Table Of Content

Author index for papers in Volume 36 Pages are numbered consecutively through the volume: 1-136, Beierle, C. January; 137-325, March; 327-529, May; 531-816, July; 375 Logic programming with typed unification and its 817-955, September; and 957-1052, November. realization on an abstract machine Boerstler, D. W. 553 see Aulet, N. R. Ackerman, D. F., M. H. Decker, J. J. Gosselin, K. M. Lasko, Bollinger, T. and U. Pletat M. P. Mullen, R. E. Rosa, E. V. Valera, and B. Wile 965 Knowledge in operation 751 Simulation of IBM Enterprise System/9000 Models 820 Boone, L. E., M. R. Brinthaupt, J. A. Malack, and J. Pavlik and 900 943 Aspects of the electrical design and analyses of the Alt, P. M., C. G. Powell, B. L. Owens, Jr., and H. Ifill printed circuit boards of the IBM Enterprise System/9000 11 A gray-scale addressing technique for thin-film-transistor/ water-cooled processors liquid crystal displays Booth, R. M., Jr., K. A. Tallman, T. J. Wiltshire, and Antonacci, F. and C. M. Calamani P. L. Yee 333 Capturing the deep meaning of texts through deduction 835 A Statistical approach to quality control of non-normal and inference lithographical overlay distributions Apté, C. V., R. A. Dionne, J. H. Griesmer, M. Karnaugh, Bordonaro, D. T. J. K. Kastner, M. M. Laker, and E. K. Mays 233 see Rubloff, G. W. 409 An experiment in constructing an open expert system using a knowledge substrate Bossen, D. C. 765 see Chen, C. L. Askawa, Y., H. Komatsu, H. Etoh, Y. Hama, and K. Brinthaupt, M. R. Maruyama 943 see Boone, L. E. 391 Zephyr: Toward true compiler-based programming in Prolog Brofman, P. J., S. K. Ray, and K. F. Beckham Aulet, N. R., D. W. Boerstler, G. DeMario, F. D. Ferraiolo, 921 Electrical connections to the thermal conduction C. E. Hayward, C. D. Heath, A. L. Huffman, W. R. Kelly, modules of the IBM Enterprise System/9000 water-cooled G. W. Peterson, and D. J. Stigliani, Jr. processors 553. IBM Enterprise Systems multimode fiber optic Brown, K. H., D. A. Grose, R. C. Lange, T. H. Ning, and technology P. A. Totta 821 Advancing the state of the art in high-perjormance Baccarani, G. logic and array technology 208 see Lee, W. Bunce, P., W. Chin, L. Clark, and B. Krumm Bahr, J. E., S. B. Levenstein, L. A.M cMahon, T. J. Mullins, 859 Directory and Trace memory chip with active and A. H. Wottreng discharge cell 1001 Architecture, design, and performance of Application System/400 (AS/400) multiprocessors Calamani, C. M. Barish, A. E., J. P. Eckhardt, M. D. Mayo, W. A. Svarczkopf, 333 see Antonacci, F. and S. P. Gaur Calta, S. A., J. A. deVeer, E. Loizides, and R. N. 829 Improved performance of IBM Enterprise System/9000 Strangwayes bipolar logic chips 535 Enterprise Systems Connection (ESCON) Batson, P. E. Architecture—System overview 183 see Kuan, T. S. Casanova, M. A., A. S. Hemerly, and R. A. de T. Guerreiro Beckhan, K. F. 347 Explaining SLDNF resolution with non-normal 921 see Brofman, P. J. defaults IBM J. RES. DEVELOP. VOL. 36 NO. 6 NOVEMBER 1992 AUTHOR INDEX Casanova, M. A. Elliott, J. C. and M. W. Sachs 361 see Guerreiro, R. A. de T. 577 The IBM Enterprise Systems Connection (ESCON) Casper, D. F. Architecture 617 see Flanagan, J. R. Etoh, H. 391 see Asakawa, Y. Chen, C. L., N. N. Tendolkar, A. J. Sutton, M. Y. Hsiao, and D. C. Bossen Fahey, P. M., S. R. Mader, S. R. Stiffler, R. L. Mohler, 765 Fault-tolerance design of the IBM Enterprise J. D. Mis, and J. A. Slinkman System/9000 Type 9021 processors 158 Stress-induced dislocations in silicon integrated Chin, W. circuits 859 see Bunce, P. Feenstra, R. M. Chiu, K., J. J. DeFazio, and T. G.M cNamara 183 see Kuan, T. S. 867 IBM Enterprise System/9000 clock system: Ferraiolo, F. D. A technology and system perspective 553 see Aulet, N. R. Chiu, G. T. Fischetti, M. V. 845 see Guthrie, W. L. 208 see Lee, W. Clark, L. Flanagan, J. R., T. A. Gregg, and D. F. Casper 859 see Bunce, P. 617 The IBM Enterprise Systems Connection (ESCON) Coleman, J. J., C. B. Meltzer, and J. L. Weiner channel—A versatile building block 647 Fiber Distributed Data Interface attachment to Fujimoto, Y. System/390 76 Study of the V,, shift of the thin-film transistor by the bias temperature stress test Covi, K. R. 781 Three-loop feedback control of fault-tolerant power Fukunaga, T. supplies in IBM Enterprise System/9000 processors 43 see Koseki, T. Crabbé, E. F. Fulton, J. J. 208 see Lee, W. 905 see Kranik, J. R. Cwiakala, R., J. D. Haggar, and H. M. Yudenfriend Fury, M. A. 633 MVS Dynamic Reconfiguration Management 845 see Guthrie, W. L. Dao-Trong, S. and K. Helwig Gaur, S. P. 733 A single-chip IBM System/390 floating-point processor 829 see Barish, A. E. in CMOS Georgiou, C. J., T. A. Larsen, P. W. Oakhill, and B. Salimi Davidson, E. E., P. W. Hardin, G. A. Katopis, M. G. Nealon, 593 The IBM Enterprise Systems Connection (ESCON) and L. L. Wu Director: A dynamic switch for 200Mb/s fiber optic links 877 Physical and electrical design features of the IBM Gibson, D. H. and G. S. Rao Enterprise System/9000 circuit module 695 Design of the IBM System/390 computer family for numerically intensive applications: An overview for engineers Decker, M. H. and scientists 751 see Ackerman, D. F. Gilgert, T. C. DeFazio, J. J. 791 see Delia, D. J. 867 see Chiu, K. Gnudi, A. Del Buono, M. 208 see Lee, W. 487 see Di Zenzo, S. Gosselin, J. J. Delia, D. J., T. C. Gilgert, N. H. Graham, U. Hwang, P. W. 751 see Ackerman, D. F. Ing, J. C. Kan, R. G. Kemink, G. C. Maling, R. F. Martin, K. P. Moran, J. R. Reyes, R. R. Schmidt, and R. A. Goth, G. F., M. L. Zumbrunnen, and K. P. Moran Steinbrecher 805 Dual-tapered-piston (DTP) module cooling for IBM 791 System cooling design for the water-cooled IBM Enterprise System/9000 systems Enterprise System/9000 processors Grahan, N. H. DeMario, G. 791 see Delia, D. J. 553 see Aulet, N. R. Gregg, T. A. deVeer, J. A. 617 see Flanagan, J. R. 535 see Calta, S. A. Griesmer, J. H. 409 see Apté, C. V. Dhondy, Noshir R., Richard J. Schmalz, Ronald M. Smith, Sr., Julian Thomas, and Phil Yeh Grose, D. A. 655 Coordination of time-of-day clocks among multiple 821 see Brown, K. H. systems Guerreiro, R. A. de T., A. S. Hemerly, and M. A. Casanova Di Zenzo, S., M. Del Buono, M. Meucci, and A. Spirito 361 STORK and PENGUIN: Logic programming systems 487 Optical recognition of hand-printed characters of any using general clauses and defaults size, position, and orientation Guerreiro, R. A. de T. Dionne, R. A. 347 see Casanova, M. A. 409 see Apté, C. V. Guthrie, W. L., W. J. Patrick, E. Levine, H. C. Jones, E. A. Mehter, T. F. Houghton, G. T. Chiu, and M. A. Fury Eckhardt, J. P. 845 A four-level VLSI bipolar metallization design with 829 see Barish, A. E. chemical-mechanical planarization AUTHOR INDEX IBM J. RES. DEVELOP. VOL. 36 NO. 6 NOVEMBER 1992 Haggar, J. D. Kelly, W. R. 633 see Cwiakala, R. 553 see Aulet, N. R. Hama, Y. Kemink, R. G. 391 see Asakawa, Y. 791 see Delia, D. J. Hardin, P. W. Knickerbocker, J. U. 877 see Davidson, E. E. 889 see Tummala, R. R. Hatoh, H. Knickerbocker, S. H. 23 see Takano, H. 889 see Tummala, R. R. Hayward, C. E. Komatsu, H. 553 see Aulet, N. R. 391 see Asakawa, Y. Heath, C. D. Koseki, T., T. Fukunaga, H. Yamanaka, and T. Ueki 553 see Aulet, N. R. 43 Color filter for 10.4-in-diagonal 4096-color thin-film- transistor liquid crystal displays Helwig, K. 733 see Dao-Trong, S. Kranik, J. R., J. J. Fulton, L. Su, and S. M. Zimmerman 905 Equipment-related advances in the fabrication of Hemerly, A. S. glass-ceramic/copper/polyimide substrates 347 see Casanova, M. A. Krumn, B. Hemerly, A. S. 859 see Bunce, P. 361 see Guerreiro, R. A. de T. Kuan, T. S., P. E. Batson, R. M. Feenstra, A. J. Slavin, and Herron, L. W. R. M. Tromp 889 see Tummala, R. R. 183 Application of electron and ion beam analysis Houghton, T. F. techniques to microelectronics 845 see Guthrie, W. L. Kumar, M. 990 Unique design concepts in GF11 and their impact on Howard, W. E. 3 Thin-film-transistor/liquid crystal display technology— performance An introduction Kuo, Y. Hsiao, M. Y. 69 Reactive ion etching technology in thin-film-transistor 765 see Chen, C. L. processing Huffman, A. L. Laker, M. M. 553 see Aulet, N. R. 409 see Apté, C. V. Humenik, J. N., J. M. Oberschmidt, L. L. Wu, and Lange, R. C. S. G. Paull 821 see Brown, K. H. 935 Low-inductance decoupling capacitor for the thermal Larsen, T. A. conduction modules of the IBM Enterprise System/9000 processors 593 see Georgiou, C. J. Lasko, K. M. Humenik, J. N. 751 see Ackerman, D. F. 889 see Tummala, R. R. Laux, S. E. Hwang, U. 208 see Lee, W. 791 see Delia, D. J. Lee, W., S. E. Laux, M. V. Fischetti, G. Baccarani, A. Gnudi, J. M. C. Stork, J. A. Mandelman, E. F. Crabbé, Ifill, H. M. R. Wordeman, and F. Odeh 11 see Alt, P. M. 208 Numerical modeling of advanced semiconductor Ing, P. W. devices 791 see Delia, D. J. Levenstein, S. B. 1001 see Bahr, J. E. Jenkins, L. C., R. J. Polastre, R. R. Troutman, and Levine, E. R. L. Wisnieff 59 Functional testing of TFT/LCD arrays 845 see Guthrie, W. L. Lien, A. and R. A. John John, R. A. 51 Lateral field effect in twisted nematic cells J see Lien, A. Liptay, J. S. Jones, H. C. 713 Design of the IBM Enterprise System/9000 high-end 845 see Guthrie, W. L. processor Loizides, E. Kan: J. ©. 535 see Calta, S. A. 791 see Delia, D. J. Karnaugh, M. Mader, S. R. 409 see Apté, C. V. 158 see Fahey, P. M. Kastner, J. K. Malack, J. A. 409 see Apté, C. V. 943 see Boone, L. E. Katopis, G. A. Maling, G. C. 877 see Davidson, E. E. 791 see Delia, D. J. Kellner, B. M. Mandeiman, J. A. 889 see Tummala, R. R. 208 see Lee, W. IBM J. RES. DEVELOP. VOL. 36 NO. 6 NOVEMBER 1992 AUTHOR INDEX Martin, R. F. Patrick, W. J. 791 see Delia, D. J. 845 see Guthrie, W. L. Maruyama, K. Paull, S. G. 391 see Asakawa, Y. 935 see Humenik, J. N. Master, R. N. Pavlik, J. 889 see Tummala, R. R. 943 see Boone, L. E. Mayo, M. D. Perry, C. H. 829 see Barish, A. E. 889 see Tummala, R. R. Mays, E. K. Peterson, G. W. 409 see Apté, C. V. 553 see Aulet, N. R. McCarthy, John Pletat, U. 329 see Wiederhold, Gio 965 see Bollinger, T. McMahon, L. A. Polastre, R. J. 1001 see Bahr, J. E. 59 see Jenkins, L. C. McNamara, T. G. Powell, C. G. 867 see Chiu, K. 11 see Alt, P. M. Mehter, E. A. 845 see Guthrie, W. L. Rao, G. S. 695 see Gibson, D. H. Meltzer, C. B. 647 see Coleman, J. J. Ray, S. K. 921 see Brofman, P. J. Meucci, M. 487 see Di Zenzo, S. Kedmond, T. F. 889 see Tummala, R. R. Mis, J. D. 158 see Fahey, P. M. Rembetski, J. F. 140 see Oehrlein, G. S. Mohler, R. L. 158 see Fahey, P. M. Reyes, J. R. 791 see Delia, D. J. Moran, K. P. 791 see Delia, D. J. Rosa, R. E. 751 see Ackerman, D. F. Moran, K. P. 805 see Goth, G. F. Rubloff, G. W. and D. T. Bordonaro 233 Integrated processing for microelectronics science Mullen, M. P. and technology 751 see Ackerman, D. F. Mullins, T. J. Sachs, M. W. 1001 see Bahr, J. E. 577 see Elliott, J. C. Salimi, B. Nealon, M. G. 593 see Georgiou, C. J. 877 see Davidson, E. E. Schlig, E. S. Neisser, M. O. 83 see Wong, H.-S. 889 see Tummala, R. R. Schmalz, Richard J. Nguyen, T. N. and H. E. Stephanou 655 see Dhondy, Noshir R. 469 Topological reasoning about dextrous grasps Schmidt, R. R. Nicholson, C. N. 791 see Delia, D. J. 958 The controlled experiment in knowledge-acquisition research Slavin, A. J. 183 see Kuan, T. S. Ning, T. H. 821 see Brown, K. H. Slinkman, J. A. 158 see Fahey, P. M. Nufer, R. W. 889 see Tummala, R. R. Smith, R. M., Sr. and P. C. Yeh 683 Integrated Cryptographic Facility of the Enterprise Niise, R. Systems Architecture/390: Design considerations 435 see Wetter, T. Smith, Ronald M., Sr. Oakhill, P. W. 655 see Dhondy, Noshir R. 593 see Georgiou, C. J. Spirito, A. Oberschmidt, J. M. 487 see Di Zenzo, S. 935 see Humenik, J. N. Steinbrecher, R. A. Odeh, F. 791 see Delia, D. J. 208 see Lee, W. Stephanou, H. E. Oehrlein, G. S. and J. F. Rembetski 469 see Nguyen, T. N. 140 Plasma-based dry etching techniques in the silicon Stiffier, S. R. integrated circuit technology 158 see Fahey, P. M. Owens, B. L., Jr. Stigliani, D. J., Jr. 11 see Alt, P. M. 553 see Aulet, N. R. AUTHOR INDEX IBM J. RES. DEVELOP. VOL. 36 NO. 6 NOVEMBER 1992 Stork, J. M. C. Weiner, J. L. 208 see Lee, W. 647 see Coleman, J. J. Strangwayes, R. N. Wetter, T. and R. Niise 535 see Calta, S. A. 435 Use of natural language for knowledge acquisition: Su, L. Strategies to cope with semantic and pragmatic variation 905 see Kranik, J. R. Wiederhold, Gio and John McCarthy Sutton, A. J. 329. = Arthur Samuel: Pioneer in Machine Learning 765 see Chen, C. L. Wile, B. Suzuki, S. 751 see Ackerman, D. F. 23 see Takano, H. Wiltshire, T. J. Svarczkopf, W. A. 835 see Booth, R. M., Jr. 829 see Barish, A. E. Wisnieff, R. L. Swanson, M. D. and C. P. Vignola 59 see Jenkins, L. C. 667 MVS/ESA coupled-systems considerations Wong, H.-S., Y. L. Yao, and E. S. Schlig Takano, H., S. Suzuki, and H. Hatoh 83 TDI charge-coupled devices: Design and applications 23 Cell design of gray-scale thin-film-transistor-driven Wordeman, M. R. liquid crystal displays 208 see Lee, W. Tallman, K. A. Wottreng, A. H. 835 see Booth, R. M.., Jr. 1001 see Bahr, J. E. Tendolkar, N. N. Wa, L. L. 765 see Chen, C. L. 877 see Davidson, E. E. Thomas, Julian Wa, L. L. 655 see Dhondy, Noshir R. 935 see Humenik, J. N. Totta, P. A. 821 see Brown, K. H. Yamanaka, H. Tromp, R. M. 43 see Koseki, T. 183 see Kuan, T. S. Yao, Y. L. Troutman, R. R. 83 see Wong, H.-S. 59 see Jenkins, L. C. Yee, P. L. Tummala, R. R., J. U. Knickerbocker, S. H. Knickerbocker, 835 see Booth, R. M., Jr. L. W. Herron, R. W. Nufer, R. N. Master, M. QO. Neisser, Yeh, P. C. B. M. Kellner, C. H. Perry, J. N. Humenik, and T. F. 683 see Smith, R. M., Sr. Redmond 889 High-performance glass-ceramic/copper multilayer Yeh, Phil substrate with thin-film redistribution 655 see Dhondy, Noshir R. Yudenfriend, H. M. Ueki, T. 633 see Cwiakala, R. 43 see Koseki, T. Valera, E. V. Zimmerman, S. M. 751 see Ackerman, D. F. 905 see Kranik, J. R. Vignola, C. P. Zumbrunnen, M. L. 667 see Swanson, M. D. 805 see Goth, G. F. IBM J. RES. DEVELOP. VOL. 36 NO. 6 NOVEMBER 1992 AUTHOR INDEX Subject index for papers in Volume 36 Each index entry below is accompanied by an author’s name and Bipolar transistors a page number; the author index contains the title of the paper Advancing the state of the art in and the names of coauthors, if any. high-performance logic and array technology Capacitors Low-inductance decoupling capacitor for the thermal conduction Subject Author modules of the IBM Enterprise System/9000 processors Humenik Artificial intelligence An experiment in construciing an open expert system using a Ceramics High-performance glass-ceramic/ knowledge substrate Apté copper multilayer substrate Capturing the deep meaning of texts with thin-film redistribution Tummala through deduction and inference Antonacci Explaining SLDNF resolution with Channels non-normal defaults Casanova Knowledge in operation Bollinger The IBM Enterprise Systems Logic programming with typed Connection (ESCON) Architecture Elliott unification and its realization The IBM Enterprise Systems on an abstract machine Bierle Connection (ESCON) channel— STORK and PENGUIN: Logic A versatile building block Flanagan programming systems using general clauses and defaults Guerreiro Chem-mech planarization The controlled experiment in A four-level VLSI bipolar knowledge-acquisition research Nicholson metallization design with Topological reasoning about dextrous chemical—-mechanical planarization Guthrie grasps Nguyen Use of natural language for Clock (computer) knowledge acquisition: Strategies IBM Enterprise Sysiem/9000 clock to cope with semantic and system: A technology and system pragmatic variation Weiter perspective Zephyr: Toward true compiler-based programming in Prolog Asakawa Clock skew IBM Enterprise System/9000 clock system: A technology and system AS/400 computer perspective Architecture, design, and performance of Application System/400 (AS/400) Clock synchronization multiprocessors Coordination of time-of-day clocks among multiple systems Bipolar logic Clock system design Improved performance of IBM IBM Enterprise System/9000 clock Enterprise System/9000 bipolar system: A technology and system logic chips perspective SUBJECT INDEX IBM J. 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VOL. 36 NO. 6 NOVEMBER 1992 Color images Display technology A gray-scale addressing technique A gray-scale addressing technique for thin-film-transistor/liquid crystal for thin-film-transistor/liquid crystal displays Alt displays Alt Cell design of gray-scale thin-film- Cell design of gray-scale thin-film- transistor-driven liquid crystal transistor-driven liquid crystal displays Takano displays Takano Color filter for 10.4-in.-diagonal Color filter for 10.4-in.-diagonal 4096-color thin-film-transistor 4096-color thin-film-transistor liquid crystal displays Koseki liquid crystal displays Koseki Functional testing of TFT/LCD Computer architecture arrays Jenkins Lateral field effect in twisted nematic Architecture, design, and performance of Application cells Lien System/400 (AS/400) Thin-film-transistor/liquid crystal multiprocessors display technology— Design of the IBM System/390 An introduction Howard computer family for numerically intensive applications: An Electrical connection overview for engineers and Electrical connections to the thermal scientists Gibson conduction modules of the IBM MVS/ESA coupled-systems Enterprise System/9000 water- considerations Swanson cooled processors Brofman Unique design concepts in GF11 and their impact on performance Kumar Electrical design Aspects of the electrical design Computer organization and design and analyses of the printed circuit Design of the IBM Enterprise boards of the IBM Enterprise System/9000 high-end processor System/9000 water-cooled Design of the IBM System/390 processors computer family for numerically intensive applications: An Emitter-coupled logic (ECL) overview for engineers and Improved performance of IBM scientists Gibson Enterprise System/9000 bipolar Fault-tolerance design of the IBM logic chips Barish Enterprise System/9000 Type 9021 processors Chen MVS Dynamic Reconfiguration Enterprise Systems Coordination of time-of-day clocks Management Cwiakala MVS/ESA coupled-systems among multiple systems considerations Swanson Design of the IBM Enterprise Simulation of IBM Enterprise System/9000 high-end processor System/9000 Models 820 and 900 Ackerman Design of the IBM System/390 computer family for numerically intensive applications: An Computer-system availability overview for engineers and Fault-tolerance design of the IBM scientists Gibson Enterprise System/9000 Type 9021 Integrated Cryptographic Facility processors Chen of the Enterprise Systems MVS Dynamic Reconfiguration Architecture/390: Design Management Cwiakala considerations Smith MVS Dynamic Reconfiguration Cryptography Management Cwiakala Integrated Cryptographic Facility MVS/ESA coupled-systems of the Enterprise Systems considerations Swanson Architecture/390: Design Physical and electrical design considerations features of the IBM Enterprise System/9000 circuit module Davidson The IBM Enterprise Systems Data structure and accessing Connection (ESCON) Architecture Elliott MVS Dynamic Reconfiguration The IBM Enterprise Systems Management Connection (ESCON) channel— A versatile building block Flanagan Differential current switch (DCS) The IBM Enterprise Systems Improved performance of IBM Connection (ESCON) Director: Enterprise System/9000 bipolar A dynamic switch for 200Mb/s logic chips Barish fiber optic links Georgiou Dislocation generation ESCON architecture Stress-induced dislecations in silicon The IBM Enterprise Systems integrated circuits Connection (ESCON) Architecture Elliott IBM J. 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VOL. 36 NO. 6 NOVEMBER 1992 SUBJECT INDEX The IBM Enterprise Systems Directory and Trace memory chip Connection (ESCON) channel— with active discharge cell Bunce A versatile building block Flanagan Improved performance of IBM The IBM Enterprise Systems Enterprise System/9000 bipolar Connection (ESCON) Director: logic chips Barish A dynamic switch for 200Mb/s fiber optic links Georgiou Interconnection design A four-level VLSI bipolar Expert systems metallization design with An experiment in constructing an chemical-mechanical planarization open expert system using a knowledge substrate Apté Interconnection processing The controlled experiment in A four-level VLSI bipolar knowledge-acquisition research Nicholson metallization design with chemical-mechanical planarization Guthrie Fault-tolerant power systems Three-loop feedback control of fault- Interconnection technology tolerant power supplies in IBM Enterprise Systems Connection Enterprise System/9000 processors (ESCON) Architecture— System overview Calta Feedback control Fiber Distributed Data Interface Three-loop feedback control of fault- attachment to System/390 Coleman tolerant power supplies in IBM IBM Enterprise Systems multimode Enterprise System/9000 processors fiber optic technology Aulet The IBM Enterprise Systems Fiber optics Connection (ESCON) Director: The IBM Enterprise Systems A dynamic switch for 200Mb/s Connection (ESCON) Architecture Elliott fiber optic links Georgiou The IBM Enterprise Systems Connection (ESCON) Director: Interface analysis A dynamic switch for 200Mb/s Application of electron and fiber optic links Georgiou ion beam analysis techniques to microelectronics Field-effect transistors Reactive ion etching technology in I/O architecture thin-film-transistor processing Kuo MVS Dynamic Reconfiguration Study of the V,, shift of the thin-film Management Cwiakala transistor by the bias temperature stress test Fujimoto Lithography A statistical approach to quality GF11 computer control of non-normal Unique design concepts in GF11 lithographical overlay distributions and their impact on performance Advancing the state of the art in high-performance logic and array Heat transfer technology Dual-tapered-piston (DTP) module cooling for IBM Enterprise Logic System/9000 systems A single-chip IBM System/390 System cooling design for the floating-point processor in CMOS Dao-Trong water-cooled IBM Enterprise Simulation of IBM Enterprise System/9000 processors System/9000 Models 820 and 900 Ackerman Image processing Logic programming TDI charge-coupled devices: Design Capturing the deep meaning of texts and applications Wong through deduction and inference Antonacci Explaining SLDNF resolution with Input/output systems non-normal defaults Casanova The IBM Enterprise Systems Logic programming with typed Connection (ESCON) Architecture Elliott unification and its realization The IBM Enterprise Systems on an abstract machine Beierle Connection (ESCON) channel— STORK and PENGUIN: Logic A versatile building block Flanagan programming systems using general The IBM Enterprise Systems clauses and defaults Guerreiro Connection (ESCON) Director: Zephyr: Toward true compiler-based A dynamic switch for 200Mb/s programming in Prolog Asakawa fiber optic links Georgiou Manufacturing Integrated circuit design Equipment-related advances in the A single-chip IBM System/390 fabrication of glass-ceramic/ floating-point processor in CMOS Dao-Trong copper/polyimide substrates SUBJECT INDEX IBM J. 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VOL. 36 NO. 6 NOVEMBER 1992 Mechanical design Oxidation-induced stress Equipment-related advances in the Stress-induced dislocations in silicon fabrication of glass-ceramic/ integrated circuits copper/polyimide substrates Packaging Microelectronics manufacturing Aspects of the electrical design and Integrated processing for analyses of the printed circuit microelectronics science boards of the IBM Enterprise and technology System/9000 water-cooled processors Module design Electrical connections to the thermal Physical and electrical design conduction modules of the IBM features of the IBM Enterprise Enterprise System/9000 water- System/9000 circuit module Davidson cooled processors Brofman Equipment-related advances in the Module testing fabrication of glass-ceramic/ Functional testing of TFT/LCD copper/polyimide substrates Kranik High-performance glass-ceramic/ arrays Jenkins copper multilayer substrate with thin-film redistribution Tummala Multilevel interconnections A four-level VLSI bipolar Low-inductance decoupling capacitor for the thermal conduction metallization design with modules of the IBM Enterprise chemical-mechanical planarization Guthrie System/9000 processors Humenik Advancing the state of the art in Physical and electrical design high-performance logic and array features of the IBM Enterprise technology Brown System/9000 circuit module Davidson Physical and electrical design features of the IBM Enterprise Parallel processing System/9000 circuit module Davidson Architecture, design, and performance of Application Multiprocessing System/400 (AS/400) Architecture, design, and multiprocessors performance of Application Unique design concepts in GF11 System/400 (AS/400) multiprocessors and their impact on performance Performance measurement and prediction Natural language processing Functional testing of TFT/LCD Capturing the deep meaning of texts through deduction and inference Antonacci arrays Jenkins Simulation of IBM Enterprise Knowledge in operation Bollinger Use of natural language for System/9000 Models 820 and 900 Ackerman knowledge acquisition: Strategies Photodetectors to cope with semantic and pragmatic variation Wetter TDI charge-coupled devices: Design and applications Networks Plasma-based anisotropic etching Fiber Distributed Data Interface attachment to System/390 Coleman Plasma-based dry etching techniques in the silicon integrated circuit Optical transmission technology Oehrlein Enterprise Systems Connection (ESCON) Architecture— Power control system System overview Three-loop feedback control of fault- IBM Enterprise Systems muitimode tolerant power supplies in IBM fiber optic technology Enterprise System/9000 processors Optoelectronic device technology Power supplies Color filter for 10.4-in.-diagonal Three-loop feedback control of fault- 4096-color thin-film-transistor tolerant power supplies in IBM liquid crystal displays Koseki Enterprise System/9000 high-end Lateral field effect in twisted nematic processors cells Lien Thin-film-transistor/liquid crystal Process-induced defects display technology— Application of electron and An introduction Howard ion beam analysis techniques to microelectronics Overlay tolerance A Statistical approach to quality Processor design control of non-normal Design of the IBM Enterprise lithographical overlay distributions System/9000 high-end processor IBM J. 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VOL. 36 NO. 6 NOVEMBER 1992 SUBJECT INDEX Quality control System cooling A statistical approach to quality System cooling design for the control of non-normal water-cooled IBM Enterprise lithographical overlay distributions System/9000 processors Robotics System timing analysis Topological reasoning about dextrous IBM Enterprise System/9000 clock grasps system: A technology and system perspective Semiconductor device modeling Systems architecture and development Numerical modeling of advanced Design of the IBM System/390 semiconductor devices computer family for numerically intensive applications: An Semiconductor device processing overview for engineers and Integrated processing for scientists Gibson microelectronics science and technology Rubloff Thermal conduction Plasma-based dry etching techniques System cooling design for the in the silicon integrated circuit water-cooled IBM Enterprise technology Oehrlein System/9000 processors Semiconductor devices Thermal conduction analysis Application of electron and Dual-tapered-piston (DTP) module ion beam analysis techniques to cooling for IBM Enterprise microelectronics System/9000 systems Numerical modeling of advanced semiconductor devices Lee Thermal conduction module Stress-induced dislocations in silicon Dual-tapered-piston (DTP) module integrated circuits Fahey cooling for IBM Enterprise Study of the V,, shift of the thin-film System/9000 systems transistor by the bias temperature stress test Fujimoto Time-of-day clock Coordination of time-of-day clocks Semiconductor technology among multiple systems A single-chip IBM System/390 floating-point processor in CMOS Dao-Trong Timing relationships Advancing the state of the art in IBM Enterprise System/9000 clock high-performance logic and array system: A technology and system technology Brown perspective Directory and Trace memory chip with active discharge cell Bunce Vector computers Reactive ion etching technology in Design of the IBM System/390 thin-film-transistor processing Kuo computer family for numerically Unique design concepts in GF11 intensive applications: An and their impact on performance Kumar overview for engineers and scientists Gibson Design of the IBM Enterprise Simulation Simulation of IBM Enterprise System/9000 high-end processor Liptay System/9000 Models 820 and 900 Ackerman VLSI A single-chip IBM System/390 Substrates floating-point processor in CMOS Dao-Trong Physical and electrical design features of the IBM Enterprise Water cooling System/9000 circuit module Davidson Dual-tapered-piston (DTP) module cooling for IBM Enterprise Surface analysis System/9000 systems Application of electron and System cooling design for the ion beam analysis techniques to water-cooled IBM Enterprise microelectronics System/9000 processors Switches The IBM Enterprise Systems Connection (ESCON) Director: A dynamic switch for 200Mb/s fiber optic links Georgiou Sysplex timer Coordination of time-of-day clocks among multiple systems Dhondy SUBJECT INDEX IBM J. RES. DEVELOP. VOL. 36 NO. 6 NOVEMBER i992