The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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Author:Dr. Gerard Kelly (auth.)
Language:English
Release year:1999
File size:5.993 MB
Number of page:142
Language:English
Release year:1999
File size:5.993 MB
Number of page:142
Most books are stored in the elastic cloud where traffic is expensive. For this reason, we have a limit on daily download.
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Most books are stored in the elastic cloud where traffic is expensive. For this reason, we have a limit on daily download.
