Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium PDF
Preview Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium
THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium Edited by E.BEYNE IMEC, Leuven, Belgium C.J.M. LASANCE v., Philips B. Eindhoven, The Netherlands and J. BERGHMANS Catholic University Leuven, Leuven, Belgium SPRINGER-SCIENCE+BUSINESS MEDIA, B.V. A C.I.P. Catalogue record for this book is available from the Library of Congress. ISBN 978-94-010-6318-0 ISBN 978-94-011-5506-9 (eBook) DOI 10.1007/978-94-011-5506-9 Printed on acid-free paper AII Rights Reserved © 1997 Springer Science+Business Media Dordrecht Originally published by Kluwer Academic Publishers in 1997 No part of the material protected by this copyright notice may be reproduced or utilized in any form or by any means, electronic or mechanical, incJuding photocopying, recording or by any information storage and retrieval system, without written permis sion from the copyright owner. CONTENTS PREFACE ............................................................................................... IX ACKNOWLEDGEMENTS ........................................................................ xi 1. INVITED LECTURES .......................................................................... 1 The Numerical Modelling of Heat Transfer in Electronic Systems: Challenges and Ideas of Answer J. Saulnier ................................................................................................ 3 DELPHI -A Status Report on the ESPRIT funded Project for the Creation and Validation of Thermal Models of Electronic Parts H. Rosten ............................................................................................... 17 Temperature Effects on Reliability M. Pecht, P. Lall, E. Hakim ...................................................................... , ... 27 2. ANALYTICAL AND COMPUTATIONAL THERMAL MODELING ....................................................................... .43 Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications -Experimental Validation P. Lybaert, C. Naveau, D. Petitjean, E. Filippi, A. Sturbois ............................... .45 Conjugate Model of a Pinned-Finned Heat-sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool D. Agonafer, A. Free .................................................................................. .53 Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction between Three Integrated Circuits B. Fourka, J.B. Saulnier ...............................................................................6 3 Heat Transfer in Tridimensional Plastic Packages Stacks of Memory Chips Y. Scudeller, C. Val ....................................................................................7 3 Electrothermal Simulation of Analogue Integrated Circuits with ETS W. Van Petegem, B. Geeraerts, W. Sansen ........................................................ 83 Calculations of the Temperature Distribution throughout Electronic Equipments by the Boundary Element Method. J.P. Fradin, B. Desaunettes .............................................................................9 3 An Interactive Thermal Characterisation of Component Placement J.L. Blanchard, S. Louage .............................................................................. 103 v VI 3. THERMAL CHARACTERISATION ............................................... 113 Thermal Characterization of Electronic Devices by means of Improved Boundary Condition Independent Compact Models H. Vinke, C. Lasance .................................................................................. 115 Experimental Validation Methods for Thermal Models W. Temmerman, W. Nelemans, T. Goossens, E. Lauwers, C. Lacaze .................. 125 Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment F. Christiaens, E. Beyne, W. Temmerman, K. Allaert, W. Nelemans .................. 137 Modelling of IC-Packages based on Thermal Characteristics I. Ewes ............................................................................................. 149 Characterisation of Thermally Enhanced Plastic Packages A. Bjiirneklett, G. Gustavsson ....................................................................... 159 Thermal Characterization of Multistripe Heterostructure Lasers V. Lepaludier, Y. Scudeller .......................................................................... 167 Application of Thermal Territories for Air Cooled Circuit Board Design A. Miilhammar ........................................................................................... 179 Thermal Impedance Evaluation for Industrial Power Profiles V. Motta, C.M. Villa, T. Zhou ...................................................................... 187 Thermal Characterisation and Modelisation of Multichip Modules using Standard Electronic Packages A. Belache, T. Gautier, J.e. Boisde, N. Leveau, G. Paulet ................................. 195 Measurement of Practical Thermal Resistance Values for Multi-Cavities Power Hybrids (MCPH) in a Vacuum Environment D. Petitjean, P. Lybaert, E. Filippi, A. Sturbois .............................................. 203 4. SINGLE AND MULTI-PHASE CONVECTIVE COOLING .............. 213 Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermo siphons for Cooling of Electronic Components N. Tengblad, B. Palm ................................................................................. 215 Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package D. Pal, Y. Joshi ......................................................................................... 227 Vll High Performance Air Cooled Heat-sinks for Power Packages A. Aranyosi, L. Bolle, H. Buyse .................................................................. 243 Thermal Control of Broadcast Transmitters by Air Cooled Cold Plates G. Cesini, E. Fumi, V. Moro, R. Ricci .......................................................... 253 Natural Convection Experiments with Cuboids and Cylinders of Equal Area R. Van Es, R.M. Noort, CJ.M. Lasance ............................................................. 263 Natural Convection Heat Transfer of Metal Cuboids Flush-Mounted in a Horizontal Plate J. Drabbels ............................................................................................. 273 5. MEASUREMENT TECHNIQUES ..................................................... 281 Visualisation of Natural Convection in Inclined Heated Parallel Plates O. Manca, B. Morrone, S. Nardini ................................................................. 283 New Jedec Standards for Thermal Measurements: Review and Examples V. Motta ............................................................................................. 293 Experimental Study on Local Convective Heat Transfer from Protruding Cubical Components E. Meinders, T. vd Meer, C. Hoogendoom, C. Lasance ....................................... 301 Modelling of Axial Fans for Electronic Equipment J. Henissen, J. Berghmans, W. Temmerman, K. Allaert ..................................... 309 6. THERMOMECHANICAL MODELLING ......................................... 319 Thermal Degradation of Power Modules L. Tielemans, G. Gregoris, L. De Schepper, M. D'Olieslaeghers ......................... 321 Thermal and Thermomechanical Modelling of Ball Grid Array Packages T. Fromont ............................................................................................. 329 Thermal and Thermomechanical Evaluation of a "Chip in Moulded Interconnect Device" F. Christiaens, E. Beyne, J. Roggen, J. Van Puymbroeck, M. Heerman ................ 339 Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by means of Finite Element Analysis J.P. Sommer, R. Dudek, B. Michel, M. Boheim, W. Hager ............................... 349 Author Index ........................................................................................... 361 PREFACE For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems. The Organising Committee succeeded in assembling an interesting conference program consisting of 38 oral and poster presentations, four invited lectures, two pre-conference tutorials, ten company exhibits and a post-conference meeting on thermal measurement standardisation. The 130 attendees from 17 different countries clearly illustrate the high interest in the subject of this seminar. Therefore it was decided that this seminar will ix x be organised for the third time in 1997. This seminar will be hosted by ISITEM of the Univeristy of Nantes in France, from September 24 to 26, 1997. The Organising Committee thanks the authors for submitting papers to this conference as well as the Scientific Committee in selecting and editing the papers. Special acknowledgements are due to the conference secretary Mrs. Chantal Deboes and ir. Filip Christiaens for their hard work in making this conference happen. Eric Beyne, C.J.M. Lasance and J.Berghmans, editors ACKNOWLEDGEMENTS exhibition participants Cambridge Accusence FEMCONSULT 900 Mt. Laurel Circle Torenstraat 36 Shirley MA 01464 3384 Attenrode-Wever U.S.A. Belgium Flowmerics Limited FLUID DYNAMICS INTERNATIONAL 81 Bridge Road NeuhofstraBe 9 Hampton Court, Surrey KT8 9HH 64625 Bensheim England Germany IMEC OPTILAS Kapeldreef 75 Postbus 222 3001 Leuven 2400 AE Alphen ald/ Rijn Belgium The Netherlands PARKER HANNIFIN -CHOMERICS SDRC Parkway Globe Park Rivium Quadrant 81 Marlow, Bucks SL71YB 2409 LC Capelle aid IJssel England The Netherlands SEMI DICE INTERNATIONAL ZUKEN-REDAC Middel6 3 Avenue du Canada 1551 SP Westzaan LP 803-91974 Les Ulis Cedex The Netherlands France xi 1. INVITED LECTURES
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