From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications PDF
Preview From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications
(cid:2) From LED to Solid State Lighting Principles, Materials, Packaging, Characterization, and Applications Shi-Wei Ricky Lee ChairProfessor,DepartmentofMechanicalandAerospaceEngineering Director,HKUSTFoshanResearchInstituteforSmartManufacturing Chairman,HKUSTSZ-HKCollaborativeInnovationResearchInstitute (cid:2) (cid:2) ActingDean,SystemsHub,HKUST(GZ) TheHongKongUniversityofScienceandTechnology Kowloon,HKSAR,China Jeffery C. C. Lo AssistantDirector,HKUSTFoshanResearchInstituteforSmartManufacturing ProgramManager,ElectronicPackagingLaboratory TheHongKongUniversityofScienceandTechnology Kowloon,HKSAR,China Mian Tao LeadEngineer,TechnologyDivision,GroupofIntegratedCircuitsandSystems HongKongAppliedScienceandTechnologyResearchInstitute NewTerritories,HKSAR,China Huaiyu Ye AssociateProfessor,SchoolofMicroelectronics SouthUniversityofScienceandTechnology Shenzhen,Guangdong,China (cid:2) (cid:2) Thiseditionfirstpublished2022 ©2022ChemicalIndustryPressCo.,Ltd.Published2022byJohnWiley&SonsSingaporePte.Ltd. Allrightsreserved.Nopartofthispublicationmaybereproduced,storedinaretrievalsystem,or transmitted,inanyformorbyanymeans,electronic,mechanical,photocopying,recordingorotherwise, exceptaspermittedbylaw.Adviceonhowtoobtainpermissiontoreusematerialfromthistitleisavailable athttp://www.wiley.com/go/permissions. 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LibraryofCongressCataloging-in-PublicationData Names:Lee,Shi-WeiRicky,author.|Lo,JefferyC.C.,author.|Tao, Mian,author.|Ye,Huaiyu,author. Title:FromLEDtosolidstatelighting:principles,materials,packaging, characterization,andapplications/Shi-WeiRickyLee,JefferyC.C.Lo, MianTao,HuaiyuYe. Description:Hoboken,NJ:Wiley,2022. Identifiers:LCCN2021003853(print)|LCCN2021003854(ebook)|ISBN 9781118881477(hardback)|ISBN9781118881583(adobepdf)|ISBN 9781118881552(epub) Subjects:LCSH:Lightemittingdiodes. Classification:LCCTK7871.89.L53L43652022(print)|LCCTK7871.89.L53 (ebook)|DDC621.32/8–dc23 LCrecordavailableathttps://lccn.loc.gov/2021003853 LCebookrecordavailableathttps://lccn.loc.gov/2021003854 CoverDesign:Wiley CoverImage:©ModernewWorld/DigitalVision/GettyImages Setin9.5/12.5ptSTIXTwoTextbyStraive,Chennai,India 10 9 8 7 6 5 4 3 2 1 (cid:2) (cid:2) iii Contents Preface v AbouttheAuthors vii 1 LEDsforSolid-StateLighting 1 1.1 Introduction 1 1.2 EvolutionofLightSourcesandLightingSystems 1 1.3 HistoricalDevelopmentofLEDs 6 1.4 ImplementationofWhiteLightIlluminationwithanLED 8 1.5 LEDsforGeneralLighting 10 (cid:2) References 12 (cid:2) 2 PackagingofLEDChips 15 2.1 Introduction 15 2.2 OverallPackagingProcessandLEDPackageTypes 16 2.3 ChipMountingandInterconnection 20 2.4 PhosphorCoatingandDispensingProcess 38 2.5 EncapsulationandMoldingProcess 48 2.6 SecondaryOpticsandLensDesign 50 References 54 3 ChipScaleandWaferLevelPackagingofLEDs 61 3.1 Introduction 61 3.2 ChipScalePackaging 63 3.3 EnablingTechnologiesforWaferLevelPackaging 66 3.4 DesignsandStructuresofLEDWaferLevelPackaging 91 3.5 ProcessesofLEDWaferLevelPackaging 96 References 106 4 BoardLevelAssembliesandLEDModules 111 4.1 Introduction 111 4.2 BoardLevelAssemblyProcesses 112 (cid:2) (cid:2) iv Contents 4.3 Chip-on-BoardAssemblies 130 4.4 LEDModulesandConsiderations 137 References 141 5 Optical,Electrical,andThermalPerformance 145 5.1 EvaluationofOpticalPerformance 145 5.2 PowerSupplyandEfficiency 159 5.3 ConsiderationofLEDThermalPerformance 163 References 172 6 ReliabilityEngineeringforLEDPackaging 175 6.1 ConceptofReliabilityandTestMethods 175 6.2 FailureAnalysisandLifeAssessment 181 6.3 DesignforReliability 185 References 187 7 EmergingApplicationsofLEDs 189 7.1 LEDsforAutomotiveLighting 189 7.2 Micro-andMini-LEDDisplay 194 7.3 LEDforVisibleLightCommunication 203 References 208 (cid:2) (cid:2) 8 LEDsBeyondVisibleLight 213 8.1 ApplicationsofUV-LED 213 8.2 ApplicationsofIR-LEDs 225 8.3 FutureOutlookandOtherTechnologyTrends 233 References 235 Index 243 (cid:2) (cid:2) v Preface The light-emitting diode (LED) is a semiconductor device based on the effect of electro- luminescence, which is a form of energy conversion from electrons directly to photons. Althoughthefundamentalprincipleofphysicswasdiscoveredmorethan100yearsago, devicesforactualapplicationswerenotinventeduntilthe1960s.Ittookanother30yearsfor researcherstocompletethevisiblelightspectrumofLEDswithvariousrecipesofsemicon- ductorcompounds.Bytheturnofthecentury,owingtothedevelopmentofhigh-brightness and high-power LEDs with white light illumination, the era of solid-state lighting (SSL) began.LEDevolvedtobethelightsourceofthefourthgenerationoflightingsystemssince theturnofthemillennium. (cid:2) Althoughdiodesseemtobethesimplestsolid-statedevice,themanufacturingofLED (cid:2) lightsourcesactuallyinvolvesmanyfabricationprocessesandsupplychains.Startingfrom thepreparationofsubstratewafersandthegrowthofepitaxiallayers,sophisticatedsemi- conductorprocessingcontrolmustbeenforcedinordertoensuregoodinternalquantum efficiency. LED chip design and fabrication are essential elements that can substantially affect light extraction efficiency. The subsequent packaging will define the luminous efficiency, and the power supply at the system level will determine the overall lighting efficiency. Thereareanumber ofbooksonLEDs,but mostofthemareonsciencesand technologiesbeforepackaging.Thisbookintendstocoverthemid-todownstreamtopics relatedtoLEDsandsoismainlybasedontheresearchoutcomesandteachingmaterials of authors over the past decade. The selected subjects are for postgraduate students in universitiesandprofessionalengineersintheindustriesinvolvedinthedesign,material development, packaging and assembly processes, reliability testing, and applications of LEDsforSSL.Thisbookisaimedattheintroductorytointermediatelevels.Abachelor’s degreeorequivalentinarelevantengineeringorsciencedisciplinegreatlyhelpthereader’s understandingofitscontents. Chapter 1 of this book is a concise review of LEDs and lighting systems for readers whohavenothadformerexposuretotheseareas.Chapter2introducesthefundamentals of packaging processes and materials for conventional LEDs. Chapter 3 covers more advanced topics on chip scale and wafer level packaging for LEDs, which are mainly basedontheauthors’researchoutcomes.Chapter4providesinformationonboardlevel assembly including chip-on-board and LED modules. Chapter 5 reviews the approaches toevaluatingtheoptical,electrical,andthermalperformanceofLEDs.Chapter6covers the topic of reliability engineering for LED packaging, with detailed test methods and (cid:2) (cid:2) vi Preface failureanalyses.Chapter7introducesemergingapplicationsofLEDs,suchasautomotive lighting,micro/mini-LEDdisplays,andvisiblelightcommunications.Chapter8discusses LEDs beyond visible light, including ultraviolet and infrared applications, and relevant technologytrends. As mentioned in the first chapter of this book, the gap between the onset of genera- tions of lighting systems is approximately 60 years. It is the consensus that the dawn of SSLoccurredinthelate1990s.Twentyyearshavegonebyandthereisnohintofnewsci- encesthatmayleadtothefifthgenerationoflightingsystemsinthefuture.Somepeople tendtobelieveLEDsmaybethelastformoflightsourceforgenerallightingapplications forhumansocieties.Nevertheless,therearealwayssurprisesinscientificandtechnological development.Wewillseewhetherthereistobeanewformoflightsourceforgenerallight- inginfourdecades’time.Inthemeantime,theauthorshopethisbookwillcontributeto theeducationandtrainingofstudentsandprofessionalsfortheimprovementofLEDpack- aginganditsrelevantapplicationsintermsofreliabilityandperformance.The2014Nobel PrizeinPhysicshighlightedthattheawardwasconferred“fortheinventionofefficientblue light-emittingdiodeswhichhasenabledbrightandenergy-savingwhitelightsources.”The mostsignificantwordinthisawardcitationis“energy-saving.”Lightingaccountsfor20% ofelectricityconsumptiononearth.Anysavingonenergyinlightingismeaningful.Let’s work together harder and further to achieve more efficient lighting through the design, materials,andpackagingofLEDs. (cid:2) March2021 Shi-WeiRickyLee (cid:2) JefferyC.C.Lo MianTao HuaiyuYe (cid:2) (cid:2) vii About the Authors Shi-WeiRickyLee,PhD,FIEEE,LFASME,LFIMAPS,FInstP Chair Professor, Department of Mechanical & Aerospace Engineering Director, HKUST Foshan Research Institute for Smart Manufacturing Director,ElectronicPackagingLaboratory ActingDean,SystemsHub,HKUST(GZ) TheHongKongUniversityofScienceandTechnology Kowloon,HKSAR,China (cid:2) RickyLeereceivedhisPhDdegreeinAeronauticalandAstro- (cid:2) nauticalEngineeringfromPurdueUniversityin1992.Currently, he is Chair Professor of Mechanical and Aerospace Engineering and Director of Foshan Research Institute for Smart Manufacturing, and Director of Electronic Packaging Lab- oratory, at the Hong Kong University of Science and Technology (HKUST). He also has concurrentappointmentsasActingDeanofSystemsHuboftheHKUSTGuangzhouCam- pus and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China.Dr.Leehasbeenfocusinghisresearchonthedevelopmentofpackagingandassem- blytechnologiesforelectronicsandoptoelectronics.HisR&Dactivitiesincludewaferlevel packagingand3DICintegration,additivemanufacturingformicrosystemspackaging,LED packagingforsolid-statelightingandapplicationsbeyondlighting,lead-freesoldering,and reliability analysis. Dr. Lee is a Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK).HeisalsoEditor-in-ChiefofASMEJournalofElectronicPackaging. JefferyC.C.Lo,PhD Assistant Director, HKUST Foshan Research Institute for SmartManufacturing ProgramManager,ElectronicPackagingLaboratory TheHongKongUniversityofScienceandTechnology Kowloon,HKSAR,China JefferyLoreceivedhisbachelor(firstclasshonors)andMPhil degreesinMechanicalEngineeringDepartmentfromtheHong Kong University of Science and Technology (HKUST) in 2002 and 2004, respectively. He then joined Electronic Packaging (cid:2) (cid:2) viii AbouttheAuthors Laboratory of HKUST as a Senior Technical Officer and provided professional technical supporttovarioususers,includingundergraduateandpostgraduatestudents,fromdiffer- ent departments and industrial partners around the world. To further develop his R&D career,hecompletedhisPhDdegreeatHKUSTin2008andcontinuedofferingsupportto thelabatthesametime.HeisnowtheProgramManagerofElectronicPackagingLabora- toryandAssistantDirectorofFoshanResearchInstituteforSmartManufacturing,focusing onR&Dprojectswithvariousinternationalcompanies.Thetopicsofhisresearchinterests includeflip-chiptechnologies,waferlevelpackaging,andLEDpackaging.Hewasgranted the2004ECTCBestPosterPaperAward(May2005),YoungAwardinIEEE9thVLSIPack- agingWorkshopinJapan(December2008),andIEEE-CPMTOutstandingYoungEngineer Awardin2015.HewastheIEEE-CPMTHongKongChapterChairmanin2015/16. MianTao,PhD Lead Engineer, Technology Division, Group of Integrated CircuitsandSystems Hong Kong Applied Science and Technology Research Institute NewTerritories,HKSAR,China Mian Tao received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineeringin2010.HethenworkedinHKUSTLED-FPDTech- (cid:2) nologyR&DCentreatFoshanfrom2011to2013focusingonthe (cid:2) optical, thermal, and electrical characterization of light-emitting diode (LED) chips and devices.HereceivedhisPhDdegreein2016fromHKUST.Hisresearchtopicfocusedonthe effectofnonuniformityjunctiontemperatureontheperformanceofanLEDdevice.After- ward,heworkedasaresearchassociateinHKUST’sElectronicPackagingLaboratoryand laterjoinedtheHongKongAppliedScienceandTechnologyResearchInstitute(ASTRI)asa leadengineer.Hisresearchinterestsincludethermalcharacterizationandthemanagement ofhigh-powerelectronicsandthedevelopmentofadvancedmicroelectronicpackages. HuaiyuYe,PhD AssociateProfessor,SchoolofMicroelectronics SouthUniversityofScienceandTechnology Shenzhen,Guangdong,China Huaiyu Ye received his PhD degree from the Department of MicroelectronicsofDelftUniversityofTechnologyin2014.Heis AssociateProfessorofSouthernUniversityofScienceandTech- nology (SUSTech). He won the Outstanding Innovation Youth Award in 2017 and Alliance Contribution Award in 2018 of the China Advanced Semiconductor Industry Innovation Alliance and was selected as the Shenzhen Overseas High-Caliber Personnel in 2019. He mainly conductshisresearchonadvancedpackagingofsolid-statelightingandpowerelectronic devices, focusing on materials, technology, structure, testing, thermal management, and reliability. He is also responsible for the construction of advanced packaging platforms, R&D,andindustrialization.Hechairedandparticipatedin16projectsinChinaandover- seas.Hehasservedasanacademiccommitteememberofseveralinternationalconferences andparticipatedinTechnologyRoadmapforWideBandGapPowerSemiconductor2018. (cid:2)
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