Table Of Content

ELSEVIER Thin Solid Films 308—309 (1997) 643-645 Author Index of Volumes 308—309 Adams, D., 448 Cale, T.S., 533, 615 Drévillon, B., 63 Hillman, J.T., 589, 615 Adams, J.A., 538 Cameron, D.C., 130, 607 Dun, J., 543 Hilton, M.R., 369 Ade, H., 627 Carreno, M.N.P., 219 Hintermann, H., 430 Adler, J., 529 Carruthers, R., 443 Elkind, A., 233 Hiraki, A., 279 Affinito, J.D., 19 Catletge, A., 209 Erickson, L., 580 Hoffmann, F., 363 Ager III, J.W., 186 Cattani, M., 215 Erkens, G., 315 Holland, K., 533, 538 Agius, B., 63 Cestone, V.C., 420 Eufinger, S., 19 Hong, J.-K., 490, 495 Ahn, J.-G., 585 Chan, H.L., 406 Eun, K.Y., 263 Hsu, J.-C., 74 Aldinger, F., 101 Chandrasekhar, D., 358 Exarhos, G.J., 42 Hsu, S.T., 570, 575 Alford, T.L., 410, 448 Chang, C.Y., 501, 594 Exarhos, G.J., 56 Hu, C-K., 443 Amamoto, Y., 249 Chang, S.J., 501 Hu, J., 589, 594 Ameen, M., 589 Chang, S.-T., 550 Falk, S.W., 562 ri, ¥ .Z.., 3a2 Anders, S., 186 Chang, T.C., 501, 518, 594 Feng, M.-S., 543, 550 Huang, J., 507 Asomoza, R., 228 Chang, Y.F., 621 Feng, M.S., 621 Huang, W.-H., 85 Cheah, L.K., 199, 268 Findeling-Dufour, C., 17 Hugon, M.C., 63 Chen, C.-F., 85 Flynn, D.I., 199, 268 Hultman, L., 223 Baca, A.G., 599 Chen, L.J., 518, 594 Forder, S.D., 351 Hunter, A.T., 358 Baker, S.P., 289 Chen, M.C., 518 Forouhi, A.R., 284 Hwan Bae, J., 135 Barnard, J.A., 340 Chen, M.S.K., 501 Foster, R.F., 615 Hwang, H., 585 Barradas, N.P., 130 Chen, T.-M., 126 Francz, G., 191 Hyun, S.-H., 490 Barton, D., 31 Chen, Y.J., 415 Fukada, E., 475 Beaudoin, S.P., 533 Cheng, S.F., 555 Fukarek, W., 38 lijima, M., 90, 475 Beghi, M.G., 107 Cheong, B.-k., 135 Islam, M.S., 607 Bell, J.M., 304 Cheung, D., 507 Gaona-Couto, A., 228 Ito, T., 279 Bertrand, N., 63 Cheung, W.Y., 415 Geist, D.E., 393 Ivanov, I., 223 Bhan, M.K., 507 Chitty, J., 430 Gicquel, A., 178 Bhushan, B., 323 Cho, N.-I., 465 Gignac, L., 443 Jamting, A.K., 304 Bibby, T.F.A., 512, 533, 538 Cho, S.-J., 263 Gilvarry, J., 130 Jacob, W., 195 Bilek, M.M.M., 79 Choi, S.-Y., 490, 495 Girsova, N.V., 393 Jankowski, A.F., 94 Bill, J., 101 Chou, K.-S., 543 Glesener, J.W., 204 Jedema, F.J., 627 Birchler, F., 191 Chou, S., 501 Godbey, D., 470, 486 Jiang, N., 279 Blawit, C., 345 Chow, T.P., 555 Goel, A., 173 Jin, Z., 279 Bloomer, I., 284 Chowdhury, A.K.M.S., 130 Gonzalez, G., 228 Jo, M.-H., 490, 495 Bottani, C.E., 107 Chung, Y.-W., 113 Graff, G.L., 19 Jonnalagadda, R., 615 Bottecchia, J.P., 219 Cinibulk, M.K., 389 Gross, M.E., 19 Julia-Schmutz, C., 297 Bouzakis, K.-D., 315 Clissold, R., 329 Gutmann, R.J., 523, 555 Branco, J.R.T., 436 Corat, E.J., 254 Gwang Kim, S., 135 Kakumu, T., 13 Briggs, R.D., 599 Coulthard, I., 580 Kalmukov, A., 233 Bright, V.M., 8 Croke, E.T., 358 Haque, M.S., 68, 141 Kaltofen, R., 118 Broitman, E., 223 Cummings, J.J., 562 Harriss, J., 460 Kang, M.-G., 634 Brooks, J.S., 351 Harwood, R., 512 Kapat, J.S., 209 Broussard, P.R., 420 Daryanani, S., 562 Hashmi, M.S.J., 130 Karimi, A., 334 Brown, I.G., 186, 215, 258 Das, S.R., 580 Hatta, A., 279 Kester, D., 173 Brown, W.D., 141, 68 Dautzenberg, J.H., 310 Hauert, R., 191 Khan, M., 1 Browning, V.M., 420 Davidson, J.L., 351 Hay, R.S., 389 Khan, M.A., 141 Buckley, L., 470, 486 de Souza, T.M., 254 Hayashi, T., 239 Kim, J.-J., 490 Bulkin, P., 63 Delmotte, F., 63 Hayashi, Y., 163 Kim, M.-G., 263 Bussmann, K., 555 Diefendorf, R.J., 460 Hayes, J.P., 94 Kim, W.M., 135 Byun, J.S., 585 Downey, D.F., 562 Hellgren, N., 223 Kliimper-Westkamp, H., 363 0257-8972/97/$17.00 © 1997 Elsevier Science S.A. All rights reserved PII $0040-6090(97)00811-0 644 Author Index of Volumes 308—309 Klimes, W., 455 McNally, P.J., 607 Qian, W.-D., 113 Sun, Z., 159 Kohzaki, M., 239 Mehner, A., 363 Quaeyhaegens, C., 154 Sundgren, J.-E., 223 Kolesar, E.S., 8 Mei, Y.J., 501, 594 Suzuki, M., 245 Kolitsch, A., 38 Méndez, J.M., 228 Rabinovich, Y., 529 Swain, M.V., 304 Konov, V.I., 168 Mergui, S., 611 Rajan, K., 529 Swain, M.V., 329 Konyashin, I., 101 Merkulov, A., 228 Ralchenko, V.G., 168 Korenev, S.A., 233 Milne, W.I., 79 Randall, N.X., 297 Tailashev, A.S., 393 Kozlov, E.V., 393 Minami, T., 13 Reeves, M.E., 420 Takahashi, Y., 90, 475 Kraatz, P., 375 Ming Chang, R., 273 Ren, F., 599 Takata, S., 13 Krulik, G.A., 538 Miotello, A., 107 Richardson, T., 50 Takeda, Y., 13 Kruml, T., 334 Moller, W., 38 Rodil, S., 228 Takeuchi, S., 245 Kruse, O., 38 Monclus, M., 130 Rogers, B.R., 615 Tay, B.K., 159, 199, 268 Kulkarni, A.K., | Monteiro, O.R., 215 Rose, A., 42, 56 Ting, A., 594 Kumar, A., 209, 406 Morrish, A.A., 204 Rostaing, J.C., 63 Tonshoff, H.K., 345 Kuo, C.-T., 126, 273 Moudgil, B.M., 529 Rubin, M., 50 Tran, M.D., 310 Kuper, A., 329 Muhl, S., 228 Ryabchikov, A.I., 393 Trava-Airoldi, V.J., 254 Miiller, U., 191 Tsai, M.S., 518, 550 Larsson, M., 351 Miinz, W.-D., 351 Sa, S.-H., 634 Tseng, W.-T, 518, 550, 621 Laursen, T., 358, 410, 448 Murakawa, M., 245 Sakagami, S., 249 Tsui, T.Y., 186 Le Huu, T., 147 Muramatsu, M., 239 Salvadori, M.C., 215, 258 Tuan, A., 501 Lee, C.-C., 74 Murarka, S.P., 523 Sanderson, L., 406 Lee, K.-N., 585 Murphy, M.J., 130 Sato, M., 90, 475 Ukishima, S., 475 Lee, K.-R., 263 Schiilke, T., 455 Ullrich, B.M., 410 Lee, K.Y., 443 Naftel, S.J., 580 Scharf, T.W., 340 Ulrich, B., 570 Lee, S., 135 Nakamura, Y., 249 Schey, D., 512 Urban III, F.K., 31 Lee, T.H., 375 Naseem, H.A., 68, 141 Schmidt, P.E., 611 Lee, Y.-J., 585 Nemanich, R.J., 627 Schroeder, A., 191 Vandevelde, T., 154 Lei, R., 173 Nesladek, M., 154 Schultrich, B., 455 Venkatraman, C., 173 Leite, N.F., 254 Neuman, G.A., 26 Schulz, K.H., 1 Vidakis, N., 315 Leusink, G., 589 Nishino, S., 163 Schwarzer, N., 304 Vlasov, I.I., 168 Leyendecker, T., 315 Schwarz-Selinger, T., 195 Vohra, Y., 209 Li, E., 284 Obraztsova, E.D., 168 Scott, W.W., 323 von Keudell, A., 195 Li, G.G., 284 Oh, K.-H., 634 Sebald, T., 118 von Rottkay, K., 50 Li, X., 163 Oh, S.-g., 135 Seidel, F., 425 von Stebut, J., 297 Lim, T.-S., 1 Osburn, C.M., 562 Seong, T.-Y., 263 Lin, C.F., 621 Osofsky, M.S., 420 Sham, T.K., 580 Wéiss, Z., 382 Lin, C.R., 273 Ossi, P.M., 107 Sharkeev, Y.P., 393 Walck, S.D., 399 Lin, H.B., 204 Outten, C., 173 Shi, X., 159, 199, 268 Wang, C., 279 Lin, J.-H., 74 Ozer, N., 50 Shojaei, O.R., 334 Wang, D., 533 Liu, C., 518, 543, 550 Siemroth, P., 455 Wang, M.T., 518 Liu, Y., 460 Pan, F.M., 501, 594 Simpson, J.O., 480 Wang, X., 159 Loeffler, J., 101 Parikh, P., 538 Singh, R., 460, 529 Wang, Y.-L., 543, 550 Lu, T.-R., 126 Park, D.I., 465 Sj6strém, H., 223 Wang, Y.-Y., 113 Park, H.-H., 490, 495, 634 Skelton, E.F., 420 Watanabe, Y., 249 Maa, J.-S., 570, 575 Park, S.J., 135 Smith, D.J., 358 Webb, D., 589 Mahadev, V., 615 Paulmier, D., 147 Smolin, A.A., 168 Wei, D.T., 74 Mahajan, U., 529 Pearton, S.J., 599 Snow, A.W., 470 Weil, L., 375 Makowiecki, D.M., 94 Peng, C.-H., 570, 575 Soro, J.M., 297 Weimer, J.J., 406 Malshe, A.P., 141 Pereyra, I., 219 Soto, R., 611 Weise, G., 118 Mammaana, V., 215, 258 Perry, A.l., 233, 393 Sowders, D.M., 8 Welch, J.R., 389 Mangiaracina, A., 209 Pertuz, A., 430 Sproul, W.D., 113 Wen-Jui Chia, R., 284 Marshall, K., 382 Pharr, G.M., 186 Srinivasa-Murthy, C., 533 Wenke, R., 315 Martin, J.L., 334 Poole, K.F., 460 Staia, M.H., 430 Wenzel, Ch., 455 Martin, P.J., 329 Poublan, J., 310 St.Clair, A.K., 480 Wilson, I.H., 415 Martin, P.M., 19 Presser, N., 369 Stals, L., 154 Windisch Jr, C.F., 56 Matsumuro, A., 239 Price, D.T., 523 Starling, C.M.D., 436 Wintermantel, E., 191 Mayer, J., 191, 358, 448 Prinz, G.A., 555 Stewart-Davis, R.L., 26 Won, J., 279 Mayr, P., 363, 425 Prusseit, W., 420 Stock, H.-R., 425 Wong, M.-S., 113 McCaffrey, J.P., 399 Puchi, E.S., 430 Sugi, S., 284 Wong, S.P., 415 McKernan, M.A., 94 Purdy, A.P., 470, 486 Suh, K.-S., 634 Wu, M.-L., 113 McKinley, K., 512 Qadri, S.B., 420 Sun, Y., 159 Wu, W.F., 594 Author Index of Volumes 308—309 Xing, K.Z., 223 Yang, D., 615 Zacharie, G., 297 Zolper, J.C., 599 Xu, D.-X., 580 Yang, H.-S., 495 Zaidi, H., 147 Zou, G., 279 Xu, J.B., 415 Yang, W., 627 Zeng, Y., 410 Zou, Y.L., 410 Yang, Y.L., 594 Zheng, W.T., 223 Yamaguchi, K., 239 You, Q., 209 Zhu, H., 284 Chin fins” ELSEVIER Thin Solid Films 308-309 (1997) 646-656 Subject Index of Volumes 308—309 ABS™ Microstructures of copper thin films prepared by chemical A Mossbauer spectroscopy study of Ti—Fe interfaces produced vapor deposition, 465 by the PVD process, 351 a-C:H:F B* ion implants Surface analysis and bioreactions of F and Si containing a- Dose-rate effects on the formation of ultra-shallow junctions C:H, 191 with low-energy B* and BF," ion implants, 562 Adhesion Barrier Nanotribology of ultrathin a:SiC/SiC-N overcoats using a Electrical properties of Ti/TiN films prepared by chemical depth sensing nanoindentation multiple sliding technique, vapor deposition and their applications in submicron struc- 340 tures as contact and barrier materials, 589 Auger depth profiles and stud pull adhesion of metal films on Benzotriazole graphite-epoxy composites, 375 Effects of corrosion environments on the surface finishing of Adhesion testing copper chemical mechanical polishing, 518 A comparative assessment of three approaches for ranking the BF,” ion implants adhesion of TiN coatings onto two steels, 329 Dose-rate effects on the formation of ultra-shallow junctions Ag films with low-energy B* and BF," ion implants, 562 Titanium-nitride self-encapsulation of Cu and Ag films on Bias-enhanced nucleation silicon dioxide, 448 An improved method for large-area oriented nucleation of dia- Alloys mond during bias process via hot-filament chemical vapor A survey of ohmic contacts to III-V compound semiconduc- deposition, 163 tors, 599 Biaxial bending Aluminum films Investigation of the elastic modulus of thin films using simple Some effects of temperature ramping on metal organic chemi- biaxial bending techniques, 304 cal vapor deposited Al film nucleation, 615 Bioreaction Aluminum nitride Surface analysis and bioreactions of F and Si containing a- Structural characterization of pulsed laser-deposited AIN thin C:H, 191 films on semiconductor substrates, 406 Boron Amorphous Formation of cubic boron nitride by the reactive sputter Electronic properties and impurity levels in filtered cathodic deposition of boron, 94 vacuum arc (FCVA) amorphous silicon, 79 Investigation of distribution of defects and impurities in boron- Amorphous carbon doped CVD diamond film by cathodoluminescence spectro- Surface analysis and bioreactions of F and Si containing a- scopy, 279 C:H, 191 Boron nitride Amorphous CN film Investigations on the structure of boron nitride films, 38 Optical and mechanical properties of amorphous CN films, 135 Low temperature plasma enhanced chemical vapour deposition Amorphous silicon boron nitride, 219 Reaction of amorphous Si with cobalt silicide before disilicide Boron nitride films formation for reducing Si consumption in SIMOX, 570 Formation of cubic boron nitride by the reactive sputter Annealing deposition of boron, 94 Post-deposition processing of low temperature PECVD silicon Buffer layers dioxide films for enhanced stress stability, 68v Evaluation of buffer layers for hot filament chemical vapor Atomic force microscopy deposition diamond films on silicon substrates, 209 Surface interaction forces in chemical-mechanical planariza- Bulge test tion, 529 Characterisation of TiN thin films using the bulge test and the Auger electron spectroscopy nanoindentation technique, 334 Vibrational spectroscopy of mixed hexagonal-cubic boron nitride thin films, 107 Carbon nitride Auger depth profiles and stud pull adhesion of metal films on Preparation of a novel target material for carbon nitride film graphite-epoxy composites, 375 deposition, 126 0257-8972/97/$17.00 © 1997 Elsevier Science S.A. All rights reserved PII S$0040-6090(97)00812-2 Subject Index of Volumes 308—309 Carbon nitride films Chemical-mechanical planarization Deposition of carbon nitride films by vacuum ion diode with Surface interaction forces in chemical-mechanical planariza- explosive emission, 233 tion, 529 Carbon nitride sputtering Chemical-mechanical polishing Low-energy ion bombardment effects in reactive rf magnetron Effects of underlying films on the chemical-mechanical polish- sputtering of carbon nitride films, 118 ing for shallow trench isolation technology, 543 Production and characterisation of carbon nitride thin films Chemical-mechanical polishing of low-dielectric-constant produced by a graphite hollow cathode system, 228 spin-on-glasses: film chemistries, slurry formulation and Carbon nitride thin films polish selectivity, 550 Preparation of carbon nitride thin films by ion beam assisted Chemical-mechanical polishing as an enabling technology for deposition and their mechanical properties, 239 giant magnetoresistance devices, 555 Cartesian coordinate maps Cleaved diamond fibers Cartesian coordinate maps for chemical mechanical planariza- Field emission from cleaved diamond fibers, 204 tion uniformity characterization, 512 CN, films Cathodic arc deposition The composition and bonding structure of CN, films and their Heat treatment of cathodic arc deposited amorphous hard car- influence on the mechanical properties, 130 bon films, 186 Reactive magnetron sputtering of CN, thin films at different Metallization of CVD diamond films by cathodic arc deposi- substrate bias, 223 tion, 215 Optical characterization of nitrogenated carbon overcoats, Cathodoluminescence 284 Investigation of distribution of defects and impurities in boron- Coating adhesion doped CVD diamond film by cathodoluminescence spectro- Influence of surface integrity on performance of coated cutting scopy, 279 tools, 345 CEMS Coatings A MOssbauer spectroscopy study of Ti—Fe interfaces produced Influence of surface integrity on performance of coated cutting by the PVD process, 351 tools, 345 Cermet TEM specimen preparation and characterization of ceramic Influence of surface integrity on performance of coated cutting coatings on fiber tows, 389 tools, 345 Thermal fatigue of hot work tool steel with hard coatings, 436 Characterization Cobalt silicide Spectroscopic characterization of processing-induced property Reaction of amorphous Si with cobalt silicide before disilicide changes in doped ZnO films, 56 formation for reducing Si consumption in SIMOX, 570 TEM specimen preparation and characterization of ceramic Edge leakage of cobalt silicided shallow junctions, 575 coatings on fiber tows, 389 Color The small angle cleavage technique applied to coatings and The use of experimental design techniques to meet reflected thin films, 399 color targets in pyrolytic low emissivity coatings, 26 Chemical mechanical planarization Combustion flame method Cartesian coordinate maps for chemical mechanical planariza- About the growth of diamond crystals obtained by the combus- tion uniformity characterization, 512 tion-flame method: use for coatings on large area sub- CMP CoO reduction: slurry reprocessing, 538 strates, 147 Chemical mechanical polishing Improving thickness uniformity of freestanding diamond Effects of corrosion environments on the surface finishing of sheets synthesized by the combustion flame method, 245 copper chemical mechanical polishing, 518 Contact materials Stress distribution in chemical mechanical polishing, 533 A survey of ohmic contacts to III-V compound semiconduc- Chemical vapor deposition tors, 599 Plasma enhanced chemical vapour deposition of silica thin Contact resistivity films in an integrated distributed electron cyclotron reso- Chemical-mechanical polishing as an enabling technology for nance reactor, 63 giant magnetoresistance devices, 555 High pressure high power microwave plasma chemical vapor Copper deposition of large area diamond films, 141 The dissolution of copper in common solvents used for low Optical emission spectroscopy of the plasma during micro- dielectric polymers, 486 wave CVD of diamond thin films with nitrogen addition Effects of corrosion environments on the surface finishing of and relation to the thin film morphology, 154 copper chemical mechanical polishing, 518 Production and characterisation of carbon nitride thin films Damascene copper interconnects with polymer ILDs, 523 produced by a graphite hollow cathode system, 228 Copper thin films Microstructures of copper thin films prepared by chemical Microstructures of copper thin films prepared by chemical vapor deposition, 465 vapor deposition, 465 Electrical properties of Ti/TiN films prepared by chemical Corrosion vapor deposition and their applications in submicron struc- Effects of corrosion environments on the surface finishing of tures as contact and barrier materials, 589 copper chemical mechanical polishing, 518 648 Subject Index of Volumes 308-309 Corrosion-fatigue properties concept in interlayer deposition to enhance diamond film Influence of electroless Ni-P deposits on the corrosion-fatigue adherence, 273 properties of an AISI 1045 steel, 430 Diamond growth Cross-sectional TEM Studies on CVD-diamond on Ti6Al4V alloy surface using hot The small angle cleavage technique applied to coatings and filament assisted technique, 254 thin films, 399 Diamond like carbon Crystalline Surface relaxation during plasma chemical vapor deposition of Structural characterization of pulsed laser-deposited AIN thin diamond-like carbon films, investigated by in-situ ellipso- films on semiconductor substrates, 406 metry, 195 Crystallite size Structural dependence of mechanical properties of Si incorpo- Crystallization and residual stress formation of sol-gel-derived rated diamond-like carbon films deposited by RF plasma- zirconia films, 363 assisted chemical vapour deposition, 263 Cu diffusion Diamond-like nanocomposite films Copper diffusion in organic polymer resists and inter-level Electrical properties of diamond-like nanocomposite coatings, dielectrics, 470 173 Cu films Diamond sheets Titanium-nitride self-encapsulation of Cu and Ag films on Improving thickness uniformity of freestanding diamond silicon dioxide, 448v sheets synthesized by the combustion flame method, 245 Cu lines Disilicide formation Electromigration in 0.25 wm wide Cu line on W, 443 Reaction of amorphous Si with cobalt silicide before disilicide Cubic boron nitride formation for reducing Si consumption in SIMOX, 570 Vibrational spectroscopy of mixed hexagonal-cubic boron Disk coatings nitride thin films, 107 Optical characterization of nitrogenated carbon overcoats, Cubic boron nitride coatings 284 A novel approach to deposition of cubic boron nitride coatings, Disordered Ni3Fe 101 Modification of a disordered Ni3Fe alloy surface by 50 keV Zr CVD diamond films ion implantation, 393 Analysis of intrinsic stress distribution in grains of high quality Dispersive strengthening CVD diamond film by micro-Raman spectroscopy, 168 Application of heat treatment and dispersive strengthening Metallization of CVD diamond films by cathodic arc deposi- concept in interlayer deposition to enhance diamond film tion, 215 adherence, 273 Investigation of distribution of defects and impurities in boron- Dissolution doped CVD diamond film by cathodoluminescence spectro- The dissolution of copper in common solvents used for low scopy, 279 dielectric polymers, 486 Doped ZnO films Damascene Spectroscopic characterization of processing-induced property Damascene copper interconnects with polymer ILDs, 523 changes in doped ZnO films, 56 Deposition rate Dual ion-beam sputtering Morphology of dual beam ion sputtered films investigated by Morphology of dual beam ion sputtered films investigated by atomic force microscopy, 74 atomic force microscopy, 74 Depth profile Elemental depth profiling of coated and surface-modified Edge emission materials by GD-OES: hard coatings on cutting tools, 382 Investigation of distribution of defects and impurities in boron- Diamond doped CVD diamond film by cathodoluminescence spectro- Fabrication and characterization of spherical polycrystalline scopy, 279 diamond emitter arrays, 85 Edge leakage Study for fabricating large area diamond single-crystal layers, Edge leakage of cobalt silicided shallow junctions, 575 178 Effective medium approximation Diamond crystal Analysis of binary electrochromic tungsten oxides with effec- About the growth of diamond crystals obtained by the combus- tive medium theory, 50 tion-flame method: use for coatings on large area sub- Elastic modulus strates, 147 Investigation of the elastic modulus of thin films using simple Growth of flake-like diamond crystal using polymer precursor, biaxial bending techniques, 304 159 Elastic recoil detection Diamond films Investigations on the structure of boron nitride films, 38 High pressure high power microwave plasma chemical vapor Electrical properties deposition of large area diamond films, 141 Electrical properties of diamond-like nanocomposite coatings, Evaluation of buffer layers for hot filament chemical vapor 173 deposition diamond films on silicon substrates, 209 Electrical resistance Measurement of internal stresses in CVD diamond films, 249 Characterization of Al-1 wt% Y thin films for VLSI intercon- Application of heat treatment and dispersive strengthening nects, 460 Subject Index of Volumes 308—309 649 Electrochromic vanadium tungsten oxide Flakes Analysis of binary electrochromic tungsten oxides with effec- Growth of flake-like diamond crystal using polymer precursor, tive medium theory, 50 159 Electroless nickel deposits Fluorine dope oxide Influence of electroless Ni-P deposits on the corrosion-fatigue Stabilizing dielectric constant of fluorine-doped SiO, film by properties of an AISI 1045 steel, 430 NO and NH; plasma post-treatment, 501 Electromigration Fluorine doped silicon dioxide films Electromigration in 0.25 wm wide Cu line on W, 443 Deposition of stable, low x and high deposition rate SiF,-doped Electron beam TEOS fluorinated silicon dioxide (SiOF) films, 507 PML/oxide/PML barrier layer performance differences arising Focused ion beam from use of UV or electron beam polymerization of the Applications of focused ion beam machining to the character- PML layers, 19 ization of carbide, nitride and oxide films, 369 Electronic properties Fourier transform infrared spectroscopy Electrical and mechanical properties of MgO thin films on Low temperature plasma enhanced chemical vapour deposition GaAs, 611 boron nitride, 219 Ellipsometry Friction Sensitivity of variable angle spectroscopic ellipsometry to iso- Bending stiffness measurements of magnetic tapes and sub- tropic thin film properties, 31 strates, 323 Investigations on the structure of boron nitride films, 38 Friction coefficient Ellipsometric studies of thermally induced transformation phe- Preparation of carbon nitride thin films by ion beam assisted nomena in oxide films, 42 deposition and their mechanical properties, 239 Emission Elemental depth profiling of coated and surface-modified GaAs materials by GD-OES: hard coatings on cutting tools, 382 Electrical and mechanical properties of MgO thin films on Emission current GaAs, 611 Fabrication and characterization of spherical polycrystalline GaAs etching diamond emitter arrays, 85 The characterization of etched GaAs surface with HCl or Encapsulation H3PQO, solutions, 634 Titanium-nitride self-encapsulation of Cu and Ag films on sili- Giant magnetoresistance con dioxide, 448 Chemical-mechanical polishing as an enabling technology for Experimental design giant magnetoresistance devices, 555 The use of experimental design techniques to meet reflected Glow discharge color targets in pyrolytic low emissivity coatings, 26 Elemental depth profiling of coated and surface-modified Explosive emission materials by GD-OES: hard coatings on cutting tools, Deposition of carbon nitride films by vacuum ion diode with 382 explosive emission, 233 Glow discharge optical spectroscopy Glow discharge optical spectroscopy depth profiles of ion Fatigue behavior implanted steel, titanium and titanium nitride coatings, Determination of the fatigue properties of multilayer PVD 425 coatings on various substrates, based on the impact test Grain orientation and its FEM simulation, 315 Electrical, optical and structural characteristics of indium-tin- Fibers oxide thin films deposited on glass and polymer substrates, TEM specimen preparation and characterization of ceramic l coatings on fiber tows, 389 Graphite-epoxy Field emission Auger depth profiles and stud pull adhesion of metal films on Field emission from cleaved diamond fibers, 204 graphite-epoxy composites, 375 Field emitter array Growth conditions Fabrication and characterization of spherical polycrystalline Growth conditions and properties of tetrahedral amorphous diamond emitter arrays, 85 carbon films, 199 Film deposition parameters Spectroscopic characterization of processing-induced property Hard carbon films changes in doped ZnO films, 56 Heat treatment of cathodic arc deposited amorphous hard car- Film hardness bon films, 186 Preparation of carbon nitride thin films by ion beam assisted Hardness deposition and their mechanical properties, 239 Superhard coatings of CN,/ZrN multilayers prepared by DC Film thickness magnetron sputtering, 113 Crystallization and residual stress formation of sol-gel-derived Structural characterization of pulsed laser-deposited AIN thin zirconia films, 363 films on semiconductor substrates, 406 Filtered cathodic vacuum arc HCI/H3PO, Growth conditions and properties of tetrahedral amorphous The characterization of etched GaAs surface with HCl or carbon films, 199 H3PO, solutions, 634 650 Subject Index of Volumes 308-309 Heat treatment Interconnect material Application of heat treatment and dispersive strengthening Characterization of Al-1 wt% Y thin films for VLSI intercon- concept in interlayer deposition to enhance diamond film nects, 460 adherence, 273 Damascene copper interconnects with polymer ILDs, 523 Hexagonal BN Interlayer Low temperature plasma enhanced chemical vapour deposition Application of heat treatment and dispersive strengthening boron nitride, 219 concept in interlayer deposition to enhance diamond film High power adherence, 273 High pressure high power microwave plasma chemical vapor Inter-metal dielectric structures deposition of large area diamond films, 141 Improved ozone-tetraethoxysilane oxide reliability for deep High pressure submicron inter-metal dielectric applications by deposition High pressure high power microwave plasma chemical vapor of a silane-based oxide underlayer, 621 deposition of large area diamond films, 141 Intermetal dielectric High temperature BPSG annealing Deposition of stable, low x and high deposition rate SiF4-doped The effects of screen oxide and low temperature BPSG anneal TEOS fluorinated silicon dioxide (SiOF) films, 507 on titanium salicide formation, 585 Intermetal dielectrics Hollow cathode Application of SiO, aerogel film with low dielectric constant to An improved method for large-area oriented nucleation of dia- intermetal dielectrics, 490 mond during bias process via hot-filament chemical vapor Internal stresses deposition, 163 Measurement of internal stresses in CVD diamond films, 249 Homoepitaxy Ion assisted beam deposition Study for fabricating large area diamond single-crystal layers, Preparation of carbon nitride thin films by ion beam assisted 178 deposition and their mechanical properties, 239 Hot filament assisted technique Ion beam analysis Studies on CVD-diamond on Ti6Al4V alloy surface using hot Materials characterization of Si,;_,-,Ge,C,/Si superlattice filament assisted technique, 254 structures, 358 Hot filament chemical vapor deposition Ion bombardment Measurement of internal stresses in CVD diamond films, 249 Low-energy ion bombardment effects in reactive rf magnetron Hot work tool steel sputtering of carbon nitride films, 118 Thermal fatigue of hot work tool steel with hard coatings, Ion energy 436 Optical properties of tetrahedral amorphous carbon films deter- Hydrogen mined by spectroscopic ellipsometry, 268 A novel approach to deposition of cubic boron nitride coatings, Ion etching 101 A Mossbauer spectroscopy study of Ti—Fe interfaces produced by the PVD process, 351 Impurities Ion implantation Post-deposition processing of low temperature PECVD silicon Modification of a disordered Ni3Fe alloy surface by 50 keV Zr dioxide films for enhanced stress stability, 68 ion implantation, 393 Electronic properties and impurity levels in filtered cathodic A study of ion-bombarded nanostructures on germanium sur- vacuum arc (FCVA) amorphous silicon, 79 faces by scanning probe microscopy, 415 Indentation Glow discharge optical spectroscopy depth profiles of ion A comparative assessment of three approaches for ranking the implanted steel, titanium and titanium nitride coatings, 425 adhesion of TiN coatings onto two steels, 329 Ion milling Infrared spectroscopy Applications of focused ion beam machining to the character- Vibrational spectroscopy of mixed hexagonal-cubic boron ization of carbide, nitride and oxide films, 369 nitride thin films, 107 Ion-thin-film interaction Inhomogeneities Surface relaxation during plasma chemical vapor deposition of Structural inhomogeneities in thin epitaxial films of YBa). diamond-like carbon films, investigated by in-situ ellipso- Cu3;07_5 and their effects on superconducting properties, metry, 195 420 ITO In-situ ellipsometry Electrical, optical and structural characteristics of indium-tin- Surface relaxation during plasma chemical vapor deposition of oxide thin films deposited on glass and polymer substrates, diamond-like carbon films, investigated by in-situ ellipso- l metry, 195 Integrated circuits Key parameters Characterization of Al-1 wt% Y thin films for VLSI intercon- About the growth of diamond crystals obtained by the combus- nects, 460 tion-flame method: use for coatings on large area sub- Integrated distributed electron cyclotron resonance reactor strates, 147 Plasma enhanced chemical vapour deposition of silica thin Large surface films in an integrated distributed electron cyclotron reso- Study for fabricating large area diamond single-crystal layers, nance reactor, 63 178 Subject Index of Volumes 308—309 Layer growth 1-Methyl-2-pyrrolidinone Growth of flake-like diamond crystal using polymer precursor, Copper diffusion in organic polymer resists and inter-level 159 dielectrics, 470 Low dielectric constant MgO films Application of SiO, aerogel film with low dielectric constant to Electrical and mechanical properties of MgO thin films on intermetal dielectrics, 490 GaAs, 611 Low dielectric constant Microelectronic devices Fundamental insight on developing low dielectric constant Fundamental insight on developing low dielectric constant polyimides, 480 polyimides, 480 Low dielectric constant Micromachining Heat resistant polyimide films with low dielectric constant by Optical scattering enhanced by silicon micromachined sur- vapor deposition polymerization, 475 faces, 8 Low dielectric constant Micro-Raman spectroscopy Preparation and characterization of porous silica xerogel film Analysis of intrinsic stress distribution in grains of high quality for low dielectric application, 495 CVD diamond film by micro-Raman spectroscopy, 168 Low dielectric Microstrains Stabilizing dielectric constant of fluorine-doped SiO, film by Crystallization and residual stress formation of sol-gel-derived NO and NH; plasma post-treatment, 501 zirconia films, 363 Low emissivity Microstructure The use of experimental design techniques to meet reflected Electromigration in 0.25 wm wide Cu line on W, 443 color targets in pyrolytic low emissivity coatings, 26 Microwave plasma chemical vapor deposition Low-pressure-chemical-vapour-deposition Fabrication and characterization of spherical polycrystalline Characterization of TiN film grown by low-pressure-chemical- diamond emitter arrays, 85 vapor-deposition, 594 High pressure high power microwave plasma chemical vapor deposition of large area diamond films, 141 Magnetic tape Modulus of elasticity Bending stiffness measurements of magnetic tapes and sub- Bending stiffness measurements of magnetic tapes and sub- strates, 323 strates, 323 Magnetron sputtering Molecular beam epitaxy Preparation of transparent conducting InySn3O), thin films by Materials characterization of Si;_,-,Ge,C,/Si superlattice DC magnetron sputtering, 13 structures, 358 Superhard coatings of CN,/ZrN multilayers prepared by DC Mosaic magnetron sputtering, 113 Study for fabricating large area diamond single-crystal layers, Low-energy ion bombardment effects in reactive rf magnetron 178 sputtering of carbon nitride films, 118 Multilayer coatings Reactive magnetron sputtering of CN, thin films at different Determination of the fatigue properties of multilayer PVD substrate bias, 223 coatings on various substrates, based on the impact test Investigation of the elastic modulus of thin films using simple and its FEM simulation, 315 biaxial bending techniques, 304 Multilayer films Mechanical properties Applications of focused ion beam machining to the character- The composition and bonding structure of CN, films and their ization of carbide, nitride and oxide films, 369 influence on the mechanical properties, 130 Multilevel interconnection Preparation of carbon nitride thin films by ion beam assisted Heat resistant polyimide films with low dielectric constant by deposition and their mechanical properties, 239 vapor deposition polymerization, 475 Between nanoindentation and scanning force microscopy: Multiphase materials measuring mechanical properties in the nanometer regime, Novel nanoindentation method for characterising multiphase 289 materials, 297 Metal oxides Preparation of transparent conducting InySn3Q), thin films by Nano-hardness tester DC magnetron sputtering, 13 Novel nanoindentation method for characterising multiphase Metallization materials, 297 Metallization of CVD diamond films by cathodic arc deposi- Nanoindentation tion, 215 Superhard coatings of CN,/ZrN multilayers prepared by DC Auger depth profiles and stud pull adhesion of metal films on magnetron sputtering, 113 graphite-epoxy composites, 375 Heat treatment of cathodic arc deposited amorphous hard car- Metallization of sub-micron trenches and vias with high aspect bon films, 186 ratio, 455 Between nanoindentation and scanning force microscopy: Damascene copper interconnects with polymer ILDs, 523 measuring mechanical properties in the nanometer regime, Method improvement 289 Improving thickness uniformity of freestanding diamond Characterisation of TiN thin films using the bulge test and the sheets synthesized by the combustion flame method, 245 nanoindentation technique, 334 652 Subject Index of Volumes 308-309 Nanotribology of ultrathin a:SiC/SiC-N overcoats using a PACVD depth sensing nanoindentation multiple sliding technique, Influence of surface integrity on performance of coated cutting 340 tools, 345 Nanostructure Passivation A study of ion-bombarded nanostructures on germanium sur- A comparative study of refractory metal nitridation in an NH; faces by scanning probe microscopy, 415 ambient, 410 Nanotribology Phase transformation Nanotribology of ultrathin a:SiC/SiC-N overcoats using a Ellipsometric studies of thermally induced transformation phe- depth sensing nanoindentation multiple sliding technique, nomena in oxide films, 42 340 Crystallization and residual stress formation of sol-gel-derived n-GaA zirconia films, 363 Thermal stability of the non-alloyed Pd/Sn and Pd/Ge Ohmic Photoresist characteristics contacts to n-GaAs, 607 Photoresist characteristics of polyurea films prepared by vapor Nitridation deposition polymerization, 90 A comparative study of refractory metal nitridation in an NH; Plain carbon steel ambient, 410 Influence of electroless Ni-P deposits on the corrosion-fatigue Nitrogenated carbon overcoats properties of an AISI 1045 steel, 430 Optical characterization of nitrogenated carbon overcoats, 284 Plasma assisted chemical vapour deposition Non-alloyed Pd/Ge Ohmic contacts Post-deposition processing of low temperature PECVD silicon Thermal stability of the non-alloyed Pd/Sn and Pd/Ge Ohmic dioxide films for enhanced stress stability, 68 contacts to n-GaAs, 607 A novel approach to deposition of cubic boron nitride coatings, Nucleation density 101 Some effects of temperature ramping on metal organic chemi- Low temperature plasma enhanced chemical vapour deposition cal vapor deposited Al film nucleation, 615 boron nitride, 219 Improved ozone-tetraethoxysilane oxide reliability for deep Optical constants submicron inter-metal dielectric applications by deposition Analysis of binary electrochromic tungsten oxides with effec- of a silane-based oxide underlayer, 621 tive medium theory, 50 Plasma film deposition Optical emission spectroscopy Surface relaxation during plasma chemical vapor deposition of Optical emission spectroscopy of the plasma during micro- diamond-like carbon films, investigated by in-situ ellipso- wave CVD of diamond thin films with nitrogen addition metry, 195 and relation to the thin film morphology, 154 Plasma post-treatment Optical measurement Stabilizing dielectric constant of fluorine-doped SiO, film by Sensitivity of variable angle spectroscopic ellipsometry to iso- NO and NH; plasma post-treatment, 501 tropic thin film properties, 31 Plasma power Optical properties Production and characterisation of carbon nitride thin Sensitivity of variable angle spectroscopic ellipsometry to iso- films produced by a graphite hollow cathode system, tropic thin film properties, 31 228 Optical and mechanical properties of amorphous CN films, Plasma sheath 135 An improved method for large-area oriented nucleation of dia- Optical properties of tetrahedral amorphous carbon films deter- mond during bias process via hot-filament chemical vapor mined by spectroscopic ellipsometry, 268 deposition, 163 Fundamental insight on developing low dielectric constant Polar maps polyimides, 480 Cartesian coordinate maps for chemical mechanical planariza- Optical scattering tion uniformity characterization, 512 Optical scattering enhanced by silicon micromachined sur- Polarized IR reflection spectroscopy faces, 8 Investigations on the structure of boron nitride films, 38 Oriented diamond Polyimide An improved method for large-area oriented nucleation of dia- Copper diffusion in organic polymer resists and inter-level mond during bias process via hot-filament chemical vapor dielectrics, 470 deposition, 163 Heat resistant polyimide films with low dielectric constant by Oxide vapor deposition polymerization, 475 Surface interaction forces in chemical-mechanical planariza- Fundamental insight on developing low dielectric constant tion, 529 polyimides, 480 CMP CoO reduction: slurry reprocessing, 538 Polymer film Ozone-tetraethoxysilane oxides Copper diffusion in organic polymer resists and inter-level Improved ozone-tetraethoxysilane oxide reliability for deep dielectrics, 470 submicron inter-metal dielectric applications by deposition Polymer ILD of a silane-based oxide underlayer, 621 Damascene copper interconnects with polymer ILDs, 523

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ELSEVIER Thin Solid Films 308—309 (1997) 643-645 Author Index of Volumes 308—309 Adams, D., 448 Cale, T.S., 533, 615 Drévillon, B., 63 Hillman, J.T., 589, 615 Adams, J.A., 538 Cameron, D.C., 130, 607 Dun, J., 543 Hilton, M.R., 369 Ade, H., 627 Carreno, M.N.P., 219 Hintermann, H., 430 Adler, J., 529 Carruthers, R., 443 Elkind, A., 233 Hiraki, A., 279 Affinito, J.D., 19 Catletge, A., 209 Erickson, L., 580 Hoffmann, F., 363 Ager III, J.W., 186 Cattani, M., 215 Erkens, G., 315 Holland, K., 533, 538 Agius, B., 63 Cestone, V.C., 420 Eufinger, S., 19 Hong, J.-K., 490, 495 Ahn, J.-G., 585 Chan, H.L., 406 Eun, K.Y., 263 Hsu, J.-C., 74 Aldinger, F., 101 Chandrasekhar, D., 358 Exarhos, G.J., 42 Hsu, S.T., 570, 575 Alford, T.L., 410, 448 Chang, C.Y., 501, 594 Exarhos, G.J., 56 Hu, C-K., 443 Amamoto, Y., 249 Chang, S.J., 501 Hu, J., 589, 594 Ameen, M., 589 Chang, S.-T., 550 Falk, S.W., 562 ri, ¥ .Z.., 3a2 Anders, S., 186 Chang, T.C., 501, 518, 594 Feng, M.-S., 543, 550 Huang, J., 507 Asomoza, R., 228 Chang, Y.F., 621 Feng, M.S., 621 Huang, W.-H., 85 Cheah, L.K., 199, 268 Findeling-Dufour, C., 17 Hugon, M.C., 63 Chen, C.-F., 85 Flynn, D.I., 199, 268 Hultman, L., 223 Baca, A.G., 599 Chen, L.J., 518, 594 Forder, S.D., 351 Hunter, A.T., 358 Baker, S.P., 289 Chen, M.C., 518 Forouhi, A.R., 284 Hwan Bae, J., 135 Barnard, J.A., 340 Chen, M.S.K., 501 Foster, R.F., 615 Hwang, H., 585 Barradas, N.P., 130 Chen, T.-M., 126 Francz, G., 191 Hyun, S.-H., 490 Barton, D., 31 Chen, Y.J., 415 Fukada, E., 475 Beaudoin, S.P., 533 Cheng, S.F., 555 Fukarek, W., 38 lijima, M., 90, 475 Beghi, M.G., 107 Cheong, B.-k., 135 Islam, M.S., 607 Bell, J.M., 304 Cheung, D., 507 Gaona-Couto, A., 228 Ito, T., 279 Bertrand, N., 63 Cheung, W.Y., 415 Geist, D.E., 393 Ivanov, I., 223 Bhan, M.K., 507 Chitty, J., 430 Gicquel, A., 178 Bhushan, B., 323 Cho, N.-I., 465 Gignac, L., 443 Jamting, A.K., 304 Bibby, T.F.A., 512, 533, 538 Cho, S.-J., 263 Gilvarry, J., 130 Jacob, W., 195 Bilek, M.M.M., 79 Choi, S.-Y., 490, 495 Girsova, N.V., 393 Jankowski, A.F., 94 Bill, J., 101 Chou, K.-S., 543 Glesener, J.W., 204 Jedema, F.J., 627 Birchler, F., 191 Chou, S., 501 Godbey, D., 470, 486 Jiang, N., 279 Blawit, C., 345 Chow, T.P., 555 Goel, A., 173 Jin, Z., 279 Bloomer, I., 284 Chowdhury, A.K.M.S., 130 Gonzalez, G., 228 Jo, M.-H., 490, 495 Bottani, C.E., 107 Chung, Y.-W., 113 Graff, G.L., 19 Jonnalagadda, R., 615 Bottecchia, J.P., 219 Cinibulk, M.K., 389 Gross, M.E., 19 Julia-Schmutz, C., 297 Bouzakis, K.-D., 315 Clissold, R., 329 Gutmann, R.J., 523, 555 Branco, J.R.T., 436 Corat, E.J., 254 Gwang Kim, S., 135 Kakumu, T., 13 Briggs, R.D., 599 Coulthard, I., 580 Kalmukov, A., 233 Bright, V.M., 8 Croke, E.T., 358 Haque, M.S., 68, 141 Kaltofen, R., 118 Broitman, E., 223 Cummings, J.J., 562 Harriss, J., 460 Kang, M.-G., 634 Brooks, J.S., 351 Harwood, R., 512 Kapat, J.S., 209 Broussard, P.R., 420 Daryanani, S., 562 Hashmi, M.S.J., 130 Karimi, A., 334 Brown, I.G., 186, 215, 258 Das, S.R., 580 Hatta, A., 279 Kester, D., 173 Brown, W.D., 141, 68 Dautzenberg, J.H., 310 Hauert, R., 191 Khan, M., 1 Browning, V.M., 420 Davidson, J.L., 351 Hay, R.S., 389 Khan, M.A., 141 Buckley, L., 470, 486 de Souza, T.M., 254 Hayashi, T., 239 Kim, J.-J., 490 Bulkin, P., 63 Delmotte, F., 63 Hayashi, Y., 163 Kim, M.-G., 263 Bussmann, K., 555 Diefendorf, R.J., 460 Hayes, J.P., 94 Kim, W.M., 135 Byun, J.S., 585 Downey, D.F., 562 Hellgren, N., 223 Kliimper-Westkamp, H., 363 0257-8972/97/$17.00 © 1997 Elsevier Science S.A. All rights reserved PII $0040-6090(97)00811-0 644 Author Index of Volumes 308—309 Klimes, W., 455 McNally, P.J., 607 Qian, W.-D., 113 Sun, Z., 159 Kohzaki, M., 239 Mehner, A., 363 Quaeyhaegens, C., 154 Sundgren, J.-E., 223 Kolesar, E.S., 8 Mei, Y.J., 501, 594 Suzuki, M., 245 Kolitsch, A., 38 Méndez, J.M., 228 Rabinovich, Y., 529 Swain, M.V., 304 Konov, V.I., 168 Mergui, S., 611 Rajan, K., 529 Swain, M.V., 329 Konyashin, I., 101 Merkulov, A., 228 Ralchenko, V.G., 168 Korenev, S.A., 233 Milne, W.I., 79 Randall, N.X., 297 Tailashev, A.S., 393 Kozlov, E.V., 393 Minami, T., 13 Reeves, M.E., 420 Takahashi, Y., 90, 475 Kraatz, P., 375 Ming Chang, R., 273 Ren, F., 599 Takata, S., 13 Krulik, G.A., 538 Miotello, A., 107 Richardson, T., 50 Takeda, Y., 13 Kruml, T., 334 Moller, W., 38 Rodil, S., 228 Takeuchi, S., 245 Kruse, O., 38 Monclus, M., 130 Rogers, B.R., 615 Tay, B.K., 159, 199, 268 Kulkarni, A.K., | Monteiro, O.R., 215 Rose, A., 42, 56 Ting, A., 594 Kumar, A., 209, 406 Morrish, A.A., 204 Rostaing, J.C., 63 Tonshoff, H.K., 345 Kuo, C.-T., 126, 273 Moudgil, B.M., 529 Rubin, M., 50 Tran, M.D., 310 Kuper, A., 329 Muhl, S., 228 Ryabchikov, A.I., 393 Trava-Airoldi, V.J., 254 Miiller, U., 191 Tsai, M.S., 518, 550 Larsson, M., 351 Miinz, W.-D., 351 Sa, S.-H., 634 Tseng, W.-T, 518, 550, 621 Laursen, T., 358, 410, 448 Murakawa, M., 245 Sakagami, S., 249 Tsui, T.Y., 186 Le Huu, T., 147 Muramatsu, M., 239 Salvadori, M.C., 215, 258 Tuan, A., 501 Lee, C.-C., 74 Murarka, S.P., 523 Sanderson, L., 406 Lee, K.-N., 585 Murphy, M.J., 130 Sato, M., 90, 475 Ukishima, S., 475 Lee, K.-R., 263 Schiilke, T., 455 Ullrich, B.M., 410 Lee, K.Y., 443 Naftel, S.J., 580 Scharf, T.W., 340 Ulrich, B., 570 Lee, S., 135 Nakamura, Y., 249 Schey, D., 512 Urban III, F.K., 31 Lee, T.H., 375 Naseem, H.A., 68, 141 Schmidt, P.E., 611 Lee, Y.-J., 585 Nemanich, R.J., 627 Schroeder, A., 191 Vandevelde, T., 154 Lei, R., 173 Nesladek, M., 154 Schultrich, B., 455 Venkatraman, C., 173 Leite, N.F., 254 Neuman, G.A., 26 Schulz, K.H., 1 Vidakis, N., 315 Leusink, G., 589 Nishino, S., 163 Schwarzer, N., 304 Vlasov, I.I., 168 Leyendecker, T., 315 Schwarz-Selinger, T., 195 Vohra, Y., 209 Li, E., 284 Obraztsova, E.D., 168 Scott, W.W., 323 von Keudell, A., 195 Li, G.G., 284 Oh, K.-H., 634 Sebald, T., 118 von Rottkay, K., 50 Li, X., 163 Oh, S.-g., 135 Seidel, F., 425 von Stebut, J., 297 Lim, T.-S., 1 Osburn, C.M., 562 Seong, T.-Y., 263 Lin, C.F., 621 Osofsky, M.S., 420 Sham, T.K., 580 Wéiss, Z., 382 Lin, C.R., 273 Ossi, P.M., 107 Sharkeev, Y.P., 393 Walck, S.D., 399 Lin, H.B., 204 Outten, C., 173 Shi, X., 159, 199, 268 Wang, C., 279 Lin, J.-H., 74 Ozer, N., 50 Shojaei, O.R., 334 Wang, D., 533 Liu, C., 518, 543, 550 Siemroth, P., 455 Wang, M.T., 518 Liu, Y., 460 Pan, F.M., 501, 594 Simpson, J.O., 480 Wang, X., 159 Loeffler, J., 101 Parikh, P., 538 Singh, R., 460, 529 Wang, Y.-L., 543, 550 Lu, T.-R., 126 Park, D.I., 465 Sj6strém, H., 223 Wang, Y.-Y., 113 Park, H.-H., 490, 495, 634 Skelton, E.F., 420 Watanabe, Y., 249 Maa, J.-S., 570, 575 Park, S.J., 135 Smith, D.J., 358 Webb, D., 589 Mahadev, V., 615 Paulmier, D., 147 Smolin, A.A., 168 Wei, D.T., 74 Mahajan, U., 529 Pearton, S.J., 599 Snow, A.W., 470 Weil, L., 375 Makowiecki, D.M., 94 Peng, C.-H., 570, 575 Soro, J.M., 297 Weimer, J.J., 406 Malshe, A.P., 141 Pereyra, I., 219 Soto, R., 611 Weise, G., 118 Mammaana, V., 215, 258 Perry, A.l., 233, 393 Sowders, D.M., 8 Welch, J.R., 389 Mangiaracina, A., 209 Pertuz, A., 430 Sproul, W.D., 113 Wen-Jui Chia, R., 284 Marshall, K., 382 Pharr, G.M., 186 Srinivasa-Murthy, C., 533 Wenke, R., 315 Martin, J.L., 334 Poole, K.F., 460 Staia, M.H., 430 Wenzel, Ch., 455 Martin, P.J., 329 Poublan, J., 310 St.Clair, A.K., 480 Wilson, I.H., 415 Martin, P.M., 19 Presser, N., 369 Stals, L., 154 Windisch Jr, C.F., 56 Matsumuro, A., 239 Price, D.T., 523 Starling, C.M.D., 436 Wintermantel, E., 191 Mayer, J., 191, 358, 448 Prinz, G.A., 555 Stewart-Davis, R.L., 26 Won, J., 279 Mayr, P., 363, 425 Prusseit, W., 420 Stock, H.-R., 425 Wong, M.-S., 113 McCaffrey, J.P., 399 Puchi, E.S., 430 Sugi, S., 284 Wong, S.P., 415 McKernan, M.A., 94 Purdy, A.P., 470, 486 Suh, K.-S., 634 Wu, M.-L., 113 McKinley, K., 512 Qadri, S.B., 420 Sun, Y., 159 Wu, W.F., 594 Author Index of Volumes 308—309 Xing, K.Z., 223 Yang, D., 615 Zacharie, G., 297 Zolper, J.C., 599 Xu, D.-X., 580 Yang, H.-S., 495 Zaidi, H., 147 Zou, G., 279 Xu, J.B., 415 Yang, W., 627 Zeng, Y., 410 Zou, Y.L., 410 Yang, Y.L., 594 Zheng, W.T., 223 Yamaguchi, K., 239 You, Q., 209 Zhu, H., 284 Chin fins” ELSEVIER Thin Solid Films 308-309 (1997) 646-656 Subject Index of Volumes 308—309 ABS™ Microstructures of copper thin films prepared by chemical A Mossbauer spectroscopy study of Ti—Fe interfaces produced vapor deposition, 465 by the PVD process, 351 a-C:H:F B* ion implants Surface analysis and bioreactions of F and Si containing a- Dose-rate effects on the formation of ultra-shallow junctions C:H, 191 with low-energy B* and BF," ion implants, 562 Adhesion Barrier Nanotribology of ultrathin a:SiC/SiC-N overcoats using a Electrical properties of Ti/TiN films prepared by chemical depth sensing nanoindentation multiple sliding technique, vapor deposition and their applications in submicron struc- 340 tures as contact and barrier materials, 589 Auger depth profiles and stud pull adhesion of metal films on Benzotriazole graphite-epoxy composites, 375 Effects of corrosion environments on the surface finishing of Adhesion testing copper chemical mechanical polishing, 518 A comparative assessment of three approaches for ranking the BF,” ion implants adhesion of TiN coatings onto two steels, 329 Dose-rate effects on the formation of ultra-shallow junctions Ag films with low-energy B* and BF," ion implants, 562 Titanium-nitride self-encapsulation of Cu and Ag films on Bias-enhanced nucleation silicon dioxide, 448 An improved method for large-area oriented nucleation of dia- Alloys mond during bias process via hot-filament chemical vapor A survey of ohmic contacts to III-V compound semiconduc- deposition, 163 tors, 599 Biaxial bending Aluminum films Investigation of the elastic modulus of thin films using simple Some effects of temperature ramping on metal organic chemi- biaxial bending techniques, 304 cal vapor deposited Al film nucleation, 615 Bioreaction Aluminum nitride Surface analysis and bioreactions of F and Si containing a- Structural characterization of pulsed laser-deposited AIN thin C:H, 191 films on semiconductor substrates, 406 Boron Amorphous Formation of cubic boron nitride by the reactive sputter Electronic properties and impurity levels in filtered cathodic deposition of boron, 94 vacuum arc (FCVA) amorphous silicon, 79 Investigation of distribution of defects and impurities in boron- Amorphous carbon doped CVD diamond film by cathodoluminescence spectro- Surface analysis and bioreactions of F and Si containing a- scopy, 279 C:H, 191 Boron nitride Amorphous CN film Investigations on the structure of boron nitride films, 38 Optical and mechanical properties of amorphous CN films, 135 Low temperature plasma enhanced chemical vapour deposition Amorphous silicon boron nitride, 219 Reaction of amorphous Si with cobalt silicide before disilicide Boron nitride films formation for reducing Si consumption in SIMOX, 570 Formation of cubic boron nitride by the reactive sputter Annealing deposition of boron, 94 Post-deposition processing of low temperature PECVD silicon Buffer layers dioxide films for enhanced stress stability, 68v Evaluation of buffer layers for hot filament chemical vapor Atomic force microscopy deposition diamond films on silicon substrates, 209 Surface interaction forces in chemical-mechanical planariza- Bulge test tion, 529 Characterisation of TiN thin films using the bulge test and the Auger electron spectroscopy nanoindentation technique, 334 Vibrational spectroscopy of mixed hexagonal-cubic boron nitride thin films, 107 Carbon nitride Auger depth profiles and stud pull adhesion of metal films on Preparation of a novel target material for carbon nitride film graphite-epoxy composites, 375 deposition, 126 0257-8972/97/$17.00 © 1997 Elsevier Science S.A. All rights reserved PII S$0040-6090(97)00812-2 Subject Index of Volumes 308—309 Carbon nitride films Chemical-mechanical planarization Deposition of carbon nitride films by vacuum ion diode with Surface interaction forces in chemical-mechanical planariza- explosive emission, 233 tion, 529 Carbon nitride sputtering Chemical-mechanical polishing Low-energy ion bombardment effects in reactive rf magnetron Effects of underlying films on the chemical-mechanical polish- sputtering of carbon nitride films, 118 ing for shallow trench isolation technology, 543 Production and characterisation of carbon nitride thin films Chemical-mechanical polishing of low-dielectric-constant produced by a graphite hollow cathode system, 228 spin-on-glasses: film chemistries, slurry formulation and Carbon nitride thin films polish selectivity, 550 Preparation of carbon nitride thin films by ion beam assisted Chemical-mechanical polishing as an enabling technology for deposition and their mechanical properties, 239 giant magnetoresistance devices, 555 Cartesian coordinate maps Cleaved diamond fibers Cartesian coordinate maps for chemical mechanical planariza- Field emission from cleaved diamond fibers, 204 tion uniformity characterization, 512 CN, films Cathodic arc deposition The composition and bonding structure of CN, films and their Heat treatment of cathodic arc deposited amorphous hard car- influence on the mechanical properties, 130 bon films, 186 Reactive magnetron sputtering of CN, thin films at different Metallization of CVD diamond films by cathodic arc deposi- substrate bias, 223 tion, 215 Optical characterization of nitrogenated carbon overcoats, Cathodoluminescence 284 Investigation of distribution of defects and impurities in boron- Coating adhesion doped CVD diamond film by cathodoluminescence spectro- Influence of surface integrity on performance of coated cutting scopy, 279 tools, 345 CEMS Coatings A MOssbauer spectroscopy study of Ti—Fe interfaces produced Influence of surface integrity on performance of coated cutting by the PVD process, 351 tools, 345 Cermet TEM specimen preparation and characterization of ceramic Influence of surface integrity on performance of coated cutting coatings on fiber tows, 389 tools, 345 Thermal fatigue of hot work tool steel with hard coatings, 436 Characterization Cobalt silicide Spectroscopic characterization of processing-induced property Reaction of amorphous Si with cobalt silicide before disilicide changes in doped ZnO films, 56 formation for reducing Si consumption in SIMOX, 570 TEM specimen preparation and characterization of ceramic Edge leakage of cobalt silicided shallow junctions, 575 coatings on fiber tows, 389 Color The small angle cleavage technique applied to coatings and The use of experimental design techniques to meet reflected thin films, 399 color targets in pyrolytic low emissivity coatings, 26 Chemical mechanical planarization Combustion flame method Cartesian coordinate maps for chemical mechanical planariza- About the growth of diamond crystals obtained by the combus- tion uniformity characterization, 512 tion-flame method: use for coatings on large area sub- CMP CoO reduction: slurry reprocessing, 538 strates, 147 Chemical mechanical polishing Improving thickness uniformity of freestanding diamond Effects of corrosion environments on the surface finishing of sheets synthesized by the combustion flame method, 245 copper chemical mechanical polishing, 518 Contact materials Stress distribution in chemical mechanical polishing, 533 A survey of ohmic contacts to III-V compound semiconduc- Chemical vapor deposition tors, 599 Plasma enhanced chemical vapour deposition of silica thin Contact resistivity films in an integrated distributed electron cyclotron reso- Chemical-mechanical polishing as an enabling technology for nance reactor, 63 giant magnetoresistance devices, 555 High pressure high power microwave plasma chemical vapor Copper deposition of large area diamond films, 141 The dissolution of copper in common solvents used for low Optical emission spectroscopy of the plasma during micro- dielectric polymers, 486 wave CVD of diamond thin films with nitrogen addition Effects of corrosion environments on the surface finishing of and relation to the thin film morphology, 154 copper chemical mechanical polishing, 518 Production and characterisation of carbon nitride thin films Damascene copper interconnects with polymer ILDs, 523 produced by a graphite hollow cathode system, 228 Copper thin films Microstructures of copper thin films prepared by chemical Microstructures of copper thin films prepared by chemical vapor deposition, 465 vapor deposition, 465 Electrical properties of Ti/TiN films prepared by chemical Corrosion vapor deposition and their applications in submicron struc- Effects of corrosion environments on the surface finishing of tures as contact and barrier materials, 589 copper chemical mechanical polishing, 518 648 Subject Index of Volumes 308-309 Corrosion-fatigue properties concept in interlayer deposition to enhance diamond film Influence of electroless Ni-P deposits on the corrosion-fatigue adherence, 273 properties of an AISI 1045 steel, 430 Diamond growth Cross-sectional TEM Studies on CVD-diamond on Ti6Al4V alloy surface using hot The small angle cleavage technique applied to coatings and filament assisted technique, 254 thin films, 399 Diamond like carbon Crystalline Surface relaxation during plasma chemical vapor deposition of Structural characterization of pulsed laser-deposited AIN thin diamond-like carbon films, investigated by in-situ ellipso- films on semiconductor substrates, 406 metry, 195 Crystallite size Structural dependence of mechanical properties of Si incorpo- Crystallization and residual stress formation of sol-gel-derived rated diamond-like carbon films deposited by RF plasma- zirconia films, 363 assisted chemical vapour deposition, 263 Cu diffusion Diamond-like nanocomposite films Copper diffusion in organic polymer resists and inter-level Electrical properties of diamond-like nanocomposite coatings, dielectrics, 470 173 Cu films Diamond sheets Titanium-nitride self-encapsulation of Cu and Ag films on Improving thickness uniformity of freestanding diamond silicon dioxide, 448v sheets synthesized by the combustion flame method, 245 Cu lines Disilicide formation Electromigration in 0.25 wm wide Cu line on W, 443 Reaction of amorphous Si with cobalt silicide before disilicide Cubic boron nitride formation for reducing Si consumption in SIMOX, 570 Vibrational spectroscopy of mixed hexagonal-cubic boron Disk coatings nitride thin films, 107 Optical characterization of nitrogenated carbon overcoats, Cubic boron nitride coatings 284 A novel approach to deposition of cubic boron nitride coatings, Disordered Ni3Fe 101 Modification of a disordered Ni3Fe alloy surface by 50 keV Zr CVD diamond films ion implantation, 393 Analysis of intrinsic stress distribution in grains of high quality Dispersive strengthening CVD diamond film by micro-Raman spectroscopy, 168 Application of heat treatment and dispersive strengthening Metallization of CVD diamond films by cathodic arc deposi- concept in interlayer deposition to enhance diamond film tion, 215 adherence, 273 Investigation of distribution of defects and impurities in boron- Dissolution doped CVD diamond film by cathodoluminescence spectro- The dissolution of copper in common solvents used for low scopy, 279 dielectric polymers, 486 Doped ZnO films Damascene Spectroscopic characterization of processing-induced property Damascene copper interconnects with polymer ILDs, 523 changes in doped ZnO films, 56 Deposition rate Dual ion-beam sputtering Morphology of dual beam ion sputtered films investigated by Morphology of dual beam ion sputtered films investigated by atomic force microscopy, 74 atomic force microscopy, 74 Depth profile Elemental depth profiling of coated and surface-modified Edge emission materials by GD-OES: hard coatings on cutting tools, 382 Investigation of distribution of defects and impurities in boron- Diamond doped CVD diamond film by cathodoluminescence spectro- Fabrication and characterization of spherical polycrystalline scopy, 279 diamond emitter arrays, 85 Edge leakage Study for fabricating large area diamond single-crystal layers, Edge leakage of cobalt silicided shallow junctions, 575 178 Effective medium approximation Diamond crystal Analysis of binary electrochromic tungsten oxides with effec- About the growth of diamond crystals obtained by the combus- tive medium theory, 50 tion-flame method: use for coatings on large area sub- Elastic modulus strates, 147 Investigation of the elastic modulus of thin films using simple Growth of flake-like diamond crystal using polymer precursor, biaxial bending techniques, 304 159 Elastic recoil detection Diamond films Investigations on the structure of boron nitride films, 38 High pressure high power microwave plasma chemical vapor Electrical properties deposition of large area diamond films, 141 Electrical properties of diamond-like nanocomposite coatings, Evaluation of buffer layers for hot filament chemical vapor 173 deposition diamond films on silicon substrates, 209 Electrical resistance Measurement of internal stresses in CVD diamond films, 249 Characterization of Al-1 wt% Y thin films for VLSI intercon- Application of heat treatment and dispersive strengthening nects, 460 Subject Index of Volumes 308—309 649 Electrochromic vanadium tungsten oxide Flakes Analysis of binary electrochromic tungsten oxides with effec- Growth of flake-like diamond crystal using polymer precursor, tive medium theory, 50 159 Electroless nickel deposits Fluorine dope oxide Influence of electroless Ni-P deposits on the corrosion-fatigue Stabilizing dielectric constant of fluorine-doped SiO, film by properties of an AISI 1045 steel, 430 NO and NH; plasma post-treatment, 501 Electromigration Fluorine doped silicon dioxide films Electromigration in 0.25 wm wide Cu line on W, 443 Deposition of stable, low x and high deposition rate SiF,-doped Electron beam TEOS fluorinated silicon dioxide (SiOF) films, 507 PML/oxide/PML barrier layer performance differences arising Focused ion beam from use of UV or electron beam polymerization of the Applications of focused ion beam machining to the character- PML layers, 19 ization of carbide, nitride and oxide films, 369 Electronic properties Fourier transform infrared spectroscopy Electrical and mechanical properties of MgO thin films on Low temperature plasma enhanced chemical vapour deposition GaAs, 611 boron nitride, 219 Ellipsometry Friction Sensitivity of variable angle spectroscopic ellipsometry to iso- Bending stiffness measurements of magnetic tapes and sub- tropic thin film properties, 31 strates, 323 Investigations on the structure of boron nitride films, 38 Friction coefficient Ellipsometric studies of thermally induced transformation phe- Preparation of carbon nitride thin films by ion beam assisted nomena in oxide films, 42 deposition and their mechanical properties, 239 Emission Elemental depth profiling of coated and surface-modified GaAs materials by GD-OES: hard coatings on cutting tools, 382 Electrical and mechanical properties of MgO thin films on Emission current GaAs, 611 Fabrication and characterization of spherical polycrystalline GaAs etching diamond emitter arrays, 85 The characterization of etched GaAs surface with HCl or Encapsulation H3PQO, solutions, 634 Titanium-nitride self-encapsulation of Cu and Ag films on sili- Giant magnetoresistance con dioxide, 448 Chemical-mechanical polishing as an enabling technology for Experimental design giant magnetoresistance devices, 555 The use of experimental design techniques to meet reflected Glow discharge color targets in pyrolytic low emissivity coatings, 26 Elemental depth profiling of coated and surface-modified Explosive emission materials by GD-OES: hard coatings on cutting tools, Deposition of carbon nitride films by vacuum ion diode with 382 explosive emission, 233 Glow discharge optical spectroscopy Glow discharge optical spectroscopy depth profiles of ion Fatigue behavior implanted steel, titanium and titanium nitride coatings, Determination of the fatigue properties of multilayer PVD 425 coatings on various substrates, based on the impact test Grain orientation and its FEM simulation, 315 Electrical, optical and structural characteristics of indium-tin- Fibers oxide thin films deposited on glass and polymer substrates, TEM specimen preparation and characterization of ceramic l coatings on fiber tows, 389 Graphite-epoxy Field emission Auger depth profiles and stud pull adhesion of metal films on Field emission from cleaved diamond fibers, 204 graphite-epoxy composites, 375 Field emitter array Growth conditions Fabrication and characterization of spherical polycrystalline Growth conditions and properties of tetrahedral amorphous diamond emitter arrays, 85 carbon films, 199 Film deposition parameters Spectroscopic characterization of processing-induced property Hard carbon films changes in doped ZnO films, 56 Heat treatment of cathodic arc deposited amorphous hard car- Film hardness bon films, 186 Preparation of carbon nitride thin films by ion beam assisted Hardness deposition and their mechanical properties, 239 Superhard coatings of CN,/ZrN multilayers prepared by DC Film thickness magnetron sputtering, 113 Crystallization and residual stress formation of sol-gel-derived Structural characterization of pulsed laser-deposited AIN thin zirconia films, 363 films on semiconductor substrates, 406 Filtered cathodic vacuum arc HCI/H3PO, Growth conditions and properties of tetrahedral amorphous The characterization of etched GaAs surface with HCl or carbon films, 199 H3PO, solutions, 634 650 Subject Index of Volumes 308-309 Heat treatment Interconnect material Application of heat treatment and dispersive strengthening Characterization of Al-1 wt% Y thin films for VLSI intercon- concept in interlayer deposition to enhance diamond film nects, 460 adherence, 273 Damascene copper interconnects with polymer ILDs, 523 Hexagonal BN Interlayer Low temperature plasma enhanced chemical vapour deposition Application of heat treatment and dispersive strengthening boron nitride, 219 concept in interlayer deposition to enhance diamond film High power adherence, 273 High pressure high power microwave plasma chemical vapor Inter-metal dielectric structures deposition of large area diamond films, 141 Improved ozone-tetraethoxysilane oxide reliability for deep High pressure submicron inter-metal dielectric applications by deposition High pressure high power microwave plasma chemical vapor of a silane-based oxide underlayer, 621 deposition of large area diamond films, 141 Intermetal dielectric High temperature BPSG annealing Deposition of stable, low x and high deposition rate SiF4-doped The effects of screen oxide and low temperature BPSG anneal TEOS fluorinated silicon dioxide (SiOF) films, 507 on titanium salicide formation, 585 Intermetal dielectrics Hollow cathode Application of SiO, aerogel film with low dielectric constant to An improved method for large-area oriented nucleation of dia- intermetal dielectrics, 490 mond during bias process via hot-filament chemical vapor Internal stresses deposition, 163 Measurement of internal stresses in CVD diamond films, 249 Homoepitaxy Ion assisted beam deposition Study for fabricating large area diamond single-crystal layers, Preparation of carbon nitride thin films by ion beam assisted 178 deposition and their mechanical properties, 239 Hot filament assisted technique Ion beam analysis Studies on CVD-diamond on Ti6Al4V alloy surface using hot Materials characterization of Si,;_,-,Ge,C,/Si superlattice filament assisted technique, 254 structures, 358 Hot filament chemical vapor deposition Ion bombardment Measurement of internal stresses in CVD diamond films, 249 Low-energy ion bombardment effects in reactive rf magnetron Hot work tool steel sputtering of carbon nitride films, 118 Thermal fatigue of hot work tool steel with hard coatings, Ion energy 436 Optical properties of tetrahedral amorphous carbon films deter- Hydrogen mined by spectroscopic ellipsometry, 268 A novel approach to deposition of cubic boron nitride coatings, Ion etching 101 A Mossbauer spectroscopy study of Ti—Fe interfaces produced by the PVD process, 351 Impurities Ion implantation Post-deposition processing of low temperature PECVD silicon Modification of a disordered Ni3Fe alloy surface by 50 keV Zr dioxide films for enhanced stress stability, 68 ion implantation, 393 Electronic properties and impurity levels in filtered cathodic A study of ion-bombarded nanostructures on germanium sur- vacuum arc (FCVA) amorphous silicon, 79 faces by scanning probe microscopy, 415 Indentation Glow discharge optical spectroscopy depth profiles of ion A comparative assessment of three approaches for ranking the implanted steel, titanium and titanium nitride coatings, 425 adhesion of TiN coatings onto two steels, 329 Ion milling Infrared spectroscopy Applications of focused ion beam machining to the character- Vibrational spectroscopy of mixed hexagonal-cubic boron ization of carbide, nitride and oxide films, 369 nitride thin films, 107 Ion-thin-film interaction Inhomogeneities Surface relaxation during plasma chemical vapor deposition of Structural inhomogeneities in thin epitaxial films of YBa). diamond-like carbon films, investigated by in-situ ellipso- Cu3;07_5 and their effects on superconducting properties, metry, 195 420 ITO In-situ ellipsometry Electrical, optical and structural characteristics of indium-tin- Surface relaxation during plasma chemical vapor deposition of oxide thin films deposited on glass and polymer substrates, diamond-like carbon films, investigated by in-situ ellipso- l metry, 195 Integrated circuits Key parameters Characterization of Al-1 wt% Y thin films for VLSI intercon- About the growth of diamond crystals obtained by the combus- nects, 460 tion-flame method: use for coatings on large area sub- Integrated distributed electron cyclotron resonance reactor strates, 147 Plasma enhanced chemical vapour deposition of silica thin Large surface films in an integrated distributed electron cyclotron reso- Study for fabricating large area diamond single-crystal layers, nance reactor, 63 178 Subject Index of Volumes 308—309 Layer growth 1-Methyl-2-pyrrolidinone Growth of flake-like diamond crystal using polymer precursor, Copper diffusion in organic polymer resists and inter-level 159 dielectrics, 470 Low dielectric constant MgO films Application of SiO, aerogel film with low dielectric constant to Electrical and mechanical properties of MgO thin films on intermetal dielectrics, 490 GaAs, 611 Low dielectric constant Microelectronic devices Fundamental insight on developing low dielectric constant Fundamental insight on developing low dielectric constant polyimides, 480 polyimides, 480 Low dielectric constant Micromachining Heat resistant polyimide films with low dielectric constant by Optical scattering enhanced by silicon micromachined sur- vapor deposition polymerization, 475 faces, 8 Low dielectric constant Micro-Raman spectroscopy Preparation and characterization of porous silica xerogel film Analysis of intrinsic stress distribution in grains of high quality for low dielectric application, 495 CVD diamond film by micro-Raman spectroscopy, 168 Low dielectric Microstrains Stabilizing dielectric constant of fluorine-doped SiO, film by Crystallization and residual stress formation of sol-gel-derived NO and NH; plasma post-treatment, 501 zirconia films, 363 Low emissivity Microstructure The use of experimental design techniques to meet reflected Electromigration in 0.25 wm wide Cu line on W, 443 color targets in pyrolytic low emissivity coatings, 26 Microwave plasma chemical vapor deposition Low-pressure-chemical-vapour-deposition Fabrication and characterization of spherical polycrystalline Characterization of TiN film grown by low-pressure-chemical- diamond emitter arrays, 85 vapor-deposition, 594 High pressure high power microwave plasma chemical vapor deposition of large area diamond films, 141 Magnetic tape Modulus of elasticity Bending stiffness measurements of magnetic tapes and sub- Bending stiffness measurements of magnetic tapes and sub- strates, 323 strates, 323 Magnetron sputtering Molecular beam epitaxy Preparation of transparent conducting InySn3O), thin films by Materials characterization of Si;_,-,Ge,C,/Si superlattice DC magnetron sputtering, 13 structures, 358 Superhard coatings of CN,/ZrN multilayers prepared by DC Mosaic magnetron sputtering, 113 Study for fabricating large area diamond single-crystal layers, Low-energy ion bombardment effects in reactive rf magnetron 178 sputtering of carbon nitride films, 118 Multilayer coatings Reactive magnetron sputtering of CN, thin films at different Determination of the fatigue properties of multilayer PVD substrate bias, 223 coatings on various substrates, based on the impact test Investigation of the elastic modulus of thin films using simple and its FEM simulation, 315 biaxial bending techniques, 304 Multilayer films Mechanical properties Applications of focused ion beam machining to the character- The composition and bonding structure of CN, films and their ization of carbide, nitride and oxide films, 369 influence on the mechanical properties, 130 Multilevel interconnection Preparation of carbon nitride thin films by ion beam assisted Heat resistant polyimide films with low dielectric constant by deposition and their mechanical properties, 239 vapor deposition polymerization, 475 Between nanoindentation and scanning force microscopy: Multiphase materials measuring mechanical properties in the nanometer regime, Novel nanoindentation method for characterising multiphase 289 materials, 297 Metal oxides Preparation of transparent conducting InySn3Q), thin films by Nano-hardness tester DC magnetron sputtering, 13 Novel nanoindentation method for characterising multiphase Metallization materials, 297 Metallization of CVD diamond films by cathodic arc deposi- Nanoindentation tion, 215 Superhard coatings of CN,/ZrN multilayers prepared by DC Auger depth profiles and stud pull adhesion of metal films on magnetron sputtering, 113 graphite-epoxy composites, 375 Heat treatment of cathodic arc deposited amorphous hard car- Metallization of sub-micron trenches and vias with high aspect bon films, 186 ratio, 455 Between nanoindentation and scanning force microscopy: Damascene copper interconnects with polymer ILDs, 523 measuring mechanical properties in the nanometer regime, Method improvement 289 Improving thickness uniformity of freestanding diamond Characterisation of TiN thin films using the bulge test and the sheets synthesized by the combustion flame method, 245 nanoindentation technique, 334 652 Subject Index of Volumes 308-309 Nanotribology of ultrathin a:SiC/SiC-N overcoats using a PACVD depth sensing nanoindentation multiple sliding technique, Influence of surface integrity on performance of coated cutting 340 tools, 345 Nanostructure Passivation A study of ion-bombarded nanostructures on germanium sur- A comparative study of refractory metal nitridation in an NH; faces by scanning probe microscopy, 415 ambient, 410 Nanotribology Phase transformation Nanotribology of ultrathin a:SiC/SiC-N overcoats using a Ellipsometric studies of thermally induced transformation phe- depth sensing nanoindentation multiple sliding technique, nomena in oxide films, 42 340 Crystallization and residual stress formation of sol-gel-derived n-GaA zirconia films, 363 Thermal stability of the non-alloyed Pd/Sn and Pd/Ge Ohmic Photoresist characteristics contacts to n-GaAs, 607 Photoresist characteristics of polyurea films prepared by vapor Nitridation deposition polymerization, 90 A comparative study of refractory metal nitridation in an NH; Plain carbon steel ambient, 410 Influence of electroless Ni-P deposits on the corrosion-fatigue Nitrogenated carbon overcoats properties of an AISI 1045 steel, 430 Optical characterization of nitrogenated carbon overcoats, 284 Plasma assisted chemical vapour deposition Non-alloyed Pd/Ge Ohmic contacts Post-deposition processing of low temperature PECVD silicon Thermal stability of the non-alloyed Pd/Sn and Pd/Ge Ohmic dioxide films for enhanced stress stability, 68 contacts to n-GaAs, 607 A novel approach to deposition of cubic boron nitride coatings, Nucleation density 101 Some effects of temperature ramping on metal organic chemi- Low temperature plasma enhanced chemical vapour deposition cal vapor deposited Al film nucleation, 615 boron nitride, 219 Improved ozone-tetraethoxysilane oxide reliability for deep Optical constants submicron inter-metal dielectric applications by deposition Analysis of binary electrochromic tungsten oxides with effec- of a silane-based oxide underlayer, 621 tive medium theory, 50 Plasma film deposition Optical emission spectroscopy Surface relaxation during plasma chemical vapor deposition of Optical emission spectroscopy of the plasma during micro- diamond-like carbon films, investigated by in-situ ellipso- wave CVD of diamond thin films with nitrogen addition metry, 195 and relation to the thin film morphology, 154 Plasma post-treatment Optical measurement Stabilizing dielectric constant of fluorine-doped SiO, film by Sensitivity of variable angle spectroscopic ellipsometry to iso- NO and NH; plasma post-treatment, 501 tropic thin film properties, 31 Plasma power Optical properties Production and characterisation of carbon nitride thin Sensitivity of variable angle spectroscopic ellipsometry to iso- films produced by a graphite hollow cathode system, tropic thin film properties, 31 228 Optical and mechanical properties of amorphous CN films, Plasma sheath 135 An improved method for large-area oriented nucleation of dia- Optical properties of tetrahedral amorphous carbon films deter- mond during bias process via hot-filament chemical vapor mined by spectroscopic ellipsometry, 268 deposition, 163 Fundamental insight on developing low dielectric constant Polar maps polyimides, 480 Cartesian coordinate maps for chemical mechanical planariza- Optical scattering tion uniformity characterization, 512 Optical scattering enhanced by silicon micromachined sur- Polarized IR reflection spectroscopy faces, 8 Investigations on the structure of boron nitride films, 38 Oriented diamond Polyimide An improved method for large-area oriented nucleation of dia- Copper diffusion in organic polymer resists and inter-level mond during bias process via hot-filament chemical vapor dielectrics, 470 deposition, 163 Heat resistant polyimide films with low dielectric constant by Oxide vapor deposition polymerization, 475 Surface interaction forces in chemical-mechanical planariza- Fundamental insight on developing low dielectric constant tion, 529 polyimides, 480 CMP CoO reduction: slurry reprocessing, 538 Polymer film Ozone-tetraethoxysilane oxides Copper diffusion in organic polymer resists and inter-level Improved ozone-tetraethoxysilane oxide reliability for deep dielectrics, 470 submicron inter-metal dielectric applications by deposition Polymer ILD of a silane-based oxide underlayer, 621 Damascene copper interconnects with polymer ILDs, 523

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