Introduction to Metrology Applications in IC Manufacturing

180 Pages·2015·28.425 MB·English

by  Bo Su, Eric Solecky, Alok Vaid, James A. Harrington (editor)

Introduction to
Metrology Applications
in IC Manufacturing
Bo Su
Eric Solecky
Alok Vaid

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Library of Congress Cataloging-in-Publication Data
Su, Bo, author.
Introduction to metrology applications in IC manufacturing / Bo Su, Eric Solecky,
and Alok Vaid.
pages cm – (Tutorial texts in optical engineering ; volume TT 101)
Includes bibliographical references and index.
ISBN 978-1-62841-811-8
1. Integratedcircuits–Measurement.2. Integratedcircuits–Designandconstruction.
I.Solecky,Eric,author.II.Vaid,Alok,author.III.Title.IV.Series:Tutorialtextsin
optical engineering ; v. TT 101.
TK7874.58.B63 2015
621.3815–dc23
2015016029
Published by
SPIE
P.O. Box 10
Bellingham, Washington 98227-0010 USA
Phone: [phone]
Fax: [phone]
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Web: http://spie.org
Copyright © 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
All rights reserved. No part of this publication may be reproduced or distributed in
any form or by any means without written permission of the publisher.
Thecontentofthisbookreflectstheworkandthoughtoftheauthor.Everyefforthas
beenmadetopublishreliableandaccurateinformationherein,butthepublisherisnot
responsible for the validity of the information or for any outcomes resulting from
reliance thereon.
Printed in the United States of America.
First printing
Introduction to the Series
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James A. Harrington
Rutgers University
Table of Contents
Preface xi
Acknowledgments xiii
List of Acronyms xvii
1 Introduction 1
1.1 What is Metrology? 1
1.2 Measurements and Metrology 2
1.3 Metrology in Daily Life 3
1.4 Applications in Modern Manufacturing 4
1.5 Standards and Traceability 6
1.6 Metrology Standards Related to IC Manufacturing 8
1.7 Measurement Methods and Process 9
1.7.1 Operator, measurement system, and measurement target 9
1.7.2 Manual measurement versus automatic measurement 10
1.8 Applications of Industrial Metrology 12
References 13
2 Metrology Fundamentals: Measurement System Characterization and
Calibration Using Traditional Definitions 15
2.1 Introduction 15
2.2 Precision 17
2.3 Long-Term Stability 19
2.4 Accuracy 20
2.5 Linearity 22
2.6 Tool-to-Tool Matching: Multiple Measurement Systems 23
2.7 Classifying Components of Uncertainty 24
2.8 Measurement Errors and Measurement Uncertainties 25
2.8.1 Random errors 25
2.8.2 Systemic errors 25
2.8.3 Tool-to-tool variations 26
2.9 Uncertainties and Risks 26
2.10 Are These Traditional Metrics Enough? 28
References 29
vii
viii TableofContents
3 Fundamental Metrology: Redefining Measurement System Analysis 31
3.1 Introduction 31
3.2 A Metrologist’s Core Activities 34
3.3 Roadmap and Specifications 35
3.4 Standards 35
3.5 Monitor Samples and Process Stressed Artifacts (PSAs) 36
3.6 Test Vehicle Variability, Metrology-Induced Sample
Damage, and Sample Stability 38
3.7 Reference Measurement System 38
3.8 Precision 39
3.8.1 Precision example 40
3.9 Calculating Precision in the Presence of Measurement-Induced
Damage or Sample Changes over Time 42
3.10 Mandel Regression 42
3.11 Accuracy 43
3.11.1 Accuracy example 44
3.12 TMU: An Alternative Definition for Clarification 47
3.12.1 Mandel analysis: the building block for new matching terms 47
3.13 Matching 50
3.13.1 Matching example 1 52
3.13.2 Matching example 2 52
3.14 Sustaining/Stability/Statistical Process Control (SPC) 55
3.14.1 Using TMP and FMP methodology to calculate
SPC control-chart limits 55
3.14.2 Mean control-chart-limit calculations for each tool 56
3.14.3 Mean control-chart-limit calculations for the fleet 56
3.14.4 Control-chart-limit setup example 1 57
3.14.5 Control-chart-limit setup example 2 60
3.14.6 Leveraging FMP to determine the root cause to allow
the fleet to meet the requirements 60
3.15 Sampling Plan: Catch-All Major Variations 61
3.16 Random Sampling 62
3.17 Systematic Sampling 63
3.18 Summary 64
References 65
4 Metrology in the Semiconductor IC Industry 67
4.1 Pervasiveness of Metrology 67
4.2 Metrology’s Impact on Time to Market 69
4.3 Value of Metrology 70
4.4 Metrology Target Design: an Element of Overhead 77
4.5 Chip Scaling and an Introduction to Some Key
Metrology Toolsets 79
TableofContents ix
4.6 Vision System and Recipes 81
4.7 Toolset Recipe Portability Monitoring 84
4.8 Large Fleet Sizes: Fleet Management 87
4.9 IC Process Development and Control 89
4.10 Metrology in IC Manufacturing Process Control 90
References 92
5 Metrology Toolsets in IC Manufacturing: Optical Metrology 93
5.1 Optical Film Characterization: Thickness and Composition 93
5.2 Scatterometry (OCD) 96
5.3 Overlay 101
References 107
6 Metrology Toolsets in IC Manufacturing: Charged-Particle Metrology
Systems 109
6.1 Electron-based Systems 109
6.2 CD-SEM and Sample Interactions 112
6.3 Key Fundamental Challenges of the CD-SEM 113
6.4 SEM-based Overlay Measurements 118
References 121
7 Metrology Toolsets in IC Manufacturing: Additional Metrology
Systems 123
7.1 X-Ray Metrology 123
7.2 In situ and Integrated Metrology 124
7.3 Critical-Dimension Atomic Force Microscope (CD-AFM) 125
References 130
8 Limitations of Metrology Techniques and Hybrid Metrology 131
8.1 Introduction 131
8.2 Hybrid Metrology: Synergies of Multiple Techniques 134
8.3 Types of HM Implementation 137
References 139
9 Metrology in Mask Making 141
9.1 Mask CD Measurements 143
9.2 Mask Inspection 144
References 147
10 Perspectives on Future Challenges and Considerations 149
10.1 Measurement Tooling Challenges 149
10.2 Fault Detection and Control 153
10.3 Virtual Metrology 153
10.4 Waferless Recipe Writing 154
10.5 The Blurry Line between Metrology and Defect Inspection 154
x TableofContents
10.6 Line-Edge Roughness and 3D Metrology 158
10.7 Contour Metrology 158
10.8 Lab-to-Fab and New Technology Trends 159
References 160
Appendix 161
Index 163