RF and Microwave Module Level Design and Integration

337 Pages·2019·12.951 MB·English

by  Mohammad Almalkawi

IETMATERIALS,CIRCUITS AND DEVICES SERIES 34
RF and Microwave Module
Level Design and Integration
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RF and Microwave Module
Level Design and Integration
Mohammad Almalkawi
The Institution of Engineering andTechnology
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Contents
Listoffigures xiii
Listoftables xxi
Preface xxiii
Acknowledgments xxvii
Listofabbreviations xxix
1 RF andmicrowave device andmodule packaging 1
1.1 Introduction 1
1.2 Packaging technologies 1
1.2.1 System on chip 3
1.2.2 System on package 3
1.2.3 System in package 4
1.2.4 Wafer level packaging 5
1.2.5 Other packaging technologies 7
1.3 Microelectronics fabrication 8
1.3.1 Photolithography fabrication 9
1.3.2 Substrate technologies 11
1.3.3 Microelectronics metallization and characterization 14
1.3.4 Dielectric permittivity characterization 22
1.3.5 Cleanroom classifications 23
1.4 RFand microwave module types 25
1.4.1 Monolithic modules 25
1.4.2 Hybrid modules 25
1.4.3 Multichip modules 26
References 27
2 Lumpedanddistributed passive elements 29
2.1 Introduction 29
2.2 Lumped elements 30
2.2.1 Resistors 30
2.2.2 Capacitors 34
2.2.3 Inductors 42
2.3 Distributed elements 51
2.4 Design considerations 54
2.4.1 Self-resonant frequency 54
viii RF and microwave module level designand integration
2.4.2 Reactance slope 55
2.4.3 Inductor orientation 55
2.5 Miniaturization of distributed elements 56
2.5.1 High permittivity materials 56
2.5.2 Capacitively loaded transmission line 56
2.6 Quality factor calculation 58
2.6.1 Q-factor improvement methods of inductors 63
References 67
3 Basicsof microwave network analysis 69
3.1 Introduction 69
3.2 Microwave port analysis 69
3.2.1 Voltage–current-based parameters 70
3.2.2 Traveling wave-based parameters 74
3.3 Microwave network basic properties 80
3.3.1 Linearity 80
3.3.2 Time invariance 80
3.3.3 Reciprocity 80
3.3.4 Symmetry 80
3.3.5 Passivity 81
3.3.6 Lossless 81
3.4 Signal flow graph 81
3.5 De-embedding and embedding S-parameters 84
3.6 Two-port equivalent circuits 85
3.7 Passive and lossless circuit synthesis 86
3.7.1 Singly and doubly terminated networks 87
3.7.2 One-port circuit synthesis 89
3.7.3 Two-port circuit synthesis 96
References 100
4 Impedance matching networks 103
4.1 Introduction 103
4.2 Power transfer and power efficiency 104
4.3 Theoretical limitation onlossless matching networks 105
4.4 Single reactive element matching 106
4.5 Reactive L-section matching networks 107
4.5.1 Case I: RL>Re{Z } 108
0
4.5.2 Case II: RL <Re{Z } 108
0
4.6 T- and p-matching networks 114
4.6.1 T-matching Circuit 115
4.6.2 p-matching circuit 115
4.6.3 Inverters 116
4.7 Impedance matching usingtransformers 117
Contents ix
4.8 Tapped capacitor resonator matching network 119
4.9 Transmission lines-basedmatching networks 122
4.9.1 Quarter wavelength transformer 122
4.9.2 Radial stub 123
4.9.3 Multisection transformer 123
4.9.4 Tapered transmission lines 124
4.9.5 Nonuniformtransmission lines 124
4.10 Powergains 126
4.11 Source- and load-pull analysis 128
4.12 Design considerations 129
References 130
5 Electromagnetic field couplings 131
5.1 Introduction 131
5.2 Electromagnetic coupling types 132
5.2.1 Inductive coupling 133
5.2.2 Capacitive coupling 133
5.2.3 Mixed coupling 134
5.2.4 Common path coupling 134
5.3 Coupled transmission lines 135
5.3.1 Single transmission line 135
5.3.2 Symmetric coupled transmission lines 138
5.3.3 Asymmetrical coupled transmission lines 146
5.3.4 Additivity of electric and magnetic coupling 151
5.4 EM fields and shielding 153
5.4.1 Electromagnetic field boundary conditions 153
5.4.2 Near-, transition-, and far-field regions 156
5.4.3 Electromagnetic shielding 157
5.4.4 Interconnects shielding by via fence 162
5.5 Anisotropic laminate materials 163
5.6 PCBand laminate design considerations 165
References 167
6 CADof RFandmicrowave circuits andmodules 169
6.1 Introduction 169
6.2 Computational electromagnetic-basedsimulators 171
6.2.1 Commercially available CEMtools 171
6.2.2 Limitations of different CEMmethods 172
6.2.3 Boundary conditions 173
6.2.4 Volumetric and surface mesh 174
6.3 Circuit theory-based simulators 175
6.3.1 Linear circuit simulators 175
6.3.2 Nonlinear circuit simulators 180