Advanced Microsystems for Automotive Applications 98

321 Pages·1998·15.637 MB·English

by  D. Rich, W. Kosiak, G. Manlove, S. V. Potti, D. Schwarz (auth.), Dr. Detlef Egbert Ricken, Wolfgang Gessner (eds.)

Detlef Egbert Ricken · Wolfgang Gessner (Eds.)
Advanced Microsystems for Automotive Applications 98
Springer-Verlag Berlin Heidelberg GmbH
Detlef E. Ricken • Wolfgang Gessner (Eds.)
Advanced Mieresystems
for Automotive
Applications 98
With 253 Figures
~Springer
Dr. DETLEF EGBERT RICKEN
VDI/VDE-Technologiezentrum Informationstechnik GmbH
Rheinstr.10B
14513 Teltow
e-mail: [email protected]
WOLFGANG GESSNER
VDI/VDE-Technologiezentrum Informationstechnik GmbH
Rheinstr.10B
14513 Teltow
e-mail: [email protected]
Die Deutsche Bibliothek-CIP-Einheitsaufnahme
Advanced Microsystems for Automotive Applications 98 I Eds.: Detlef Egbert Ricken; Wolfgang
Gessner. -Berlin; Heidelberg; New York; Barcelona; Budapest; Hongkong; London; Milano; Paris;
Santa Clara; Singapore; Tokyo: Springer, 1998
ISBN 978-3-662-38795-5 ISBN 978-3-662-39696-4 (eBook)
DOI 10.1007/978-3-662-39696-4
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© Springer-Verlag Berlin Heidelberg 1998
Originally published by Springer-Verlag Berlin Heidelberg New York in 1998.
Softcover reprint of the hardcover 1st edition 1998
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Preface
The idea of a conference dedicated to microsystems for automotive applications
was bom at the Innovation Centre North Germany in early 1995 in order to
improve communications in the supply chain ..
A conference programme was drawn up a few months later with the support of H.
Ehlbeck. The main topic of the frrst conference was sensors for safety applications.
This event revealed the need for a discussion platform for microsystems in the
automotive field and the conference 'Advanced Microsystems for Automotive
Applications' was held subsequently in 1996 and 1998. The conference has grown
from a event similar to a workshop to a large conference including contributions
from Europe, Japan and the United States. Global suppliers and manufacturers as
weil as SME's and research institutes present their technology and solutions. This
proceedings volume includes both oral and poster presentations from the 1998
conference. The technical topics extend from microsystems for safety applications
and systems for driver support to intelligent systems for the power train. The main
emphasis has shifted from the pure microsystem, such as the accelerometer, to the
system as a whole. Thus the papers presented during the conference deal with all
aspects of a smart system: sensors, communication, signal evaluation and
evaluation strategies and packaging.
Future restraint systems will utilize a wide variety of microsensors, e.g.
accelerometers, yaw-rate-sensors, subsystems for occupant detection (passenger
presence, -position -size and -mass), precrash-sensors and intelligent inflator
technology for depowered airbags. Some smaller companies, as weil as the well
known suppliers, present their developments within the system context. The
inclusion of the presentation on pressure sensor mats is a good example for the
system oriented approach of the conference; although the mat is not fabricated
with state of the art microsystem technology it is an important component for
intelligent occupant detection systems and the paper fits weil into the sessions on
passenger protection.
Driver support systems have always been a major topic of the AMAA conference.
The AMAA '98 discusses systems for electronic imaging and vision enhancement.
State of the art systems realised with CMOS or CCD technology improve driving
safety (e.g. in night vision systems or in blind spot monitoring sensors) and offer
an unparalleled degree of convenience for the driver (e.g. automatic park systems
etc. ) Initial applicatons are approaching the stage of preliminary production. The
blind spot monitoring device which is described in this volume could, for example,
be produced for evaluation in 1998 and large scale production could commence
before 2001.
Although initial products will be available soon, electronic imaging for automotive
applications is a very challenging task. Various technological questions have tobe
solved to allow for cost effective solutions even for non-luxury cars. The TFA or
VI Preface
"Thin Film on ASIC" technology discussed in one of the papers could be an
interesting approach for meeting the target prices. Since the various vision systems
are not as close to application as the passenger restraint systems the corresponding
papers provide a discussion of more general aspects of the technology involved.
Another important field of application for microsystems is engine management and
the power train. The use of micromachined sensors enables engineers to monitor a
variety of important parameters. The intelligent power train session as weil as
some of the posters reflect important components like chemical sensors, innovative
pressure sensors and flow sensors. Furthermore, control strategies for both direct
injection engines and transmission systems are discussed.
We would like to thank the members of the Honorary Committee and the Steering
Committee for their support. Their assessments provided the basis for the selection
of papers for the conference and the proceedings. The authors provided excellent
papers and we would also like to thank them for their co-operation. Finally, the
editors wish to thank H. Johansson, B._ Kühl and P. Mulvanny for many fruitful
discussions during the preparation of the conference. Without their support this
book and the conference would not have been possible.
Teltow, January 1998
Detlef Egbert Ricken Wolfgang Geßner
Table of Contents
Oral presentations
A Sensor for Crash Severity and Side Impact Detection ........................ .
D. Rich et.al., Deiphi Delco Electronics Systems
Peripheral Aceeieration Sensor for Side Airbag . .. .. .. .. .. ... ..... .. .. .. .. .. . .. .. .. .. . 19
G. Bischopink et.al., Robert Bosch GmbH
Future Applications of Microsystem Technologies in Automotive Safety
Systems ......................................................................................................... 21
P. Steiner et.al., TEMIC Telefunken microelectronic GmbH
Situation Appropriate Airbag Deployment: Child Seat Presence and
Orientation Detection (CPOD) ................................................................... 43
T. Goniva, International Electronics & Engineering
Rollover Sensing (Rose) .............................................................................. 55
G. Mehler et.al., Robert Bosch GmbH
Yaw Rate Sensor in Silicon Micromachining Technology for Automotive
Applications .. . .. .. .. .. .. .. . .. . .. . . .. .. .. . .. .. .. .. .. . .. .. .. .. . .. .. . .. .. .. . .. .. . .. . .. . .. . .. .. .. . .. . . .. .. . . .. .. 69
W. Goiderer et.al., Robert Bosch GmbH
AW ARE A Collision Warning and Av oidance Radar System ......... .. .. . .. . 79
H. Lind et.al., AB Volvo
Multifunctional Radar Sensor for Vehicle Dynamics Control Systems .. 87
M. Wollitzer et.al., Daimler·Benz AG
Forward Looking 2-dimensional Laser Radar for ACC Systems .......... 101
T. Matsui, Denso Corporation
Surface Micromachined Sensors for Vehicle Navigation Systems . .. .. .. ... 103
C. Lemaire et.al., Analog Devices, Inc.
MEMS: The New Challenge for the Electronic Design Automation
Vendors ........................................................................................................ 113
J.M. Karam et.al., TIMA-CMP
VIII Table of Contents
The Smart Image Sensor Toolbox for Automotive Vision Applications . 123
P. Seitz, CSEM SA
A Low Cost Image Processing Device for Blind Spot Monitorlog .......... 139
G. Burzio et.al., Centro Ricerche Fiat
Continuous Parallel Analogue Image Processing Using Time Discrete
Sampling .......................................................................... ............ ....... .. .. ...... 149
U. Apel et.al., Institute for Micoelectronics, Stuttgart
High Dynamic Range Image Sensors in Thin Film on ASIC Technology
for Automotive Applications ....................................................................... 157
M. Böhm et.al., Universität-Gesamthochschule Siegen
A Wide Dynamic Range CMOS Stereo Camera ....................................... 173
G. Meynants et.al., IMEC
Computer Vision Suitable for Vehicle Applications ............ ............ ......... 183
U. Regensburger et.al., Daimler-Benz AG
Optical Detector System for Water, Sludge and Iee ................................. 193
T.W. Huth-Fehre et.al., Institut ofChemical and Biochemical Sensor Research
Engine Management System for Direct Injection Gasoline Engine .. .. .... 199
H. Tamura, Nissan Motor Co., Ltd.
Integration of Electronic Control Units in Modern Transmission Systems 213
R. lngenbleek et.al., ZF Friedeichshafen AG
New High·T emperature Sensors for Innovative Engine Management ... 223
G. Krötz et.al., Daimler-Benz AG
Automotive High-Pressure Sensor ............................................................. 231
T. Matsui, Denso Corporation
A New Sensor for Continuous Measurement of Fuel Injection Rate and
Quantity During Diesel Engine Operation ................................................ 233
0. Berberig et.al., ZEXEL Corporation
Measurement of Physical Parameters of Car Tires Using Passive SA W
Sensors . .............................................................. ............ ...................... .. .. ..... 249
A. Pohl et.al., TU Wien
A Rotary Position Sensor System for Automotive Applications .............. 263
D. Schödlbauer, ruf e1ectronics GmbH
Table of Contents IX
SA W and IDC Devices as Oil Quality Sensors........................................... 273
A. Leidl et.al.; Fraunhofer-IFf
Poster Presentations
A New Silicon Rate Gyroscope with Decoupled Oscillation Modes .... .. .. . 277
W. Geiger et.al., Hahn-Schickard-Gesellschaft, Institut für Mikro- und
Informationstechnik
Miniaturized Crash Test System................................................................. 281
G. Haas, Kayser-Threde GmbH
Microelectronic Technologies for Automotives .. .... .. ... ... ... .. .. .. .. .. ... .... .. .... 285
D. J. Jendritza et.al., Philips GmbH
Europractice Competence Center No 1
Microsystems for Automotive Applications and Physical Measurement
Systems ......................................................................................................... 291
W. Riethmüller et.al., Fraunhofer-ISiT
Microtechnologies • The Alternative for Automotive Applications
Concerning Economic, Technical and Quality Aspects ..... .. .. .. .. ..... .. .... .. .. 295
J. Herrnsdorf et.al., HL-Planartechnik GmbH
Technology and Process Approval Cut Down the Costs for Semiconductor
in the Automotive Environment-ES 59001 the Brandnew European
Specification for Semiconductors for Automotive Applications .. .. .. ..... ... 299
A. Bergmann; VDE Prüf-und Zertifizierungsinstitut
Application of Gas Sensor for Air Damper Control Systems in
Automobiles . ..... ...... .. ........ ........ .. ....... .. ....... ......... .. .. ...... ...... .. ...... .. .. .. . .. .. .. .. . 303
N. Murakami et.al.; Murakami Research Services
Protectionsystems for Car Passengers by Surveillance of the Airquality 307
C. Voit, Unitronic GmbH
Ernerging Assembly Technology for Automotive Applicationsb . ............ 311
K. Heinriebt et.al., Fraunhofer-IZM
Surveillance of the Air-Quality in the Passenger Cabin of Cars .......... .. . 315
C. Voit, Unitronic GmbH
List of Contact Addresses ................... ............................... .. .... .. .. .. ............. 319