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RF and Microwave Passive and Active Technologies (Electrical Engineering Handbook) PDF

734 Pages·2007·32.04 MB·English
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Preview RF and Microwave Passive and Active Technologies (Electrical Engineering Handbook)

✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page i — #1 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page ii — #2 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page iii — #3 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page iv — #4 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page v — #5 ✐ ✐ Contents Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi Editors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii AdvisoryBoard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv Contributors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix IntroductiontoMicrowavesandRF PatrickFay. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1 1 OverviewofMicrowaveEngineering MikeGolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 SECTION I Passive Technologies 2 PassiveLumpedComponents AlfyRiddle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 3 PassiveMicrowaveDevices MichaelB.Steer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 4 DielectricResonators S.JerryFiedziuszko. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 5 RFMEMS KarlVarian . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 v ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page vi — #6 ✐ ✐ vi Contents 6 SurfaceAcousticWave(SAW)Filters DonaldC.Malocha . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 7 RFCoaxialCables MichaelE.Majerus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 CoaxialConnectors DavidAnderson . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 9 AntennaTechnology JamesB.West . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 10 PhasedArrayAntennaTechnology JamesB.West . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1 11 TheFresnel-ZonePlateAntenna JamesC.Wiltse. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 12 RFPackageDesignandDevelopment JeanneS.Pavio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1 SECTION II Active Device Technologies 13 Varactors JanStake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 14 SchottkyDiodeFrequencyMultipliers JackEastandImranMehdi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-1 15 TransitTimeMicrowaveDevices RobertJ.Trew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1 16 BipolarJunctionTransistors(BJTs) JohnC.Cowles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-1 17 HeterostructureBipolarTransistors(HBTs) WilliamLiu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-1 18 Metal-Oxide-SemiconductorField-EffectTransistors(MOSFETs) JulioCosta,MikeCarroll,G.AliRezvani,andTomMcKay . . . . . . . . . . . . . . . . . . . 18-1 ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page vii — #7 ✐ ✐ Contents vii 19 RFCMOSModelingandCircuitApplications JulioCosta,MikeCarroll,G.AliRezvani,andTomMcKay . . . . . . . . . . . . . . . . . . . 19-1 20 MetalSemiconductorFieldEffectTransistors MichaelS.Shur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-1 21 HighElectronMobilityTransistors(HEMTs) PrashantChavarkarandUmeshMishra . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-1 22 NitrideDevices RobertJ.Trew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 23 MicrowaveVacuumTubes JerryC.Whitaker,RobertR.Weirather,andThomasK.Ishii. . . . . . . . . . . . . . . . . . 23-1 24 MonolithicMicrowaveICTechnology LawrenceP.Dunleavy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24-1 25 BringingRFICstotheMarket JohnC.Cowles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 SECTION III Materials Properties 26 Metals MikeGolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-1 27 Dielectrics K.F.Etzold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27-1 28 FerroelectricsandPiezoelectrics K.F.Etzold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-1 29 MaterialPropertiesofSemiconductors H.MikeHarris. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29-1 AppendixA:Mathematics,Symbols,andPhysicalConstants . . . . . . . . . . . . A-1 AppendixB:MicrowaveEngineeringAppendix JohnP.Wendler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1 ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page viii — #8 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page ix — #9 ✐ ✐ Preface The first edition of the RF and Microwave Handbook was published in 2000. The project got off to an inauspiciousstartwhen24inchesofsnowfellinDenvertheeveningbeforetheadvisoryboardplannedto holdtheirkick-offmeeting.TwomembersoftheboardweretrappedfordaysintheDenverairportsince planeswerenotarrivingorleaving.Becauseofroadclosures,onememberwasstrandedonlymilesaway fromthemeetinginBoulder.AndtheremainderoftheboardwasstrandedinaDenverhotel10miles fromtheairport.Despitethisominousbeginning,aplanwasformed,expertauthorsrecruited,andthe bookwasdevelopedandpublished.Theplanninganddevelopmentofthissecondeditionhavebeenvery smoothanduneventfulincomparisontoourfirstefforts.Sincepublicationin2000,thevalueoftheRF andMicrowaveHandbookhasbeenrecognizedbythousandsofengineersthroughouttheworld. Three derivativehandbookshavealsobeenpublishedandembracedbythemicrowaveindustry.Theadvisory boardbelievesthatthiseditionwillbefoundtobeofevengreatervaluethanthefirstedition. Priortothe1990s,microwaveengineeringwasemployedalmostexclusivelytoaddressmilitary,satellite, andavionicsapplications.In1985,therewereafewlimitedapplicationsofRFandmicrowavesystemsthat laymenmightbefamiliarwithsuchassatelliteTVandtheuseofsatellitecommunicationsforoverseas phonecalls.Pagerswerealsoavailablebutnotcommon.Incontrast,by1990thewirelessrevolutionhad begun.Cellphoneswerebecomingcommonandnewapplicationsofwirelesstechnologywereemerging everyday.Companiesinvolvedinwirelessmarketsseemedtohavealicensetoprintmoney.Atthetime oftheintroductionofthefirsteditionoftheRFandMicrowaveHandbook,wirelesselectronicproducts werepervasive,butrelativelysimple,earlygenerationsoftheadvancedwirelessproductsavailabletoday. Atpresent,thenumberofpeopleusingwirelessvoiceanddatasystemscontinuestogrow.Newsystems suchas3Gphones, 4Gphones, andWiMAXrepresentemergingnewwirelessmarketswithsignificant growth potential. All of these wireless products are dependent on the RF and microwave component andsystemengineering, whichisthesubjectofthisbook. Duringthistimethemilitary, satellite, and avionicssystemshavealsobecomeincreasinglycomplex.Theresearchanddevelopmentthatdrivesthese applicationscontinuestoserveasthefoundationformostofthecommercialwirelessproductsavailable toconsumers. ThiseditionofthehandbookcoversissuesofinteresttoengineersinvolvedinRF/microwavesystem andcomponentdevelopment.Thesecondeditionincludessignificantlyexpandedtopiccoverageaswell asupdatedornewarticlesformostofthetopicsincludedinthefirstedition.Theexpansionofmaterial haspromptedthedivisionofthehandbookintothreeindependentvolumesofmaterial.Thechaptersare aimedatworkingengineers,managers,andacademicswhohaveaneedtounderstandmicrowavetopics outsidetheirareaofexpertise.Althoughthebookisnotwrittenasatextbook,researchersandstudents will find it useful. Most of the chapters provide extensive references so that they will not only explain fundamentalsofeachfield,butalsoserveasastartingpointforfurtherin-depthresearch. ix ✐ ✐ ✐ ✐

Description:
In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped compone
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