Atom Chips

447 Pages·2011·5.181 MB·English

by  Jakob Reichel, Vladan Vuletić

Atom Chips
Edited by
Jakob Reichel and Vladan Vuleti´c
WILEY-VCH Verlag GmbH & Co. KGaA

AtomChips
Editedby
JakobReichelandVladanVuleti´c
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Atom Chips
Edited by
Jakob Reichel and Vladan Vuleti´c
WILEY-VCH Verlag GmbH & Co. KGaA
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V
Contents
Preface XV
ListofContributors XVII
PartOne Fundamentals 1
1 FromMagneticMirrorstoAtomChips 3
AndreiSidorovandPeterHannaford
1.1 Introduction 3
1.2 HistoricalBackground 4
1.3 MagneticMirrorsforColdAtoms 7
1.3.1 BasicPrinciples 7
1.3.2 ExperimentalRealizationofMagneticMirrors 9
1.3.2.1 MacroscopicArrayofRare-EarthMagnetsofAlternatingPolarity 9
1.3.2.2 Micro-FabricatedGroovedMagneticMirrors 10
1.3.2.3 Micro-FabricatedArrayofCurrent-CarryingConductors 11
1.3.2.4 Magneto-OpticalRecordingofMagneticMicrostructures 12
1.4 TheMagneticFilmAtomChip 13
1.4.1 Background 13
1.4.2 BEConaMagneticFilmAtomChip 14
1.4.3 SpatiallyResolvedRFSpectroscopy
toProbeMagneticFilmTopology 16
1.4.4 AdiabaticSplittingofaBECforAsymmetricPotentialSensing 19
1.4.5 SpatiallyInhomogeneousPhaseEvolution
ofaTwo-ComponentBEC 21
1.4.6 BEConOtherPermanent-MagnetAtomChips 22
1.5 PermanentMagneticLatticeonaMagneticFilmAtomChip 23
1.5.1 Background 23
1.5.2 BasicPrinciples 24
1.5.2.1 One-DimensionalMagneticLattice 24
1.5.2.2 Two-DimensionalMagneticLattice 25
1.5.2.3 Permanent1DMagnetLatticeforUltra-ColdAtoms 26
1.5.2.4 OtherPermanentMagneticLattices 28
AtomChips.EditedbyJakobReichelandVladanVuleti´c
Copyright©2011WILEY-VCHVerlagGmbH&Co.KGaA,Weinheim
ISBN:978-3-527-40755-2
VI Contents
1.6 SummaryandConclusions 28
References 29
2 TrappingandManipulatingAtomsonChips 33
JakobReichel
2.1 Introduction 33
2.2 OverviewofTrappingTechniques 34
2.3 MagneticTrapsforNeutralAtoms 35
2.3.1 MagneticInteraction 35
2.3.2 StabilityagainstSpin-FlipLosses 36
2.3.3 QuadrupoleTraps 37
2.3.4 Ioffe–PritchardTraps 37
2.3.5 SomeGeneralPropertiesofMagneticTraps 38
2.4 TheDesignofWirePatternsforMagneticPotentials 39
2.4.1 ConductorElementsandMultipoles 39
2.4.2 WireGuide 40
2.4.3 ConductorCross(“Dimple”Trap) 41
2.4.4 “H”,“Z”,and“U”Traps 43
2.4.5 FiniteWireDimensions 44
2.4.6 MaximumConfinement 46
2.4.6.1 FieldGradient 46
2.4.6.2 FieldCurvatureandTrapFrequency 46
2.4.7 CombiningElements:Arrays,ConveyorsandOthers 47
2.5 RealWires:RoughnessandMaximumCurrent 48
2.5.1 EffectofWireRoughness 48
2.5.2 HeatTransportandMaximumCurrent 49
2.5.2.1 Wire–SubstrateInterface 49
2.5.2.2 HeatEvacuationthroughtheSubstrate 51
2.6 LoadingTechniques 51
2.6.1 Mirror-MOT 51
2.6.2 MagneticElevator 52
2.6.3 “ModeMatching” 52
2.7 VacuumCells 53
2.7.1 TraditionalCell 53
2.7.2 CompactCellwithAtomChipWall 55
2.8 ConclusionandOutlook 57
References 58
3 AtomChipFabrication 61
RonFolman,PhilippTreutleinandJörgSchmiedmayer
3.1 Introduction 61
3.2 FabricationChallenges 62
3.3 TheSubstrate 63
3.4 Lithography 65
3.4.1 OpticalLithography 65
Contents VII
3.4.2 Electron-BeamLithography 67
3.5 MetallicLayers 68
3.5.1 DepositionandEtching 68
3.5.1.1 Electroplating 68
3.5.1.2 EvaporationandLift-OffMetallization 70
3.5.1.3 WetandDryEtching 72
3.5.1.4 DesigningPotentialsbyPostprocessingtheWires 73
3.5.2 EffectsofRoughnessandHomogeneityoftheFabricatedStructures 74
3.5.3 SpecialMetals 76
3.5.3.1 Alloys 76
3.5.3.2 Superconductors 77
3.5.3.3 Semiconductors 79
3.5.4 PermanentMagnets 80
3.5.5 MetalOutlook 82
3.6 AdditionalFeatures 85
3.6.1 PlanarizationandInsulation 85
3.6.2 On-ChipMirrors 87
3.6.3 Multi-LayerChips 88
3.7 CurrentDensitiesandTests 91
3.8 PhotonicsonAtomChips 93
3.8.1 Fiber-BasedIntegratedOptics 93
3.8.1.1 SU8–HoldingStructures 93
3.8.1.2 Fiber-BasedFluorescenceDetector 94
3.8.1.3 FiberCavities 95
3.8.2 MicrolensandCylindricalLens 97
3.8.3 MicrodisksandMicrotoroids 98
3.8.4 MountedandFullyIntegratedFabry–Pérots 99
3.8.5 PlanarOptics 101
3.8.6 PhotonicsOutlook 102
3.9 ChipDicing,Mounting,andBonding 104
3.10 FurtherIntegrationandPortability 106
3.11 ConclusionandOutlook 109
References 110
PartTwo UltracoldAtomsnearaSurface 119
4 AtomsatMicrometerDistancesfromaMacroscopicBody 121
StefanScheelandE.A.Hinds
4.1 Introduction 121
4.2 PrinciplesofQEDinDielectrics 123
4.3 RelaxationRatesnearaSurface 126
4.3.1 SpinFlipsnearaDielectricorMetallicSurface 126
4.3.2 SpinFlipsnearaSuperconductor 130
4.3.3 TransverseSpinRelaxation 132
4.3.4 Heating 133
4.3.5 ElectricDipoleCouplingofMoleculestoaSurface 134
VIII Contents
4.4 Casimir–PolderForces 138
4.5 ClosingRemarks 144
References 145
5 InteractionofAtoms,Ions,andMoleculeswithSurfaces 147
CarstenHenkel
5.1 QualitativeOverview 147
5.1.1 ElectromagneticDipoleMoments 148
5.1.2 ElectromagneticFieldStrengths 149
5.1.3 Digression:SurfaceGreenFunctions 151
5.2 InteractionPotentials 153
5.2.1 ChargesandPermanentDipoles 153
5.2.2 VanderWaalsPotential 154
5.2.3 Casimir–PolderPotential 155
5.2.4 RecentDevelopments 156
5.3 Surface-InducedAtomicTransitions 157
5.3.1 VisibleFrequencies:SpontaneousEmission 158
5.3.2 ThermalFrequencies:Spin-Flips 159
5.3.3 TrapHeating 161
5.3.4 AtomChipsandDecoherence 162
5.4 Perspectives 165
References 166
PartThree CoherenceonAtomChips 171
6 DiffractionandInterferenceofaBose–Einstein CondensateScattered
fromanAtomChip-BasedMagneticLattice 173
A.Günther,T.E.Judd,J.FortághandC.Zimmermann
6.1 Introduction 173
6.2 ExperimentalSetup 174
6.2.1 TheBECApparatus 174
6.2.2 TheMagneticLatticeChip 177
6.3 TheMagneticLatticePotential 178
6.3.1 InfiniteLattice 178
6.3.2 FiniteSizeEffects 181
6.3.3 TheDoubleMeanderPotential 182
6.4 DiffractionandInterference 184
6.4.1 DiffractionScheme 184
6.4.2 TheoreticalModelfortheInteraction 185
6.4.3 DiffractionintheRaman–NathRegime 189
6.4.4 EvolutionoftheWaveFunctionaftertheLatticeInteraction 190
6.5 BallisticExpansionandPhaseImprinting 194
6.6 ExperimentalResults 195
6.7 EffectofAtomicInteractions 202
6.7.1 ModelingBECSurfaceDiffraction 202
6.7.2 DensityProfileDynamics 203