✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page i — #1 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page ii — #2 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page iii — #3 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page iv — #4 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page v — #5 ✐ ✐ Contents Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi Editors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii AdvisoryBoard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv Contributors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix IntroductiontoMicrowavesandRF PatrickFay. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1 1 OverviewofMicrowaveEngineering MikeGolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 SECTION I Passive Technologies 2 PassiveLumpedComponents AlfyRiddle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 3 PassiveMicrowaveDevices MichaelB.Steer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 4 DielectricResonators S.JerryFiedziuszko. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 5 RFMEMS KarlVarian . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 v ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page vi — #6 ✐ ✐ vi Contents 6 SurfaceAcousticWave(SAW)Filters DonaldC.Malocha . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 7 RFCoaxialCables MichaelE.Majerus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 CoaxialConnectors DavidAnderson . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 9 AntennaTechnology JamesB.West . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 10 PhasedArrayAntennaTechnology JamesB.West . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1 11 TheFresnel-ZonePlateAntenna JamesC.Wiltse. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 12 RFPackageDesignandDevelopment JeanneS.Pavio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1 SECTION II Active Device Technologies 13 Varactors JanStake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 14 SchottkyDiodeFrequencyMultipliers JackEastandImranMehdi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-1 15 TransitTimeMicrowaveDevices RobertJ.Trew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1 16 BipolarJunctionTransistors(BJTs) JohnC.Cowles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-1 17 HeterostructureBipolarTransistors(HBTs) WilliamLiu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-1 18 Metal-Oxide-SemiconductorField-EffectTransistors(MOSFETs) JulioCosta,MikeCarroll,G.AliRezvani,andTomMcKay . . . . . . . . . . . . . . . . . . . 18-1 ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page vii — #7 ✐ ✐ Contents vii 19 RFCMOSModelingandCircuitApplications JulioCosta,MikeCarroll,G.AliRezvani,andTomMcKay . . . . . . . . . . . . . . . . . . . 19-1 20 MetalSemiconductorFieldEffectTransistors MichaelS.Shur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-1 21 HighElectronMobilityTransistors(HEMTs) PrashantChavarkarandUmeshMishra . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-1 22 NitrideDevices RobertJ.Trew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 23 MicrowaveVacuumTubes JerryC.Whitaker,RobertR.Weirather,andThomasK.Ishii. . . . . . . . . . . . . . . . . . 23-1 24 MonolithicMicrowaveICTechnology LawrenceP.Dunleavy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24-1 25 BringingRFICstotheMarket JohnC.Cowles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 SECTION III Materials Properties 26 Metals MikeGolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-1 27 Dielectrics K.F.Etzold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27-1 28 FerroelectricsandPiezoelectrics K.F.Etzold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-1 29 MaterialPropertiesofSemiconductors H.MikeHarris. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29-1 AppendixA:Mathematics,Symbols,andPhysicalConstants . . . . . . . . . . . . A-1 AppendixB:MicrowaveEngineeringAppendix JohnP.Wendler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1 ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page viii — #8 ✐ ✐ ✐ ✐ ✐ ✐ ✐ ✐ “7220_C000” — 2007/11/17 — 9:53 — page ix — #9 ✐ ✐ Preface The first edition of the RF and Microwave Handbook was published in 2000. The project got off to an inauspiciousstartwhen24inchesofsnowfellinDenvertheeveningbeforetheadvisoryboardplannedto holdtheirkick-offmeeting.TwomembersoftheboardweretrappedfordaysintheDenverairportsince planeswerenotarrivingorleaving.Becauseofroadclosures,onememberwasstrandedonlymilesaway fromthemeetinginBoulder.AndtheremainderoftheboardwasstrandedinaDenverhotel10miles fromtheairport.Despitethisominousbeginning,aplanwasformed,expertauthorsrecruited,andthe bookwasdevelopedandpublished.Theplanninganddevelopmentofthissecondeditionhavebeenvery smoothanduneventfulincomparisontoourfirstefforts.Sincepublicationin2000,thevalueoftheRF andMicrowaveHandbookhasbeenrecognizedbythousandsofengineersthroughouttheworld. Three derivativehandbookshavealsobeenpublishedandembracedbythemicrowaveindustry.Theadvisory boardbelievesthatthiseditionwillbefoundtobeofevengreatervaluethanthefirstedition. Priortothe1990s,microwaveengineeringwasemployedalmostexclusivelytoaddressmilitary,satellite, andavionicsapplications.In1985,therewereafewlimitedapplicationsofRFandmicrowavesystemsthat laymenmightbefamiliarwithsuchassatelliteTVandtheuseofsatellitecommunicationsforoverseas phonecalls.Pagerswerealsoavailablebutnotcommon.Incontrast,by1990thewirelessrevolutionhad begun.Cellphoneswerebecomingcommonandnewapplicationsofwirelesstechnologywereemerging everyday.Companiesinvolvedinwirelessmarketsseemedtohavealicensetoprintmoney.Atthetime oftheintroductionofthefirsteditionoftheRFandMicrowaveHandbook,wirelesselectronicproducts werepervasive,butrelativelysimple,earlygenerationsoftheadvancedwirelessproductsavailabletoday. Atpresent,thenumberofpeopleusingwirelessvoiceanddatasystemscontinuestogrow.Newsystems suchas3Gphones, 4Gphones, andWiMAXrepresentemergingnewwirelessmarketswithsignificant growth potential. All of these wireless products are dependent on the RF and microwave component andsystemengineering, whichisthesubjectofthisbook. Duringthistimethemilitary, satellite, and avionicssystemshavealsobecomeincreasinglycomplex.Theresearchanddevelopmentthatdrivesthese applicationscontinuestoserveasthefoundationformostofthecommercialwirelessproductsavailable toconsumers. ThiseditionofthehandbookcoversissuesofinteresttoengineersinvolvedinRF/microwavesystem andcomponentdevelopment.Thesecondeditionincludessignificantlyexpandedtopiccoverageaswell asupdatedornewarticlesformostofthetopicsincludedinthefirstedition.Theexpansionofmaterial haspromptedthedivisionofthehandbookintothreeindependentvolumesofmaterial.Thechaptersare aimedatworkingengineers,managers,andacademicswhohaveaneedtounderstandmicrowavetopics outsidetheirareaofexpertise.Althoughthebookisnotwrittenasatextbook,researchersandstudents will find it useful. Most of the chapters provide extensive references so that they will not only explain fundamentalsofeachfield,butalsoserveasastartingpointforfurtherin-depthresearch. ix ✐ ✐ ✐ ✐
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