Table Of Content

THIN SOLID FILMS VOLUME 236, NUMBERS 1-2, DECEMBER 15, 1993 Contents Publication schedule OPTICAL THIN FILMS Optically active films and ion processing of optical materials Properties of transparent conducting oxides deposited at room temperature L. Davis (Fort Lauderdale, FL, USA) CUPUEAE Switeitig COCHMOIUUY ION GIAMATTI. oc. ce nce ec cdde sabes dea eeie OAL 8d). Bee eel, BAe C. M. Lampert (Berkeley, CA, USA) Low temperature preparation of transparent conducting ZnO:Al thin films by chemical beam deposition H. Sato, T. Minami, S. Takata, T. Miyata and M. Ishii (Ishikawa, Japan) SnO, transparent conductor films produced by filtered vacuum arc deposition A. Ben-Shalom, L. Kaplan, R. L. Boxman, S. Goldsmith and M. Nathan (Tel-Aviv, Israel) Transparent conducting p-type NiO thin films prepared by magnetron sputtering H. Sato, T. Minami, S. Takata and T. Yamada (Ishikawa, Japan) Characterization of n-CdS/p-CuGaI,n, _, Se, thin film heterojunctions Y. Aparna, P. S. Reddy, B. Srinivasulu Naidu and P. Jayarama Reddy (Tirupati, India) CVD, PECVD and non-vacuum deposition techniques for optical coating Low temperature preparation of SrTiO, thin films E. Dayalan and M. S. Tomar (Tulsa, OK, USA) Thermal stability of pyrolytic tin oxide films on aluminium A. Roos (Uppsala, Sweden), G. Chinyama (Lusaka, Zambia) and P. Hedenqvist (Uppsala, Sweden) Optical properties and equilibrium temperatures of titanium-nitride- and graphite-coated Langmuir probes for space application M. Veszelei and E. Veszelei (Uppsala, Sweden) Deposition and characterization of multicomponent oxide films and multilayers from aqueous solution G. J. Exarhos and N. J. Hess (Richland, WA, USA) Silicon based, protective transparent multilayer coatings deposited at high rate on optical polymers by dual-mode MW/r.f. J. C. Rostaing, F. Coeuret (Jouy-en-Josas, France), B. Drevillon, R. Etemadi, C. Godet, J. Huc, J. Y. Parey and V. A. Yakovlev (Palaiseau, France) Inhomogeneous dielectrics grown by plasma-enhanced chemical vapor deposition S. Lim, J. H. Ryu, J. F. Wager (Corvallis, OR, USA) and L. M. Casas (Ft. Monmouth, NJ, USA) Characterization of magnetron-sputtered diamond-like thin films for optical coatings in IR G. A. Clarke and R. R. Parsons (Vancouver, B.C., Canada) DIAMOND AND RELATED MATERIALS Electronic and optical applications of diamond and related materials Thermal reaction of Ta thin films with polycrystalline diamond J. S. Chen, E. Kolawa, M.-A. Nicolet and F. S. Pool (Pasadena, CA, USA) Effect of oxygen on hydrogenated amorphous carbon films Y. Suefuji, Y. Nakamura, Y. Watanabe, S. Hirayama and K. Tamaki (Kanagawa, Japan) Fabrication of amorphous diamond films S. Falabella, D. B. Boercker and D. M. Sanders (Livermore, CA, USA) Elsevier Sequoia Vili Synthesis of diamond and related materials Selective area deposition of diamond on 4 in Si wafers W. Hanni, C. Miiller, M. Binggeli, H. E. Hintermann, P. Krebs and A. Grisel (Neuchatel, Switzerland) Plasma diagnostics of a d.c. arcjet chemical vapor deposition diamond reactor S. W. Reeve and W. A. Weimer (China Lake, CA, USA) Diamond and related materials (Poster session) Properties of mixed-phase BN films deposited by r.f. PACVD D. C. Cameron, M. Z. Karim and M. S. J. Hashmi (Dublin, Ireland) Thermal expansion of chemical vapor deposition grown diamond films S. B. Qadri, C. Kim, E. F. Skelton, T. Hahn and J. E. Butler (Washington, DC, USA) Diamond thin films synthesized by a multinozzle oxy-acetylene chemical vapour deposition method W. Zhu, B. H. Tan and H. S. Tan (Singapore, Singapore) Application of nickel plating for the synthesis of chemical vapour deposition of diamond on steels H. C. Shih, W. T. Hsu, C. T. Hwang, C. P. Sung, L. K. Lin and C. K. Lee (Hsinchu, Taiwan) Nucleation of diamond particles by hot filament chemical vapour deposition K. Tamaki, Y. Watanabe, Y. Nakamura and S. Hirayama (Kanagawa, Japan) Microwave diamond synthesis with high oxygen hydrocarbons—(carbon dioxide, oxygen) C.-F. Chen, S.-H. Chen, T.-M. Hong (Hsinchu, Taiwan), H.-W. Ko and S. E. Sheu (Lungtan, Taiwan) ADVANCES IN COATING AND THIN FILM CHARACTERIZATION Microstructural characterization and imaging techniques Calibration of an off-axis quartz crystal thickness monitor for a pulsed laser deposition system using a high resolution scanning electron microscope S. D. Walck, J. S. Zabinski, M. S. Donley (Wright Patterson, OH, USA) and J. E. Bultman (Dayton, OH, USA) XRD characterization of multilayered systems P. Scardi, L. Lutterotti (Mesiano, Italy) and A. Tomasi (Povo, Italy) Temperature dependence of atomic mixing at the copper-silicon interface A. M. Ektessabi (Kyoto, Japan) Low energy electron microscopy studies of Ge and Ag growth on Si(111) A. W. Denier van der Gon, R. M. Tromp and M. C. Reuter (Yorktown Heights, NY, USA) Surface and thin film analysis techniques Thermal modeling of a calorimetric technique for measuring the emittance of surfaces and coatings D. A. Jaworske (Cleveland, OH, USA) Further investigation of proton elastic scattering cross-section on carbon and silicon T. Xie (McMinnville, OR, USA), J. Liu (Chicago, IL, USA) and H. J. Fischbeck (Norman, OK, USA) Energy calibration accomplished by proton resonance scattering simulation T. Xie (McMinnville, OR, USA), J. Liu (Chicago, IL, USA) and H. J. Fischbeck (Norman, OK, USA) Application of X-ray photoelectron spectroscopy valence bands in studying ceramic surfaces and interfaces D. Majumdar and D. Chatterjee (Rochester, NY, USA) Auger electron spectroscopy studies of interfacial reactions in metal/semiconductor multilayers activated during differential scanning calorimetry measurements A. Zalar (Ljubljana, Slovenia), S. Hofmann, F. Pimentel (Stuttgart, Germany) and P. Panjan (Ljubljana, Slovenia) New trends in analytical tribology J. M. Martin and M. Belin (Ecully, France) Optical properties and surface morphology studies of palladium contacts on mercuric iodide single crystals M. A. George, M. Azoulay, A. Burger, Y. Biao, E. Silberman (Nashville, TN, USA) and D. Nason (Goleta, CA, USA) Non-destructive characterization techniques Decorative hard coatings: advances in optical characterization techniques U. Beck, G. Reiners and K. Witt (Berlin, Germany) Photothermal characterization of optical thin films Z. L. Wu, P. K. Kuo, L. Wei, S. L. Gu and R. L. Thomas (Detroit, MI, USA) In-situ characterization techniques Kinetics of aluminium film oxidation measured by a modified quartz crystal microbalance M. Martin and E. Fromm (Stuttgart, Germany) Investigation of the adhesion mechanisms of silicon alloy thin films on polymer substrates by IR ellipsometry B. Drévillon (Palaiseau, France), J. C. Rostaing (Les Loges en Josas, France) and S. Vallon (Palaiseau, France) Mechanical properties and film adhesion Elastic behaviour of TiN thin films M. Elena, M. Bonelli (Povo, Italy), C. E. Bottani, G. Ghislotti (Milano, Italy), A. Miotello (Povo, Italy), P. Mutti and P. M. Ossi (Milano, Italy) The nanoindentation response of systems with thin hard carbon coatings S. V. Hainsworth, T. Bartlett and T. F. Page (Newcastle upon Tyne, UK) The temperature-variant hardness response of duplex TBCs P. C. Twigg and T. F. Page (Newcastle upon Tyne, UK) Finite element studies of tensile testing on thin film multilayers D. Krus, Jr, and R. W. Hoffman (Cleveland, OH, USA) An overview on metal/PET adhesion J. F. Silvain (Talence, France) and J. J. Ehrhardt (Villers-lés-Nancy, France) Interface structure and adhesion of sputtered Ti layers on Si: the effect of heat treatment I. Kondo, T. Yoneyama, K. Kondo, O. Takenaka (Kariya, Japan) and A. Kinbara (Tokyo, Japan) Cusp-like flaws along a rough surface J. Li, C.-H. Chiu, H. Gao (Stanford, CA, USA) and T.-W. Wu (San Jose, CA, USA) Measurement of Young’s moduli of TiC-coated film by the X-ray method H. Asada (Nagoya, Japan), Y. Kishi and Y. Hirose (Kanazawa, Japan) Measurement of the adhesion of TiN and Al coatings by fracture mechanics tests D. Miiller, Y. R. Cho and E. Fromm (Stuttgart, Germany) TOPICAL CONFERENCE ON ADVANCED METALLIZATION Advanced metallization: materials and processes Advanced multilayer metallization schemes with copper as interconnection metal S. P. Murarka, R. J. Gutmann (Troy, NY, USA), A. E. Kaloyeros and W. A. Lanford (Albany, NY, USA) Properties of titanium and aluminum thin films deposited by collimated sputtering D. Liu, S. K. Dew, M. J. Brett (Edmonton, Alb., Canada), T. Janacek, T. Smy (Ottawa, Ont., Canada) and W. Tsai (Palo Alto, CA, USA) Selective plasma deposition M. A. Ray, J. Duarte and G. E. McGuire (Research Triangle Park, NC, USA) Advanced dielectrics and planarization: materials and processes Stability and surface morphology of films obtained by a chemical vapor deposition process H. J. Viljoen (Lincoln, NE, USA) Characterization of phosphosilicate glass films obtained using plasma-enhanced chemical vapor deposition from tetra- ethylorthosilicate and trimethylphosphite C. L. Pillote, F. A. Shemansky (Mesa, AZ, USA), T. S. Cale and G. B. Raupp (Tempe, AZ, USA) Diffusion barriers Kinetics and conformality of TiN films from TDEAT and ammonia T. S. Cale, M. B. Chaara, G. B. Raupp (Tempe, AZ, USA) and I. J. Raaijmakers (San Jose, CA, USA) Amorphous W49Re4oBo o diffusion barriers for ¢<Si>/Al and <Si>/Cu metallizations E. Kolawa, X. Sun, J. S. Reid, J. S. Chen, M.-A. Nicolet and R. Ruiz (Pasadena, CA, USA) Study of sputtered molybdenum nitride as a diffusion barrier V. P. Anitha, A. Bhattacharya, N. G. Patil and S. Major (Bombay, India) Properties of chemical-vapor-deposited titanium nitride J. B. Price, J. O. Borland and S. Selbrede (Sunnyvale, CA, USA) Evaluation of amorphous (Mo, Ta, W)-—Si-N diffusion barriers for <Si>|Cu metallizations J. S. Reid, E. Kolawa, R. P. Ruiz and M.-A. Nicolet (Pasadena, CA, USA) Manufacturing aspects of low pressure chemical-vapor-deposited TiN barrier layers E. O. Travis and R. W. Fiordalice (Austin, TX, USA) Characterization of low pressure chemically vapor-deposited tungsten nitride films S. D. Marcus and R. F. Foster (Phoenix, AZ, USA) Spatial composition variation in sputtered Ti-W films B. R. Rogers (Mesa, AZ, USA) and T. S. Cale (Tempe, AZ, USA) Topical conference on advanced metallization (Poster session) Mass and surface conductivity gain on polymer surfaces metallized using vacuum arc deposition R. L. Boxman and S. Goldsmith (Tel Aviv, Israel) Properties of reactively sputter-deposited Ta—N thin films X. Sun, E. Kolawa, J.-S. Chen, J. S. Reid and M.-A. Nicolet (Pasadena, CA, USA) Three-dimensional simulation of an isolation trench refill process H. Liao and T. S. Cale (Tempe, AZ, USA) Author Index Subject Index