Plating and Surface Finishing 1992: Vol 79 Index

7 Pages·1992·2.3 MB·English

Index to
Plating and Surface Finishing
Vol. 79, 1992
Plating and Surface Finishing is indexed in Ap- | Foeckler, Eugene P. .............scscsseseeeeees Feb/26 | RAE LOL Mar/18
plied Sciences and Technology Index and ab- Foster, Dennis Aug/29, Oct/46 | MII i055 scisansitussnesiaitteisesinaucemeccesores Jan/46
stracted in Chemical Abstracts, Metal Working | Gabo, DOVE FPR. ........cccccscossscsseseossovvesses Dec/20 | Orcel, Gérard
Review, Metal Abstracts, Engineering Index, | Gan, Yongxue |P aiva, Olga
Technical Data Digest, Bulletin Analytique, Sur- | Gau, Jhy-Yeong BI ITs csnhte asihisbersetarsaictnnnceshenmsbaannel Jul/49
face Treatment Technology Abstracts, and other Gemmler, Armin Pan, Shao-xian
publications. This volume will be microfilmed and IR, III La, ..enecnercosencossnssesneoceesevs Jul/16 | Parker, Konrad
made available to the Library of Congress, among RNIN osnsicoseoceserscssuseecusdessconsis Sep/56 | Patram, John
Gotthelf, Beth | Patry, Michael
others. Printed copies of the 1992 issues will be |
Graham, Glen Pearlstein, Fred Jan/72, Feb/70, Mar/76
bound for reference in the AESF headquarters
I so cos sccsescennsiacuvseeninoonh Feb/42 | PRP, FEW. esecscosescssconsciiesosassevens May/116,
and preserved with other volumes as annual SI oss ecevcsvervessnescvensestieusconts Nov/18 | Jul/38, Aug/41, Oct/56, Dec/52
historical records of the American Electroplaters | Hampden-Smith, M.J. .........cccccseseeeesesees Jun/71 | PR PRN Ne aciassccscsesseacoeeescesusenses May/116,
and Surface Finishers Society. | Hayashi, Tadao Jul/38, Aug/41, Oct/56, Dec/52
Hofmann, Udo WAPI IG ps viciecntoncsonccievocncccntovcmmcoassuel Jul/57
The key to monthly features other than articlesis | NE I vsissaccsnevecesesvsovessivevervoncecesd Aug/50 PS IES <secnccencvcecssvvanevsacsoses Apr/68, Nov/72
as follows: (A&C) Advice & Counsel; (BR) Book | eee Aug/55 | Poskanzer, Alan
Review; (CT) Circuit Topics; (COM) Computer SN NIN, cs cscesesocicsovsinascenynisnrereutees Mar/55 Mar/41, May/106, Jun/58, Aug/27, Oct/44
Topics; (ED) Editorial; (ES) Enviroscope; (FL) Hu, Ching-Yu 4, WORN, Fe scctisccsenceresseveccvnvscnconcvvess Apr/62
Fine Lines; (FTT) Finishers Think Tank; (FOA) Huang, Chein-Ho BE Mic ccncstisvcecascsvescssisensecenremnvaienees Apr/57
Focus on the AESF; (TQM) Focus on Total Huang, Fengchun BS ene Jun/85
Quality Management; (P&OF) Pretreatment and Jandik, Petr | Rapacki, W. Steve
Organic Finishing; (RU) Regulatory Update; I ikckc insoosenseecinenenereeiocnceneierents Jul/60 IE ivecttieccssehtiwenncudeeteeatenasceunaeel Jan/46
(SMT) SMT Topics; (SVC) SVC Topics. PITS icsrissnecsnacecsomncensvaoversmuced Aug/55 cn, {REESE Se enerye See een ener e Apr/62
1 RN IIE To ceevccesencceusancsucconscenuovcela Jun/71 IE I sicaiciversscesnsnenocernaisamirnivn Apr/62
i cegymeipac pe Re Dec/67 | EEG pertiexdAviiinrcacinaemnimee Jun/71
Index to Authors PI eiencsecsvecvveveienvevectoniis Jun/74, Dec/56 Sapjeta, Joyce
INT cn duse s oneptonesevcenbnstlenseredneent s Jul/60 | III <1. cascolemcismicadeniicbaneiGen Feb/49 Saxena, Mohini
NS setae ccdiaigs nda bd ikteacreaneneeceees Feb/49 PRIN, MIG ccccsescssenctesissecéoccsivcssenes Jul/57 Schachameyer, Steven R. ............:0c08 Jan/13
Altmayer, Frank, CEF | Kuhn, Leigh Ann Schermerhorn, Michele ...............:..:00-+ .Jan/g
Feb/33, Mar/39, Apr/36, May/103, Jun/54, Lamantia, Anthony J. ............::csscssscesseeseee Jul/8 Schumacher, J.Howard Jan/21
Jul/30, Aug/23, Sep/42, Oct/40, EIN, IIIT «ccc nincsernincessvonssssscmescty Jan/42, | SOUP, GK, ..c.sscceceseseseoseres Jun/85, Aug/72
Nov/47, Dec/31 Feb/40, Mar/48, Apr/46, May/117, Jun/66, | Sewell, Bev Jun/20, Dec/24
oe SESE Mar/18 | Jul/42, Aug/44, Sep/53, Oct/58, Nov/58, DN; GOONGD E.. 550-500cesecesnecaseesesseceees Aug/19
Bauman, Doug Dec/48 RR PEE ccveresvasnverscrcessnceeinepnenpsenneevinel Jun/74
Baumgartner, Charles E. ...........:.sseee Jan/53 | LING, JOT 0:00 ecvessseesssecssereresesess Apr/82, Se eee ty Dec/67
IG olakcssdgaiieseconiosssuicourcuesanieuiunt Apr/68 | May/137, Jun/95, Aug/92, Sep/80, | RIT INN oa occvevecessceovenecosevesnooceesun Aug/11
IS 5 coxcsiscvensvenssecasssevenececresexeeies Mar/63 | Oct/92, Nov/81, Dec/75 5S RR Center Oct/78
Boich, Thomas Lay, Meei-Ling GY ReEC er e ree Nov/68
BIEN okncicorencncnsninstnstissonnetoencaceen Apr/62 Lee, Sheng-Long Spearot, Rebecca
Borruso, Marty aSr eeneoee arer ere Jul/62 | Stevenson, Milton, Sr. ..........cccceeeeeeeees Jan/12
Feb/37, Mar/44, Apr/42, May/112, Jun/62, Li, Jiazhu | Stewart, Bryan
Jul/34, Aug/37, Sep/47, Oct/48, Nov/54, Li, W. Renn eneecees Jul/60
Dec/41 Liang, Han Hsi | Sugg, David
I. csev excess ssedesrasvonsuntianins Sep/56 Liang, Yonglin Feb/38, Mar/46, Apr/44, May/114, Jun/64,
RS scsio rsecnsnaskvascecetteveoeotenbiae Nov/68 Lin, Shih-Min Jul/36, Aug/39, Sep/29 and 48, Oct/54,
Chen, Jin-Ming Lindsay, James H. ..............0 May/129, Sep/16 IN etl ss spctoissciersnsanscnavecoonecsanveareeas Aug/50
oat wssicescenceecerrencunvaheovennnie e Jan/58 Re INIIDINIE, sccvsnsncccrvevesediceriinesnebnN Nov/8 RINE iicrisencecinetheinsmascuonswed Jul/57
RNIN, Uc conscasersescrvevessasinecesectrvoneed Nov/68 ere Feb/49 | RG RS saishiccaissivicecmicasctwestniseanseceoneene Jul/62
SS SS SS are oreo eee! Dec/62 III EIGEN cosscscnsencnesnccssduestuessensend Jul/57 I, PEIN UT5 -crsvicccsisensesecnesensacveccsanees Apr/32
RIS Io cctovernencccctssaccecheesevecseecees Jul/60 | PIII E,F I. cnecccecccccescesvesescue Jun/74, Dec/56 Vitek, Jaromir
RIC TI. ccnsenavunvsinnevonstesecesebucesens Feb/49 POPEIEING, THAIN, cesescocrrcoseseccesssssis Feb/60, Sep/69 | Walton, Clifford W. ...........cceee Nov/8, Dec/44
NO cenoncineccasesnsvecresetvsosens Sep/86, Oct/94 | TN RTL Aug/50 | WRG, PHU E,,.....cseresssceccssssevorcenvenscsees Aug/65
I aii ciesoacccevemsincenamnserasuenoninnnee Feb/42 Mattox, Donald M. ...........:cccceeeeseeeeees Jan/44, | Wang, YanWen
MING IIE ls aventcxscnsnrcesnssnsersiccoseevsens Mar/55 Feb/41, Mar/49, Apr/48, May/119, Jun/68, WRIT, FHGIIENG.. 5.0.c cicscsessescercscsesscvcseess Dec/8
Comassar, Dorothy M. ............:csceeseeseeeee Jul/20 Jul/43, Aug/47, Sep/54, Oct/62, Nov/60, NI, IIIT Bis ccscvesssseissnseiosarscerceesed Nov/18
Cooper, C. David Dec/50 | Weil, Konrad
CGY, PICT WY... oncasccesicecsesscssesssessencees Jan/86, | Maurer, Kurt | WII ID. sccavevessseessesnsnsooencnscccveqnteesernans Dec/53
Mar/88, May/144, Jun/105, Jul/87, Aug/98, McChesney, Mike RN II scot cectencnicacictirreecs corensiandcteossd Aug/55
Sep/89, Oct/95, Nov/90, Dec/82 Jul/81, Aug/32, Sep/46, Oct/52, Nov/51, | Wen, Ten-Chin Oct/64
Crotty, D. ..... Dec/43 White, Ralph E. ........... Mar/55, Apr/68, Nov/72
McDuffie, Bruce Sep/69 Wu, Hsien-Ming
Davidson, Tamara S. ........::cscsssesseeeeee Aug/11 RII ns oneussnesecsossiecesusvesteeunves Feb/26 | Wu, Jiann-Kuo
RIT cada victineo des tonticcnaeeuresovsereecesr es Aug/50 | Mendoza, Oscar YN WR oncnisaverscrevivesscevevncboseenteunetirsncey Dec/62
Deng, ZhongGang | Miller, Mark | Xiao, ChangGeng
BI aee snsiesiciciennceccanéctesvissemencesed Aug/72 BN Rsv scseiessvcsvescseveisvseaservepoccsteced Oct/78 | Ye, Xiang Rong
CBO, GGT A. ..........520s0scecseccovsceesseses Nov/62 Moleux, Peter | Yeh, Shin-Horng
BI NINES sicericyesvcucssacsconcorresstoneccaved Nov/18 Moller, Per Zavodjancik, John, CEF
NU ihitieciinsontivcssnonisiesnnccnenasee May/121 BIN de cove sncscnevesacsisustacesersssvessenensd Jan/46 Zeng, Liangyu
Durkin, Brad Mooney, Ted DSI ADD. “sainvecrcnssaveciarenrcrvesertoreiinnses Jul/57
DuRose, Richard A. ............:ccscesscesseeeees Sep/50 Feb/35, Mar/42, Apr/40, May 109, Jun/60,
LEPUENG, SMUT WY. cnr ccccccesecsecessserrenesccesees Oct/36 | Jul/33
| * 1991. These authors were inadvertently omitted
Fabro, Mario W|I, TICE cvcvcseesscosencccsssonscvedes Dec/67
PRIN, SILI, secevctvcsonssvossesevcasenessoresuse Dec/67 from the 1991 annual index and from the table of
Fang, Jing Li I oohicccccessvsnvencvvendivemeanneeneul Oct/78 | contents of the July 1991 issue.
December 1992
Abrasives SUR/FIN® ’92
Where Diamonds Are a Finisher’s Best Friend | SUR/FIN '92 Exhibitors Feb/25,
A P&SF Report Mar/14, Apr/20, May/23 & Jun/10 (booth descriptions)
| SUR/FIN '92 Technical Conference Program Feb/19,
Advice & Counsel, by Frank Altmayer, CEF Mar/9, May/61 (abstracts)
Zero Discharge SUR/FIN '92 General Program
Spill Prevention, Control & Countermeasure Plans, Part | SUR/FIN ’92 Opening Session
Spill Prevention, Control & Countermeasure Plans, Part Il ....Mar/39 SUR/FIN '92 Technical Session Organizers & Chairmen May/58
Preventing Surface Finishing Disasters, Part 1 ASEP Seminar at SUR/FIN '92 May/82, Jun/16
Preventing Surface Finishing Disasters, Part II MFSA Program at SUR/FIN ’92 May/82, 84; Jun/16
Regulatory Forecast: Cloudy, Possible Rain NAMF Sessions at SUR/FIN '92 May/71, 75; Jun/16
The Clean Air Act and Chromium Emissions SVC Program at SUR/FIN '92 May/82, Jun/16
Pollution Prevention: Both Sides | SUR/FIN '92 Spouse/Guest Program
(See Editor's note, Sep/44) SUR/FIN '92 Highlights Sep/8,10
Compliance News: The DOT Hazardous Materials Registration
Program Continuous Strip Plating Workshop
EPA Proposes New Definition for Hazardous Waste (Program for May 5-6) Mar/89, Apr/29, Jul/8
EPA's Proposed New Definition for Hazardous Waste (Report) Continuous Steel Strip Plating Workshop:
Environmentally Speaking, What's It Like on the Well-Organized; Well Received
NE CPOE UU UIIIIN Sccvecescccsceocesorsceecerecnsnivessoeocesteroess Dec/31 Anthony J. Lamantia
Aerospace
Alloy Plating
Some of This Finisher’s Products Go “Out-of-This-World”
The Structure and Hardness of Electroless Ni-Mo-P Alloy Deposits
A P&SF Staff Feature
Surface Coatings Technology for Turbine Engine Applications Sheng-Long Lee and Han-Hsi Liang
Dorothy M. Comasser Chemical Characterization of Electroless Ni-Mo-P Alloys
Oscar Mendoza, Ralph E. White, David L. Cocke and
AESF Activities Ben A. Horrell
Structure and Corrosion Resistance of Electroless Ni-Cu-P
Committee Selects AESF Nominees
YanWen Wang, ChangGeng Xiao and ZhongGang Deng ... Mar/57
Profiles of AESF Nominees
The Effect of Organic Additives on the Phase Composition of
AESF Annual Report
Electroless Nickel-Phosphorus Films
AESF Membership Census
AESF Research Patrons, Associates and Sponsors Udo Hofmann and Konrad Weil Mar/60
Effect of Saccharin Addition on the Physico-Chemical
AESF Certified Electroplater-Finishers (CEF)
Characteristics of Deposits from Electrolytic
AESF Certified Electroplater-Finishers, Specialist in
Electronics (CEF-SE) Nickel-Phosphorus Baths
J.P. Bonino, P. Pouderoux, C. Rossignol and A. Rousset .... Apr/62
AESF Electronics Specialists, Certified (ESC)
Electrodeposition of Nickel-Chromium-Phosphorus Alloys
AESF Award Recipients (list)
in the Presence of Additives
AESF 1992 Award Recipients
AESF Presidents R. Bindlish, B.N. Popov and R.E. White
Factors Influencing Solderability of Electroless Ni-P Deposits
AESF Honorary Members
Jing Li Fang, Xiang Rong Ye and Jing Fang
In Memoriam
Effects of Agitation on Conventional Electroless Plating:
Annual Conferences of the Society
Implications for Production of Ni-P Composite Coatings
Richard O. Watson—AESF’s New President
M.R. Kalantary, K.A. Holbrook and P.B. Wells
1992-1993 Branch Directory
Investigations into Gaseous Testing Requirements for
AESF 1992-93 Boards, Sections and Committees
Pd-Ni Alloy Coatings of Electrical Contacts
Scholarship Recipients
James L. Chao and Randy R. Gore
Scholarship Fund Contributors
Tensile Strength of Plated Glass Optical Fibers
AESF Selects Dr. Christoph J. Raub for AESF’s
Gérard Orcel
1992 Scientific Achievement Award
Electroless Deposition of Ni-Cu-P Alloys
Publications Catalog
M. Cherkaoui, A. Srhiri and E. Chassaing
Proposed Amendments to AESF Constitution
A Study of the Stability of Ni-Cr-P Plating Solutions
Nominees for “Best Papers” in P&SF
B.N. Popov, W. Li and R.E. White
AESF Defines Its Role for the Future (FOA)
AESF Conferences and Symposia Aluminum/Anodizing
AESF Week 1992 Aluminum Coloring Using Robust Design
AESF Week 1992 Exhibitors Ten-Chin Wen and Shih-Min Lin
AESF Week Info-Minute
Automotive
AESF Week 1993 Electrogalvanized Automotive Sheet Steel and the
14th AESF Conference on Environmental Control for the Manufacturing System
Surface Finishing Industry (preliminary program) James H. Lindsay May/129
(abstracts) They Put the Finishing Touches on a Piece of History
Symposium on the Search for Environmentally
“Safer” Deposition Processes for Electronics
Book Review
(abstracts)
Symposium for Organic Coatings Electroless Nickel Plating, by Wolfgang Riedel
Reviewed by Morton Schwartz, CEF Jun/108
(abstracts)
Aerospace Symposium
(abstracts) Chromium
AESF Training Courses & Workshops The Effects of Pulse Plating on Low-Contraction Chromium
AESF Week 1993 Exhibitors Electrodeposits
(booth descriptions) Mark Miller and S.K. Pan Jul/49
Plating and Surface Finishing
Applying Taguchi Statistics to Optimize Current Efficiency in | EAST News
Hard Chromium Pulse Plating Jan/85, Feb/81, Jun/106, Sep/86, Oct/94
P.Leisner, D. Ulrich and P. Maller Jul/62 |
Barrel Chromium Plating from a Trivalent Chromium Electrolyte | Electroless Plating
George E. Shahin Electroless Nickel Conference
Atmospheric Releases of Hexavalent Chromium from Hard | Interfacial Bonding between Electroless Copper Deposits and
Chromium Plating Operations Sulfonic-Acid-Modified Polystyrene
Mitchell S. Hall, John D. Dietz, C. David Cooper, Charles E. Baumgartner Jan/53
Roger L. Wayson and Doug Bauman The Electroless Copper Facility: An Updated Review of
Good Plating Practices
Circuit Topics, by Dr. Alan Poskanzer Eugene P. Foeckler and James P. Melka
The Renaissance of PC Board Fabrication Electroless Nickel Plating Cycle Design for
Dual Breakthroughs in PCB Fabrication? .............:sssseeeeess Mar/41 Thin Film Memory Disks
NI EIN 5c co vicccescoseneetsiceonsoiadnenrstenceenes May/106 D. Crotty, B. Clark, J. Greene and B. Durkin Feb/42
I cao ditos doce vstescnctntesar sas hiss oerononnissobesieniapuusavneeoeekonae r Jun/58 The Structure and Hardness of Electroless Ni-Mo-P Alloy Deposits
Waste Disposal—One More Time! ...............ssscssessececssessesnees Aug/27 Sheng-Long Lee and Han-Hsi Liang
The PC Fabrication Industry According to Poskanzer: Rejuvenating Electroless Solutions: Electroless Nickel Bath
Some Parting Shots Recovery by Cation Exchange and Precipitation
R.W. Anderson and W.A. Neff
Cleaning and Surface Preparation Electroless Nickel: State of the Art
Aerospace Manufacturer's Program Focuses on Konrad Parker
Replacing Vapor Degreasers Oscar Mendoza, Ralph E. White, David L. Cocke and
John Zavodjancik Apr/26 Ben A. Horrell
Vapor Degreasing Alternatives in Metal Cleaning Applications: Structure and Corrosion Resistance of Electroless Ni-Cu-P
Evaluation of Aqueous Degreasers YanWen Wang, ChangGeng Xiao and ZhongGang Deng .. Mar/57
Johnny L. Golden Jul/16 The Effect of Organic Additives on the Phase Composition of
Electroless Nickel-Phosphorus Films
Composite Plating Udo Hofmann and Konrad Weil Mar/60
Porosity of Composite Palladium, Palladium-Nickel and Perspective on Plating for Precision Finishing
Gold Electrodeposits May/121
E.J. Kudrak, J.A. Abys, V. Chinchankar and J.J. Maisano .. Feb/49 Factors Influencing Solderability of Electroless Ni-P Deposits
Polarization and Galvanic Studies of Cobalt-Titania Cermets in Jing Li Fang, Xiang Rong Ye and Jing Fang
Corrosive Environments Effects of Agitation on Conventional Electroless Plating:
E.P. Rajiv and S.K. Seshadri Jun/85 Implications for Production of Ni-P Composite Coatings
M.R. Kalantary, K.A. Holbrook and P.B. Wells
Computerization The Effect of Organic Additives on a CuO Electroless
Automated Parts Handling for a Wet Process Facility Copper Bath
John Patram Haewei H. Wan, Shin-Horng Yeh, Jhy-Yeong Gau and
Modifying a PC to Diagnose “Sick” Paint Robots Chin-Yu Hu
Bryan Stewart Determination of the Mixed Potential on Synthetic Electroless
Copper Baths
Computer Topics, by Ted Mooney, P.E. Nicholas M. Martyak and Bruce McDuffie
About “The Gooey” Tensile Strength of Plated Glass Optical Fibers
I cissaise ccs scnsidecies sacineiniapanthncneksisivccestsiesiiewsoHisewnoicmcuaeni Feb/35 Gérard Orcel
A Picture Is Worth 1000 Words Electroless Deposition of Ni-Cu-P Alloys
High-Tech Fun M. Cherkaoui, A. Srhiri and E. Chassaing
Computers on the Shop Floor
Computers and Just-In-Time Electronics/PC Boards
INS cdeiics ax eesncouscencevcctsvscarseernaemaeveempeenee eO s Jul/33 The Renaissance of PC Board Fabrication (CT)
SMT Requirements for High-Aspect Ratio PTHs (SMT)
Continuous Strip The High-Tech Approach to “Thinking Small”
Continuous Steel Strip Plating Workshop: Well Organized; Limitations of Electroplating on
Well Received High-Aspect-Ratio PTHs (SMT)
Anthony J. Lamantia Dual Breakthroughs in PCB Fabrication? (CT)
SMT Requirements for Additive Circuitry (SMT)
Copper Tin/Lead Coatings with Fused Solder Paste (SMT)
Copper Electroplating on Carbon Fibers with HEDP + P,O.* 3-D Circuits? Why Not? (CT)
Electrolyte Limitations in Attaching Fine-Pitch SMCs (SMT)
Yongxue Gan Jun/81 Hot New Stuff! (CT)
Heat Treatment Maskant Materials—Evaluation of In the 90s: PC Fabrication in the U.S. (SMT)
Non-Cyanide-Containing Electrolytes Direct Deposition of Patterned Copper Films on PTFE
Blair A. Smith, W. Steve Rapacki and T.T. Kodas, M.J. Hampden-Smith and R.R. Rye
Tamara S. Davidson A Contribution Toward Understanding the Phenomenon of
The Effect of Organic Additives on a CuO Electroless Copper Bath Pink Ring
Haewei H. Wan, Shin-Horng Yeh, Jhy-Yeong Gau and R.S. Sidhu, G.A. Krulik and N.V. Mandich
Chin-Yu Hu The U.S. in the Global Marketplace: Can a Lead-Free Electronics
Pulsed Electrodeposition of Copper Industry Compete? (SMT)
G. Devaraj and S.K. Seshadri Advantages of Electroless Ni/Au on SMT Boards (SMT)
Determination of the Mixed Potential on Synthetic Electroless Chemical Plating of Tin/Lead (SMT) Sep/53
Copper Baths The PC Fabrication Industry According to Poskanzer:
Nicholas M. Martyak and Bruce McDuffie Some Parting Shots (CT)
Ultrasonic Agitation Effects on Electrodeposition of Copper A Glossary for Keeping Pace with Changing
from a Copper(Il)- EDTA Bath Technology (SMT)
A. Chiba and W.C. Wu Fine Line Requirements for SMT (SMT)
December 1992 87
Methods of Applying Liquid Photoimageable Fine Lines, by Mike McChesney, CEF-SE
Solder Mask (SMT) ... May/110, Jun/70, Jul/81, Aug/32, Sep/46, Oct/52, Nov/51, Dec/43
Modern Permanganate Etchback Systems for
Printed Circuit Board Production Finishers’ Think Tank, by Marty Borruso
N.V. Mandich and G.A. Krulik Jan/40, Feb/37, Mar/44, Apr/42, May/112, Jun/62, Jul/34,
Aug/37, Sep/47, Oct/48, Nov/54, Dec/41
Emerging Technologies
Emerging Technologies: Their Impact on Surface Finishing ... Jun/18 Focus on AESF
Hot New Stuff! (CT) AESF Provides Technical Information to help Finishers
Direct Deposition of Patterned Copper Films on PTFE Protect the Environment
T.T. Kodas, M.J. Hampden-Smith and R.R. Rye Jun/71 a, NIU IRIN I cv cwcscncsmedssecenacaneste Jan/21
AESF Defines Its Role for the Future
Environmental Topics Richard O. Watson, CEF
Business as Usual? Not an Option in the 90s!
Milton Stevenson Sr. ..........:0000--+ cis citings ieseieNaitnad edcaes ibe Jan/12 Focus on Quality Management, by David Sugg
Zero Discharge (A&C) Does Quality Cost? Part VI: Cost-of-Quality Accounting
Environmental Compliance: Close Caii 8ecomes a Does Quality Cost? Part VII: Cost-of-Quality Accounting II .... Feb/38
Success Story Does Quality Cost? Conclusion: Cost-of-Quality Accounting,
Spill Prevention, Control & Countermeasure Plans, Part Three
Part | (A&C) Back to Basics
Spill Prevention, Control & Countermeasure Plans, The Grass is Always Greener
Part Il (A&C) Opening the Toolchest
An AESF Week Retrospective: Government and Industry Seek The Vital Few
Cooperative Solutions to Environmental Control & Power Tools...Cause and Effect Diagrams, Part 1
Waste Reduction “Dem Bones, Dem Bones” Cause and Effect Diagrams,
Those Pesky Cyanides...& Other Problems
(Operator Forum) Flesh for the Bones—Cause and Effect Diagrams, Part 3
Aerospace Manufacturer's Program Focuses on
Replacing Vapor Degreasers Gold
John Zavodjancik The Plating of the Magna Carta—an Historical Perspective
Three Dimensions of Waste Minimization & Project Integration Bev Sewell
Kevin Vidmar Tensile Strength of Plated Glass Optical Fibers
You Learn You're Operating Without a Necessary Permit. Gérard Orcel
What Do You Do?
Beth Gotthelf and Rebecca Spearot Apr/34 Historical Notes
Effective Removal of Organics from Nickel Wastewater by The Plating of the Magna Carta—an Historical Perspective
Modified Carbon Adsorption Bev Sewell
Chein-Ho Huang
Regulatory Forecast: Cloudy, Possible Rain (A&C) Jun/54 Leadership Profile
Hazardous Waste Minimization at Tinker AFB Pilar Martin
Glen Graham and Michael Patry Jul/28 Fred Pearlstein, CEF
The Clean Air Act and Chromium Emissions (A&C) Jul/30
Heat Treatment Maskant Materials—Evaluation of
Management
Non-Cyanide-Containing Electrolytes
Blair A. Smith, W. Steve Rapacki & Tamara S. Davidson ..Aug/11 Help Wanted: Hiring Right the First Time
Michele Schermerhorn
Contamination Prevention: Both Sides (A&C)
Waste Disposal—One More Time! (CT) Aug/27 Business as Usual? Not an Option in the 90s!
PORT COIN Gs oss scesccesacenssacanencsucneneseevasssnanoseesoessnenrets Jan/12
“Green” for Go for the Environment
The Hierarchy of Management (P&OF)
J.H. Lindsay Sep/16
Compliance News: The DOT Hazardous Materials Registration
Program (A&C) MFSA News Digest, by Richard W. Crain
EPA Proposes New Definition for Hazardous Waste (A&C) ... Oct/40 Jan/86, Mar/88, May/144, Jun/105, Jul/87, Aug/98, Sep/89,
Atmospheric Releases of Hexavalent Chromium from Hard Oct/95, Nov/90, Dec/82
Chromium Plating Operations
Mitchell S. Hall, John D. Dietz, C. David Cooper, Nickel
Roger L.Wayson and Doug Bauman Nov/18 Rejuvenating Electroless Solutions: Electroless Nickel Bath
Chasing Those Elusive Cyanide lons Recovery by Cation Exchange and Precipitation
Thomas H. Martin, CEF Nov/23 R.W. Anderson and W.A. Neff
Compliance Calendar: Important Deadlines for 1992-'93 Nov/44 Electroless Nickel: State of the Art
Options for Minimizing Metal Finishing Waste Konrad Parker
Clifford Walton, CEF & Kevin Loos Chemical Characterization of Electroless Ni-Mo-P Alloys
EPA's Proposed New Definition for Hazardous Waste (A&C) .. Nov/47 Oscar Mendoza, Ralph E. White, David L. Cocke and
Wastewater Recycling in a European Manufacturing Facility Ben A. Horrell
Mario Fabro Structure and Corrosion Resistance of Electroless Ni-Cu-P
Environmentally Speaking, What's It Like on the Other Side YanWen Wang, ChangGeng Xiao and ZhongGang Deng .. Mar/57
of the World? (A&C) The Effect of Organic Additives on the Phase Composition of
Electroless Nickel-Phosphorus Films
Enviroscope Udo Hofmann and Konrad Weil Mar/60
Developing a Manageable Health & Safety Program Toward Automatic Control of Nickel Plating Processes
Dennis Foster J.W. Bécker, T. Bolch, A. Gemmler and P. Jandik Mar/63
OSHA's Bloodborne Pathogens Standard: If Someone's Effect of Saccharin Addition on the Physico-Chemical
Injured in Your Shop, It Applies to You Characteristics of Deposits from Electrolytic
Dennis Foster Oct/46 Nickel-Phosphorus Baths
Dec/39 J.P. Bonino, P. Pouderoux, C. Rossignol and A. Rousset... Apr/62
88 Plating and Surface Finishing
Factors Influencing Solderability of Electroless Ni-P Deposits Pretreatment and Organic Finishing,
Jing Li Fang, Xiang Rong Ye and Jing Fang by R.W. Phillips Ill and R.W. Phillips Jr.
Prototype Manufacture of Nickel/lron Alloy Magnetic Sleeves Almost Perfect
for Optical Switching Garbage In—Garbage Out
H.H.Law, C.A. Holden, C.A. Mattoe, J. Sapjeta, Y. Degani A Good (?) Idea Goes Bad
ee I aisha incincnenscrnspeanrenteniacceseenmeannanoanines , .ug/50 Plan for the Future...It's Closer than You Think May/116
Investigations into Gaseous Testing Requirements for The Pumps Work. Why Are the Parts Dirty? ..............c:cceeees Jul/38
Pd-Ni Alloy Coatings of Electrical Contacts PUGET FIRE PIII Tc. vovsevovsensecesessnonssuecesivnecevinecnsesovesonestess Aug/41
James L. Chao and Randy R. Gore The Hierarchy of Management: It Can Be Lonely at the Top,
Continuous Carbon Filtration of Nickel Plating Baths Frustrating in the Middle, and Miserable at the Bottom
Steven W. Erwin Will We Ever Get Everything Right? ................c:cscsceseessereeeees Dec/52
Tensile Strength of Plated Glass Optical Fibers
Gérard Orcel Pulse Plating
Evaluation of a Simple, Thin-Film Ductility Tester & Review The Effects of Pulse Plating on Low-Contraction Chromium
of the Ductility of Nickel Sulfamate Deposits Electrodeposits
George A. DiBari Nov/62 Mark Miller and S.K. Pan Jul/49
Electroless Deposition of Ni-Cu-P Alloys Applying Taguchi Statistics to Optimize Current Efficiency in Hard
M. Cherkaoui, A. Srhiri and E. Chassaing Nov/68 Chromium Pulse Plating
A Study of the Stability of Ni-Cr-P Plating Solutions P.Leisner, D. Ulrich and P. Moller Jul/62
B.N. Popov, W. Li and R.E. White Nov/72 Pulsed Electrodeposition of Copper
G. Devaraj and S.K. Seshadri
Organic Finishing/Painting
Evaluation of Some Engineering Properties of an Precision Finishing
Enamel-Coated Steel Perspective on Plating for Precision Finishing
Mohini Saxena, B.K. Prasad and T.K. Dan J.W. Dini
Powder Coatings Play Major Role in Microwave
Antenna Manufacture Regulatory Update
Coatings: Protecting the Walkways That Protect Recent OSHA Case Clarifies Definition of “Platform” in
Airline Passengers Automated Plating Facility
Modifying a PC to Diagnose “Sick” Paint Robots Richard A. DuRose
Bryan Stewart
Flame lonization Detector Response Factors for Paint Solvents: Safety and Health
Measuring Emissions of Volatile Organic Compounds Ergonomics: OSHA's Anti-Injury Watchword for the 90s Mar/34
Leigh Ann Kuhn Preventing Surface Finishing Disasters Part 1 (A&C) Apr/36
Preventing Surface Finishing Disasters, Part Il (A&C) May/103
Palladium Developing a Manageable Health & Safety Program
Porosity of Composite Palladium, Palladium-Nickel and Dennis Foster (ES)
Gold Electrodeposits OSHA's Bloodborne Pathogens Standard: If Someone's
E.J. Kudrak, J.A. Abys, V. Chinchankar and J.J. Maisano .. Feb/49 Injured in Your Shop, It Applies to You
Investigations into Gaseous Testing Requirements for Dennis Foster (ES)
Pd-Ni Alloy Coatings of Electrical Contacts Control of Hazardous Energy (ES)
James L. Chao and Randy R. Gore
Shop Features
Physical Vapor Deposition The High-Tech Approach to “Thinking Small”
Physical Vapor Deposition (PVD) Processes (SVC) Environmental Compliance: Close Call Becomes a
ll: What Is a Vacuum? (SVC) Success Story
lll: Vacuum Systems for PVD Processing (SVC) Manufacturer Relies on Surface Finishing to Tap the
IV: Deposition Chambers and Surface Worldwide Soft Drink Market
“Conditioning” (SVC) Where Diamonds are a Finisher’s Best Friend
V: Oil Diffusion Pumps (SVC) Some of This Finisher’s Products Go “Out of This World” Jul/12
Vi: Vacuum Gauging (SVC) They Put the Finishing Touches on a Piece of History Aug/16
Vil: Purchasirig, Characterizing Vacuum Deposition Powder Coatings Play Major Role in Microwave
Systems (SVC) Antenna Manufacture
Vill: Vacuum Evaporation - Evaporation and
Sublimation (SVC) SMT Topics, by James P. Langan
IX: Vacuum Evaporation - Vaporization Sources (SVC) SMT Requirements for High-Aspect-Ratio PTHs
X: Vacuum Evaporation - Evaporant Materials (SVC) Limitations of Electroplating on High-Aspect-Ratio PTHs
XI: Vacuum Evaporation - Heating and Cooling (SVC) SMT Requirements for Additive Circuitry
XII: Vacuum Evaporation - Pinholes (SVC) Tin/Lead Coatings with Fused Solder Paste
Limitations in Attaching Fine-Pitch SMCs
Plating on Plastics In the 90s: PC Fabrication in the U.S. .......ccscseseseeeeeseeeeees Jun/66
Interfacial Bonding between Electroless Copper Deposits and The U.S. in the Global Marketplace: Can a
Sulfonic-Acid-Modified Polystyrene Lead-Free Electronics Industry Compete? ...........:sscsseeees Jul/42
Charles E. Baumgartner Advantages of Electroless Ni/Au on SMT Boards
Chemical Plating of Tin/Lead
Plating Unusual Substrates A Glossary for Keeping Pace with Changing Technology Oct/58
The Midas Touch Fine Line Requirements for SMT
Kurt Maurer Methods of Applying Liquid Photoimageable Solder Mask .... Dec/48
Copper Electroplating on Carbon Fibers with HEDP + P,O.*
Electrolyte Software Review
Yongxue Gan Plato’s Process Planner
Reviewed by Clifford Walton, CEF Dec/44
December 1992
SPC Waste Minimization
Why Johnny Can’t Do SPC Effective Removal of Organics from Nickel Wastewater by
David J. Sugg Modified Carbon Adsorption
Chein-Ho Huang Apr/50
Steel Hazardous Waste Minimization at Tinker AFB
Electrochemical Studies of TiN-Coated Stainless Steel Glen Graham and Michael Patry Jul/28
Options for Minimizing Metal Finishing Waste
Evaluation of Some Engineering Properties of an Clifford W. Walton and Kevin J. Loos Nov/8
Enamel-Coated Steel
Mohini Saxena, B.K. Prasad and T.K. Dan Wastewater Treatment
The Application of Electropiating for Prevention of Hydrogen Effective Removal of Organics from Nickel Wastewater by
Embrittlement in AISI 4140 Steel Modified Carbon Adsorption
Jin-Ming Chen and Jiann-Kuo Wu Chein-Ho Huang
Electrogalvanized Automotive Sheet Steel and the Hazardous Waste Minimization at Tinker AFB
Manufacturing System Glen Graham and Michael Patry
James H. Lindsay Options for Minimizing Metal Finishing Waste
Clifford W. Walton and Kevin J. Loos
Structure and Properties Wastewater Recycling at a European Manufacturing Facility
Mario Fabro
The Morphology and Optical Characteristics of Black Solar
Selective Coatings
Worldwide Trends in Surface Finishing
F.J. Monteiro, F. Oliveira, R. Reis and O. Paiva
China Study Tour
SVC Topics, by Donald M. Mattox Steven R. Schachameyer
“Green” for Go for the Environment
Physical Vapor Deposition (PVD) Processes
ee III ac hcctnichanancicuisesinreisctnctecconessnssesverksconeeond Feb/41 J.H. Lindsay
Surface Finishing in the 2000s: A European View
lll: Vacuum Systems for PVD Processing
David R. Gabe
IV: Deposition Chambers and Surface “Conditioning”
In Asia: The Year 2000 and Beyond
V: Oil Diffusion Pumps
Tadao Hayashi
VI: Vacuum Gauging
Surface Finishing in Czechoslovakia
Vil: Purchasing, Characterizing Vacuum
Deposition Systems Jul/43 Jaromir Vitek
Vill: Vacuum Evaporation - Evaporation and Sublimation Aug/47 U.S. Environmental Technology: A View from the Other
Side of the Pond
IX: Vacuum Evaporation - Vaporization Sources
Bev Sewell
X: Vacuum Evaporation - Evaporant Materials
Environmentally Speaking, What's It Like on the Other
XI: Vacuum Evaporation - Heating and Cooling
XII: Vacuum Evaporation - Pinholes Side of the Worla? (A&C)
Zinc
Test Your Plating !Q, Electrogalvanized Automotive Sheet Steel and the
by Fred Pearlstein, CEF Manufacturing System
May/129
James H. Lindsay
Cathode Reaction of Brightening Agent Vanillin in
Test Your Plating IQ, Alkaline Zinc Electroplating
by John J. Laurilliard, CEF Fengchun Huang, Shao-Xian Pan and Yonglin Liang Jan/64
Characteristics of a Non-Cyanide Alkaline Zinc Plating Bath
Apr/82, May/137, Jun/95, Aug/92, Sep/80, Oct/92, R.M. Krishnan, S.R. Natarajan, V.S. Muralidharan &
Nov/81, Dec/75 Gurdeep Singh
Testing and Analysis
Gran’s Plot Strandard Addition Method for Determination of
Ammonia in Electroless Copper Plating Solutions
Nicholas M. Martyak
Auto-Measuring Technique and Application for Stress in
Metal Electrodeposits Training & Educational Videotapes
Jiazhu Li and Liangyu Zeng
Effects of Surfactants on Cuclic Voltammetric Stripping Available from AESF
Analysis of Acid Copper Sulfate Plating Baths
H.M. Wu, M.L. Lay and C.H. Huang
Determination of the Mixed Potential on Synthetic Electroless The Basics of Wastewater Treatment (56 min.) #106
Copper Baths The Clean Air Act Amendments of 1990 (60 min) #402
Nicholas M. Martyak and Bruce McDuffie Sep/69 Stormwater Regulations (40 min) #408
Evaluation of a Simple, Thin-Film Ductility Tester & Review The Role of Microfiltration in Waste Treatment (55 min) #410
of the Ductility of Nickel Sulfamate Deposits Avoiding Metal Finishing Disasters (45 min) #78
George A. DiBari The Basics of Tin Plating (35 min) #82
The Relationship Between Vickers Hardness and Universal Safety in Metal Finishing (42 min) #85
The above tapes are $49.95 for Members & Research Sponsors;
Hardness
$99.95 for Non-Members (plus shipping).
W. Weiler
Tin Basic Mathematics for Metal Finishers (20 min) #74
This tape is $99.95 for Members & Research Sponsors; $199.95 for
Elecirodeposition of Tin-Based Alloys as Functional Coatings Non-Members (plus shipping).
V.N. Kudryavtsev, K.M. Tyutina, A.N. Popov,
S.A. Maksimenko and V.A. Zonin Use Your Credit Card
Electrodeposition of Bright Tin from Neutral Gluconate Baths (VISA, MC, AMEX) & Call AESF Toll-Free to Order:
T. Sonoda, H. Nawafune and S. Mizumoto 1-800/334-2052
Plating and Surface Finishing