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Mechanical Engineering Series Chakravarti V. Madhusudana Thermal Contact Conductance Second Edition Mechanical Engineering Series Editor-in-Chief Frederick F. Ling Advisory Board/Series Editor D. Gross V. C. Mow H. T. Yang D. Bryant J. R. Welty K. K. Wang G.-A. Klutke A. E. Bergles W. O. Winer For furthervolumes: http://www.springer.com/series/1161 The Mechanical Engineering Series features graduate texts and research mono- graphs to address the need for information in contemporary mechanical engineering, including areas of concentration of applied mechanics, biomechanics, computational mechanics, dynamical systems and control, energetics, mechanics ofmaterials, processing, production systems, thermal science, and tribology. Chakravarti V. Madhusudana Thermal Contact Conductance Second Edition 123 Chakravarti V.Madhusudana Sydney, NSW Australia ISSN 0941-5122 ISSN 2192-063X (electronic) ISBN 978-3-319-01275-9 ISBN 978-3-319-01276-6 (eBook) DOI 10.1007/978-3-319-01276-6 SpringerChamHeidelbergNewYorkDordrechtLondon LibraryofCongressControlNumber:2013943984 (cid:2)SpringerInternationalPublishingSwitzerland2014 Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeorpartof the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation,broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,andtransmissionor informationstorageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilar methodology now known or hereafter developed. Exempted from this legal reservation are brief excerpts in connection with reviews or scholarly analysis or material supplied specifically for the purposeofbeingenteredandexecutedonacomputersystem,forexclusiveusebythepurchaserofthe work. Duplication of this publication or parts thereof is permitted only under the provisions of theCopyright Law of the Publisher’s location, in its current version, and permission for use must always be obtained from Springer. Permissions for use may be obtained through RightsLink at the CopyrightClearanceCenter.ViolationsareliabletoprosecutionundertherespectiveCopyrightLaw. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publicationdoesnotimply,evenintheabsenceofaspecificstatement,thatsuchnamesareexempt fromtherelevantprotectivelawsandregulationsandthereforefreeforgeneraluse. While the advice and information in this book are believed to be true and accurate at the date of publication,neithertheauthorsnortheeditorsnorthepublishercanacceptanylegalresponsibilityfor anyerrorsoromissionsthatmaybemade.Thepublishermakesnowarranty,expressorimplied,with respecttothematerialcontainedherein. Printedonacid-freepaper SpringerispartofSpringerScience+BusinessMedia(www.springer.com) Dedicated to the memory of my parents Preface to the First Edition Overthepastfiftyyears,asignificantamountoffundamentalandappliedresearch has been carried out in the field of contact heat transfer. In this book, I have attemptedtosynthesisetheinformationgeneratedandpresentitinaformthatis,I hope, interesting to the practising engineer, scientist or student. For this reason, many applications are enumerated in the Introduction and emphasised in the later chapters.Itisalsohopedthatthematerialpresentedisreadilyunderstandable. To thisend,Ihaveexplainedinsomedetailthestepsinvolvedindevelopingthebasic conceptsinChapters2and3.Although,writtenmainlyforthegeneralistengineer orphysicist,Ibelievethereissufficientdetail,especiallyinChapters4,6and7to beofinteresttothespecialistortheadvancedstudentinthefield.Chapter5should be of particular interest to those contemplating experimental determination of thermal contact conductance and associated problems. Although more than 500 references were consulted during the preparation of themanuscript,onlyafewrepresentativeonesineachcategoryhavebeencited,so that the actual number of references listed is approximately half the number consulted. For the sake of systematic and chronological development of each particulartheme,however,earlypioneeringworkinthatareahasnecessarilybeen cited. In general, reference has not been made to internal reports, theses or other work that is not readily available in open literature. Because of language limita- tions, references in English or English translations of references in other lan- guages, have been used. Some graphs and diagrams from original sources have been modified and redrawn to suit the format of this work. These have been identified by the words ‘‘after’’ or ‘‘based on’’ followed by the reference to the source. Sincethesubjectofcontactheattransferhasabroadrange,itislikelythatsome topicshavebeenomittedinaworkofthissize.Ihope,however,thatthemajority of topics, both basic and applied, have received some airing. ItisapleasuretoacknowledgemydebtofgratitudetoDr.ArthurWilliamswho introducedmetocontactheattransferatMonashUniversity.Isincerelyappreciate thehelpandcooperationthatIreceivedfromProfessorSkipFletcherandProfessor BudPetersonduringmysabbaticalsatTexasA&MUniversity.Particularmention must be made of the vast source of references that I had access to during those periods.IamgratefultoProfessorBrianMiltonandProfessorMarkWainwrightof the University of New South Wales for ‘‘reassigning my duties’’ in lieu of a vii viii PrefacetotheFirstEdition sabbaticalduringthefirsthalfof1993.Thishelpedmeingathering,collatingand updatingthematerialforthiswork.Finally,mythanksgotomywifeNaguforher supportand understanding. C. V. Madhusudana Preface to the Second Edition More than 17 years have passed since the first edition of Thermal Contact Conductanceappearedinprint.Ihavetakenthisopportunitytorevisethebookin order to reflect the developments in contact heat transfer that have taken place during the intervening years. This revision has also involved reading, reviewing and abstracting from over 150 recent technical papers, reports and theses. Amainfeatureofthiseditionisthatseveralnewandrelevanttopicshavebeen added. These include: Thermal boundary resistance, gap liquid conductance, transient experimental techniques, periodic contacts, heat transfer in sliding friction, carbon nano tubes and other recently developed thermal interstitial materials, finned tube heat exchangers, manufacturing processes, contact heat transfer at low temperatures and non-metallic materials. About75 %(96outof129)ofthediagramshavebeenspeciallydrawnforthis edition. Whiletherevisionhasbeenextensive,itishopedthatthespiritandtheformat of this edition remain the same as in the first. My sincere thanks go to Prof. Tomasz Wisniewski for helpful correspondence regarding periodic contacts and permission to use Fig. 6.25. It isa pleasuretoacknowledge the help andsupportofSpringer editorialstaff, especially Alex Greene, Ania Levinson and Jessica Lauffer. As in the previous edition, I wish to thank my wife Nagu for her continuous encouragement and understanding during the preparation of the manuscript. Chakravarti V. Madhusudana ix Acknowledgments The author thanks the following publishers for granting permission to use copy- righted material: • American Institute of Physics for 1. Figure 3.15 (Zhou et al. 2011, Applied Physics Letters, 99:063110) 2. Figure 7.10 (Son et al. 2008, Journal of Applied Physics, 103:024911) 3. Figure 8.16 (Bendada et al. 2003, Rev Scientific Instruments, 74:5282–5284) 4. Figure 9.1 (Mykhyalik et al. 2012, Rev Scientific Instruments, 83:034902) 5. Figure9.5and9.6(Wangetal.2006,RevScientificInstruments,77:024901) • The American Society of Mechanical Engineers, for Figs. 9.12 and 9.13 (Li et al. 2000, Trans ASME, J Heat Transfer, 122:46–49) • Elsevier Inc for 1. Figures 6.10 and 6.11 (Yeh et al. 2001, Experimental Thermal and Fluid Science, 25:349–357) 2. Figure 8.3 (Jeong et al. 2006, Int J Heat and Mass Transfer, 49:1547–1555) • Pergamon for 1. Figure 4.4 (Wahid and Madhusudana, 2000, Int J Heat Mass Transfer, 43:4483–4487) 2. Figures 6.26 and 6.27 (Wang and Degiovanni 2002, Int J Heat and Mass Transfer 45:2177–2190) 3. Figure 7.11 (Cola et al. 2009, Int J Heat and Mass Transfer 52 3490–3503) 4. Figure 7.12 (Shaikh et al. 2007, Carbon, 45:695–703) 5. Figure 8.25 (Hadley, 1986, Int J Heat Mass Transfer, 29:909–920) 6. Figures 9.2 and 9.3 (Xu and Xu, 2005, Cryogenics, 45:694–704) • Springer for the use of data in Table 7.6 (Abadi and Chung, 2011, Journal of Electronic Materials, 40:1490–1500) ThanksarealsoduetoCopyrightClearanceCenterforfacilitatingmanyofthe permissions listed above. xi