,P =Φ×hν =Φ×hc/λ,wherecisthe speedoflightinvacuumandλisthewavelengthoflightinvacuum.Theluminous 1.1 Electronic and Optical Properties of Bulk Silicon 7 Table 1.2. Definitionof thevariousefficiencies. τ and τ are theradiativeand rad nr nonradiative lifetimes, respectively. P and P are the optical power as op(int) op(ext) measured in and outof thedevice. W , I andV aretheelectrical powerabsorbed, e current and voltage of the operating LED. (cid:1)ω is theemission energy of the LED internal quantum numberof photonsemitted τ eP efficiency ηint versusthe numberof electron– ηint = τ +nrτ = Io(cid:1)p(ωint) hole pairs generated nr rad external quantum numberof photonsdetected eP efficiency ηext versusnumbersof charge ηext = Iop(cid:1)(ωext) injected power efficiency η watts of light detected P η (cid:1)ω P η = op(ext) = ext versuswatts of electricity used P W eV e calledwall–plug-inefficiency because it is intendedthat the powershouldbe directlytakenbytheplug-in.Itshouldbenoticedthatthisgeneraldefinition can also be used for nonelectrically pumped luminescence mechanisms. In any case, the power efficiency value will always be between 0 and 1. The mechanism of electrically pumped light generation involves the gen- eration of a photon by the radiative recombination of electrical carriers (one electronandonehole).Thecapabilityofasingleelectron–holepairtogener- ateaphotoniscalledthe internalquantumefficiency,η .η isthenumber int int ofphotonsgenerateddividedbythenumberofminoritycarriersinjectedinto the region where recombination mostly occurs. By definition (Rate of radiative recombination) η = , int (Total rate of recombination (radiative and nonradiative)) or 1/τ η = r , int (1/τ )+(1/τ ) r nr where τ is the mean lifetime of a minority carrier before it recombines ra- r diatively and τ is the mean lifetime before it recombines without emitting nr flux F is the power of light weighted by the human eye responsivity V(λ), as defined in 1924 by CIE [11]. The conversion factor F/P, called the efficacy, has the same spectral shape as the eye responsivity V(λ), with the convention that the efficacy is 683 lm/W at λ =555 nm. The radiant intensity J is P per unit solidangleandismeasuredinwattspersteradian.Theluminousintensity I isF per unit solid angle. It is measured in candela, which are lumens per steradian. TheradianceListhesurfacedensity(withrespecttothesurfaceofthesource)of radiantintensityJ.Itismeasuredinwattspersquarecentimeterpersteradian. The luminance or brightness B is its photometric counterpart, i.e. the surface density of the luminous intensity I, and it can be measured in candelas per square meters, or nits (nt). Radiance and brightness are important when the source cannot be assumed as a point source. 8 1 FundamentalAspects a photon. If one considers that the number of carriers per unit time elec- trically injected by a current I is I/e, where e is the electrical charge of one electron, and that the number of photons per unit time carried by the internally generated optical power P is P /(cid:1)ω, where (cid:1)ω is the op(int) op(int) emissionenergy,thenη =eP /I(cid:1)ω.Theinternal quantumefficiency int op(int) (IQE),η ,isusedtocharacterizetheinternalgenerationofphotons.Itdoes int not take into account(1) how many electricalcarriers injected into the LED do not excite the material to the emitting excited state, and (2) how many generated photons get lost before exiting the device (e.g. by reabsorption processes). In fact, for those photons that are generated, there can still be loss through absorption within the LED material, reflection loss when light passes from a semiconductor to air due to differences in refractive index and total internal reflection of light at angles greater than the critical angle de- finedby Snell’s law.Forthese reasonsoneintroducesa moregeneralconcept to measure the efficiency of a LED, the external quantum efficiency (EQE), η , which is the ratio of the number of photons actually exiting the LED ext and the number of electrical carriers entering the LED per unit time. Thus, the following relation holds: ηext =ηj ×ηint×ηx (1.3) where ηj and ηx are by definition the carrier injection efficiency and the photonextractionefficiencies,respectively[12,13].Onecangiveestimatesof these last quantities for a LED based on a plane p/n junction. (cid:2) (cid:3) µ N L −1 ηj = 1+ µhNALe (1.4) e D h whereµ andµ arethemobilitiesofelectronsandholes,N andN arethe e h A D dopingdensitiesonthep-typeandn-typesideofthejunction,andL andL e h arethediffusionlengthsoftheelectronsandholes,respectively.Ontheother hand, the extraction efficiency can be estimated by considering the fraction of light which is transmitted through a plane interface between a medium of index of refraction n and one of index of refraction n with respect to the 1 2 total light impinging on the interface at any angle: (cid:2) (cid:3)(cid:4) (cid:2) (cid:3) (cid:5) 1 n n −n 2 F = 2 1− 1 2 . (1.5) T 4 n n +n 1 1 2 Finally,byusingtheEQEonecanalsoderiveη .Infact,η =η (cid:1)ω/eV, P P ext where V is the working voltage of the LED. The power efficiency of a LED should be at least 1% for display applications, whereas for optical intercon- nects it should be at least 10%, due to the requirement of a small thermal budget on the chip. The operating voltage can be high for display applica- tions, while it should be low (1–5 V) for interconnects. An operating life of more than severaltens of thousand hours with no degradation is a must. 1.2 Electroluminescence in Bulk Crystalline Si 9 1.2 Electroluminescence in Bulk Crystalline Si AreviewofLEDsbasedonSiandSicompatiblematerialsisreportedin[14]. Here we discussthose LEDs made frombulk Si; the other approachesto a Si LED are discussed in the following chapters. 1.2.1 Bulk-Si pn Junction LED EL from bulk crystalline Si can be obtained in the most basic way both by forwardor by reverse biasing a pn junction at room temperature (RT), thus injectingminoritycarriersacrossthepnjunction,andrealizingband-to-band radiativerecombinationoffreeexcessminoritycarriersaftertheinjection[15]. A pn junction shows a power efficiency of about 10−4 at 1.1 µm in forward bias,andofabout10−8inthevisibleandinreversebiaswhileintheavalanche breakdown regime [16]. The power quantum efficiency of an ordinary Czochralski (CZ) direct- biased pn junction is low, typically of the order of 10−4% or lower [17]. The most important recombination mechanisms are schematically shown in Fig. 1.4 [13]. EL in bulk Si was first reported by R. J. Haynes and H. B. Briggs in 1952 [19] by direct biasing a Si pn junction at room temperature (RT), and explainedby R.J. Haynes andW. C. Westphal in 1956[18] reporting exper- iments both at RT and at 77 K (see Fig. 1.5). At 77 K, the emission is not only due to free carriers, but also to exciton recombination [15]. The main feature of Fig. 1.5 at 77 K is the peak at hν = 1.100 eV (vacuum wave- 1 length 1127 nm). The emission line shape is the product of the Boltzmann occupation factor times the density of states. Forpracticalapplications,however,itisnecessarytoprovidemechanisms which work at RT. By raising the temperature to RT, several changes are observed.The first is a loweringof the peak intensity andofη . This is due int (1) to an increase of nonradiative recombination rates, and (2) to exciton ionization. Since the exciton binding energy is of the order of 15 meV, at RT exciton dissociation is significant (kT is about 25.8 meV at RT). It has been shown that the radiative recombination rate, which is dominated by excitonrecombinationallow temperature(under 26K),decreasesby raising the temperature. The drop is over an order of magnitude from 100 K to 300 K [20]. The second change is a shift to lower energy because of thermal band-gap shrinkage [17, 18, 21]. The third effect is the broadening of the luminescence band, as a consequence of the rise in the free carrier kinetic energy:thefull-width-half-maximum(FWHM) ofluminescenceisfittedwith 1.795 kT. The ratio between the free carrier concentration (n ) and exciton c concentration (n ) increases with the temperature according to the mass x actionlaw.AtRT,variousspectralfeaturesareobserved,whoseoriginisnot yetclearandseveralmodelshavebeenpresented[22].Theyinclude:interband 10 1 FundamentalAspects Fig. 1.4. Schematics of selected radiative (a) and nonradiative (b) recombina- tion mechanisms in Si. (a) (1) Intrinsic free electron–hole (eh) and free exciton (X),which both also involvecreation or annihilation of a phonon(not shown); (2) extrinsic recombination (in the presence of a neutral acceptor), of a free electron to bound hole (eAo) and of a bound exciton (AoX) (a similar situation can exist with neutral donors); (3) extrinsic recombination, bound electron (neutral donor) toboundhole(neutralacceptor)(DoAo).(b):Similarmechanismsoftype(1),(2), (3) can give rise to nonradiative (Auger) recombination. In this case the released energy is transferred to a free (or bound) carrier rather than generating a photon. (4) is Shockley–Read–Hall recombination. After [13] Fig. 1.5. First reported electroluminescence spectrum due to recombination of electrons and holes in Si, as published by J. R. Haynes and W. C. Westphal in 1956. The solid line shows the emission at 77 K, whereas the dashed line and the line with circles show emission at room temperature (the two spectra correspond to slightly different conditions). After[18]

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