Analog Monitoring & Control Circuit w/Multi-Ch ADC, 4 DACs, Temp Sens, 12 GPIOs

41 Pages·2015·1.07 MB·English

AMC7891
www.ti.com SBAS518A–AUGUST2011–REVISEDDECEMBER2011
Analog Monitor and Control Circuit
with 10-Bit, Multi-Channel ADC and Four DACs, Temperature
Sensor, and 12 GPIOs
CheckforSamples:AMC7891
FEATURES APPLICATIONS
1
• 10-Bit,500-kSPSSAR ADC: • CellularBaseStations
23
– 8ExternalAnalogInputs • RFCommunicationSystems
– V ,2 ×V InputRanges • OpticalNetworks
REF REF
• Four10-BitMonotonicDACs: • General-PurposeMonitor andControl
– 0to5-VOutputRange
DESCRIPTION
– Upto10-mA Sinkand SourceCapability
The AMC7891 is a highly-integrated, low-power,
– Power-OnResetto0V
complete analog monitoring and control system in a
• Internal2.5-VReference verysmallpackage.
• InternalTemperatureSensor:
For monitoring functions, the AMC7891 has 8
– –40°Cto+125°COperation uncommitted inputs multiplexed into a 10-bit SAR
– Accuracyof ±2.5°C analog-to-digital converter (ADC) and an accurate
on-chip temperature sensor. Control signals are
• 12General-PurposeI/OPorts:
generated through four, independent, 10-bit
– 1.8-Vto5.5-V Operation digital-to-analog converters (DACs). Additional digital
• Low-PowerSPI™-CompatibleSerialInterface: signalmonitoringandcontrolisaccomplishedthrough
twelve configurable GPIOs. An internal reference can
– 4-WireMode, 1.8-V to5.5-V Operation
beusedtodrivetheADCandDACs.
– SCLKupto30MHz
Communication to the device is performed through a
• TemperatureRange:–40°Cto+105°C
versatile, four-wire serial interface compatible with
• LowPower: 32.5mWat5V,FullOperating industry-standard microprocessors and
Conditions microcontrollers. The serial interface can operate at
• Space-SavingPackage:36-pin, clock rates up to 30 MHz, allowing quick access to
criticalsystem data.
6-mmx6-mmQFN
The device is characterized for operation over the
AMC7891 2.5-V Reference temperature range of –40ºC to 105ºC and is available
inaverysmall, 36-pin,6-mmx6-mm QFNpackage.
DAC The AMC7891’s low power, small size and
Eight Analog Inputs MUX ADC DDAACC Four DAC Outputs hcpffoeiiorguacwhntuue-diirtrneiftanoesmrgeRrpmtaFlitiofisiocdenoerssmrimmn(maPiRlakuAFern)lyicitatrabanatendinonsnliieodsfwetsiocay-rinslaomtlloeisiwomned-scug.aoleemTsnsthpe,elsrbifauiiAealcrsMhpsucCa(orLs7pnN8ottr9hsAoe1e)l
TEMP monitor andcontrolsystems.
SENSOR
For applications that require a different channel
Serial Interface SerialInterface DAC cTMoeouxnnaittso,rIandstdraiutnimodneanltCsfeooanfftteurorrsel sa,(coAorMmcCpol)entveePfratreomrdiluryecostsof.lAuntioaSnleoseg,
GPIO Control http://www.ti.com/amc.
12 GPIOs
1
Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas
Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
SPIisatrademarkofMotorola,Inc.
2
Allothertrademarksarethepropertyoftheirrespectiveowners.
3
PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2011,TexasInstrumentsIncorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarilyincludetestingofallparameters.
AMC7891
SBAS518A–AUGUST2011–REVISEDDECEMBER2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore
susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
RHHPACKAGE
QFN-36
(TOPVIEW)
EF N7 N6 N5 N4 N3 N2 N1 N0
R AI AI AI AI AI AI AI AI
36 35 34 33 32 31 30 29 28
AVDD 1 27 GPIOA0
AGND1 2 26 GPIOA1
DGND 3 25 GPIOA2
GPIOVDD 4 24 GPIOA3
SPIV 5 23 GPIOB0
DD
CS 6 22 GPIOB1
SCLK 7 21 GPIOB2
SDI 8 20 GPIOB3
SDO 9 19 DAV
10 11 12 13 14 15 16 17 18
T3 T2 T1 T0 D2 C3 C2 C1 C0
U U U U N O O O O
ACO ACO ACO ACO AG GPI GPI GPI GPI
D D D D
AMC7891PinFunctions
PIN
I/O DESCRIPTION
NO. NAME
1 AV I Analogsupplyvoltage.(4.75Vto5.5V)
DD
2 AGND1 I Analogground.Groundreferencepointforallanalogcircuitryonthedevice,AGND.ConnectAGND1and
AGND2tothesamepotential,AGND.
3 DGND I Digitalground.Groundreferencepointforalldigitalcircuitryonthedevice.Ideally,AGNDandDGNDshould
beatthesamepotentialandmustnotdifferbymorethan0.3V.
4 GPIOV I GPIOsupplyvoltage.(1.8Vto5.5V)
DD
SetstheGPIOoperatingvoltageandthresholdlevels.
5 SPIV I Serialinterfacesupplyvoltage.(1.8Vto5.5V)
DD
Setstheserialinterfaceoperatingvoltageandthresholdlevels.
6 CS I Activelowserialdataenable.Schmitt-triggerlogicinput.
Thisinputistheframesynchronizationsignalfortheserialdata.Whenthissignalgoeslow,itenablesthe
inputshiftregisteranddataissampledonsubsequentfallingclockedges.TheDACoutputandregister
settingsupdatefollowingthe24thclock.IfCSgoeshighbeforethe23thclockedge,thecommandis
ignored.
7 SCLK I Serialinterfaceclock.Schmitt-triggerlogicinput.
MaximumSCLKrateis30MHz.
8 SDI I Serialinterfacedatainput.Schmitt-triggerlogicinput.
DataisclockedintotheinputshiftregisteroneachfallingedgeofSCLK.
9 SDO O Serialinterfacedataoutput.TheSDOpinisinhighimpedancewhenCSishigh.
DataisclockedoutoftheinputshiftregisteroneachrisingedgeofSCLK.
10 DACOUT3 O DAC3bufferedoutput.(0VtoAV ).
DD
Cansource/sinkupto10mA.
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AMC7891PinFunctions (continued)
PIN
I/O DESCRIPTION
NO. NAME
11 DACOUT2 O DAC2bufferedoutput.(0VtoAV ).
DD
Cansource/sinkupto10mA.
12 DACOUT1 O DAC1bufferedoutput.(0VtoAV ).
DD
Cansource/sinkupto10mA.
13 DACOUT0 O DAC0bufferedoutput.(0VtoAV ).
DD
Cansource/sinkupto10mA.
14 AGND2 I Analogground.Groundreferencepointforallanalogcircuitryonthedevice,AGND.ConnectAGND1and
AGND2tothesamepotential,AGND.
15 GPIOC3 I/O GeneralpurposedigitalI/OC3.MaximumvoltageissetbyGPIOV
DD
16 GPIOC2 I/O GeneralpurposedigitalI/OC2.MaximumvoltageissetbyGPIOV
DD
17 GPIOC1 I/O GeneralpurposedigitalI/OC1.MaximumvoltageissetbyGPIOV
DD
18 GPIOC0 I/O GeneralpurposedigitalI/OC0.MaximumvoltageissetbyGPIOV
DD
19 DAV O ADCdataavailableindicator.Open-drain,activelowoutput.
Indirect-mode,DAVgoeslowwhenanADCconversioncyclefinishes.Inauto-modea1µspulseappears
onthispinwhentheconversioncyclefinishes(seeADCOperationfordetails).DAVstayshighwhen
deactivated.Ifused,anexternal10kΩpull-upresistortoGPIOV isrequired.Ifunused,thepincanbe
DD
connectedtoDGND.
20 GPIOB3 I/O GeneralpurposedigitalI/OB3.MaximumvoltageissetbyGPIOV
DD
21 GPIOB2 I/O GeneralpurposedigitalI/OB2.MaximumvoltageissetbyGPIOV
DD
22 GPIOB1 I/O GeneralpurposedigitalI/OB1.MaximumvoltageissetbyGPIOV
DD
23 GPIOB0 I/O GeneralpurposedigitalI/OB1.MaximumvoltageissetbyGPIOV
DD
24 GPIOA3 I/O GeneralpurposedigitalI/OA3.MaximumvoltageissetbyGPIOV
DD
25 GPIOA2 I/O GeneralpurposedigitalI/OA2.MaximumvoltageissetbyGPIOV
DD
26 GPIOA1 I/O GeneralpurposedigitalI/OA1.MaximumvoltageissetbyGPIOV
DD
27 GPIOA0 I/O GeneralpurposedigitalI/OA1.MaximumvoltageissetbyGPIOV
DD
28 AIN0 I Uncommittedanaloginput0.(0Vto5V)
29 AIN1 I Uncommittedanaloginput1.(0Vto5V)
30 AIN2 I Uncommittedanaloginput2.(0Vto5V)
31 AIN3 I Uncommittedanaloginput3.(0Vto5V)
32 AIN4 I Uncommittedanaloginput4.(0Vto5V)
33 AIN5 I Uncommittedanaloginput5.(0Vto5V)
34 AIN6 I Uncommittedanaloginput6.(0Vto5V)
35 AIN7 I Uncommittedanaloginput7.(0Vto5V)
36 REF I/O UsedasexternalADCreferenceinputwhentheinternalreferencebufferisdisabledinregisterAMC_power,
ref_on=‘0’(default).Adecouplingcapacitorisrecommendedbetweentheexternalreferenceoutputan
AGNDfornoisefiltering.
UsedasinternalreferenceoutputwhentheinternalreferencebufferisenabledinregisterAMC_power,
ref_on=‘1’.Requiresa4.7µFdecouplingcapacitortoAGNDwhenusedasreferenceoutput.Anexternal
bufferamplifierwithhighimpedanceinputisrequiredtodriveanexternalload.
– THERMAL – Thethermalpadislocatedonthepackageunderside.Connecttotheboardgroundplaneusingmultiple
PAD vias.
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FUNCTIONAL BLOCK DIAGRAM
AMC7891
Internal Reference
REF
(2.5V)
ref_on
AIN0
AIN1
AIN2 DAC0
DACOUT0
10-Bit
AIN3 xer
e 10-Bit
AIN4 ultipl ADC dac0_clear
M
DAC1
AIN5 10-Bit DACOUT1
AIN6 Temperature
Sensor dac1_clear
AIN7
DAC2
DACOUT2
10-Bit
Configuration
DAV Registers dac2_clear
DAC3
DACOUT3
10-Bit
dac3_clear
CS
al
er
SCLK eriphPerface
SDI erial Int AV
S DD
SDO
GPIOV
GPIO Control DD
SPIV
DD
GPIOA0 GPIOA1 GPIOA2 GPIOA3 GPIOB0 GPIOB1 GPIOB2 GPIOB3 GPIOC0 GPIOC1 GPIOC2 GPIOC3 AGND1 AGND2 DGND
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ORDERINGINFORMATION(1)
PACKAGE TRANSPORT
TA ORDERCODE DRAWING/TYPE(2)(3) MEDIA QUANTITY
AMC7891SRHHT 250
–40°Cto105°C RHH/36-QFNQuadFlatpackNo-Lead TapeandReel
AMC7891SRHHR 2000
(1) ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orseethe
deviceproductfolderatwww.ti.com.
(2) ThermalPadSize:4.39mmx4.39mm
(3) MSLPeakTemperature:Level-3-260C-168HR
ABSOLUTE MAXIMUM RATINGS(1)
Overoperatingfree-airtemperaturerange,unlessotherwisenoted.
VALUE UNIT
MIN MAX
AV toAGND(2) –0.3 6 V
DD
GPIOV toDGND –0.3 6 V
DD
Supplyvoltagerange
SPIV toDGND –0.3 6 V
DD
AGNDtoDGND –0.3 0.3 V
AIN[0:7],DACOUT[0:3],REFtoAGND –0.3 AV +0.3 V
DD
CS,SCLK,SDItoDGND –0.3 6 V
Pinvoltagerange SDOtoDGND –0.3 SPIV +0.3 V
DD
GPIOA[0:3],GPIOB[0:3],GPIOC[0:3]toDGND –0.3 GPIOV +0.3 V
DD
DAVtoDGND –0.3 6 V
Operatingfree-airtemperaturerange,T :AMC7891 (3)(4) –40 105 °C
A
Storagetemperaturerange –40 150 °C
Humanbodymodel(HBM) 2.5 kV
ESDratings:
Chargeddevicemodel(CDM) 1.0 kV
(1) StressesabovethoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Exposuretoabsolute
maximumconditionsforextendedperiodsmayaffectdevicereliability.
(2) AGND1andAGND2mustbetiedtogetherasAGND.
(3) Airfloworheatsinkingreducesθ andmayberequiredforsustainedoperationat105°Candmaximumoperatingconditions.
JA
(4) Solderingthedevicethermalpadtotheboardgroundplaneisstronglyrecommended.
THERMAL INFORMATION
AMC7891
THERMALMETRIC(1) RHHPACKAGE UNITS
36PINS
θ Junction-to-ambientthermalresistance 30.6
JA
θ Junction-to-case(top)thermalresistance 16.0
JCtop
θ Junction-to-boardthermalresistance 5.3
JB
°C/W
ψ Junction-to-topcharacterizationparameter 0.2
JT
ψ Junction-to-boardcharacterizationparameter 5.3
JB
θ Junction-to-case(bottom)thermalresistance 0.8
JCbot
(1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953.
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ELECTRICAL CHARACTERISTICS (DAC SPECIFICATIONS)
AV =4.75to5.5V,GPIOV =1.8to5.5V,SPIV =1.8to5.5V,AGND=DGND=0V,ExternalADCreference=AV ,
DD DD DD DD
T =–40°Cto105°C(unlessotherwisenoted)
A
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
STATICACCURACY
Resolution 10 Bits
INL Relativeaccuracy ±0.05 ±1 LSB
DNL Differentialnonlinearity Specifiedmonotonic ±0.1 ±1 LSB
Offseterror Code0x008 ±0.5 ±5 mV
Gainerror ±0.025 ±0.2 %FSR
Offsettemperaturecoefficient ±1 ppm/°C
Gaintemperaturecoefficient ±1 ppm/°C
DACOUTPUT (1)
Fullscaleoutputvoltagerange 0 AV V
DD
Transition:Code0x008to0x3F8towithin1/2LSB,
Outputvoltagesettlingtime 5 µs
C =2nF,RL=∞
L
Slewrate 2 V/µs
Shortcircuitcurrent Full-scalecurrentshortedtogroundorpulledtoAVDD ±30 mA
Loadcurrent Sourceand/orsinkwithin300mVofsupply ±10 mA
Capacitiveloadstability R =∞ 10 nF
L
DCoutputimpedance 1 Ω
Power-onovershoot AV 0to5V,2msramp 10 mV
DD
Glitchenergy Transition:Code0x1FFto0x200;0x200to0x1FF 0.15 nV-s
T =25°C,1kHz 260 nV/√Hz
A
Outputnoise
Integratednoisefrom0.1Hzto10Hz 20 µV
PP
(1) Specifiedbydesignandcharacterization.Nottestedduringproduction.
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ELECTRICAL CHARACTERISTICS – (ADC SPECIFICATIONS)
AV =4.75to5.5V,GPIOV =1.8to5.5V,SPIV =1.8to5.5V,AGND=DGND=0V,ExternalADCreference=AV ,
DD DD DD DD
T =–40°Cto105°C(unlessotherwisenoted)
A
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
DCACCURACY
Resolution 10 Bits
INL Integralnonlinearity ±0.1 ±1 LSB
DNL Differentialnonlinearity Specifiedmonotonic ±0.1 ±1 LSB
Offseterror ±0.5 ±2 LSB
Offseterrormatch ±0.4 LSB
Gainerror ±0.5 ±2 LSB
Gainerrormatch ±0.4 LSB
CONVERSIONTIME
ADCconversionrate 500 kSPS
Autocycleupdaterate All8ADCinputchannelsenabled 16 µs
Throughputrate SCLK≥12MHz,singleanalogchannel 500 kSPS
Conversiondelay Delayfromtriggertoconversionstart 2 4 µs
ANALOGINPUT
Absoluteinputvoltagerange Independentofgainsetting AGND–0.2 AV +0.2 V
DD
Gain=1,adcn_gain='0' 0 V V
REF
Fullscaleinputvoltagerange
Gain=2,adcn_gain='1' 0 2×V V
REF
Inputcapacitance(1) 40 pF
DCinputleakagecurrent MeasuredwithADCinHoldmode ±1 µA
ACPERFORMANCE
SFDR SpuriousFreeDynamicRange f =1kHz,–1dBFSsinewave 76 dBc
IN
SNR SignaltoNoiseRatio f =1kHz,–1dBFSsinewave 61 dBc
IN
SINAD SignaltoNoise+DistortionRatio f =1kHz,–1dBFSsinewave 60.5 dBc
IN
f =1kHz,–1dBFSsinewave,Measured
THD TotalHarmonicDistortion IN 75 dBc
uptothefifthharmonic
INTERNALADCREFERENCE (2)
InternalADCreferencebufferedoutputat
V Referenceoutputvoltage 2.5 V
REF REFpin
Referencebufferpower AV =5V 360 µA
DD
Referencetemperaturecoefficient 10 ppm/°C
EXTERNALADCREFERENCE
V Referenceinputvoltage ExternalADCreferenceinputtoREFpin 0.3 AVDD V
REF
Inputresistance(1) V =5V,AIN=5V 20 kΩ
REF
TEMPERATURESENSOR
Operatingrange –40 125 °C
Accuracy T =–40°Cto125°C,AV =5V ±1 ±2.5 °C
A DD
Resolution LSBsize 0.125 °C
Conversiontime 15 ms
(1) Specifiedbydesign.Nottestedduringproduction.
(2) Useanexternalbufferamplifierwithhighimpedanceinputtodriveanyexternalload.
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ELECTRICAL CHARACTERISTICS – GENERAL SPECIFICATIONS
AV =4.75to5.5V,GPIOV =1.8to5.5V,SPIV =1.8to5.5V,AGND=DGND=0V,ExternalADCreference=AV ,
DD DD DD DD
T =–40°Cto105°C(unlessotherwisenoted)
A
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
GENERALPURPOSEI/O
GPIOV =1.8V 0.7×GPIOV V
DD DD
V High-levelinputvoltage
IH
GPIOV =3.3to5.5V 2.1 V
DD
GPIOV =1.8V 0.3 V
DD
V Low-levelinputvoltage
IL
GPIOV =3.3to5.5V 0.8 V
DD
I =1.6mA,GPIOV =1.8V,AllGPIOs
load DD GPIOV -0.25 V
loadedandsetto'1' DD
V High-leveloutputvoltage
OH
I =1.6mA,GPIOV =3.3to5.5V,All
load DD GPIOV -0.2 V
GPIOsloadedandsetto'1' DD
V Low-leveloutputvoltage I =-1.6mA,AllGPIOsloaded 0.4 V
OL load
Inputcapacitance (1) 1 pF
Highimpedanceoutput
capacitance (1) 1 pF
LOGICINPUTS:CS,SDI,SCLK
SPIV =1.8V 0.7×SPIV V
DD DD
V High-levelinputvoltage
IH
SPIV =3.3to5.5V 2.1 V
DD
SPIV =1.8V 0.3 V
DD
V Low-levelinputvoltage
IL
SPIV =3.3to5.5V 0.7 V
DD
Inputcurrent ±1 µA
Inputcapacitance (1) 1 pF
Highimpedanceoutput
capacitance (1) 1 pF
LOGICOUTPUT:SDO
V High-leveloutputvoltage I =1.6mA SPIV -0.2 V
OH load DD
V Low-leveloutputvoltage I =-1.6mA 0.4 V
OL load
LOGICOUTPUT:DAV
V Low-leveloutputvoltage I =-2mA 0.4 V
OL load
POWERREQUIREMENTS
AV 4.75 5 5.5 V
DD
GPIOV 1.8 5.5 V
DD
SPIV 1.8 5.5 V
DD
I Totalsupplycurrent,AVDD+ Operatingmode(2) 6.5 10 mA
DD GPIOV +SPIV
DD DD
Powerdownmode 1.25 2 mA
Powerconsumption Operatingmode(2) 32.5 55 mW
Powerdownmode 6.25 11 mW
OPERATINGRANGE
Specifiedtemperaturerange –40 25 105 °C
(1) Specifiedbydesign.Nottestedinproduction.
(2) AV =GPIOV =SPIV =5V.NoDACload,allDACsat0x200codeandADCatthefastestautoconversionrate.
DD DD DD
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TIMING SPECIFICATIONS(1)(2)
AV =4.75to5.5V,GPIOV =1.8to5.5V,SPIV =1.8to5.5V,AGND=DGND=0V,ExternalADCreference=AV ,
DD DD DD DD
T =–40°Cto105°C(unlessotherwisenoted).
A
PARAMETER TESTCONDITIONS MIN TYP MAX UNIT
SPIV =5.5V 30 MHz
DD
f SCLKfrequency SPIV =2.7V 15 MHz
SCLK DD
SPIV =1.8V 10 MHz
DD
t Inputrisetime 10%to90%ofSPIV 2 ns
R DD
t Inputfalltime 10%to90%ofSPIV 2 ns
F DD
SPIV =5.5V 33 ns
DD
t SCLKcycletime SPIV =2.7V 66 ns
1 DD
SPIV =1.8V 100 ns
DD
SPIV =5.5V 13 ns
DD
t SCLKhightime SPIV =2.7V 30 ns
2 DD
SPIV =1.8V 50 ns
DD
SPIV =5.5V 13 ns
DD
t SCLKlowtime SPIV =2.7V 26 ns
3 DD
SPIV =1.8V 40 ns
DD
t Framestarttime CSfallingedgetoSCLKrisingedge 5 ns
4
t SDIsetuptime SDIvalidtofallingedgeofSCLK 4 ns
5
t SDIholdtime SDIvalidafterfallingedgeofSCLK 12 ns
6
t Framestoptime SCLKfallingedgetoCSrisingedge 15 ns
7
t CShightime 50 ns
8
SPIV =5.5V,C =10pF,1ns≤t ≤4ns 5 16 ns
DD L R,F(SDO)
t SDOdelay SPIV =2.7V,C =10pF,1ns≤t ≤5ns 6 22 ns
9 DD L R,F(SDO)
SPIV =1.8V,C =10pF,2ns≤t ≤8ns 8 39 ns
DD L R,F(SDO)
t Waittime CSrisingedgetonextSCLKrisingedge 5 ns
10
(1) Specifiedbydesign.Nottestedduringproduction.
(2) DigitalinputsandoutputstimedfromavoltagelevelofSPIV /2.
DD
TIMING INFORMATION
t8 t4 t7
CS
t1 tf t10
SCLK t2 t3
tr
SDI Bit23 Bit1 Bit0
t5 t6
Figure1. Serial InterfaceWriteTimingDiagram
t8
t4 t7
CS
t1 tf tr
SCLK t2 t3
Read Command Any Command
SDI Bit23 Bit0 Bit23 Bit1 Bit0
t5 t6 t9
SDO Bit23 Bit1 Bit0
Data read from the register selected in previous operation
Figure2. Serial InterfaceReadTimingDiagram
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TYPICAL CHARACTERISTICS: DAC
AV =5V,GPIOV =5V,SPIV =5V,AGND=DGND=0V,ExternalADCreference=AV
DD DD DD DD
(unlessotherwisenoted)
1.000 1.000
0.750 0.750
0.500 0.500
B) 0.250 B) 0.250
S S
NL (L 0.000 NL (L 0.000
I−0.250 D−0.250
−0.500 −0.500
−0.750 −0.750
T=25ºC T=25ºC
−1.000 −1.000
0 128 256 384 512 640 768 896 1024 0 128 256 384 512 640 768 896 1024
Code Code
G001 G002
Figure3.DACINTEGRALNON-LINEARITY Figure4.DACDIFFERENTIALNON-LINEARITY
1.000 1.000
0.750 0.750
0.500 INL Max 0.500 DNL Max
B) 0.250 B) 0.250
S S
NL (L 0.000 NL (L 0.000
I−0.250 D−0.250
−0.500 INL Min −0.500 DNL Min
−0.750 −0.750
−1.000 −1.000
−40 −20 0 20 40 60 80 100 120 −40 −20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)
G003 G004
Figure5.DACINLvs.TEMPERATURE Figure6.DACDNLvs.TEMPERATURE
5 200
4
150
3
V) 2 SR) 100
or (m 1 m%F 50
Err 0 or ( 0
Offset −−21 ain Err −50
G−100
−3
−150
−4
−5 −200
−40 −20 0 20 40 60 80 100 120 −40 −20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)
G005 G006
Figure7.DACOFFSETERRORvs.TEMPERATURE Figure8.DACGAINERRORvs.TEMPERATURE
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