Springer Theses Recognizing Outstanding Ph.D. Research For furthervolumes: http://www.springer.com/series/8790 Aims and Scope The series ‘‘Springer Theses’’ brings together a selection of the very best Ph.D. theses from around the world and across the physical sciences. Nominated and endorsed by two recognized specialists, each published volume has been selected for its scientific excellence and the high impact of its contents for the pertinent fieldofresearch.Forgreateraccessibilitytonon-specialists,thepublishedversions includeanextendedintroduction,aswellasaforewordbythestudent’ssupervisor explaining the special relevance of the work for the field. As a whole, the series will provide a valuable resource both for newcomers to the research fields described, and for other scientists seeking detailed background information on specialquestions.Finally,itprovidesanaccrediteddocumentationofthevaluable contributions made by today’s younger generation of scientists. Theses are accepted into the series by invited nomination only and must fulfill all of the following criteria • They must be written in good English. • ThetopicshouldfallwithintheconfinesofChemistry,Physics,EarthSciences, Engineering andrelatedinterdisciplinaryfieldssuchasMaterials, Nanoscience, Chemical Engineering, Complex Systems and Biophysics. • The work reported in the thesis must represent a significant scientific advance. • Ifthethesisincludespreviouslypublishedmaterial,permissiontoreproducethis must be gained from the respective copyright holder. • They must have been examined and passed during the 12 months prior to nomination. • Each thesis should include a foreword by the supervisor outlining the signifi- cance of its content. • The theses should have a clearly defined structure including an introduction accessible to scientists not expert in that particular field. Janusz Bogdanowicz Photomodulated Optical Reflectance A Fundamental Study Aimed at Non-Destructive Carrier Profiling in Silicon Doctoral Thesis accepted by the University of Leuven, Belgium 123 Author Supervisor Dr. JanuszBogdanowicz Prof.Dr. Ir.Wilfried Vandervorst IMEC IMEC Leuven Leuven Belgium Belgium ISSN 2190-5053 ISSN 2190-5061 (electronic) ISBN 978-3-642-30107-0 ISBN 978-3-642-30108-7 (eBook) DOI 10.1007/978-3-642-30108-7 SpringerHeidelbergNewYorkDordrechtLondon LibraryofCongressControlNumber:2012940720 (cid:2)Springer-VerlagBerlinHeidelberg2012 Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeorpartof the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation,broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,andtransmissionor informationstorageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilar methodology now known or hereafter developed. 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While the advice and information in this book are believed to be true and accurate at the date of publication,neithertheauthorsnortheeditorsnorthepublishercanacceptanylegalresponsibilityfor anyerrorsoromissionsthatmaybemade.Thepublishermakesnowarranty,expressorimplied,with respecttothematerialcontainedherein. Printedonacid-freepaper SpringerispartofSpringerScience+BusinessMedia(www.springer.com) Supervisor’s Foreword Thecontinuousdownscalingofnanoelectroniccomponentsandtransistorsfollowing Moore’slawleadstoevercheaper,morepowerfulcomputers,andmoremultifunc- tionaldevices.To maintain this progressinscaling,materialscientists,andprocess engineers explore new materials, novel processing steps and more complex device structures.Thesetechnologicaldevelopmentsareextremelychallengingandcanonly be achieved if based on profound physical insight and understanding. As such metrology has become a key enabler toward successful product development and inevitablysubjecttosimilarscalinglawsinordertoremainrelevant.Henceresearchin metrologytargetingtheextensionofmeasurementstowardsmallerdimensions,higher resolution,bettersensitivityandspecificity,andquantificationaccuracyisanimpor- tantcornerstoneoftechnologicalprogressinsemiconductortechnology. As dopants anddopant distributions constitutethe active heart of thetransistor operation,engineeringofthesourceanddrainjunctionregionsofMOStransistors has become an important research item listed in the International Technology Roadmap for Semiconductors and the subject of a lot of advanced research activities. Their strong impact on the device performance led to a continuous scaling toward very shallow depths and an engineering of very detailed dopant distributions (doping concentration, depth, abruptness, halo,..). Concurrently the development of new doping and annealing processes as well as their production control has becomeextremelydependent onthe availabilityofprecise (electrical) characterization with adequate specifications. In particular the interest in in-line monitoring and non-destructive characterization has spurred the search for junc- tionmetrologybasedonopticalprobes;however,withtheimportantconstraintsto provide also sub-nanometer accuracy, precision, and quantification. Thisworkcontributestothisevolutionanddemonstratesthecapabilitiesofthe Photomodulated Optical Reflectance (PMOR) which measures the variations in reflectanceinducedbyamodulatedpumplaser.Basedonafastlaserpump-probe technique, PMOR was originally designed as a non-contact concept for implant dose metrology. However, a breakthrough has been realized in this work by extending the concept from a simple process control tool for as-implant profiles towardthequantitativeanalysisofacompleteactivecarrierprofilethroughavery v vi Supervisor’sForeword detailed modeling ofthe fundamentalphysicsofthe PMOR technique.This work provides a complete description of the carrier and heat generation/transport/ recombination phenomena as well as of their translation into reflectance signals withanexcellentagreementtoexperimentaldata.Novelexperimentalapproaches are introduced to extend PMOR from qualitative dose monitoring toward quan- titativejunctiondepthmeasurementanddetailedcarrierprofilereconstruction.The latter development represents a significant breakthrough in USJ metrology and generated substantial industrial interest, up to the development of a new product implementing the final recommendations of this book. Leuven, January 2012 Prof. Dr. Ir. Wilfried Vandervorst Acknowledgments Firstandforemost,IwouldliketothankProf.WilfriedVandervorstforgivingme the opportunity to carry out my Ph.D. studies under his supervision. I really appreciatedhisguidanceandsupportthroughouttheseyears.Despitehisverybusy agenda,healwaystookthetimeneededforshortexplanationsorlongdiscussions. I also wish to sincerely acknowledge Trudo Clarysse, who really made the difference all along these years. He was an excellent supervisor who always pushed me to the best of myself. In so many instances, his invaluable assistance andinvolvement were the keytotheresultsshown inthisthesis. Iamtodayfully aware that I owe him much more than I could ever write in these acknowledgments. ThefollowingthanksgotoFabianDortu,whosehelpandwilltosharehisdeep fundamentalandtechnicalunderstandinggavemearealboostintheearlyphaseof this work. Even 3 years after he left imec, I still have the impression that the numerous technical discussions we used to have paved the way to the final con- clusions of this work. I should obviously not forget to mention that he is the originaldeveloper of FSEM. Now that this work is reaching an end,I realize that this tool is a real goldmine and I deeply acknowledge him for the energy he put into its development. IamalsoindebtedtoErikRosseel,whoIverymuchenjoyedworkingwith.The numerous hours spent discussing technical issues next to the TP tool and all the experimental results collected on his immense experimental database were clear determining factors of this work. I am very grateful to all the KLA-Thermawave team and more particularly to Derrick Shaughnessy and Alex Salnik. My special thanks to Derrick for the very nice company during my two stays in California. This work would not have been possible without the help of Duy Nguyen, Laurent Souriau, and all the epi group of imec, who provided me with very nice layers.ThanksalsotoAlainMoussa,DanielleVanhaeren,JorisDelmotte,Bastien Douhard,LucGeenen,PierreEyben,JozefienGoossens,andBennyVanDaelefor kindlytakingcareofthecharacterizationoftheselayersandtotheFPSunitforthe measurement time on the ThermaProbe tool. vii viii Acknowledgments I certainly will not forget to thank all my (ex-)mca colleagues and friends and most particularly Francesca, Simone, Wouter, Jay, Alain, Fabian, Cindy, Bart, Bastien,Joris,Alexis,andDaniellefortheenjoyabletimespenttogether.Myimec experience would not have been the same without you. I would also like to acknowledge the Institute for the Promotion of Innovation throughScienceandTechnologyinFlanders(IWT-Vlaanderen)fortheirfinancial support. Lastbutnotleast,Iwouldliketothankallthepeople,familyandfriends,whoI love and who supported me along these years. Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 State of the Art of USJ Characterization . . . . . . . . . . . . . . . . . 3 1.2.1 Contacting and/or Destructive Techniques . . . . . . . . . . . 3 1.2.2 Non-Contacting and Non-Destructive Techniques. . . . . . 10 1.3 Outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2 Theory of Perturbation of the Reflectance. . . . . . . . . . . . . . . . . . . 21 2.1 Uniform Perturbation of the Complex Refractive Index . . . . . . . 25 2.2 Box-Like Perturbation of the Complex Refractive Index . . . . . . 26 2.3 Double Box-Like Perturbation of the Complex Refractive Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2.4 Arbitrary Perturbation of the Complex Refractive Index. . . . . . . 31 2.5 Second-Order Effects. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 2.5.1 Impact of the Presence of a Native Oxide . . . . . . . . . . . 33 2.5.2 Impact of a Lateral Variation in Refractive Index Perturbation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 3 Theory of Perturbation of the Refractive Index. . . . . . . . . . . . . . . 39 3.1 Refractive Index of Electrically Conductive Materials . . . . . . . . 41 3.2 Electrooptical Effects. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.2.1 Drude Effect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.2.2 Carrier-Induced Bandgap Narrowing (BGN) Effect. . . . . 43 3.2.3 Burstein Shift or Band-Filling (BF) Effect. . . . . . . . . . . 47 3.2.4 Pockels, Kerr and Franz-Keldysh Effects. . . . . . . . . . . . 48 ix x Contents 3.3 Thermooptical Effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 4 Theory of Carrier and Heat Transport in Homogeneously Doped Silicon. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 4.1 Thermodynamic Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 4.1.1 Generalized Ambipolar Diffusion Equation . . . . . . . . . . 58 4.1.2 Heat Equation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 4.1.3 Steady-Periodic Model Equations . . . . . . . . . . . . . . . . . 63 4.1.4 Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 4.2 Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 4.2.1 One-Dimensional Linear Solution. . . . . . . . . . . . . . . . . 79 4.2.2 Three-Dimensional Linear Solution. . . . . . . . . . . . . . . . 83 4.2.3 Three-Dimensional Nonlinear Solution . . . . . . . . . . . . . 92 4.3 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 5 Extension of the Transport Theory to Ultra-Shallow Doped Silicon Layers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 5.1 Simplified Transport Theory. . . . . . . . . . . . . . . . . . . . . . . . . . 103 5.2 Validity of the Assumptions . . . . . . . . . . . . . . . . . . . . . . . . . . 106 5.2.1 Flat Quasi-Fermi Level Approximation . . . . . . . . . . . . . 107 5.2.2 Impact of Doped Layers on Substrate Injection . . . . . . . 109 5.3 Steady-Periodic Model Equations . . . . . . . . . . . . . . . . . . . . . . 110 5.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 6 Assessment of the Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 6.1 Homogeneous Doping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 6.1.1 Comparison of the Model with Experimental Data . . . . . 119 6.2 Box-Like Doping Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 6.2.1 Comparison of the Model with Experimental Data . . . . . 126 6.3 Discussion of the Modeling Error . . . . . . . . . . . . . . . . . . . . . . 133 6.3.1 Modeling Error on R . . . . . . . . . . . . . . . . . . . . . . . . 133 dc 6.3.2 Modeling Error on DRac . . . . . . . . . . . . . . . . . . . . . . . 134 6.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 7 Application of the Model to Carrier Profiling. . . . . . . . . . . . . . . . 141 7.1 Model-Free Determination of Junction Depths . . . . . . . . . . . . . 141 7.1.1 Absolute Determination of Junction Depths . . . . . . . . . . 142 7.1.2 Relative Determination of Junction Depths . . . . . . . . . . 149
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