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“Frontmatter” The Electronic Packaging Handbook Ed. Blackwell, G.R. Boca Raton: CRC Press LLC, 2000 Library of Congress Cataloging-in-Publication Data The electronic packaging handbook / edited by Glenn R. Blackwell. p. cm. — (The electrical engineers handbook series) Includes bibliographical references. ISBN 0-8493-8591-1 (alk. paper) 1. Electronic packaging Handbooks, manuals, etc. I. Blackwell, Glenn R. II. Series. TK7870.15.E44 1999 621.381′046—dc21 99-41244 CIP This book contains information obtained from authentic and highly regarded sources. Reprinted material is quoted with permission, and sources are indicated. A wide variety of references are listed. Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use. Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, microfilming, and recording, or by any information storage or retrieval system, without prior permission in writing from the publisher. All rights reserved. Authorization to photocopy items for internal or personal use, or the personal or internal use of specific clients, may be granted by CRC Press LLC, provided that $.50 per page photocopied is paid directly to Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923 USA. The fee code for users of the Transactional Reporting Service is ISBN 0-8493-8591-1/00/$0.00+$.50. The fee is subject to change without notice. For organizations that have been granted a photocopy license by the CCC, a separate system of payment has been arranged. The consent of CRC Press LLC does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific permission must be obtained in writing from CRC Press LLC for such copying. Direct all inquiries to CRC Press LLC, 2000 N.W. Corporate Blvd., Boca Raton, Florida 33431. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation, without intent to infringe. © 2000 by CRC Press LLC No claim to original U.S. Government works International Standard Book Number 0-8493-8591-1 Library of Congress Card Number 99-41244 Printed in the United States of America 1 2 3 4 5 6 7 8 9 0 Printed on acid-free paper Preface The Electronic Packaging Handbook is intended for engineers and technicians involved in the design, manufacturing, and testing of electronic assemblies. The handbook covers a range of applied technologies and concepts that are necessary to allow the user to follow reasonable steps to reach a defined goal. The user is encouraged to follow the steps of concurrent engineering, which considers aspects of design, manufacturing, and testing during the design phase of a project and/or product. Each chapter begins with an introduction, which includes a Where Else? section. Because the topics considered in this handbook are interactive, this section guides the reader of a particular chapter to other sections of the handbook where similar issues are discussed. The Electronic Packaging Handbook is the latest in a series of major electrical/electronics engineering handbooks from CRC Press, including several that are published jointly with the IEEE Press: • The Electronics Handbook, Jerry C. Whitaker • The Electrical Engineering Handbook, 2nd ed., Richard C. Dorf • The Circuits and Filters Handbook, Wai-Kai Chen • The Control Handbook, William S. Devine • The Mobile Communications Handbook, Jerry D. Gibson • The Transforms and Applications Handbook, Alexander D. Poularikas This handbook covers a subset of the topics that exist in Whitaker’s The Electronics Handbook, and as such covers the included topics in more detail than that handbook, while restricting coverage to only topics directly related to electronics packaging. Electronics packaging continues to include expanding and evolving topics and technologies, as the demands for smaller, faster, and lighter products continue without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging, such as electronic, mechanical, and thermal designers, and manufacturing and test engineers, are all interdependent on each other’s knowledge. This handbook will assist each group in understanding other areas. Organization The two introductory chapters of this handbook are intended to provide an overview to the topics of project management and quality, and to surface mount technology generally. Following chapters then present more detailed information about topics needed to successfully design, manufacture, and test the packaging for an electronic product: 1. Fundamentals of the Design Process 2. Surface Mount Technology 3. Integrated Circuit Packages © 2000 by CRC Press LLC 4. Direct Chip Attach 5. Circuit Boards 6. EMC and Printed Circuit Board Design 7. Hybrid Assemblies 8. Interconnects 9. Design for Test 10. Adhesive and Its Application 11. Thermal Management 12. Testing 13. Inspection 14. Package/Enclosure 15. Electronics Package Reliability and Failure Analysis 16. Product Safety and Third-Party Certification The last two chapters cover reliability and failure analysis issues, which are necessary to understand both failure mechanisms, and also analysis of failed products and the safety issues that must be considered for any product that is intended to be sold to corporate or public consumers. The index is complete and was developed by the chapter authors. This index will be of great value to the reader in identifying areas of the book that cover the topics of interest. This handbook represents a multi-year effort by the authors. It is hoped that the reader will both benefit and learn from their work. Glenn R. Blackwell © 2000 by CRC Press LLC Contributors Bruce C. Beihoff Steli Loznen Ray Prasad Rockwell Automation The Standards Institution of Israel Ray Prasad Consultancy, Inc. Allen Bradley Tel Aviv, Israel Portland, OR Milwaukee, WI Janet K. Lumpp Glenn R. Blackwell Michael C. Shaw University of Kentucky Purdue University Design and Reliability Lexington, KY W. Lafayette, IN Department Rockwell Science Center Victor Meeldijk Constantin Bolintineanu Thousand Oaks, CA Diagnostic/Retrieval Systems Inc. Digital Security Controls, Ltd. Oakland, NJ Toronto, Ontario, Canada Peter M. Stipan Garry Grzelak Mark I. Montrose Rockwell Automation Teradyne Telecommunications Montrose Compliance Services, Inc. Allen-Bradley Deerfield, IL Santa Clara, CA Milwaukee, WI © 2000 by CRC Press LLC Contents 1 Fundamentals of the Design Process Glenn R. Blackwell 2 Surface Mount Technology Glenn R. Blackwell 3 Integrated Circuit Packages Victor Meeldijk 4 Direct Chip Attach Glenn R. Blackwell 5 Circuit Boards Glenn R. Blackwell 6 EMC and Printed Circuit Board Design Mark I. Montrose 7 Hybrid Assemblies Janet K. Lumpp 8 Interconnects Glenn R. Blackwell 9 Design for Test Glenn R. Blackwell 10 Adhesive and Its Application Ray Prasad 11 Thermal Management Glenn R. Blackwell 12 Testing Garry Grzelak and Glenn R. Blackwell © 2000 by CRC Press LLC 13 Inspection Glenn R. Blackwell 14 Package/Enclosure Glenn R. Blackwell 15 Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach Peter M. Stipan, Bruce C. Beihoff, and Michael C. Shaw 16 Product Safety and Third-Party Certification Constantin Bolintineanu and Steli Loznen Appendix A: Definitions © 2000 by CRC Press LLC Blackwell, G.R. “Fundamentals of the Design Process” The Electronic Packaging Handbook Ed. Blackwell, G.R. Boca Raton: CRC Press LLC, 2000 1 Fundamentals of the Design Process Glenn R. Blackwell 1.1 Handbook Introduction Purdue University 1.2 Concurrent Engineering 1.3 Systems Engineering 1.4 Quality Concepts 1.5 Engineering Documentation 1.6 Design for Manufacturability 1.7 ISO9000 1.8 Bids and Specifications 1.9 Reference and Standards Organizations 1.1 Handbook Introduction This handbook is written for the practicing engineer who needs current information on electronic packaging at the circuit level. The intended audience includes engineers and technicians involved in any or all aspects of design, production, testing, and packaging of electronic products regardless of whether those products are commercial or industrial in nature. This means that circuit designers participating in concurrent engineering teams, circuit board designers and fabricators, test engineers and technicians, and others will find this handbook of value. 1.2 Concurrent Engineering* In its simplest definition, concurrent engineering requires that a design team consider all appropriate issues of design, manufacturability, and testability during the design phase of a project/product. Other definitions will include repairability and marketability. Each user must define the included elements to best fit the specific needs. 1.2.1 Introduction Concurrent engineering (CE) is a present-day method used to shorten the time to market for new or improved products. Let it be assumed that a product will, upon reaching the marketplace, be competitive in nearly every respect, such as quality and cost, for example. But the marketplace has shown that products, even though competitive, must not be late to market, because market share, and therefore *Adapted from Whitaker, J., The Electronics Engineering Handbook, Chapter 146, “Concurrent Engineering,” by Francis Long, CRC/IEEE Press, 1997. © 2000 by CRC Press LLC