High-Speed Circuit Board Signal Integrity

263 Pages·2004·2.96 MB·English

High-Speed Circuit Board
Signal Integrity
ForalistingofrecenttitlesintheArtechHouseMicrowaveLibrary,
turntothebackofthisbook.
High-Speed Circuit Board
Signal Integrity
Stephen C. Thierauf
Artech House, Inc.
Boston • London
www.artechhouse.com
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CoverdesignbyIgorValdman
©2004ARTECHHOUSE,INC.
685CantonStreet
Norwood,MA02062
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InternationalStandardBookNumber:1-58053-131-8
10987654321
ToAnn,Christopher,andKevin
.
Contents
Preface xiii
CHAPTER 1
Characteristics and Construction of Printed Wiring Boards 1
1.1 Introduction 1
1.2 UnitSystem 1
1.3 PWBConstruction 2
1.3.1 Resins 3
1.3.2 AlternateResinSystems 3
1.3.3 Reinforcements 5
1.3.4 VariabilityinBuildingStackups 6
1.3.5 MixingLaminateTypes 7
1.4 PWBTraces 7
1.4.1 CopperCladding 8
1.4.2 CopperWeightsandThickness 9
1.4.3 PlatingtheSurfaceTraces 9
1.4.4 TraceEtchShapeEffects 9
1.5 Vias 10
1.5.1 ViaAspectRatio 13
1.6 SurfaceFinishesandSolderMask 14
1.7 Summary 14
References 15
CHAPTER 2
Resistance of Etched Conductors 17
2.1 Introduction 17
2.2 ResistanceatLowFrequencies 17
2.3 LoopResistanceandtheProximityEffect 20
2.3.1 ResistanceMatrix 21
2.3.2 ProximityEffect 22
2.4 ResistanceIncreasewithFrequency:SkinEffect 24
2.5 HandCalculationsofFrequency-DependentResistance 27
2.5.1 ReturnPathResistance 28
2.5.2 ConductorResistance 28
2.5.3 TotalLoopResistance 29
2.6 ResistanceIncreaseDuetoSurfaceRoughness 29
2.7 Summary 30
vii
viii Contents
References 30
CHAPTER 3
Capacitance of Etched Conductors 31
3.1 Introduction 31
3.2 CapacitanceandCharge 31
3.2.1 DielectricConstant 32
3.3 ParallelPlateCapacitor 33
3.4 SelfandMutualCapacitance 35
3.5 CapacitanceMatrix 37
3.6 DielectricLosses 39
3.6.1 ReactanceandDisplacementCurrent 40
3.6.2 LossTangent 40
3.6.3 CalculatingLossTangentandConductanceG 41
3.7 EnvironmentalEffectsonLaminateε andLossTangent 43
r
3.7.1 TemperatureEffects 44
3.7.2 MoistureEffects 44
3.8 Summary 45
References 45
CHAPTER 4
Inductance of Etched Conductors 47
4.1 Introduction 47
4.2 FieldTheory 47
4.2.1 Permeability 48
4.2.2 Inductance 48
4.2.3 InternalandExternalInductance 49
4.2.4 PartialInductance 49
4.2.5 ReciprocityPrincipalandTransverseElectromagneticMode 50
4.3 CircuitBehaviorofInductance 51
4.3.1 InductiveVoltageDrop 53
4.3.2 InductiveReactance 54
4.4 InductanceMatrix 55
4.4.1 UsingtheReciprocityPrincipletoObtainthe
InductanceMatrixfromaCapacitanceMatrix 55
4.5 MutualInductance 55
4.5.1 CouplingCoefficient 56
4.5.2 BeneficialEffectsofMutualInductance 57
4.5.3 DeleteriousEffectsofMutualInductance 59
4.6 HandCalculationsforInductance 60
4.6.1 InductanceofaWireAboveaReturnPlane 60
4.6.2 InductanceofSide-by-SideWires 61
4.6.3 InductanceofParallelPlates 61
4.6.4 InductanceofMicrostrip 63
4.6.5 InductanceofStripline 63
4.7 Summary 64
References 65