ACSP · Analog Circuits And Signal Processing Dixian Zhao Patrick Reynaert CMOS 60-GHz and E-band Power Amplifi ers and Transmitters Analog Circuits and Signal Processing Serieseditors MohammedIsmail,Dublin,USA MohamadSawan,Montreal,Canada Moreinformationaboutthisseriesathttp://www.springer.com/series/7381 Dixian Zhao • Patrick Reynaert CMOS 60-GHz and E-band Power Amplifiers and Transmitters 123 DixianZhao PatrickReynaert NationalMobileCommunication ESAT-MICAS ResearchLaboratory KULeuven SoutheastUniversity Leuven,Belgium Nanjing,China ISSN1872-082X ISSN2197-1854 (electronic) AnalogCircuitsandSignalProcessing ISBN978-3-319-18838-6 ISBN978-3-319-18839-3 (eBook) DOI10.1007/978-3-319-18839-3 LibraryofCongressControlNumber:2015939179 SpringerChamHeidelbergNewYorkDordrechtLondon ©SpringerInternationalPublishingSwitzerland2015 Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeorpartof thematerialisconcerned,specificallytherightsoftranslation,reprinting,reuseofillustrations,recitation, broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,andtransmissionorinformation storageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilarmethodology nowknownorhereafterdeveloped. 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Printedonacid-freepaper SpringerInternational PublishingAGSwitzerlandispartofSpringerScience+Business Media(www. springer.com) Preface The rapid growth of mobile data and the use of smart phones are making unprecedented challenges for wireless service providers to overcome a global bandwidthshortage.Millimeter-wave(mm-Wave)technologyiswidelyconsidered asoneofthekeytechnologiesthatwillcontinuetoservetheconsumerdemandfor increased wireless data capacity. Meanwhile, the advanced CMOS can now well operate in mm-Wave bands, permitting the integration of a full transceiver in a low-cost,high-yieldtechnology. However, the design of a mm-Wave transceiver in advancedCMOS still poses many challenges at device, circuit, and architecture levels. In addition to generic difficulties, such as high-frequency operation and low active gain, mm-Wave designersmustdealwithissueslikelowbreakdownvoltage,highinterconnectloss, unwantedmutualcoupling,poordevicematching,inaccuratePDKhigh-frequency models, strict design rules, long EM-simulation time, etc. At transmitter side, all thesecriticalissueslimittheoutputpowerandefficiency,prolongthedesigntime, andmakeitdifficulttoguaranteethesuccessoftape-out. This book focuses on the techniques to realize compact CMOS mm-Wave transmitters(TXs) andpoweramplifiers(PAs) towardsmoreoutputpower,higher efficiency, and broader bandwidth. To address design challenges at mm-Wave, novel design techniques will be introduced, such as optimal transistor layout, enhanced amplifier stage, and broadband power combiner. Design methodologies will be presented to deal with the long EM-simulation time and strict design rules. In addition, detailed design issues, such as common-mode stability and magnetic mutual coupling, will also be covered in the book. All the proposed design techniques will be applied to five prior-art designs that are implemented and measured in the context of this work. These designs include (1) a 60-GHz outphasingTXwhichisthefirstapplicationofoutphasingtechniqueatmm-Wave; (2) a 60-GHz dual-mode Class AB PA which is the first dual-modePA presented at 60GHz and achievesa recordedPAE of 30%; (3) an E-banddirect-conversion TXthatshowsmeasured4.5-Gb/s64-QAMand14-Gb/s16-QAM;(4)abroadband v vi Preface 4-way E-band PA which is the first reported silicon-based PA achieving uniform gain,outputpower,andPAEacrossthecompleteE-band;and(5)a 4-wayE-band PA based on neutralized bootstrapped amplifier topology that shows the highest reportedpowergainperstage. Nanjing,China DixianZhao Leuven,Belgium PatrickReynaert May2015 Contents 1 Introduction .................................................................. 1 1.1 WhyMillimeter-Wave?................................................. 1 1.2 mm-WaveApplicationsandPrior-Arts ................................ 2 1.3 DesignChallenges ...................................................... 6 1.4 OutlineofThisBook ................................................... 9 References..................................................................... 10 2 PAandTransmitterBasics.................................................. 13 2.1 Introduction ............................................................. 13 2.2 PABasics................................................................ 13 2.2.1 GainMatchandPowerMatch ................................. 13 2.2.2 DrainEfficiencyandPAE ...................................... 14 2.2.3 PAClasses....................................................... 16 2.2.4 PowerCombiningTechnique .................................. 18 2.3 TransmitterBasics ...................................................... 21 2.3.1 TransmitterArchitectures ...................................... 21 2.3.2 TransmitterNon-idealities...................................... 23 2.4 LinkBudgetforWirelessCommunications ........................... 28 2.5 Conclusions ............................................................. 31 References..................................................................... 31 3 mm-WaveActiveandPassiveDevices..................................... 33 3.1 Introduction ............................................................. 33 3.2 ActiveDevice ........................................................... 34 3.2.1 InfluenceofDeviceParasiticsandLongIntraconnects....... 34 3.2.2 mm-WavePowerTransistorLayout ........................... 36 3.2.3 NeutralizedAmplifierStage.................................... 39 3.3 PassiveDevice .......................................................... 43 3.3.1 InductorsandLossMechanisms............................... 43 3.3.2 Capacitors....................................................... 44 3.3.3 TransmissionLines............................................. 49 vii viii Contents 3.3.4 Transformers.................................................... 52 3.3.5 InfluenceofMetalFills......................................... 54 3.4 Conclusions ............................................................. 55 References..................................................................... 56 4 Low-Power and Efficiency Enhancement Techniques formm-WavePAs............................................................ 59 4.1 Introduction ............................................................. 59 4.2 Low-PowerandHigh-EfficiencyTechniques.......................... 60 4.2.1 ClassABOperation............................................. 60 4.2.2 Dual-ModePA.................................................. 62 4.2.3 Digital-ControlledPolarTransmitter .......................... 63 4.2.4 OutphasingPA.................................................. 64 4.2.5 DohertyPA...................................................... 65 4.3 DesignExample:A60-GHzClassABDual-ModePA............... 67 4.3.1 PATopology .................................................... 68 4.3.2 Dual-ModePowerCombiner................................... 70 4.3.3 MeasurementResults........................................... 72 4.3.4 LongTermReliability.......................................... 82 4.4 Conclusions ............................................................. 83 References..................................................................... 84 5 mm-WaveOutphasingTransmitter........................................ 87 5.1 Introduction ............................................................. 87 5.2 OutphasingPAvs.LinearPAatmm-Wave............................ 88 5.3 OutphasingSignalCombining ......................................... 90 5.3.1 IsolatingandNon-isolatingCombiners........................ 90 5.3.2 Transformer-Based Combiner and Load ModulationEffect .............................................. 92 5.3.3 SignalCombiningbyBeamforming........................... 93 5.4 OutphasingNon-idealities.............................................. 94 5.4.1 OutphasingSignalBandwidth ................................. 94 5.4.2 MismatchBetweenSignalPaths............................... 96 5.5 DesignExample:A60-GHzOutphasingTransmitter................. 99 5.5.1 TransmitterImplementation.................................... 99 5.5.2 PAandCombiner............................................... 101 5.5.3 FloorPlan ....................................................... 103 5.5.4 OutphasingAngleClipping .................................... 104 5.5.5 MeasurementResults........................................... 105 5.5.6 Comparison ..................................................... 111 5.6 Conclusions ............................................................. 112 References..................................................................... 113 Contents ix 6 mm-WaveBroadbandDirect-ConversionTXTowards10+Gb/s....... 115 6.1 Introduction ............................................................. 115 6.2 LOLeakageandI/QImbalance........................................ 116 6.2.1 LOLeakageandCalibration ................................... 116 6.2.2 I/QImbalanceandCalibration................................. 118 6.3 DesignExample:A64-QAME-BandTX............................. 119 6.3.1 SystemArchitecture............................................ 119 6.3.2 I/QModulatorwithLOLeakageCalibration.................. 120 6.3.3 PPFwithI/QImbalanceCalibration........................... 124 6.3.4 PowerAmplifier ................................................ 129 6.3.5 MeasurementResultsandDiscussions ........................ 129 6.4 Conclusions ............................................................. 134 References..................................................................... 137 7 mm-WaveBroadbandPowerAmplifierTowards20+dBm ............. 139 7.1 Introduction ............................................................. 139 7.2 Single-StageAmplifier ................................................. 140 7.2.1 NCSAmplifier.................................................. 140 7.2.2 CascodeAmplifier.............................................. 142 7.3 BroadbandPowerCombiner ........................................... 145 7.3.1 SeriesPowerCombiner......................................... 145 7.3.2 ParallelPowerCombiner....................................... 146 7.3.3 Parallel-SeriesPowerCombiner ............................... 147 7.4 DesignExample1:ABroadbandE-BandPowerAmplifier.......... 149 7.4.1 Implementation ................................................. 149 7.4.2 MeasurementResults........................................... 151 7.5 DesignExample2:AnE-bandNeutralizedBootstrapped CascodePowerAmplifier............................................... 157 7.5.1 NeutralizedBootstrappedCascodeAmplifier................. 157 7.5.2 Implementation ................................................. 159 7.5.3 MeasurementResults........................................... 162 7.6 Conclusions ............................................................. 167 References..................................................................... 169 8 ConclusionandOutlook..................................................... 171 8.1 Summary ................................................................ 171 8.2 MajorContributions .................................................... 172 8.3 FutureWork............................................................. 173 References..................................................................... 174 Index............................................................................... 177
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