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Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria PDF

331 Pages·2006·7.214 MB·English
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Preview Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria

PRECISION ASSEMBLY TECHNOLOCI ES FOR MINI AND MICRO PRODUCTS IFIP - The International Federation for Information Processing IFlP was founded in 1960 under the auspices of UNESCO, following the First World Computer Congress held in Paris the previous year. An umbrella organization for societies working in information processing, IFIP's aim is two-fold: to support information processing within its member countries and to encourage technology transfer to developing nations. As its mission statement clearly states, IFIP's mission is to be the leading, tndy iinterrzatioual, apolitical o~ganization which encourages and assists in the developtnent, exploitation and application of irformation technology for the benefit of all people. IFIP is a non-profitmaking organization, run almost solely by 2500 volunteers. It operates through a number of technical committees, which organize events and publications. IFIP's events range from an international congress to local seminars, but the most important are: The IFIP World Computer Congress, held every second year; Open conferences; Working conferences. The flagship event is the IFIP World Comp~~teCro ngress, at which both invited and contributed papers are presented. Contributed papers are rigorously refereed and the rejection rate is high. As with the Congress, participation in the open conferences is open to all and papers may be invited or submitted. Again, submitted papers are stringently refereed. The working conferences are structured differently. They are usually run by a working group and attendance is small and by invitation only. Their purpose is to create an atmosphere conducive to innovation and development. Refereeing is less rigorous and papers are subjected to extensive group discussion. Publications arwng from IFIP events vary The papers presented at the IFIP World Computer Congress and at open conferences are pubhshed as conference proceedings, while the results of the workmg conferences are often publ~sheda s collections of selected and ed~tedp apers Any national society whose primary activity is in information may apply to become a full member of IFIP, although full membership is restricted to one society per country. Full members are entitled to vote at the annual General Assembly, National societies preferring a less committed involvement may apply for associate or corresponding membership. Associate members enjoy the same benefits as full members, but without voting rights. Corresponding members are not represented in IFIP bodies. Affiliated membership is open to non-national societies, and individual and honorary membership schemes are also offered. PRECISION ASSEMBLY TECHNOLOGIES FOR MINI AND MICRO PRODUCTS Proceedings of the IFIP TC5 WC5.5 Third International Precision Assembly Seminar (IPAS '2006), 19-21 February 2006, Bad Hofgastein, Austria Edited by Svetan Ratchev University of Nottingharn United Kingdom - Springer Library of Congress Control Number: 2005938213 Precision Asseinb[v Teckizologies for Mini and Micro Products Edited by Svetan Ratchev p cm (IFIP Inte~nat~onFale derat~onf o~In forniat~onP rocessing, a Spimgei Series in Computer Sc~ence) ISSN: 1571-5736 1 1861-2288 (Internet) ISBN- 10: 0-387-3 1276-5 ISBN-I 3: 9780-387-31.276-5 Printed on acid-free paper Copyright O 2OOG by International Federation for Information Processing. All rigilrs reserved. This itork may not be translated or copied in whole or In part without the written pcrn~issioiio f the piiblislier (Springer Science+Business Media. Iiic., 233 Spring Strcct, Ncw York, NY 10013, CSA). excey for bnef excerpts In connection with rcvicws or scholarly analys~s. Use In connection mith any form of infolmation storage and retrieval: electronic adaptation, computer softxbare, or by sini~laor r dissim~larn ietliodology now kno\wi or hereafter developed is forbidden. Tile use in this publica:ion of trade inamcs, tradeniarks, servlce iiiarks and similar ternis, even if they are iiot identitied as such. is not to be taken as an expressioi: of opinion as to whether or not they ai-c. subject to proprietary rights. Printed in the United States of:\merica 9 8 7 6 5 4 3 2 1 spriiigeronline corn TABLE OF CONTENTS Preface International Advisory Committee PART I - Micro Handling and Feeding Techniques 1. Design of a Capillary Gripper for a Submillimetric Application Lambert, P., Seigneur, F., Koelemeijer, S., Jacot, J. 2. Multi-Axes Micro Gripper for the Handling and Alignment of Flexible Micro Parts 11 Brecher, C., Peschke, C., Freundt, M. Lange, S. 3. Design, Fabrication and Characterization of a Flexible System Based on Thermal Glue for in Air and in SEM Microassembly 2 1 ClCvy, C., Hubert, A., Fahlbusch, S., Chaillet, N., Michler, J. 4. Design and Experimental Evaluation of an Electrostatic Micro-Gripping System 33 Lang, D., Tichem, M. 5. A Generic Approach for a Micro Parts Feeding System 43 Paris, M., Perrard, C., Lutz, P. 6. Pneumatic Contactless Feeder for Microassembly 53 Turitto, M., Chapius, Y., Ratchev, S. PART I1 - Robotics and Robot Applications for 63 Precision Assembly 7. "Parvus" A Micro-Parallel-SCARA Robot for Desktop Assembly Lines 65 Burisch, A., Wrege, J., Soetebier, S., Raatz, A., Hesselbach, J., Slatter, R. 8. Methods for Comparing Servo Grippers for Mini and Micro Assembly Applications 7 5 Karjalainen, I., Tuokko, R. 9. Compliant Parallel Robots 83 Raatz, A., Wrege, J., Burisch, A., Hesselbach, J. 10. Test Environment for High-Performance Precision Assembly - Development and Preliminary Tests 93 Prusi, T., Heikkila, R., Uusitalo, J., Tuokko, R. 11 . Sensor Guided Micro Assembly by Using Laser-Scanning Technology 101 Rathmann, S., Wrege, J., Schottler, K., Raatz, A., Hesselbach, J. 12. High Speed and Low Weight Micro Actuators for High Precision Assembly Applications Degen, R., Slatter, R. PART I11 - Design and Planning for Microassembly 13. Automated Assembly Planning Based on Skeleton Modelling Strategy Bley, H., Bossmann M. 14. Morphological Classification of Hybrid Microsystems Assembly Kurniawan, I., Tichem, M., Bartek, M. 15. First Steps in Integrating Micro-Assembly Features into Industrially used DFA Software 149 Salmi, T., Lempiainen, J. 16. Tolerance Budgeting in a Novel Coarse-Fine Strategy for Micro- Assembly 155 Henneken, V., Tichem, M. 17. The Importance of Concept and Design Visualisation in the Production of an Automated Assembly and Test Machine 167 Smale, D. 18. Development of Passive Alignment Techniques for the Assembly of Hybrid Microsystems Brecher, C., Weinzierl, M., Lange, S. PART IV - Modular Assembly Systems and Control Applications 19. Miniature Reconfigurable Assembly Line for Small Products Codourey, A,, Perroud, S., Mussard, Y. 20. Conception of a Scalable Production for Micro- Mechatronical Products Fleischer, J., Krahtov, L., Volkmann, T. 21. Towards an Integrated Assembly Process Decomposition and Modular Equipment Configuration Lohse, N., Schafer, C., Ratchev, S. 22. Evolvable Skills for Assembly Systems Hoppe, G. 23. Toward the Vision Based Supervision of Microfactories Through Images Mosaicing Bert, J., DembClC, S., Lefort-Piat, N. 24. Precision Multi-Degrees-Of-Freedom Positioning Systems Olea, G., Takamasu, I<., Raucent, B. PART V - Economic Aspects of Microassembly 25. What is the Best Way to Increase Efficiency in Precision Assembly Koelemeijer, S., Bourgeois, F., Jacot, J. 26. Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems Heilala, J., Helin, K., Montonen, J., Vaatainen, 0. 27. Impact of Bad Components on Costs and Productivity in Automatic Assembly Oulevey, M., Koelemeijer, S., Jacot, J. PART VI - Microassembly - Solutions And Applications 295 28. The Reliable Application of Average and Highly Viscous Media 297 Lenz, T., Othman, N. 29. Laser Sealed Packaging for Microsystems Seigneur, F., Jacot, J. 30. Modelling and Characterisation of an Ortho-Planar Micro- Valve 315 Smal, O., Dehez, B., Raucent, B., De Volder, M., Peirs, J., Reynaerts, D., Ceyssens, F., Coosemans, J., Puers, R. 3 1. Microhandling and Assembly: the Project ASSEMIC 32 7 Almansa, A., Bou, S., Fratila, D. Author Index 333 Keyword Index 334 Preface Customers increasingly expect products that are smaller, have improved functionality and reliability and cost less. Miniaturisation and integration of mechanical, sensing and control functions within confined spaces is becoming an important trend in designing new products in industries such as automotive, biomedical, pharmaceutical and telecommunications. In micromanufacture often manual assembly becomes unfeasible due to the small size of the products. As a result microassembly is becoming a sector of strategic importance in high labour cost areas due to the specific needs of automated fabrication and assembly processes which make outsourcing a less attractive option. It is well recognised that the production of miniaturised products will require radical rethinking and restructuring of the underlying technologies and system engineering approaches in high precision assembly as well as developing unprecedented and unique commercial concepts and infrastructure for delivering new technologies. In precision assembly there is a clear need for modular and highly customisable miniaturised production systems based on plug and produce assembly units with micro and nano accuracy of operation. From the equipment point of view the key emphasis is on developing new solutions for the automatic handling of large volumes of very small parts; development of multi-process microassembly machines using a smaller mechanical base and incorporating a wide variety of specialised product specific processes, capable of meeting the increased demands on process capability, repeatability and traceability. The critical enabling technologies currently being developed include: high precision positioning devices; precision tracking and control of applied forces; process monitoring and feedback; miniaturised "super-clean" environments; automated micro and nano assembly, testing and packaging techniques. There is also a need to develop new approaches for microassembly system design which will allow the deployment of reconfigurable systems for volume manufacture of products in close proximity to the customer. The International Precision Assembly Seminar (IPAS) is a premier international forum for reporting and discussing key technological developments in the field of mini and micro assembly automation. The contributions to the 3rd IPAS'2006 seminar have been grouped into 6 sections. Part 1 deals with new techniques for the handling and feeding of micro parts. Micro-robotics and robot applications for micro assembly are discussed in Part 2. An overview of different design and planning applications for microassembly is provided in Part 3. Part 4 is dedicated to reconfigurable and modular micro assembly systems and control applications. The economic aspects of microassembly including new

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