ISTFA 2000 : proceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington PDF
Preview ISTFA 2000 : proceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington
ISTFA 2000 Proceedings of the 26th International Symposium for Testing and Failure Analysis 12 - 16 November 2000 Meydenbauer Convention Center Bellevue, Washington Sponsored by Published by ASM International Materials Park, Ohio 44073-0002 Copyright©2000 by ASMInternational® Allrightsreserved Nopartofthisbookmaybereproduced,storedinaretrievalsystem,or transmitted,inanyformorbyany means, electronic, mechanical, photocopying, recording, or otherwise, without the written permission of thecopyrightowner. Firstprinting,October2000 Greatcareistaken inthe compilationandproduction ofthisVolume, but it shouldbe made clear that NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE GIVEN IN CONNECTION WITH THIS PUBLICATION. Although this information is believed to be accurate by ASM, ASM cannot guarantee that favorable resultswillbeobtained from the use of this publication alone. This publication is intendedfor usebypersons havingtechnical skill, attheir sole discretionandrisk.Sincetheconditions of productor materialuseareoutsideofASM'scontrol,ASMassumes no liability or obligationinconnection with any use of this information. No claim of any kind, whether as to products or information in this publication, and whether or not based on negligence, shall be greater in amount than the purchase price of this product or publication in respect of which damages are claimed. THE REMEDY HEREBY PROVIDED SHALLBETHE EXCLUSIVEAND SOLEREMEDYOF BUYER, AND IN NO EVENT SHALL EITHER PARTY BE LIABLE FOR SPECIAL, INDIRECT OR CONSEQUENTIAL DAMAGES WHETHER OR NOT CAUSED BY OR RESULTING FROM THE NEGLIGENCE OF SUCH PARTY. As with any material,evaluation of the material under end-use conditions prior to specification is essential. Therefore, specifictestingunderactualconditionsisrecommended. Nothing contained in this book shall be construed as a grant of any right of manufacture, sale, use, or reproduction, in connection with any method, process, apparatus, product, composition, or system, whetherornotcoveredbyletterspatent,copyright,or trademark,andnothing contained inthisbookshall be construed as a defense against any alleged infringement of letters patent, copyright, or trademark, or asadefenseagainstliabilityforsuchinfringement. Comments,criticisms,andsuggestionsareinvited,andshouldbeforwardedtoASMInternational. ISBN:0-87170-701-2 SAN:204-7586 ASMInternational® MaterialsPark,OH44073-0002 PrintedintheUnitedStatesofAmerica The image on the cover shows one of the latest developments in microelectromechanical systems (MEMS) at Sandia National Laboratories. The device shown is an electrostatically driven mechanical actuator that operates at less than 20 volts using a simple square wave drive signal. The use of low voltages and simple waveforms to drive MEMS devices is a key issue for the evolution of MEMS-based microsystems. This actuator uses a torsional electrostatic comb drive that is coupled to an external ring gear through a ratcheting system. In this design, the application of a periodic voltage signal causes the inner combs to angularly vibrate about the torsional support springs. These small angular displacements are converted to continuous rotation of the ring gear by the ratchet pawls. Because the actuator producesa discrete displacement outputfor every applied voltage pulse,itcan be used for precise open- looppositioncontrol. The image is courtesy of Samuel L. Miller (Manager for Advanced Concepts for MEMS) and Stephen M. Barnes(Torsionalratchetingactuatordesigner)fromSandiaNationalLaboratories. Formoreinformation, pleasecontact: SamuelL.Miller (505)844-4678 [email protected] orvisittheSandiaNationalLaboratoriesMEMSwebsiteathttp://www.mems.sandia.gov. iii The Organizers of the 2000 International Symposium on Testing and Failure Analysis would like to acknowledgeandthankthefollowingpeoplefortheirassistanceineditingthisproceedings: D.Bodoh K.M.McCray Motorola,Inc. DiversifiedTechnologiesResources Austin,Texas ColoradoSprings,Colorado V.Chowdhury J.McDaniel AlteraCorporation LucentTechnologies SanJose,California Orlando,Florida S.Delgado S.V.Pabbisetty AccurelSystemsInternational TexasInstruments Sunnyvale,California Stafford,Texas I.DeWolf J.C.H.Phang IMEC NationalUniversityofSingapore Leuven,Belgium Singapore D.Dylis J.D.Plante IITResearchInstitute PhilipsSemiconductors ReliabilityAnalysisCenter(RAG) Sunnyvale,California Rome,NewYork H.S.Silvus,Jr. B.Ebersberger SouthwestResearchInstitute InfineonTechnologiesAG SanAntonio,Texas Munich,Germany J.Soden C.Hartfield SandiaNationalLaboratories TexasInstruments Albuquerque,NewMexico Dallas,Texas T.Taylor C.L.Henderson WhiteOakSemiconductor SandiaNationalLaboratories Sandston,Virginia Albuquerque,NewMexico M.Thayer L.G.Henry AdvancedMicroDevices ESD/TLPConsultant Austin,Texas Fremont,California M.Vanzi K.N.Hooghan Universita'diCagliari LucentTechnologies Cagliari,Italy Allentown,Pennsylvania K.-W.Yang TektronixOscilloscopeGroup Beaverton,Oregon iv ISTFA 2000 Organizing Committee DanielL.Barton ChristopherL.Henderson GeneralChair PanelDiscussion/UserGroupChair SandiaNationalLaboratories SandiaNationalLaboratories Albuquerque,NewMexico Albuquerque,NewMexico RichardJ.Ross SandraDelgado GeneralViceChair PublicityChair IBMMicroelectronics AccurelSystemsInternational EssexJunction,Vermont Sunnyvale,California H.StanSilvus,Jr. ChristianBoit TechnicalProgramChair SeminarCommitteeChair SouthwestResearchInstitute InfineonTechnologiesAG SanAntonio,Texas Munich,Germany JamesB.Colvin JerryM.Soden ExpositionChair SeminarCommitteeVice-Chair ConsultingServices SandiaNationalLaboratories Newark,California Albuquerque,NewMexico ThomasM.Moore AudioVisualChair TexasInstruments Dallas,Texas EDFAS 2000 - 2001 Board of Directors EdwardI.Cole,Jr. DanielL.Barton EDFASPresident EDFASDirector-At-Large SandiaNationalLaboratories SandiaNationalLaboratories Albuquerque,NewMexico Albuquerque,NewMexico LarryWagner ChristianBoit EDFASImmediatePastPresident EDFASDirector-At-Large TexasInstruments InfineonTechnologies/FA Dallas,Texas Munich,Germany RichardJ.Ross SandraDelgado EDFASVicePresident EDFASDirector-At-Large IBMMicroelectronics AccurelSystemsInternational EssexJunction,Vermont Sunnyvale,California GaryF.Shade JamesJ.Erickson EDFASSecretary EDFASDirector-At-Large VisteonMicroelectronics HughesSpaceandCommunicationsCo. ColoradoSprings,Colorado ElSegundo,California GlenGilfeather EDFASDirector-At-Large AMD Austin,Texas v ISTFA 2000 Committee Members Expo Committee JimColvin,Chair ConsultingServices,Newark,California KathyRenteria Compaq,Cupertino,California EfratRaz SelaUSA,Sunnyvale,California A/V Committee TomMoore,Chair TexasInstruments,Dallas,Texas CherylHartfield,Vice-Chair TexasInstruments,Dallas,Texas AnuBarman OkiSemiconductor,Sunnyvale,California ChrisHenderson SandiaNationalLaboratories,Albuquerque,NewMexico ScottWills TexasInstruments,Stafford,Texas LeeKnauss Neocera,Beltsville,Maryland EdwardKeyes SemiconductorInsights,Kanata,Ontario,Canada StanSilvus SouthwestResearchInstitute,SanAntonio,Texas CharlesOdegard TexasInstruments,Stafford,Texas Seminar Committee ChristianBoit,Chair Infineon,Munich,Germany JerryM.Soden SandiaNationalLaboratories,Albuquerque,NewMexico DaveBurgess AcceleratedAnalysis,HalfmoonBay,California TomMoore TexasInstruments,Dallas,Texas DickRoss IBMMicroelectronics,EssexJunction,Vermont DeanTomasi IBMMicroelectronics,EastFishkill,NewYork BrentWahl Agilent,SanJose,California ScottWills TexasInstruments,Stafford,Texas Discretes Committee MassimoVanzi,Chair Universita'diCagliari,Cagliari,Italy JimErickson HughesSpace&CommunicationsCo.,ElSegundo,California GaryMolle KaiserElectronics,SanJose,California NathalieLabat IXL–UniversityofBordeaux,Bordeaux,France PaoloMalberti ETH,Zurich,Switzerland Advanced Techniques Committee JacobC.H.Phang,Chair UniversityofSingapore,Singapore LudwigJ.Balk UniversityofWuppertal,Wuppertal,Germany MehrdadMahanpour AdvancedMicroDevices,Sunnyvale,California KiyoshiNikawa NECCorporation,Kanagawa,Japan ValluriRao Intel,SantaClara,California ScottWills TexasInstruments,Stafford,Texas Backside Committee MattThayer,Co-Chair AdvancedMicroDevices,Austin,Texas DanBodoh,Co-Chair Motorola,Austin,Texas MarkE.Potter LucentTechnologies,Allentown,Pennsylvania DaveVallett IBMMicroelectronics,EssexJunction,Vermont PeterNguyen TexasInstruments,Dallas,Texas Testing Committee JerryM.Soden,Chair SandiaNationalLaboratories,Albuquerque,NewMexico CharlesF.Hawkins UniversityofNewMexico,Albuquerque,NewMexico vi ISTFA 2000 Committee Members (continued) SPM Committee BerndEbersberger,Chair InfineonTechnologies,Munich,Germany RolandWiesendanger UniversityofHamburg,Hamburg,Germany WilfriedVandervorst IMEC,Leuven,Belgium PhilKaszuba IBMMicroelectronics,EssexJunction,Vermont PaiboonTangyunyong SandiaNationalLaboratories,Albuquerque,NewMexico NobuyukiNakagiri NikonCorporation,Tokyo,Japan Techniques Committee IngridDeWolf,Chair IMEC,Leuven,Belgium SandraDelgado AccurelSystemsInternational,Sunnyvale,California Jean-PierreLandesman Thomson-CSF,Orsay,France JenniferMcDaniel LucentTechnologies,Orlando,Florida ChrisPlougonven IBM,CorbeilEssonnes,France Case Histories Committee JimPlante,Chair PhilipsSemiconductors,Sunnyvale,California SteveFerrier SDGAnalytic,Inc.,Corvallis,Oregon ChristopherHenderson SandiaNationalLaboratories,Albuquerque,NewMexico StacyGleixner SanJoseStateUniversity,SanJose,California MakotoYamazaki AdvantestCorp.,Gunma,Japan SandraDelgado AccurelSystemsInternational,Sunnyvale,California Packaging Committee KathyMcCray,Co-Chair DiversifiedTechnologies,ColoradoSprings,Colorado CherylHartfield,Co-Chair TexasInstruments,Dallas,Texas TomMoore TexasInstruments,Dallas,Texas TomPaquette InsightAnalyticalLabs,ColoradoSprings,Colorado DeepakGoyal Intel,Chandler,Arizona RajenDias Intel,Chandler,Arizona RodMartens Hewlett-Packard,FortCollins,Colorado Military Committee DavidDylis,Chair ReliabilityAnalysisCenter(RAC),Rome,NewYork PerryMartin MartinEngineering,NorthHighlands,California GeorgeSlenski USAirForce,WrightPattersonAFB,Ohio DavidJohnson USAirForce,WrightPattersonAFB,Ohio EddieWhite USAirForce,WrightPattersonAFB,Ohio DaleHart UniversityofDaytonInstitute,USAirForce,WrightPattersonAFB,Ohio JoeBuben DefenseSupplyCenterColumbus(DSCC),Columbus,Ohio FIB Committee KultaransinghHooghan,Chair LucentTechnologies,Allentown,Pennsylvania AlanStreet IntegratedReliability,SanDiego,California WilliamVanderlinde MicroelectronicsResearchLaboratory,Columbia,Maryland AnnCampbell SandiaNationalLaboratories,Albuquerque,NewMexico RoseRing AdvancedMicroDevices,Austin,Texas StevenHerschbein IBMMicroelectronics,HopewellJunction,NewYork vii ISTFA 2000 Committee Members (continued) Yield Enhancement Committee TomTaylor,Co-Chair WhiteOakSemiconductor,Sandston,Virginia SeshuPabbisetty,Co-Chair TexasInstruments,Stafford,Texas SweeYongKhim UnitedTestandAssemblyCenterLtd.,Singapore MarkRatner LSILogic,FortCollins,Colorado LuisAndrade WhiteOakSemiconductor,Sandston,Virginia EOS/ESD Committee LeoG.Henry,Co-Chair ESD/TLPConsultant,Fremont,California VijayChowdhury,Co-Chair AlteraCorporation,SanJose,California MehrdadMahanpour AdvancedMicroDevices,SunnyvaleCalifornia KoenVerhaege SarnoffCorporation,Princeton,NewJersey MarkA.Kelly DelphiDelcoElectronics,Kokomo,Indiana viii 1999 BEST PAPER AWARD Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy L.A.Knauss,B.M.Frazier,H.M.Christen,S.D.Silliman,K.S.Harshavardhan Neocera,Inc. Beltsville,Maryland E.F.Fleet,F.C.Wellstood UniversityofMaryland CollegePark,Maryland M.Mahanpour,A.Ghaemmaghami AdvancedMicroDevices,Inc. Sunnyvale,California 1999 OUTSTANDING PAPER AWARD Light Emission Spectral Analysis: The Connection Between the Electric Field and the Spectrum D.L.Barton,P.Tangyunyong,J.M.Soden,C.L.Henderson,E.I.Cole,Jr. SandiaNationalLaboratories Albuquerque,NewMexico R.Danz,R.Steiner CarlZiess,Inc. Jena,Germany Z.Iwinski CarlZeiss,Inc. Thornwood,NewYork Future ISTFA Dates 27th International Symposium for Testing and Failure Analysis 11 - 15 November 2001 Santa Clara Convention Center Santa Clara, California Be sure to put this date on your calendar! ix FirstAnnouncementAnd ISTFA 2001 • Call for Papers 27th International Symposium for Testing and Failure Analysis SponsoredbytheASMElectronicDeviceFailureAnalysisSociety(EDFAS) 11-15November2001(cid:129)SantaClara,California,USA ISTFAsolicitsoriginal,previouslyunpublishedpapersonawiderangeofTestingandFailure Analysistopicsofpracticalvaluetoanyoneworkingtodetect,understandandeliminateelectronic devicefailures. Non-commercialpapersfromequipmentvendorsdealingwithneworuniquetoolsand methodologies,applicationsandresultsarewelcome. Paperswillbeselectedforinclusioninthe technicalprogramonthebasisofappropriatenessandqualityofdata,technicalimportance, novelty/originality,andinterpretationofresults. Paperacceptanceisbasedentirelyonthe informationincludedintheabstract. We arecurrently seeking papers on(but not limitedto) thefollowingrelevant topics: (cid:129) AdvancedFaultLocalizationTechniques (cid:129) DefectCharacterizationMethods (cid:129) SamplePreparationandDeprocessingMethods (cid:129) CaseHistories (cid:129) Discrete/PassiveComponentFailureAnalysis (cid:129) DesignforTest/DesignforAnalysis (cid:129) TestingandDeviceCharacterization (cid:129) PackagingRelatedFailureAnalysis (cid:129) BacksideandFlip-ChipAnalysisTechniques (cid:129) CompoundSemiconductorDevices (cid:129) Micro-ElectroMechanicalSystems(MEMS) (cid:129) SignatureAnalysis ABSTRACT SUBMISSIONGUIDELINES AbstractPreparation: 1. Beginyourabstractwiththeconferencename,ISTFA2001,followedbythetitleofyourpaper. 2. Typeyourabstract(two-pagemaximum)inEnglishandincludesignificantrepresentativeimages, figures,references,etc. Allabstractsmustadheretothetwo-pagemaximumlengthtobeconsidered. Withinthetwo-pagemaximum,itishighlyadvisabletoincludesufficientdetail(atleastonefullpage) toallowforfairevaluationoftheworkdiscussed. AfullcopyofthemanuscriptinMicrosoftWord formatmaybesubmittedinadditiontotheabstractifdesired. 3. Attheendofyourabstract,describein25wordsorless,thesignificanceofyourwork(conclusions andbenefits). Thenlistthree(3)keywordsfromyourabstractthatcanbeusedforindexinginthe ConferenceProceedings,andindicatetowhichtopicalarea(fromthelistabove,or“other”if appropriate)yourabstractrelates. 4. Onanadditionalpage(s),providethefollowinginformationforthepresentingauthorfirst,thenforall co-authorsofthework:Completename(includingDr./Mr./Mrs./Ms./Prof.etc.),title,affiliationwith completemailingaddress(noP.O.Boxnumbers),telephoneandfaxnumbers,ande-mailaddress. Thisinformationmustbeincludedwithyourabstractoritwillnotbeconsideredforevaluation. AbstractandManuscriptDeadlines: 1. Abstractsmustbesubmittedby1MARCH2001tobeconsideredforinclusionintheprogram. 2. AConferenceProceedingsisplannedforpublicationanddistributionattheevent. Afullmanuscriptin MicrosoftWordformatmustbesubmittedforreviewby15JUNE2001,theninfinalcamera-readyand electronicformatsby13JULY2001. AbstractSubmissionOptions: (cid:129) Pleasee-mailyourabstractasaMicrosoftWordfileattachmenttoeducatn@po.asm-intl.org. Inthe “SubjectLine,”pleaseenterISTFA2001. (cid:129) Ifyouabsolutelycannotsubmityourabstractelectronically,mailittoarrivebeforethedeadlineto: ISTFAConferenceAdministrator,ASMInternational,MaterialsPark,Ohio44073-0002(telephone: +440.338.5151). VisittheEDFASWebsitefrequentlyatwww.edfas.orgforupdatesonthisevent. xi
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