Table Of Content

wea eunneuomaoes The Science Ee eve tira, and Engineering lenses of Microelectronic ere Fabrication ean hes Pista Se ins, Lh Dis tnd Sendh Des SECOND EDITION ‘Sam a Rte, dct acinar Toomey, Tele ave A Koso Short Cre nici Braye Simon nti Opal ier Connon me Stephen A. Campbell eo oot oie of tinoscte Vat Moan Dig ar lng Canon Seer, 2 Bat Mun Digi! ineyroed Ge Ove ation rd Came Canara sree Signa and tin dao, ed Mina Lie od Eat Peg Pagers eee v ‘Schaumann sd Yan Vahenburg Desir Artes Phere Schourn Eucromare Peers Seat tad Sia sheet Faroe. Teta 2nd Ee Ses nd Sah Mcneee Ciey Sten, Se, Sahin seeing eg of Fea Contd Sen Sr a enn rerete: Contents Port Chapter 3 Preface xi Overview and Materials 1 An Intradueion to Mictoeleetonie Fadrication iereloreTaneges A Stele some ‘hain ad fukn sew Semiconductor Substrates 10 aryl cae” 13 Unit Process I: Hot Processing and lon Implantation 37 Difusion 39 1 brs Batson Baton in ne Dinemon 39 Chapter + Chapter 5 fn Cocos for CoouorTspmts ‘ues fiat Per 2 BitininieSiD. Se Pitino Sear SEPREM Sunstone of Offa Pree SL Semone et Raton 6 ‘Thermal Oxidation 68 he Dele ee isin “Te Lara Pobie ee Coen 71 Theta Octopus TS Re sinenre of $0. ec Eth of ran ring Odin alten Ouida Grid ndued Suhing ants 86 ‘Ahearn alent 58 SUPREM Gvietom= 92 trae 9 Feta 8S {on Implantation 98 Tstsedtin nplnatn Sota) Cou Ssterng” IO Sericl Ped ange 108 Camsting ine Prec argo 110 Tplanain Dwage2 Shao ention Parmar” 188 enfant Syters: Petia and ences 30 Uopan reflc ms SUPETA 12 fete 128 Ohnpcer 6 Part WI Chapter 7 Chapter 8 Be Rapid Thermal Processing 127 ‘ie boty Kadaton, Hal chins ind Oral Awa” Eigen Opal oon amt Chace Beige Tempe ete. Thataspiss See Rip Theron Binion npuiin 8 ope aul Prices ot Dee 1 Str nd Commer Fntnon AL ‘roars Rap eral eeming Sotane 1 Unit Processes 2: Pattern Transter Optical Lithography 181 athrsphy Oven USL ‘She Ntuidaina Tens Peto nd Opal gaa. Samer Syaebs wdspatal ebm 138 Conacutociiy nu 18 Proscionriner 149 Strtteeerons and Snap Wana 176 Alan TE Froblene la Photoresists 183 Pores Types 188 tga tetas 86 “ype Retr ofDON Pests Petacst 5 Com Gaver 18? Thea Nedsaten Tee Fuori 190 Ape i Dereon Moura 191 Stews One Espen i95 Asean actos Qype ote 2 ‘Chapter'9 Nonoplical Lithographic Techniques 205 , oo 21 knowieu et Raheecy Bo cer 2s, Part IV Unit Processes 3: Thin Films 2 3) ig aanet tig ee erro Chapuer 12. Physical Deposition: Evaporation 83 Punky FoyBquasesnvem: 28 and Sputering 295 35 Mamtcteytiogey 28 121 Fhe Di Suhgnron ene 6 24 Pueanaricannsemidengiy SEAR) 28 2s Sponge wt ichamee 2 BE Racalipet Hd tigeteniy Manesco 310 Chapter 10 Vacuum Sciance and Plasmas 236 pe Moseley na Sep Covey aD. 10d Gurr nitiemacr 20 ete Spating uff Mowrite997 1s a ecm 2 Reschenitawe (26 Moet 7 “= 18 Summon 2 Chapter 13 Chemical Vapor Deposition 326 Gal ARieplee WD Sypien ir Dyes AScen— 38 12 Chemis tgulty rdehe rere Aeter? ZOE ee Gan anl Beals Lave’ 3 Chapter 11 Etching — 258 Hea See ope 36 Chapter 14 Part V¥ Chapter 15 Epitaxial Growth 355 - Istierantnercae euros 3 Depettcaporiat 8 Bua ntecn Gon 368 “ha home ins Nepetha may 89 “utenti Sout ayer tens 270 SG hotest qe pe AIG) 373 Aihanol ian VyorPanc¥aal wb Taig 31% BBesimee MRF ne Consol ram Fp! 36t Process Integration 399 Device isolation, Contacts, and Metaliization 401 EDCOH Matec onl hove Comme $18 Sigel Came 2 Reece Mirek <8 cer Be GHOS Technologies 439 ‘ic Lite Channel Derkeabovee Chapuer 1 Chapter 08 ora bot aed Dn Pagweang 438 Pstsing ha an Otis Summers 8 Dron: oy Gas Technologies 471 Bass Relay Tir2 DyeniweeneDetcs 2 Rarsomee “ats Silicon Bigolar Tachnotogies 488 Kerk Bpule Devices Melanesia Beas 58 Sead oe ties a aly tiny Pcs Rehm pleas 95 Firelaann Slice Tames S08 Retcms "SID MEMS, 514 andres ofMaoies 315 Meco pci Eeuon 318 Bu Mocenchaing recs oie Appeutix Appendix B. Appendix I Aypendie 1. Argon ¥ Appendix VI appendix: VIE wove acon 16 alent Tote AST Integrated Giecull Manutacturlng 559 Waoaieanou vee 5 Sees Pecuecsenl st Crogan vs ‘Acronyms and Common Symbats 580 Properties of Select Semiconductor Matertats 885 Physical Constants 586 Conversion Factors 588 Some Properties ofthe Error Function S01 Fvalues 595 SUPREM Commands 597 Index 598 meno eee ge bcd mere he aa race te ee ain iieunemaere, mae ee aicaens i ET pens 8E ta ceny rng The Science and Engineering of Microelectronic Fabrication Part I Overview and Materials Chapter 1 An Introduction to Microelectronic Fabrication ‘oct wd au sr at pore Seaidearne ope cept eto espe pe: ee pha fete ee 11.1 Microelectronic Technalogies: A Simple Example Seemann orn ee tise mstentn nce! © step Somber wut nce aera tins nt ae ote ae I