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Advances in Material Research and Technology J. Radhakrishnan Sunil Pathak Editors Advanced Engineering of Materials Through Lasers Advances in Material Research and Technology SeriesEditor ShadiaJamilIkhmayies,PhysicsDepartment,IsraUniversity,Amman,Jordan ThisSeriescoverstheadvancesanddevelopmentsinawiderangeofmaterialssuch as energy materials, optoelectronic materials, minerals, composites, alloys and compounds, polymers, green materials, semiconductors, polymers, glasses, nano- materials, magnetic materials, superconducting materials, high temperature materials,environmentalmaterials,PiezoelectricMaterials,ceramics,andfibers. Moreinformationaboutthisseriesathttps://link.springer.com/bookseries/16426 · J. Radhakrishnan Sunil Pathak Editors Advanced Engineering of Materials Through Lasers Editors J.Radhakrishnan SunilPathak DepartamentodeFísicaAplicadae HiLaseCentre,InstituteofPhysics IngenieríadeMateriales CzechAcademyofSciences E.T.S.deIngenierosIndustriales DolniBrezany,CzechRepublic UniversidadPolitécnicadeMadrid Madrid,Spain ISSN 2662-4761 ISSN 2662-477X (electronic) AdvancesinMaterialResearchandTechnology ISBN 978-3-031-03829-7 ISBN 978-3-031-03830-3 (eBook) https://doi.org/10.1007/978-3-031-03830-3 ©TheEditor(s)(ifapplicable)andTheAuthor(s),underexclusivelicensetoSpringerNature SwitzerlandAG2022 Thisworkissubjecttocopyright.AllrightsaresolelyandexclusivelylicensedbythePublisher,whether thewholeorpartofthematerialisconcerned,specificallytherightsoftranslation,reprinting,reuse ofillustrations,recitation,broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,and transmissionorinformationstorageandretrieval,electronicadaptation,computersoftware,orbysimilar ordissimilarmethodologynowknownorhereafterdeveloped. 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ThisSpringerimprintispublishedbytheregisteredcompanySpringerNatureSwitzerlandAG Theregisteredcompanyaddressis:Gewerbestrasse11,6330Cham,Switzerland Preface The4thindustrialrevolutionurgesallsectors,includingmanufacturingtodevelop sustainable and advanced manufacturing processes with a solution to process the partsaftermanufacturing.Thisrequiredintelligentmethodsandtechniquesinorder to stay competitive in the global economy. Laser in recent times has been one of themostsignificantcontributorsintheworldeconomy,alwayshelpingindustryby latest development in promoting research and innovations to meet the accelerated demand for productivity, quality, and sustainability. The development of lasers in applicationsofadditivemanufacturing(AM)andpostprocessingofAMpartsand compositestructureshasbeenachallengingworkinthecurrentandfuturescenario of worlds manufacturing economy. The book will cover the process fundamentals ofdifferentlaser-basedmanufacturingandprocessing,namely:lasershockpeening, lasermicromachining,lasercutting,re-melting,andseveralotheraspectsrelatedto thisfield.Laserinteractionwithdifferentmaterialsisaimtobepartofthebook. This book will help in providing fundamental understanding and advanced researchinsightsonlasermaterialsinteractionandtheirapplicationsinawiderange ofconventionalandadvancedmanufacturing. This book consists of eight chapters on fundamentals to advanced use of lasers in manufacturing. Chapter “Introduction to Lasers and Processing’s of Materials” presents a detailed overview of laser materials interaction. Chapter “Introduction toGasandSolidStateLaserTechniquesinCuttingProcess”shedslightsonthegas andsolidstatelasertechniquesincuttingprocess.Chapter“LaserCuttingofCeramic MatrixComposites”presentsdetailsonlasercuttingofceramicmatrixcomposites. Chapter “Laser Shock Peening: A Walkthrough” highlights the use of laser shock peening(LSP)inadetailedmannertodiscusstheeffectsofLSPonmaterialsprop- ertiesandfatiguelife.Chapter“LaserRe-MeltingofAtmosphericPlasmaSprayed HighEntropyAlloy”describeslaserre-meltingofatmosphericplasmasprayedhigh entropyalloy.Chapter“SurfaceMorphologyofNimonicAlloy263™inNanosecond PulsedLaserAblation”presentsinsightsonsurfacemorphologyofNimonicAlloy 263™ in nanosecond pulsed laser ablation. Chapter “Laser-Based Post-processing ofMetalAdditiveManufacturedComponents”shedshighlightsonlaser-basedpost- processingofmetaladditivemanufacturedcomponents.ThebookendswithChapter v vi Preface “AdvancesinSuperhydrophobicSurfaces:BiologytoBiomimetic”highlightingthe advancesinsuperhydrophobicsurfaces:biologytobiomimetic. I sincerely acknowledge Springer for this opportunity and their professional support.Iamalsothankfultoallthechapter contributorsfortheiravailabilityand valuablecontributions. Madrid,Spain J.Radhakrishnan DolniBrezany,CzechRepublic SunilPathak Contents IntroductiontoLasersandProcessing’sofMaterials .................. 1 AshishK.Shukla,AchyuthKulkarni,ShaliniSingh,S.Jayachandran, AnshuSahu,andI.A.Palani IntroductiontoGasandSolidStateLaserTechniquesinCutting Process ........................................................... 33 S¸enolBayraktarandCemAlparslan LaserCuttingofCeramicMatrixComposites ........................ 55 SundarMarimuthu,NiallBurtt,HelenElkington,andBethanSmith LaserShockPeening:AWalkthrough ............................... 73 R.Sundar LaserRe-MeltingofAtmosphericPlasmaSprayedHighEntropy Alloy ............................................................. 105 HimanshuKumar, ChandraKumar, S.G.K.Manikandan, M.Kamaraj,andS.Shiva Surface Morphology of Nimonic Alloy 263™ in Nanosecond PulsedLaserAblation ............................................. 129 ZhehaoJiang, SunilPathak, S.Subramani, J.Radhakrishnan, andSundarMarimuthu Laser-BasedPost-processingofMetalAdditiveManufactured Components ...................................................... 147 A.N.Jinoop,S.Shiva,andC.P.Paul AdvancesinSuperhydrophobicSurfaces:BiologytoBiomimetic ....... 171 S.SubramaniandJ.Radhakrishnan Index ............................................................. 197 vii Introduction to Lasers and Processing’s of Materials AshishK.Shukla,AchyuthKulkarni,ShaliniSingh,S.Jayachandran, AnshuSahu,andI.A.Palani 1 Introduction The materials processing from nano to micro and bulk level for various commer- cial applications such as Texturing, engraving, and peening dedicated to commer- cialapplicationscanbesubstantiatedemployingaLasersystem[1–4].Thematerial processingemployinglasersystemischosendependingonthedemandofprocessing capabilityanditsreal-lifeapplication[5,6].Theoutliningofalasersystemdepends onlaserparameters,Laserwavelength,Pulseduration,LaserPower,andRepetition rate [7, 8]. Besides, Identifying the absorption coefficient of range of laser wave- length(225nmto1064nm)withsamplematerialbeforereal-timeinteractionwith laser plays a significant role in outlining the experimental system and window for experimentalparameters[9,10]. Figure1showstheapplicationoflasersinactuation,forming,peening,honing, nitriding,patterning,andadditivemanufacturing[11].Inthefieldofactuation,alaser canbeusedtoactuatesmartbi-morphmaterials[12].Thesmartbi-morphmaterial is thin film of Ni–Ti-based smart material over the pre-strained flexible polyimide substrate.Asmartbimorphisdifferentfromaconventionalbimorph[13].TheNi– Tiisheat-sensitivematerial;therefore,itsbimorphcanbeactuatedwithadifferent mediumofheatinputsuchaselectricalheating(Jouleheating)[14]. Theoutlinedwindowentirelydependsontheabsorptioncoefficientofmaterial for the different wavelengths. The influence of varying laser wavelengths can be B A.K.Shukla( ) SchoolofDesignandInnovations,ATLASSKILLTECHUNIVERSITY,Mumbai400070,M.P., India e-mail:[email protected] A.Kulkarni·S.Singh·S.Jayachandran·A.Sahu·I.A.Palani MechatronicsandInstrumentationLab,IndianInstituteofTechnologyIndore,Indore453552, M.P,India ©TheAuthor(s),underexclusivelicensetoSpringerNatureSwitzerlandAG2022 1 J.RadhakrishnanandS.Pathak(eds.),AdvancedEngineeringofMaterialsThrough Lasers,AdvancesinMaterialResearchandTechnology, https://doi.org/10.1007/978-3-031-03830-3_1 2 A.K.Shuklaetal. Fig.1 Laserprocessingofdifferentmaterialsandtheirapplicationinvariousfields observedinthegraphrepresentedinFig.2[15].Theselectedmaterialiscomplex in its lattice characteristics, such as polycrystalline polyimide flexible substrates [16].Figure2Demonstratestheinfluenceoflaserwavelengthrangingfrom225to 1086nmoverflexiblepolymericsubstrates[16].Figure2Illustratestheabsorption ofPIsubstrateisstartedreducingat450nmstraightupto550nm[17].Further,after 600nm,itshoulddecaystraight,whichisnothappeningduetothepolycrystalline nature of the substrate [18]. In addition, the percentage increase in absorption for PI substrate because of 355 nm laser processing compared to 1064 nm of laser processingisconsideredasabsorptionof50%insimulationandsubsequently25% Fig.2 Primary survey for the determination of transition band and highly absorbing region of incidentlaserwavelength;UV–VisTransmissionspectroscopyofpristinepolyimide