Reflections on IPC APEX EXPO 2012 - magazines007.com

115 Pages·2012·29.13 MB·English

Electronics
Final Finishing
Universal Finish SolderBond (ENEPIG and ENEP)
for Soldering, Au-Wire and Cu-Wire Bonding
Process Flow
Cleaner
Pro Select UC Pure Pd
Micro Etch
MicroEtch C
Soldering Au-wire wedge
Dip
Aurodip (Option) &Q uSaaltifeilelidte f oTre Achenrooslopgayce
Pre Dip
Activator
Al-wire wedge Cu-wire wedge Aurotech Activator 1000
Gold Wire Bond Pull Test AuroFtienceh L FinLe P Pluoss tP Doispt Dip BGonodld F Winiirseh
10
9 Pd with Phosphorus 4-6 wt% Pure Pd (Option)
ev (g) 87
d D 6 Electroless Ni
3x St 54 Aurotech CNN mod.
Mean - 321 ElePctDro-Tleescsh Pd BCoonppdeFriWniisreh
Process ENEPIG UFSB ENEPIG UFSB ENEPIG UFSB ENEPIG UFSB ENEPIG UFSB ENEPIG UFSB
Pd Layer PdP pure Pd PdP pure Pd PdP pure Pd PdP pure Pd PdP pure Pd PdP pure Pd
Nickel µm 6.0 6.0 6.0 6.0 7.0 7.0 7.0 7.0 7.0 7.0 7.0 7.0 Immersion Au
Pd µm 0.05 0.05 0.15 0.15 0.25 0.25 0.05 0.05 0.15 0.15 0.25 0.25
Au µm 0.04 0.04 0.04 0.04 0.04 0.04 0.15 0.15 0.15 0.15 0.25 0.15 Aurotech SF Plus

Universal Finish SolderBond provides also with low Au-thickness excellent
results, as pure Pd is 50% softer than Palladium-Phosphor (4-6wt%).
NiPdAu (ENEPIG) NiPd (ENEP)
Features and Bene(cid:31) ts
Deposit Structure
▪ Three finishes (ENIG, ENEPIG and ENEP) in one process
Electroless Nickel 4.0 μm - 6.0 μm 4.0 μm - 6.0 μm
▪ ENEPIG is Au-wire and Al-wire bondable
Electroless Palladium 0.05 μm - 0.3 μm 0.2 μm - 0.3 μm
▪ ENEP is Cu-wire bondable
Immersion Au 0.02 μm - 0.06 μm --
▪ Wider Au-wire bond process window compared to ENEPIG
Functionality
with PdP
Soldering
▪ Pure Pd-layer without phosphorus co-deposition
Eutectic Sn/Pb Good Good
▪ Pure Pd is 50% softer than PdP
Sn-Ag-Cu Alloy Excellent Excellent
▪ Superior solder joint reliability
Contact Switching Yes --
▪ Excellent reliability regarding thermocycling, hot storage
Al Wire Bonding Yes --
test and humidity
Au Wire Bonding Yes --
▪ For wirebond processes of today and tomorrow
Cu Wire Bonding -- Yes
Atotech Headquarters · P.O. Box 21 07 80 · 10507 Berlin · Germany · www.atotech.com
Tel. [phone] · Fax [phone]

StAndArdS, SPECIfICAtIOnS
And APPrOvAlS
Standards and specifications are fundamental to the
F PcB industry both locally and internationally. these
e
a carefully crafted industry tools harmonize fabrica-
t
tion processes and safety requirements and define
u
r reproducible levels of product quality and reliability.
e
d However, several questions must be addressed: Which
standards are relevant to PcBs? Who is responsible for
c
o writing and enforcing them and what is there to gain
n by participating in the process? the March edition of
t the PcB Magazine navigates the who, what and why
e
n of today’s industry standards.
t
12 Connecting Innovation 76 Standards Boost Business for
Through Standards Development an Innovation Nation
by Dave Torp by S. Joe Bhatia
28 IEC Cooperative
Activities Yield
Maximum Benefit
for the Global
Electronics Market 86 Industry Standards—The Glue That
by Dieter Bergman and Marc Carter Holds Industries Together
by Joseph Fjelstad
40 Flying by the Seat of its Pants:
A View of EDA from the File
Format Standards Perspective
by Abby Monaco
IPC APEX EXPO 2012 Special Section
52 Post-Show Coverage and Reviews 61 iNEMI Update with
CEO Bill Bader
69 Show Floor Photos
65 IPC Addresses
73 Golf Tournament Collage Conflict Minerals
IPC APEX EXPO VIDEO INTErVIEwS: 69 New IPC Board Chair
Sets Sights on Future
55 Market Outlook
72 Mikel Williams’
59 PC Hall of Fame Award Government Relations
Winner Denny Fritz Update
4 The PCB Magazine • March 2012

MArCH 2012 S
&P
c VOluME 2 S
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n NuMBEr 3 ACA
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t THE DEFINITIVE rCD
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INTErACTIVE MAGAzINE
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DEDICATED TO THE AIOD
GlOBAl PCB INDuSTry l S
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thepcbmagazine.com
articleS coluMnS
88 Registering Multilayers 8 The Wrap Up
for Lamination: The by Ray Rasmussen
Challenge of Registering
New Materials on High- 18 Introduction to Board Level
Density Interconnection PCBs Simulation and the PCB Design
by Victor Lazaro and Paul R. Waldner Process
by Barry Olney
104 The Future of American PCB Shops, Part II:
Electronics Assembly and PCB Platform 36 Rigid-flex Manufacturing Part III:
by Harvey Miller Z-axis Expansion
by Dale Smith
48 How William Shatner
Changed the (PCB) World
by Steve Williams
82 It’s Not Your Father’s
106 CPCA Show 2012 Preview FR-4 Anymore
by Michael Carano
SHortS 100 Advances in Copper
17 Corporate Recognition Awards Plating, Part B
Honor DDi Corp. & Flextronics by Karl Dietz
24 AT&S Leads Hermes Consortium 112 Was it Good
for You?
35 Adams Named Prototron Circuit’s by Barry Matties
National Sales Manager
39 Cosmotronics Earns NADCAP Accreditation
neWS HigHligHtS
46 Polar Instruments Names Prochaska 26 Flex007 Highlights
N.A. Sales Manager
35 MilAero007 Highlights
51 Mentor Graphics Releases New PADS Suite
74 PCBDesign007 Highlights
extraS 103 Supplier/New Product Highlights
114 Events Calendar
110 Top Ten Most-Read News Highlights
115 Advertisers Index & Masthead from PCB007 This Month
6 The PCB Magazine • March 2012
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THE wAy I SEE IT

c
o
The Wrap Up
l
u
M
n

by Ray Rasmussen
i-connect007
Summary — real Time with…IPC, our video Pudles to Lead IPC
program, produced in conjunction with IPC, Steve Pudles, CEO of Spectral Response, has
taped more than 190 interviews, with many of the taken on the role of Chairman of the IPC Board
industry’s premier companies and top professionals. of Directors. Steve has served IPC in a variety
This was an amazing effort by the I-Connect007 of volunteer positions. His goals as chairman
crew to schedule and produce this impressive are to expand membership in IPC and continue
number of interviews for our global audience. to foster IPC standards throughout the
electronics industry. Currently, the IPC Board is
All-in-all it was a really good show; not a interviewing candidates for President of the IPC
great show, but a good one. The who’s who of to replace former President Denny McGuirk.
the industry descended on San Diego to hear
and see all the latest and greatest technology in Printed Electronics Exclusive Coverage
the industry. A solid technical program drew up Betting on the future and in support of
to 1,700 folks who then flowed onto the show their recent efforts into printed electronics
floor, delighting the exhibitors. Most of the (PE), IPC for the first time dedicated a section
folks we talked to were quite pleased with the of the show floor to this emerging technology.
quality of the traffic this year and satisfied with It’s encouraging to see this bet on this closely
their investment. related, and in some cases, game-changing
Initially, the weather didn’t cooperate, industry. Aligning with this effort, we invited PE
with Monday and Tuesday wet and drizzly, Technology Roadmap Subcommittee Chairman
disappointing many of those from out of town Dan Gamota to conduct a series of interviews
who were expecting San Diego to be warm and to outline IPC efforts, as well as introduce some
sunny. By the end of the week, the expected of those companies developing PE materials or
weather finally showed up with even warmer equipment. Dan’s interviews demonstrate the
weather predicted after most of us had already effort and position this exciting new industry
gone home. can play within the world of circuits.
Market Outlook
Walt Custer again walks us through the
market dynamics driving our industry in his
Market Outlook interview. Expectations for the
U.S. are flat for the first half of 2012, with the
second half finally experiencing some growth.
Nothing stellar is predicted, but we’ll take what
we can get. Not sure why Walt didn’t give his
presentation at this year’s conference like he’s
done for the past 20-plus years, but we have it
in this issue, so give it a look.
Hall of Fame Award
Denny Fritz has been inducted into the
Raymond E. Pritchard Hall of Fame. A quote
8 The PCB Magazine • March 2012

THE WRAP UP continues
from an IPC write-up about Denny said: “Back
then, companies were fierce competitors. Many
were run by wild-West entrepreneurs who
were real characters,” says Fritz. “IPC meetings
were exceedingly open and these guys were
ready to tell their competitors how they built
boards, which often provided the basis for
IPC standards. Their secret wasn’t in how they
made the boards, but the level of service they
provided their customers.”
A very long-time member and supporter of
the IPC, this well-deserved award couldn’t have
gone to a better guy. Congratulations, Denny.
Real Time with…IPC
Real Time with…IPC, our video program
produced in conjunction with IPC, produced
more than 190 interviews with many of with a corresponding interviewee. Thanks to:
the industry’s premier companies and top Kelly Dack (PCB designer), Mark Thompson
professionals. This was an amazing effort by the (PCB technologist), Bob Neves (reliability
I-Connect007 crew to schedule and produce expert), Dan Beaulieu (PCB business consultant),
this impressive number of interviews that Dan Gamota (printed electronics), Dr. Jennie
capture the essence of the show for our global S. Hwang (SMT, PCB assembly technologies),
audience. Thanks so much to our sponsors Mike Carano (PCB chemistries), Dick Crowe
who made this event possible: Aegis Software, (PCB lamination), Joe Fjelstad (PCB, PCBA, flex
Assembleon, BBG, Bürkle, Isola, Indium, Mentor circuits), Ron Lasky (PCB assembly materials),
Graphics, MicroCraft, Nordson Asymtek, P. Stuart Hayton (PCB equipment, and business)
Kay Metal, Prototron Circuits, Rehm Thermal and the I-Connect007 editorial staff: Andy
Systems, Saturn Electronics, and Sensible Micro Shaughnessy (PCB design), Pete Starkey (PCB
Corporation. and assembly) and Steve Gold (PCB business).
What really helped make this Real Time Great job, everyone; we killed it!
with… event exceptional isn’t the number of Special thanks to our own Jo Ann Sotelo,
interviews, but the quality. This year our team Program Manager; Bryson Matties, video
of editors went to great lengths to match up production team manager; and the entire
a guest editor’s technical or business expertise production crew for producing so many high-
quality videos in record time for viewers around
the world.
We’re back in San Diego again next year, so
start making your plans. The conference and
EXPO is scheduled for February 19-21, 2013.
See you there!
ray rasmussen is the publisher
and chief editor for i-connect007
publications. He has worked in
the industry since 1978 and is the
former publisher and chief editor
of CircuiTree Magazine. to contact
ray, click here.
10 The PCB Magazine • March 2012