Power Ultrasonics: Applications of High-Intensity Ultrasound

1127 Pages·2014·151.909 MB·English

by  Juan A Gallego-Juárez, Karl F Graff

Power Ultrasonics
Related title
Ultrasonictransducers:Materialsanddesignforsensors,actuatorsandmedicalapplications
(ISBN978-1-84569-989-5)
Woodhead Publishing Series in Electronic
and Optical Materials: Number 66
Power Ultrasonics
Applications of High-intensity
Ultrasound
Edited by
Juan A. Gallego-Jua´rez and Karl F. Graff
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List of contributors
V.M.Acosta-Aparicio ConsejoSuperior de Investigaciones Cient´ıficas (CSIC),
Madrid,Spain
E-mail: [email protected]
A. Alippi La Sapienza Universita´ diRoma, Rome, Italy
E-mail: [email protected]
M. Ashokkumar Universityof Melbourne,Melbourne, VIC, Australia
E-mail: [email protected]
F. Baillon Research Centre inParticulate Solid ProcessEngineering, Energy and
Environment in Mines-Albi, Albi, France
E-mail: [email protected]
L. Barthe Laboratoire deGe´nie Chimique,Toulouse, France
E-mail: [email protected]
A. Benatar TheOhioState University,Columbus, OH,USA
E-mail: [email protected]
E. Calcio Gaudino University ofTurin,Turin, Italy
E-mail: [email protected]
J.A. Carcel Universitat Polite`cnica deVale`ncia, Valencia, Spain
E-mail: [email protected]
A. Cardoni PusonicsS.L,Madrid,Spain
E-mail: [email protected]
F. Chemat Universite´ d’Avignon et des Paysdu Vaucluse, Avignon, France
E-mail: [email protected]
C. Cogne´ University ofLyon, Villeurbanne, France
E-mail: [email protected]
G. Cravotto UniversityofTurin, Turin, Italy
E-mail: [email protected]
H. Delmas Laboratoire de Ge´nie Chimique, Toulouse,France
E-mail: [email protected]
xviii Listofcontributors
B. Dubus Institut d’Electronique deMicroe´lectronique et de Nanotechnologie,
Lille, France
E-mail: [email protected]
B. Ducharne Universite´ deLyon, Villeurbanne, France
E-mail: [email protected]
N.P.K.Ellens Universityof Toronto, Toronto,ON, Canada
E-mail: [email protected]
D.G.Eskin Brunel University,Uxbridge, UK
E-mail: [email protected]
F.Espitalier ResearchCentreinParticulateSolidProcessEngineering,Energyand
Environment inMines-Albi, Albi, France
E-mail: [email protected]
R.J. Friel Loughborough University,Loughborough, UK
E-mail: [email protected]
F.J.Fuchs Blackstone-Ney Ultrasonics, Jamestown, NY,USA
E-mail: [email protected]
L. Gaete-Garreto´n Universidad de Santiago deChile,Santiago, Chile
E-mail: [email protected]
J.A. Gallego-Jua´rez ConsejoSuperior de InvestigacionesCient´ıficas (CSIC),
Madrid,Spain
E-mail: [email protected];[email protected]
J.V. Garc´ıa-Pe´rez Universitat Polite`cnicade Vale`ncia, Valencia, Spain
E-mail: [email protected]
A. Gedanken Bar-IlanUniversity, Ramat-Gan, Israel
E-mail: [email protected]
P.R.Gogate InstituteofChemicalTechnology, Mumbai,India
E-mail: [email protected]
I. Gonza´lez-Gomez Consejo Superiorde Investigaciones Cient´ıficas (CSIC),
Madrid,Spain
E-mail: [email protected]
K.F. Graff EWI, Columbus, OH,USA
E-mail: [email protected];[email protected]
Listofcontributors xix
D. Guyomar Universite´ de Lyon, Villeurbanne, France
E-mail: [email protected]
M. Hodnett National Physical Laboratory, Teddington, UK
E-mail: [email protected]
K. Hynynen UniversityofToronto, Toronto, ON, Canada
E-mail: [email protected]
W. Lauterborn Universita¨tG€ottingen, G€ottingen, Germany
E-mail: [email protected]
O. Louisnard Research CentreinParticulate Solid Process Engineering,Energy
and Environment inMines-Albi, Albi, France
E-mail: [email protected]
M. Lucas University ofGlasgow,Glasgow,UK
E-mail: [email protected]
T.J.Mason Coventry University,Coventry, UK
E-mail: [email protected]; [email protected]
M.P. Matheny EWI, Columbus, OH, USA
E-mail: [email protected]
A. Mathieson Universityof Glasgow,Glasgow,UK
E-mail: [email protected]
R. Mettin Universita¨tG€ottingen, G€ottingen, Germany
E-mail: [email protected]
P. Mosbah Institut d’Electronique deMicroe´lectronique et deNanotechnologie,
Lille, France
E-mail: [email protected]
A. Mulet UniversitatPolite`cnica de Vale`ncia,Valencia, Spain
E-mail: [email protected]
K. Nakamura TokyoInstitute ofTechnology,Tokyo, Japan
E-mail: [email protected]
U. Neis Ultrawaves GmbH, Hamburg,Germany
E-mail: [email protected];[email protected]
xx Listofcontributors
A.B. Pandit Instituteof ChemicalTechnology,Mumbai, India
E-mail: [email protected]; [email protected]
L. Pardo ConsejoSuperior de InvestigacionesCient´ıficas (CSIC),Madrid,Spain
E-mail: [email protected]
R. Peczalski UniversityofLyon, Villeurbanne, France
E-mail: [email protected]
I. Perelshtein Bar-Ilan University, Ramat-Gan, Israel
E-mail: [email protected]
C. Pe´trier Universite´ Joseph Fourier, Grenoble,France; King Abdulaziz
University, Jeddah, Saudi Arabia
E-mail: [email protected]
E. Riera Consejo Superior deInvestigaciones Cient´ıficas (CSIC), Madrid, Spain
E-mail: [email protected]
G. Rodr´ıguez ConsejoSuperior de Investigaciones Cient´ıficas (CSIC), Madrid,
Spain
E-mail: [email protected]
O.A.Sapozhnikov MoscowState University,Moscow, Russia; Universityof
Washington, Seattle, WA,USA
E-mail: [email protected]; [email protected]
M.E.Schafer Sonic Tech, Inc., Ambler, PA,USA
E-mail: [email protected]
G. Se´bald Universite´ de Lyon, Villeurbanne, France
E-mail: [email protected]
M. Short EWI, Columbus, OH, USA
E-mail: [email protected]
S. Tagliapietra Universityof Turin, Turin,Italy
E-mail: [email protected]
J. Virkutyte Hammontree &Associates Ltd,NorthCanton, OH,USA
E-mail: [email protected]
B. Zhang Universite´ deLyon,Villeurbanne, France
E-mail: [email protected]
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