Ultra-Fine Particles: Exploratory Science and Technology (Materials Science and Process Technology Series) PDF
Preview Ultra-Fine Particles: Exploratory Science and Technology (Materials Science and Process Technology Series)
ULTRA-FINE PARTICLES Exploratory Science and Technology Edited by Chikara Hayashi ULVAC Japan Ltd. RyoziUyeda Nagoya University, Japan Akira Tasaki University ofTsukuba, Japan NOYES PUBLICATIONS Westwood, NewJersey, U.S.A. Copyright© 1997byNoyesPublications Nopartofthisbookmaybereproducedorutilized inanyform orbyanymeans,electronicor mechanical,includingphotocopying,recordingor byanyinformationstorageandretrievalsystem, withoutpermissioninwritingfromthePublisher. LibraryofCongressCatalogCardNumber:96-12584 ISBN: 0-8155·1404-2 PrintedintheUnitedStates PublishedintheUnitedStatesofAmericaby NoyesPublications 369FairviewAvenue,Westwood,NewJersey07675 1098765432 I LibraryofCongressCataloging-in-PublicationData Ultra-fineparticles:exploratoryscienceandtechnology/editedby ChikaraHayashi, R. Uyeda,A. Tasaki. p. em. Includesbibliographicalreferencesandindex. ISBN0-8155-1404-2 1.Nanoparticles. 2. Nanostructurematerials. 1. Hayashi, Chikara. II. Uyeda,Ryozi. III. Tasaki, A. TA418.78.UI5 1996 620'.43--dc20 96-12584 CIP MATERIALS SCIENCEAND PROCESS TECHNOLOGYSERIES Series Editors Rointan F. Bunshah, University ofCalifornia, LosAngeles GaryE. McGuire, Microelectronics CenterofNorth Carolina Stephen M. Rossnagel, IBM ThomasJ. Watson Research Center Electronic Materials and Process Technology HANDBOOKOFDEPOSITIONTECHNOLOGIESFORFILMSANDCOATINGS, Second Edition: edited byRointan F. Bunshah CHEMICALVAPOR DEPOSITION FOR MICROELECTRONICS: by Arthur Sherman SEMICONDUCTOR MATERIALS AND PROCESS TECHNOLOGY HANDBOOK: edited byGaryE. McGuire HYBRID MICROCIRCUITTECHNOLOGY HANDBOOK: byJames J. Licariand Leonard R. Enlow HANDBOOKOFTHIN FILM DEPOSITION PROCESSESAND TECHNIQUES:edited by Klaus K. Schuegraf IONIZED-CLUSTER BEAM DEPOSITION AND EPITAXY: by Toshinori Takagi DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS: edited byDevendra Gupta and Paul S. Ho HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS: edited by Donald L. Tolliver HANDBOOKOFIONBEAM PROCESSINGTECHNOLOGY:editedbyJeromeJ. Cuomo, Stephen M. Rossnagel, and Harold R. Kaufman CHARACTERIZATIONOFSEMICONDUCTORMATERIALS,Volume1:editedbyGaryE. McGuire HANDBOOKOFPLASMAPROCESSINGTECHNOLOGY:editedbyStephenM.Rossnagel, JeromeJ. Cuomo, and William D. Westwood HANDBOOK OF SEMICONDUCTOR SILICON TECHNOLOGY: edited by William C. O'Mara, Robert B. Herring, and Lee P. Hunt HANDBOOK OF POLYMER COATINGS FOR ELECTRONICS, 2nd Edition: by James Licari and LauraA. Hughes HANDBOOKOFSPUTTERDEPOSITIONTECHNOLOGY:byKiyotakaWasaandShigeru Hayakawa HANDBOOKOFVLSIMICROLITHOGRAPHY:editedbyWilliamB. GlendinningandJohn N. Helbert CHEMISTRYOF SUPERCONDUCTOR MATERIALS: edited byTerrell A. Vanderah CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND TUNGSTEN SII-ICIDES: by JohnE. J. Schmitz ELECTROCHEMISTRY OF SEMICONDUCTORS AND ELECTRONICS: edited byJohn McHardyand Frank Ludwig HANDBOOKOF CHEMICALVAPOR DEPOSITION: by Hugh O. Pierson v Series DIAMOND FILMSAND COATINGS:editedby Robert F. Davis ELECTRODEPOSITION: byJackW. Dinl HANDBOOK OF SEMICONDUCTOR WAFER CLEANING TECHNOLOGY: edited by Werner Kern CONTACTS TO SEMICONDUCTORS: edited by Leonard J. Brillson HANDBOOKOFMULTILEVELMETALLIZATIONFOR INTEGRATEDCIRCUITS:edited bySyd R.Wilson, ClarenceJ.Tracy, and John L. Freeman, Jr. HANDBOOKOF CARBON, GRAPHITE, DIAMONDS AND FULLERENES: by Hugh O. Pierson MOLECULAR BEAM EPITAXY: editedbyRobin F. C. Farrow HANDBOOK OF COMPOUND SEMICONDUCTORS: edited by Paul H. Holloway and GaryE. McGuire HANDBOOKOFVACUUMARC SCIENCEAND TECHNOLOGY: edited byRaymond L. Boxman, PhilipJ. Martin, and David M. Sanders HIGH DENSITY PLASMASOURCES: edited byOleg A. Popov DIAMOND CHEMICALVAPOR DEPOSITION: byHuimin Liuand David S. Dandy HANDBOOK OF MAGNETO-OPTICAL DATA RECORDING: edited by Terry McDaniel and Randall H. Victora HANDBOOKOF REFRACTORYCARBIDESAND NITRIDES: by Hugh O. Pierson ULTRA-FINE PARTICLES: edited byChikara Hayashi, R. Ueda and A. Tasaki Ceramic and Other Materials-Processing and Technology SOL-GEL TECHNOLOGY FOR THIN FILMS, FIBERS, PREFORMS, ELECTRONICS AND SPECIALTYSHAPES: edited byLisa C. Klein FIBER REINFORCED CERAMIC COMPOSITES: edited by K. S. Mazdiyasni ADVANCED CERAMICPROCESSINGANDTECHNOLOGY,Volume1:editedbyJonG. P. Binner FRICTION ANDWEAR TRANSITIONS OFMATERIALS: by PeterJ. Blau SHOCKWAVES FOR INDUSTRIALAPPLICATIONS: edited by Lawrence E. Murr SPECIAL MELTINGAND PROCESSING TECHNOLOGIES: edited byG. K. Bhat CORROSION OF GLASS, CERAMICS AND CERAMIC SUPERCONDUCTORS: edited byDavid E. Clarkand Bruce K. Zoitos HANDBOOKOFINDUSTRIALREFRACTORIESTECHNOLOGY:byStephenC.Carniglia and Gordon L. Barna CERAMIC FILMSAND COATINGS: edited byJohn B. Wachtman and Richard A. Haber CERAMIC CUTTINGTOOLS: editedby E. DowWhitney Related Titles CODE COMPLIANCE FOR ADVANCED TECHNOLOGY FACILITIES: by William R. Acorn SEMICONDUCTOR INDUSTRIAL HYGIENE HANDBOOK: byMichael E. Williams and David G. Baldwin Acknowledgment This book is a translated and revised edition ofthe book "UltraFine Particles" published in Japanese. Dr. Robert Lewis at the Tsukuba Research Consortium corrected and did the prelimi nary editing ofthe entire manuscript and Professor Kanji Ono at International Christian University and University ofCalifornia at Los Angeles provided the first translation into English. The Mita publishinghousegraciouslygavetheauthorsthefreedomtoenable theEnglisheditiontobeavailablefor publication. Ms. ReikoOhya supplied most ofthe clerical service. The authors wish to express their sincere appreciation to them. Our many thanks also to Professor Rointan Bunshah and Mr. George Narita for their patience and continued interest in "Ultra Fine Particles." vii Contributors GenyaChiba Sumio lijima Research Development Corporation NEC Corporation ofJapan Tsukuba, Ibaraki, Japan Kawaguchi, Saitama, Japan Kazuharu Iwasaki Eiji Fuchita RMECompany Vacuum Metallurgical Co., Ltd. Tagajo, Miyagi, Japan Sanbu-gun, Chiba, Japan Akira Johgo ChikaraHayashi Applied Materials Japan, Inc. ULVAC Japan Ltd. Sinjuku-ku, Tokyo, Japan Chigasaki, Kanagawa, Japan Hideo Kakuta ToyoharuHayashi PlantEcochemicalsResearchCenter Mitsui Toatsu Chemicals, Inc. Eniwa, Hokkaido, Japan Yokohama, Kanagawa, Japan Seiichiro Kashu TsukasaHirayama Vacuum Metallurgical Co., Ltd. Japan Fine Ceramics Center Sanbu-gun, Chiba, Japan Nagoya, Aichi, Japan Akio Kato Toshinari Ichihashi Kyushu University NEC Corporation Fukuoka,Fukuoka,Japan Tsukuba, Ibaraki, Japan viii Contributors Michiko Kusunoki Akira Tasaki JapanFineCeramics Center InstituteofApplied Physics ~agoya,AUchi, Japan UniversityofTsukuba Tsukuba, Ibaraki, Japan Takeshi Manabe TeisanK.K. Hideki Toyotama Tsukuba, Ibaraki, Japan StanleyElectric Co., Lid. Tsukuba, Ibaraki, Japan Tadashi Matsunaga TokyoUniversityofAgricultureand Shunichi Tsuge Technology Tsukuba, Ibaraki, Japan Koganei, Tokyo, Japan Akifumi Ueno Hiroshi Miyamoto Shizuoka University CellularBiophysics Laboratory Hamamatsu, Shizuoka, Japan ~ationalInstituteofBioscience& HumanTechnology Shizuo Umemura Tsukuba, Ibaraki, Japan MiyanodaiTechnologyDevelopment Center Iku Nemoto Fuji PhotoFilm Co., Ltd. TokyoDenki University Ashigarakami-gun, Kanagawa, Hatoyama, Saitama, Japan Japan Masaaki Oda Ryozi Uyeda VacuumMetallurgical Co., Ltd. Nagoya University Sanbu-gun, Chiba, Japan Nagoya, Aichi, Japan Norio Saegusa Nobuhiko Wada Surnitomo3MLtd. Nagoya University Setagaya-ku, Tokyo, Japan Nagoya, AUchi, Japan Yasukazu Saito Toyonobu Yoshida ScienceUniversity ofTokyo TheUniversity ofTokyo Shinjuku-ku, Tokyo, Japan Bunkyo-ku' Tokyo, Japan Shigetoshi Takahashi Akinori Yoshizawa Nisshin, Aichi, Japan YoshizawaIndustry Inc. ~agaoka, Niigata, Japan ix
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