Table Of Content

Qualcomm Technologies, Inc. WTR4905/WTR4605 Wafer-level RF Transceiver Device Specification 80-NL713-1 Rev. H July 1, 2015 Confidential and Proprietary – Qualcomm Technologies, Inc. © 2014-2015 Qualcomm Technologies, Inc. All rights reserved. NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: [email protected]. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Technologies, Inc. MSM and Qualcomm RF360 are products of Qualcomm Technologies, Inc. Other Qualcomm products referenced herein are products of Qualcomm Technologies, Inc. or its subsidiaries. Questions or comments: https://support.cdmatech.com Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies, Inc. or its affiliated companies without the express approval of Qualcomm Configuration Management. MSM, Qualcomm, and Qualcomm RF360 are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners. This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited. Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego, CA 92121 U.S.A. Revision history Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions. Revision Date Description A February 2014 Initial release B March 2014  Added WTR4605 throughout  Updated stencil in Figure4-1 C August 2014  Section1.1, Documentation overview: Changed 3GPP2 CDMA 1X to DOrA and 3GPP WCDMA Rel 99 to DC-HSPA+  Section1.3, WTR4x05 device features: Removed 3C-HSPA+  Table2-4, Transmitter RF pin descriptions: Moved pin name 4905 = TX_DA3 and 4605 = DNC to pin 12 and renamed pin 7 to TX_DA5  The following content was included in this document for the first time:  Chapter3, Electrical Specifications  Section4.2, Part marking, Section4.3 Device ordering information, Section4.4, Device moisture-sensitivity level, and Section4.5 Thermal characteristics  Chapter5, Carrier, Storage, and Handling Information  Chapter6, PCB Mounting Guidelines  Chapter7, Part Reliability D November 2014  Figure1-1 WTR4x05 device functional block diagram: Updated switch connections  Table1-3 Summary of WTR4x05 device features: Made multiple updates  Table3-4 XO input performance specifications: Updated the minimum value of input amplitude to 1.7 Vpp  Section3.6.3: Updated the title to CDMA (other than DOrB) receiver performance  Section3.6.4 CDMA DOrB receiver performance: Added a section  Table3-13 Tx RMS power detector performance specifications: Updated 1x/DOrA to 1x/DOrA/DOrB for the input RF power range parameter  Table3-16 GNSS receiver performance (with GNSS eLNA): Updated the maximum value of output load capacitance  Table3-17 GNSS receiver performance (without GNSS eLNA): Made multiple updates  Section3.7 RF transmitters: Added DOrB transmitter  Section3.7.2: Updated the title to CDMA (other than DOrB) transmitter performance  Section3.7.3 CDMA DOrB transmitter performance: Added a new section 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 3 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR4905/WTR4605 Wafer-level RF Transceiver Device Specification Revision history Revision Date Description D November 2014  Table3-22 LTE Tx performance specifications: Made multiple updates (cont.) to the table and moved the 4FMOD specification into a new table Table3-23 LTE Tx performance specification for 4FMOD  Table4-2 Device identification code/ordering information details: Added new sample types (and a footnote for WTR4605 ES devices) and a footnote for the RR value  Table7-1 Silicon reliability results and Table7-2 Package reliability results: Updated TBD values and added new information E December 2014  Updated the document title to include WTR4605 and removed Advance Information  Table4-2 Device identification code/ordering information details: Made multiple updates to the table and the table footnotes F February 2015  Figure 4-1 60 WLNSP (3.22 × 3.22 × 0.57 mm) outline drawing: Updated the outline drawing G March 2015  Table3-2 Operating conditions: Changed VDD_RF1_X Max voltage and added explanatory note  Table4-1 WTR4x05 device marking line definitions: Added new vendor to assembly (drop ball) site code  Section7.2 Qualification sample description: Added new vendor to assembly site device characteristics H July 2015  Table3-14 DPD and RF calibration performance specifications (DRx I/Q path): Added (DRX I/Q path) to the title  Table3-15 DPD and RF calibration performance specifications (GNSS I/Q path): Changed title and updated specifications  Table3-22 LTE Tx performance specifications: Updated the rated output power (B13) and LTE Rx band noise (B13) parameters  Table4-2 Device identification code/ordering information details: Added note with code information for CS2 devices 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 4 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1.1 Documentation overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1.2 WTR4x05 device introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1.3 WTR4x05 device features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 1.4 Terms and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.1 I/O parameter definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3 Software-assigned RF ports for different configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.2 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.3 Power-supply sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.4 Digital logic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.5 Support functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.5.1 19.2 MHz XO input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.6 RF receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.6.1 GSM receiver performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.6.2 GSM receiver performance (SAWless) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.6.3 CDMA (other than DOrB) receiver performance . . . . . . . . . . . . . . . . . . . . . . . 32 3.6.4 CDMA DOrB receiver performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.6.5 UMTS receiver performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.6.6 LTE receiver performance (WTR4905 only) . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3.6.7 TD-SCDMA receiver performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 3.6.8 TD-SCDMA receiver performance (SAWless) . . . . . . . . . . . . . . . . . . . . . . . . 42 3.6.9 Tx feedback receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.6.10 GNSS receiver performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.7 RF transmitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.7.1 GSM transmitter performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.7.2 CDMA (other than DOrB) transmitter performance . . . . . . . . . . . . . . . . . . . . . 49 3.7.3 CDMA DOrB transmitter performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 3.7.4 UMTS transmitter performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 5 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR4905/WTR4605 Wafer-level RF Transceiver Device Specification Contents 3.7.5 LTE transmitter performance (WTR4905 only) . . . . . . . . . . . . . . . . . . . . . . . . 54 3.7.6 TD-SCDMA transmitter performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 4 Mechanical information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 4.1 Device physical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 4.2 Part marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 4.2.1 Specification compliant devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 4.2.2 Daisy chain devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 4.3 Device ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 4.3.1 Specification compliant devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 4.3.2 Daisy chain devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 4.4 Device moisture-sensitivity level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 4.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 5 Carrier, storage, and handling information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 5.1 Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 5.1.1 Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 5.2 Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 5.2.1 Bagged storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 5.2.2 Out-of-bag duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 5.3 Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 5.3.1 Baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 5.3.2 Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 5.4 Barcode label and packing for shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 6 PCB mounting guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 6.1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 6.2 SMT parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 6.2.1 Land pad and stencil design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 6.2.2 Keep-out areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 6.2.3 Reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 6.2.4 SMT peak package body temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 6.2.5 SMT process verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 6.3 Daisy-chain components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 6.4 Board-level reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7 Part reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.1 Reliability qualifications summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.2 Qualification sample description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 6 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR4905/WTR4605 Wafer-level RF Transceiver Device Specification Contents Figures Figure1-1 WTR4x05 device functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure2-1 WTR4905 pin assignments – top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure2-2 WTR4605 pin assignments – top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure4-1 60 WLNSP (3.22 × 3.22 × 0.57 mm) outline drawing . . . . . . . . . . . . . . . . . . . . . . . 64 Figure4-2 WTR4x05 device marking (top view, not to scale) . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Figure4-3 Device identification code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Figure5-1 Carrier tape drawing with part orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Figure5-2 Tape handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Figure6-1 Stencil printing aperture area ratio (AR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Figure6-2 Acceptable solder paste geometries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Figure6-3 WTR4x05 device keep-out areas (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Figure6-4 WTR4x05 device keep-out areas (B – top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Figure6-5 QTI typical SMT reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 7 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR4905/WTR4605 Wafer-level RF Transceiver Device Specification Contents Tables Table1-1 Primary WTR4x05 device documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table1-2 Summary of supported air interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table1-3 Summary of WTR4x05 device features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table1-4 Terms and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table2-1 I/O description (pad type) parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table2-2 Receiver RF pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table2-3 Receiver baseband pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table2-4 Transmitter RF pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table2-5 Transmitter baseband pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table2-6 Support functions pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table2-7 DNC pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table2-8 Power pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table2-9 Ground pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table3-1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table3-2 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table3-3 Digital I/O characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table3-4 XO input performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table3-5 GSM Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table3-6 GSM Rx performance specifications (SAWless) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table3-7 CDMA Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table3-8 CDMA DOrB Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table3-9 UMTS Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table3-10 LTE Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table3-11 TD-SCDMA Rx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table3-12 TD-SCDMA Rx performance specifications (SAWless) . . . . . . . . . . . . . . . . . . . . . 42 Table3-13 Tx RMS power detector performance specifications . . . . . . . . . . . . . . . . . . . . . . . . 44 Table3-14 DPD and RF calibration performance specifications (DRx I/Q path) . . . . . . . . . . . . 45 Table3-15 DPD and RF calibration performance specifications (GNSS I/Q path) . . . . . . . . . . 45 Table3-16 GNSS receiver performance (with GNSS eLNA) . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table3-17 GNSS receiver performance (without GNSS eLNA) . . . . . . . . . . . . . . . . . . . . . . . . 46 Table3-18 GSM Tx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Table3-19 CDMA Tx performance specifications (without Tx filter) . . . . . . . . . . . . . . . . . . . . 49 Table3-20 CDMA DOrB performance specifications (without Tx filter) . . . . . . . . . . . . . . . . . 50 Table3-21 UMTS Tx performance specifications (without Tx filter) . . . . . . . . . . . . . . . . . . . . 52 Table3-22 LTE Tx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table3-23 LTE Tx performance specification for 4FMOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table3-24 TD-SCDMA Tx performance specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Table4-1 WTR4x05 device marking line definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table4-2 Device identification code/ordering information details . . . . . . . . . . . . . . . . . . . . . . . 66 Table4-3 Source configuration code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table4-4 MSL ratings summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 8 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION WTR4905/WTR4605 Wafer-level RF Transceiver Device Specification Contents Table6-1 QTI typical SMT reflow profile conditions (for reference only) . . . . . . . . . . . . . . . . 75 Table7-1 Silicon reliability results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table7-2 Package reliability results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 9 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 1 Introduction 1.1 Documentation overview This device specification defines two RF transceivers: the WTR4605 and the WTR4905 devices. Throughout this document, the devices are referred to as the WTR4x05 device when material being presented applies to both of them. The WTR variants are distinguished by the airlink technologies they support:  WTR4605 – 3GPP2 CDMA 1X to DOrA, 3GPP WCDMA Rel 99 to DC-HSPA+, 3GPP GSM to EDGE, and TD-SCDMA  WTR4905 – All airlinks supported by WTR4605, plus 3GPP LTE FDD and TDD Technical information for the WTR4x05 wafer-level transceiver is primarily covered by the documents listed in Table1-1. All documents should be studied for a thorough understanding of the device and its applications. Released WTR4x05 device documents are available from the CDMATech Support website at https://support.cdmatech.com. Table1-1 Primary WTR4x05 device documentation Document Title/description number 80-NL713-1 WTR4905/WTR4605 Wafer-level Transceiver Device Specification (this document) Provides all WTR4x05 device electrical specifications and mechanical information. Additional material includes pin assignments; shipping, storage, and handling instructions; printed circuit boards (PCB) mounting guidelines; and part reliability. This document can be used by company purchasing departments to facilitate procurement. 80-NL713-4 WTR4905/WTR4605 Wafer-level Transceiver Device Revision Guide Provides a history of WTR4x05 device revisions, explains how to identify the various device revisions, and discusses known issues (or bugs) for each revision and how to work around them. 80-NL713-5 WTR4905/WTR4605 RF Transceiver Design Guidelines/Training Slides  Detailed functional and interface descriptions for the WTR4x05 device  Key design guidelines are illustrated and explained, including:  Technology overview  DC power distribution  Interface schematic details  PCB layout guidelines  External component recommendations  Ground and shielding recommendations 80-NL713-1 Rev. H Confidential and Proprietary – Qualcomm Technologies, Inc. 10 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION