ANSYS, Inc. Release Notes

146 Pages·2013·1.23 MB·English

Release Notes
ANSYS, Inc. Release 15.0
Southpointe November 2013
275 Technology Drive 000504
Canonsburg, PA 15317 ANSYS, Inc. is
[email protected] certified to ISO
9001:2008.
http://www.ansys.com
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Table of Contents
Global ......................................................................................................................................................... ix
1. Advisories........................................................................................................................................... ix
2. Installation ......................................................................................................................................... ix
3. Licensing............................................................................................................................................. x
4. Documentation................................................................................................................................... x
5. ANSYS Customer Portal....................................................................................................................... xi
I. ANSYS Structural Products...................................................................................................................... 1
1. Mechanical........................................................................................................................................ 3
1.1. Incompatibilities and Changes in Product Behavior from Previous Releases.................................. 3
1.2. General Enhancements............................................................................................................... 4
1.3. Analysis Enhancements .............................................................................................................. 5
1.4. Geometry Enhancements ........................................................................................................... 6
1.5. Contact and Connection Enhancements...................................................................................... 6
1.6. Graphics Enhancements............................................................................................................. 6
1.7. Loads/Supports/Conditions Enhancements................................................................................. 7
1.8. Finite Element (FE) Enhancements.............................................................................................. 7
1.9. Mapping Enhancements............................................................................................................. 8
1.10. Solution Enhancements............................................................................................................ 9
1.11. Rigid Body Solver Enhancements.............................................................................................. 9
1.12. Explicit Dynamics Solver Enhancements.................................................................................. 10
1.13. Results Enhancements............................................................................................................ 10
2. Mechanical APDL ............................................................................................................................ 13
2.1. Structural ................................................................................................................................. 13
2.1.1. Contact............................................................................................................................ 13
2.1.1.1. Bolt Thread Modeling.............................................................................................. 13
2.1.1.2. Contact Surface Wear.............................................................................................. 14
2.1.1.3.Traction-Based Model for Line-to-Line and Line-to-Surface Contact.......................... 14
2.1.1.4. Enhancements for Contact Interfacial Behavior Subroutines..................................... 14
2.1.1.5. Other Contact Changes and Enhancements............................................................. 14
2.1.2. Elements and Nonlinear Technology................................................................................. 14
2.1.2.1. Rezoning................................................................................................................. 15
2.1.2.2. Mesh Nonlinear Adaptivity (Automatic Rezoning)..................................................... 15
2.1.2.3. Enhanced Ocean Loading........................................................................................ 15
2.1.2.4. Section Integration for Pipes.................................................................................... 15
2.1.2.5. Arc-Length Method................................................................................................. 16
2.1.3. Material and Fracture Modeling........................................................................................ 16
2.1.3.1. Material Force Evaluation......................................................................................... 16
2.1.3.2. Material Curve Fitting.............................................................................................. 17
2.1.3.3. Material Damage..................................................................................................... 17
2.1.3.4.T-Stress Calculation for Fracture Analysis.................................................................. 17
2.1.3.5. Shape Memory Alloy (SMA)...................................................................................... 17
2.1.3.6. Cohesive Zone Material (CZM)................................................................................. 17
2.1.3.7. Chaboche Model with Creep.................................................................................... 17
2.1.3.8. Plasticity Yield Stress for Beams and Shells................................................................ 18
2.1.3.9. Strain Energy Density Output................................................................................... 18
2.1.3.10. Field Variables........................................................................................................ 18
2.1.4. Linear Dynamics .............................................................................................................. 18
2.1.4.1. Mode Selection....................................................................................................... 18
2.1.4.2. Structural Damping in a QRDAMP Modal Analysis.................................................... 19
2.1.4.3. Structural Damping in a Harmonic Analysis.............................................................. 19
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of ANSYS, Inc. and its subsidiaries and affiliates. iii
Release Notes
2.1.4.4. Mode-Superposition Harmonic Analysis for Cyclic Structures.................................... 19
2.1.4.5. Closely Spaced Modes (CSM) Method for Dynamic Design Method (DDAM).............. 19
2.1.4.6. Precise Mass Summary............................................................................................. 19
2.1.4.7. Damping Support for Component Mode Synthesis (CMS) Superelement Genera-
tion .................................................................................................................................... 19
2.1.4.8. Results Comparison with RSTMAC............................................................................ 19
2.1.4.9. Mode Superposition Harmonic Analysis Based on the Unsymmetric Eigensolver....... 20
2.1.4.10. Brake Squeal Analysis Using Superelements........................................................... 20
2.2. Coupled Physics........................................................................................................................ 20
2.2.1. Coupled-Field .................................................................................................................. 20
2.2.1.1. Multiframe Restart................................................................................................... 20
2.2.1.2. Linear Perturbation.................................................................................................. 20
2.2.1.3. Nonlinear Stabilization ............................................................................................ 20
2.2.2. Low-Frequency Electromagnetics..................................................................................... 20
2.2.2.1.Velocity Effects........................................................................................................ 21
2.2.2.2. Linear Perturbation.................................................................................................. 21
2.2.2.3. Magnetic Energy, Co-energy, Apparent, and Incremental Energy............................... 21
2.2.3. Acoustics ......................................................................................................................... 21
2.2.3.1. Sophisticated Acoustic Materials.............................................................................. 21
2.2.3.2. Acoustic Loads and Boundary Conditions................................................................. 21
2.2.3.3.Visco-Thermo Acoustics........................................................................................... 22
2.2.3.4. Acoustic Analysis..................................................................................................... 22
2.2.3.5. Acoustic Postprocessing.......................................................................................... 22
2.2.3.6. Acoustic Commands................................................................................................ 22
2.2.4.Thermal ........................................................................................................................... 22
2.2.4.1.Thermal Analysis with Radiosity............................................................................... 23
2.2.4.2.View Factor File....................................................................................................... 23
2.2.4.3. User-Defined Heat Generation Loading.................................................................... 23
2.2.5. Unidirectional Pressure Mapping...................................................................................... 23
2.3. Solvers ..................................................................................................................................... 23
2.3.1. Sparse Solver Enhancements............................................................................................ 23
2.3.2. Distributed Solver Enhancements..................................................................................... 24
2.3.3. GPU Acceleration Enhancements...................................................................................... 24
2.3.4. Modal Eigensolver Enhancements.................................................................................... 24
2.3.5. Other Solver Changes and Enhancements........................................................................ 24
2.4. Commands............................................................................................................................... 25
2.4.1. New Commands............................................................................................................... 25
2.4.2. Modified Commands........................................................................................................ 26
2.4.3. Undocumented Commands............................................................................................. 28
2.5. Elements .................................................................................................................................. 29
2.5.1. Modified Elements........................................................................................................... 29
2.5.2. Undocumented Elements................................................................................................. 30
2.6. Documentation ........................................................................................................................ 30
2.6.1.Technology Demonstration Guide....................................................................................... 30
2.6.1.1. Elastoplastic Creep Analysis of Lead-Free Solder Bumps............................................ 30
2.6.1.2. Large-Deformation Neo-Hookean Analysis (via UserMat Subroutine)........................ 30
2.6.1.3. Evaluation of Mixed-Mode Stress-Intensity Factors for 3-D Surface Flaws................... 30
2.6.1.4.VCCT-Based Crack Growth Simulation of a Composite Laminated T-Joint.................. 31
2.6.1.5. Dynamic Simulation of a Nuclear Island.................................................................... 31
2.6.1.6. Bolt Thread Simulation............................................................................................ 31
2.6.1.7.Wire Bonding Ultrasonic Transducer......................................................................... 31
2.6.2. New Acoustic Analysis Guide.............................................................................................. 31
Release 15.0 - © SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
iv of ANSYS, Inc. and its subsidiaries and affiliates.
Release Notes
2.6.3.Feature Archive................................................................................................................. 31
2.6.4. Documentation Updates for Programmers........................................................................ 31
2.6.4.1. Routines and Functions Updated............................................................................. 31
2.6.4.2. Subroutines Added.................................................................................................. 31
2.7. Known Incompatibilities........................................................................................................... 32
2.7.1. High-Frequency Electromagnetic Analysis........................................................................ 32
2.7.2.Tabular Real Constants Using X,Y,Z Primary Variables......................................................... 32
2.7.3. Normal Contact Stiffness.................................................................................................. 32
2.7.4.Tangential Contact Stiffness ............................................................................................. 32
2.7.5. Maximum Allowable Tensile Contact Pressure................................................................... 32
2.7.6. Stream Function Wave Loading........................................................................................ 33
2.7.7. Resuming Ocean Loading Analyses................................................................................... 33
2.7.8. Acoustics ......................................................................................................................... 33
2.7.9. Preloads in Modal and Harmonic Analyses are Ignored...................................................... 33
3. Autodyn .......................................................................................................................................... 35
3.1. Incompatibilities and Changes in Product Behavior from Previous Releases................................ 35
3.2. New Features............................................................................................................................ 35
4. Aqwa ............................................................................................................................................... 37
4.1. Aqwa Solver Modules............................................................................................................... 37
4.2. Hydrodynamic Analysis Systems................................................................................................ 37
4.3. Documentation ........................................................................................................................ 37
5. Beamcheck...................................................................................................................................... 39
6. Fatjack............................................................................................................................................. 41
7. ANSYS Composite PrepPost (ACP).................................................................................................. 43
7.1. New Features............................................................................................................................ 43
II. ANSYS Fluids Products.......................................................................................................................... 45
1. Fluent .............................................................................................................................................. 47
1.1. New Features in ANSYS Fluent 15.0........................................................................................... 47
1.2. Supported Platforms for ANSYS Fluent 15.0............................................................................... 54
1.3. New Limitations in ANSYS Fluent 15.0....................................................................................... 54
1.4. Limitations That No Longer Apply in ANSYS Fluent 15.0............................................................. 55
1.5. Updates Affecting Code Behavior.............................................................................................. 56
2. CFX .................................................................................................................................................. 63
2.1. New Features and Enhancements.............................................................................................. 63
2.1.1. Parallel Processing Enhancements ................................................................................... 63
2.1.2. ANSYS CFX-Solver............................................................................................................ 63
2.1.3. ANSYS CFX-Pre................................................................................................................. 65
2.1.4. ANSYS CFX Documentation.............................................................................................. 65
2.2. Incompatibilities....................................................................................................................... 65
2.2.1. CFX-Solver ....................................................................................................................... 65
3.TurboGrid........................................................................................................................................ 67
4. BladeModeler.................................................................................................................................. 69
4.1. BladeGen.................................................................................................................................. 69
4.1.1. BladeGen New Features and Enhancements..................................................................... 69
4.2. BladeEditor............................................................................................................................... 69
4.2.1. BladeEditor New Features and Enhancements................................................................... 69
4.2.2. BladeEditor Incompatibilities............................................................................................ 69
5. CFD-Post.......................................................................................................................................... 71
5.1. New Features and Enhancements.............................................................................................. 71
6. Polyflow .......................................................................................................................................... 73
6.1. Introduction ............................................................................................................................. 73
6.2. New Features............................................................................................................................ 73
Release 15.0 - © SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
of ANSYS, Inc. and its subsidiaries and affiliates. v
Release Notes
6.3. Defect Fixes.............................................................................................................................. 75
6.4. New Limitations in ANSYS Polyflow 15.0.................................................................................... 76
III. ANSYS Electronics Products................................................................................................................. 77
1. Icepak.............................................................................................................................................. 79
1.1. Introduction ............................................................................................................................. 79
1.2. New and Modified Features in ANSYS Icepak 15.0...................................................................... 79
IV. ANSYS Geometry & Mesh Prep Products............................................................................................. 83
1. DesignModeler................................................................................................................................ 85
1.1. Electronics................................................................................................................................ 85
1.2. Import/Export .......................................................................................................................... 85
1.3. Modeling Feature Enhancements.............................................................................................. 86
1.4. Option Changes........................................................................................................................ 87
1.5. Parameter Manager.................................................................................................................. 87
1.6. Shared Topology....................................................................................................................... 88
1.7. Units ........................................................................................................................................ 89
1.8. Usability ................................................................................................................................... 89
1.9. CAD Integration Enhancements................................................................................................ 90
2. Meshing........................................................................................................................................... 93
2.1. Incompatibilities and Changes in Product Behavior from Previous Releases................................ 93
2.2. Ease of Use Enhancements........................................................................................................ 93
2.3. Meshing Options Enhancements............................................................................................... 93
2.4. Fluent Export Changes and Enhancements................................................................................ 94
2.5. Assembly Meshing Changes and Enhancements....................................................................... 94
2.6. Assembly Model Changes and Enhancements........................................................................... 94
2.7. MultiZone Mesh Method Enhancements................................................................................... 94
2.8. Parallel Part Meshing................................................................................................................. 95
2.9. Size Control Enhancements....................................................................................................... 96
2.10. Meshing Failure Troubleshooting............................................................................................ 96
3. IC Engine......................................................................................................................................... 97
4. ICEM CFD......................................................................................................................................... 99
4.1. Highlights of ANSYS ICEM CFD 15.0........................................................................................... 99
4.2. Key New Features/Improvements.............................................................................................. 99
4.2.1.Workbench Add-In Component........................................................................................ 99
4.2.2.Translate and Rotate....................................................................................................... 100
4.2.3. Smooth Hexahedral Mesh Orthogonal............................................................................ 100
4.2.4. Aspect Ratio (Fluent)...................................................................................................... 100
4.2.5. Delaunay Smooth Mesh option...................................................................................... 100
4.2.6. Geometry Import options............................................................................................... 100
4.2.7. Remote Solver Manager................................................................................................. 100
4.3. Documentation ...................................................................................................................... 100
4.3.1.Tutorials......................................................................................................................... 101
5. Fluent Meshing.............................................................................................................................. 103
5.1. Changes in Product Behavior from Previous Releases............................................................... 103
5.2. New Features.......................................................................................................................... 103
V. ANSYS Simulation Products................................................................................................................ 109
1.Workbench .................................................................................................................................... 111
1.1. ANSYS Workbench.................................................................................................................. 111
1.1.1. ANSYS Workbench Enhancements.................................................................................. 111
1.1.2. ANSYS Workbench and EKM Integration......................................................................... 113
1.2. External Connection ............................................................................................................... 114
1.3. Engineering Data Workspace................................................................................................... 114
1.4. External Data.......................................................................................................................... 115
Release 15.0 - © SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
vi of ANSYS, Inc. and its subsidiaries and affiliates.
Release Notes
1.5. FE Modeler............................................................................................................................. 115
1.6. Remote Solve Manager (RSM).................................................................................................. 115
1.6.1. Cluster Enhancements.................................................................................................... 115
1.6.2. RSM Setup Wizard Enhancements................................................................................... 116
1.6.3. RSM Enhancements........................................................................................................ 117
1.6.4. RSM User Interface Enhancements.................................................................................. 117
1.6.5. RSM Design Point Enhancements................................................................................... 118
1.7. System Coupling..................................................................................................................... 118
1.7.1. Numerics Changes......................................................................................................... 119
1.7.2. Known Limitations......................................................................................................... 120
1.8.TurboSystem........................................................................................................................... 120
1.8.1.Vista CCD....................................................................................................................... 120
1.8.1.1.Vista CCD New Features and Enhancements........................................................... 120
1.8.1.2.Vista CCD Incompatibilities.................................................................................... 121
1.8.2.Vista CPD....................................................................................................................... 121
1.8.2.1.Vista CPD Incompatibilities.................................................................................... 121
1.8.3.Vista RTD........................................................................................................................ 121
1.8.3.1.Vista RTD New Features and Enhancements........................................................... 121
1.8.3.2.Vista RTD Incompatibilities..................................................................................... 121
1.8.4.Vista TF.......................................................................................................................... 121
1.8.4.1.Vista TF New Features and Enhancements.............................................................. 122
1.8.4.2.Vista TF Incompatibilities....................................................................................... 122
1.8.5.Throughflow Analysis System......................................................................................... 122
2. EKM ............................................................................................................................................... 123
2.1. ANSYS EKM Enhancements..................................................................................................... 123
3. DesignXplorer............................................................................................................................... 131
3.1. DesignXplorer Becomes an Open Optimization Platform with ACT Customization.................... 131
3.2. Optimization Enhancements................................................................................................... 131
3.3. General Enhancements........................................................................................................... 133
Release 15.0 - © SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
of ANSYS, Inc. and its subsidiaries and affiliates. vii
Release 15.0 - © SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
viii of ANSYS, Inc. and its subsidiaries and affiliates.
Global Release Notes
The release notes are specific to ANSYS, Inc. Release 15.0 and arranged by application/product, with
the exception of:
• Advisories (p.ix)
• Installation (p.ix)
• Licensing (p.x)
• ANSYS Customer Portal (p.xi)
Note that installation- and licensing-specific information is detailed in some application and product
sections.The release notes are available in printable format (PDF) via the product media, and accessible
in the ANSYS Help Viewer or online via the ANSYS Customer Portal (p.xi).
To view release notes specific to previous ANSYS, Inc. releases, go to ANSYS Customer Portal> Down-
loads> Previous Releases> Documentation.The release notes files are named “ai_rn (followed by the
inventory number) in the following zip file links:
• ANSYS 14.5.7 Release Documentation (applies to release 14.5)
• ANSYS 14.0 Release Documentation
• ANSYS 13.0 Release Documentation
1. Advisories
ANSYS 15.0 will be the last release to support the Windows XP operating system,Windows 7 (32-bit)
operating system, and the Windows 32-bit platform. Subsequent service packs' and verification testing
packages' discontinuance of support of Windows XP will concur with Microsoft's discontinuance of the
same, anticipated to be April 2014. For detailed and current support information, see the Platform
Support section of the ANSYS, Inc. website (www.ansys.com).
In addition to the incompatibilities noted within the release notes, known non-operational behavior,
errors and/or limitations at the time of release are documented in the Known Issues and Limitations
document, although not accessible via the ANSYS Help Viewer. See the ANSYS Customer Portal for in-
formation about the ANSYS service packs and any additional items not included in the Known Issues
and Limitations document. First-time users of the customer portal must register to create a password.
2. Installation
The following features are new or changed at Release 15.0. Please review these items carefully.
• The Windows and Linux installation guides have been rewritten and reorganized to enhance ease of use.
• Installs and Uninstalls can now be performed from a single unified installation interface.
• An installation launcher is now available for the Linux platform. From this launcher, you can run the ANSYS
product, License Manager and EKM installs.
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of ANSYS, Inc. and its subsidiaries and affiliates. ix
Global
• For Windows systems, ANSYS, Inc. Product installation must be performed by users with administrative
privileges.
• Enhancements to the installation user interface include:
– Improved installation speed
– Streamlined content display during the installation process
– Progress bar tracks the installation process
3. Licensing
The following enhancements have been made to ANSYS, Inc. Licensing for Release 15.0:
• The ANSYS, Inc. License Manager now supports the use of IP addresses & LM_PROJECT in the FlexNet
options file.
• DesignPoint studies and ANSYS HPC Parametric Pack has been enhanced in the following ways:
– ANSYS Icepak licenses may now be reserved for DesignPoint studies and can be used with HPC Para-
metric Packs.
– ANSYS Structural, ANSYS Structural Solver and ANSYS Professional NLS licenses may now be reserved
for DesignPoint studies and can be used with HPC Parametric Packs
• In the License Preference dialog box, the PrePost tab now includes the product licenses that provide
both pre/post processing & solver capability. Previously, this class of product licenses (example ANSYS
Mechanical) were only available in the Solver tab.
• The ANSYS ASAS SPLINTER functionality is now enabled in these products: ANSYS Multiphysics, ANSYS
Mechanical, ANSYS Professional NLS, ANSYS Structural and any ANSYS Academic products that contain
ANSYS Mechanical simulation capabilities.
• Graphics Processing Unit (GPU) licensing has been enabled for both ANSYS HPC and ANSYS HPC Pack li-
censes.
• EKM no longer needs to check out application licenses when extracting data for reports.
4. Documentation
The Help Viewer has been updated with a more modern browser look-and-feel. It offers several enhanced
and new capabilities:
• Improved full-text searching, including filters for searching by physics, application, type, and book.
• Boolean searching using a plain English query builder.
• Table of Contents filtering, so you can hide any books that you don’t use on a regular basis and then save
the filtered version as your default view.
• Annotations, allowing you to add your own comments to the existing help pages. Annotations can be
saved and later imported into a future version of the help.
Release 15.0 - © SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
x of ANSYS, Inc. and its subsidiaries and affiliates.