Theory and Practice of Thermal Transient Testing of Electronic Components

389 Pages·2022·15.501 MB·English

by  Márta Rencz, Gábor Farkas, András Poppe

Márta Rencz
Gábor Farkas
András Poppe   Editors
Theory and
Practice of Thermal
Transient Testing
of Electronic
Components
Theory and Practice of Thermal Transient Testing
of Electronic Components
ThiSisaFMBlankPage
á (cid:129) á (cid:129) á
M rta Rencz G bor Farkas Andr s Poppe
Editors
Theory and Practice
of Thermal Transient Testing
of Electronic Components
Editors
MártaRencz GáborFarkas
SiemensDigitalIndustrySoftwareSTS SiemensDigitalIndustrySoftwareSTS
Budapest,Hungary Budapest,Hungary
BudapestUniversityofTechnology
andEconomics
Budapest,Hungary
AndrásPoppe
SiemensDigitalIndustrySoftwareSTS
Budapest,Hungary
BudapestUniversityofTechnology
andEconomics
Budapest,Hungary
ISBN978-3-030-86173-5 ISBN978-3-030-86174-2 (eBook)
https://doi.org/10.1007/978-3-030-86174-2
©TheEditor(s)(ifapplicable)andTheAuthor(s),underexclusivelicensetoSpringerNatureSwitzerland
AG2022
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materialisconcerned,specificallytherightsoftranslation,reprinting,reuseofillustrations,recitation,
broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,andtransmissionorinformation
storageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilarmethodology
nowknownorhereafterdeveloped.
Theuseofgeneraldescriptivenames,registerednames,trademarks,servicemarks,etc.inthispublication
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This book is dedicated to the memory of
Vladimír Székely, who was the founder of the
network identification by deconvolution
method, and who was the teacher of all the
authors.
The authors wish to acknowledge the support
of the Budapest University of Technology and
Economics and Siemens Digital Industries,
which were invaluable in the preparation of
this book.
Gábor Farkas
András Poppe
Márta Rencz
Zoltán Sárkány
András Vass-Várnai
“Heat, like gravity, penetrates every
substance of the universe, its rays occupy
all parts of space.”
Motivation for the research of heat
equations,
by Joseph Fourier,
inThe AnalyticalTheory of Heat,1822 [1]
“The force of the current in a galvanic
circuitisproportionaldirectly tothesumof
all the tensions, and inversely to the entire
reduced length of the circuit.”
Firstformulationofanequationdescribing
a discretized electric system,
by Georg Simon Ohm,
in The galvanic circuit investigated
mathematically, 1827 [2]
Contents
1 WhyWasWrittenandHowtoReadThisBook. . . . . . . . . . . . . . . . 1
MártaRenczandGáborFarkas
2 TheoreticalBackgroundofThermalTransientMeasurements. . . . . 7
GáborFarkas,AndrásPoppe,andMártaRencz
3 ThermalMetrics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
AndrásPoppeandGáborFarkas
4 Temperature-DependentElectricalCharacteristics
ofSemiconductorDevices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
GáborFarkas
5 FundamentalsofThermalTransientMeasurements. . . . . . . . . . . . . 171
GáborFarkas
6 ThermalTransientMeasurementsonVariousElectronic
Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
GáborFarkas,AndrásPoppe,ZoltánSárkány,
andAndrásVass-Várnai
7 TheUseofThermalTransientTesting. . . . . . . . . . . . . . . . . . . . . . . 319
MártaRencz,GáborFarkas,ZoltánSárkány,
andAndrásVass-Várnai
8 OntheAccuracyandRepeatabilityofThermalTransient
Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353
AndrásPoppeandMártaRencz
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371
Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383
ix
Chapter 1
Why Was Written and How to Read
This Book
MártaRenczandGáborFarkas
Thermal transient measurements have become the most important characterization
method of the thermal behavior of electronic systems in the last decades. This
development is mainly due to the emergence of a new methodology, the structure
function method, which is based on the network identification by deconvolution,
introducedbyV.Székely.Thismethodologyinitsmatureformoffersa“lookinside
thestructure”ofanelectroniccomponentwithasingle electricalmeasurementand
the subsequent automated evaluation in software. It helps reveal data about the
partial thermal resistances and capacitances inside the structure at all levels of an
assembly,startingatachipinadevicepackageormodule,throughthermalinterface
andothermateriallayersandvariouscoolingmounts.Themethodmayevenprovide
temperature data on internal surfaces in the heat-conducting path which are other-
wisenotaccessiblefortemperaturemeasurements.
Theusersofthemethodsoonunderstoodthatitisnotpuremagic,andtobeable
to fully exploit the capabilities of the methodology, a large amount of advanced
knowledge is needed about the operation and the structure of the devices that are
tested. In this book the authors, who are electrical engineers and university pro-
fessors, tried to collect all information that is needed to fully understand the
capabilitiesandthespecialtiesofthethermaltransientmeasurementtechnique.
Thebookisverytimelynow.Theprimarychallengeinpresentengineeringtasks
iscopingwiththegrowingpowerlevelinelectronicsystems.Powercontrollerunits
of electric cars and locomotives switch hundreds and thousands of amperes and
forward many kilowatts toward the engine in order to bring tons of weight into
M.Rencz(*)
SiemensDigitalIndustrySoftwareSTS,Budapest,Hungary
BudapestUniversityofTechnologyandEconomics,Budapest,Hungary
e-mail:[email protected]
G.Farkas
SiemensDigitalIndustrySoftwareSTS,Budapest,Hungary
©TheAuthor(s),underexclusivelicensetoSpringerNatureSwitzerlandAG2022 1
M.Renczetal.(eds.),TheoryandPracticeofThermalTransientTesting
ofElectronicComponents,https://doi.org/10.1007/978-3-030-86174-2_1
2 M.RenczandG.Farkas
motion. Solid-state lighting luminaires now operate in dozens and may dissipate
hundreds of watts. Wind turbines and their power conversion units operate in the
kilowatt to megawatt range, some high-voltage direct current electricity grid links
are already in operation worldwide, and many new ones in Europe are under
construction with a planned capacity of 1400 MW. The power density further
increases in most of the systems in electronics. Processors run now at aggressive
clock frequencies and dissipate hundreds of watts in a small box, video projectors
which were formerly of suitcase size now resemble a pocketbook, and mobile
phones produce although a few watts only but in a densely packed very thin case
withnoventilationatall.Thesehigh-powerlevelsrepresentanincreaseddangerof
overheatinganddamagingthedevices.
Many of the power electronic systems work in extremely harsh environments.
Automotive electronics, for example, must operate in the -30 to +80 °C external
temperaturerange;thisissimilarforwindturbines,automotivelightingsolutions,or
streetlightingluminaires.
Traditionally,thetemperatureoftheinternalsemiconductordeviceshasbeenthe
principal factor which limited the system operability and influenced the system’s
reliability and lifetime. Due to the moderate cost and mature manufacturing tech-
nologiessemiconductorpowerdevicestodayarestillmostlyproducedfromsilicon.
Under the above-outlined environmental conditions, they sometimes reach their
operation limits around 150 °C or 175 °C. With the advent of revolutionary wide
bandgapsemiconductormaterials,thisisexpectedtochangesoon,andthestructural
materials of the device package will represent the new bottleneck in the system
construction.
With increasingly sophisticated engineering and with the help of new thermal
design methods based on measurements and simulation, the overheating of critical
components can be prevented. Failure analysis shows that nowadays systems are
correctlydesignedinthisrespect;thetypicalcomponentbreakdowniscausedbythe
repeatedthermaltransients.Heatingandcoolinginduceshearstressatthematerial
interfaces inthestructure, mostly atthe dieattach, orthesolderjoints, resultingin
delamination, tear-off, etc. The poorer heat removal through a diminished surface
cancausethenthermalrunaway.
The theory of heat propagation in materials was elaborated as early as the first
decadesofthenineteenthcentury.Sincethen,weknowthattheheatflowsfromthe
heatsourcetowardtheambient,andtheactualtemperatureofanypointinbetween
dependsonthegeometricalstructure andthematerialpropertiesofthepartswhere
the heat flows through. Knowing the structure and the material parameters, the
temperature distribution and the heat flow paths can be determined, if the heating
sourcesare known.This calculationis doneby thermal simulation.Thermal simu-
lation can also reveal the time dependence of the temperature at any point in the
structure.
Inthecaseofthermaltransienttesting,theoppositeisdone.Thetimedependence
of the temperature change is measured at a well-selected point in the system,
resulting from a sudden change in the amount of the generated heat, and if the
structure and the material composition of the system are known, the resulting and