NASA Technical Reports Server (NTRS) 20170000475: 2015 NEPP Tasks Update for Ceramic and Tantalum Capacitors

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by  NASA Technical Reports Server (NTRS)

NASA Electronic Parts and Packaging (NEPP) Program
2015 NEPP Tasks Update for
Ceramic and Tantalum Capacitors
Alexander Teverovsky
AS&D, Inc.
Work performed for Parts, Packaging, and
Assembly Technologies Office,
NASA GSFC, Code 562
[email protected]
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
List of Acronyms
AF acceleration factor IM Infant mortality
BI burning-in JAXA Japan Aerospace Exploration Agency
BME base metal electrode MLCC multilayer ceramic capacitor
DCL direct current leakage PHS polymer hermetically sealed
ESR Equivalent series resistance PME precious metal electrode
FB ferrite beads PV Prokopowicz-Vaskas
FR failure rate QA quality assurance
HALT highly accelerated life testing RVT random vibration testing
HSD hot solder dip S&Q screening and qualification
HT High temperature VR rated voltage
HTS high temperature storage
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 2
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
Reasons for NEPP Tasks on Capacitors
 Capacitors constitute the majority of elements in electronic
systems.
 New technologies and designs appear with increasing
speed. There is a need for optimization of S&Q procedures
and setting adequate requirements.
 Physics behind degradation and failure processes needs
better understanding.
 Capacitors exhibit both, infant mortality and wear-out
failures, and can be used as models to refine quality
assurance approaches for variety of space components.
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 3
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
Outline
 Update on tantalum capacitors.
 Use of ferrite beads as surge current limiters.
 Polymer capacitors.
 Random vibration testing of advanced wet capacitors.
 Future work.
 Update on ceramic capacitors.
 Effect of cracking on degradation of MLCCs at high
temperatures.
 Can we use automotive industry capacitors?
 Future work.
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 4
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
Ferrite Chip Beads as Surge Current
Limiters
 Contrary to inductors, FBs at high frequencies
work like resistors and dissipate power in the
form of heat.
 NEPP report contains
(https://nepp.nasa.gov/):
Effect of ferrite beads on surge currents
 Analysis of requirements of DLA DWG#03024 for hi-rel chips; 45
40 15uF 10V at 22V surge
 Results of testing of 12 types of FB; 35 same with FB 03024-021
 Data on the specific features of FBs; nt, A 2350
e
 Evaluation of the robustness of FB to soldering stresses; urr 20
c
15
 Behavior of FBs under multiple high current spikes. 10
5
 Recommendations for reliability assurance of tantalum 0
-10 10 30 50 70 90
capacitors operating under surge current conditions.
time, us
 Conclusion:
BLM18PG181SNID, 0603,
 Due to decrease of impedance with frequency and current, 180 180ohm, 90mohm, 1.5A
the effective resistance remains substantially below the 150
A 0.11 ohm
value that is required to limit surge in tantalum capacitors ke, 120 no FB
pi
s SN1
(from 1 to 5 Ohm). ent 90 SN2
 Recommendations on current derating are available at curr 60 0.16 ohm SN3
SN4
30 SN5
https://nepp.nasa.gov/. failures
SN6
0
0 10 20 30
voltage, V
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 5
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
Polymer Tantalum Capacitors
 A report on evaluation of PHS capacitors manufactured
per DLA LAM DWG#13030 :
(https://nepp.nasa.gov/)
Literature review; analysis of requirements; characteristics, including thermal
resistance; behavior of DCL under forward and reverse bias, recommendations.
 Specific feature: operation of polymer capacitors requires certain
amount of moisture in the case. What happens if cases dry out?
Variations of capacitance, ESR, and DCL with time of HTS
120 PHS 100uF 60V during HTS at 1 PHS 100uF 60V during HTS at 1.E-06 PHS14 100uF 60V
150C 150C
100 hermetic 0.8
A
non-hermetic c,
citance, uF 6800 ESR, Ohm 00..46 CL_1000 se 1.E-07 pol SN7 pol SN8
a non-hermetic D
p pol SN9 pol SN10
ca 40 0.2 hermetic non-hermetic pol SN11 dep SN7
dep SN8 dep SN9
dep SN10 dep SN11
20 1.E-08
0
0 200 400 600 800 1000 0 200 400 600 800 1000
0 200 400 600 800 1000
time, hr
time, hr time, hr
 PHS can survive 1000 hr storage at 150°C without degradation.
 Non-hermetic parts degraded due to a substantial decrease in
capacitance and increase in ESR caused likely by increasing
resistance of the polymer.
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 6
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
Recommendations for Use of PHS
 PHS capacitors have lower weight and ESR compared to
similar case size wet tantalum capacitors and their
application in power lines can assure better filtering and
lower ripple currents.
 Polymer capacitors would mostly benefit low-temperature
applications (below 0°C) or systems where a cold start-up is
required. However, additional application-specific testing are
required if the parts are to be used at T < -55°C.
 Self-healing capability of PHS is much worse than wet
capacitors and flaws in the dielectric that might be forgiven in
wet capacitors might cause catastrophic failures in PHS.
This requires a close attention to the results of S&Q,
specifically, to measurements of leakage currents through the
testing.
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 7
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
Random Vibration Testing
 Report is available at https://nepp.nasa.gov/
 Problems in assurance robustness of capacitors
under RVT have a long history.
 Larger anode size increases the stress during RVT.
Some test labs
 Existing requirements and practice: assume this level of
 MIL-PRF-39006: 1.5hr in 3 directions; 30 min spiking is acceptable
monitoring every 0.5 msec “to determine
intermittent open-circuiting or short-circuiting”.
 Test techniques and failure criteria are not
specified allowing different test labs to carry out
testing differently, e.g limiting resistors from
ohms to dozens of kohms, and failure criteria vary from 5% to 90% of VR.
 Different set-ups have different sensitivity to short-circuiting.
 Different failure criteria cause inconsistency in test results.
 A single scintillation event is sufficient to cause lot failure.
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 8
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
RVT: Step Stress Testing
Example of a part passing RVT at 34 g rms and failing at 53.44 g rms
680uF 50V Mfr.C at 34.02g rms
2.0E-05 680uF 50V Mfr.C at 53.44g rms
2.0E-05
SN1
1.5E-05 SN1 1.5E-05 SN2
SN2 SN3
A
current, 1.0E-05 SSSNNN345 current, A 1.0E-05 SSNN45
5.0E-06
5.0E-06
0.0E+00
0.0E+00
0 200 400 600 800 1000 1200
0 200 400 600 800 1000 1200
time, sec
time, sec
Did this part fail at 10.76 g rms, at 19.64 g rms?
DWG#93026 470uF 75V Mfr.A
DWG#93026 470uF 75V Mfr.A 1.0E-05
1.0E-05 at 19.64g rms
at 10.76g rms
8.0E-06
8.0E-06
SN1
6.0E-06 SN2 A6.0E-06
nt, A SN3 ent,
urre4.0E-06 SN4 curr4.0E-06
c
2.0E-06
2.0E-06
0.0E+00 0.0E+00
0 200 400 600 800 1000 1200 0 200 400 600 800 1000 1200
time, sec time, sec
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 9
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.
RVT: Post-testing Leakage Currents
Leakage currents were monitored with time after RVT.
Currents during RVT Currents after RVT
560uF 25V Mfr.A at 53.79 g rms 1.E-04 560uF 25V Mfr.A at RT, 25V
5.0E-05  Spiking during
SN1
4.0E-05 SN2 1.E-05 RVT might not result
SN3
A
ent, A3.0E-05 SN4 urrent, 1.E-06 in DCL failures after
curr2.0E-05 c the testing.
1.E-07
initial
1.0E-05
after RVT 560 µF 25 V
1.E-08
0.0E+00
1.E+1 1.E+2 1.E+3 1.E+4 1.E+5
0 200 400 600 800 1000 1200 capacitors passed
time, sec time, sec
HALT after RVT at
470uF 75V Mfr.A at 34.02g rms 470uF 75V Mfr.A after RVT
1.0E-05 1.E-03
53.8 g rms.
8.0E-06
A 1.E-04
5V, Parts with
A 6.0E-06 7
current, 4.0E-06 rrent@ 1.E-05 SN1 excessive currents
u SN2
c 1.E-06 SN3 are recovering with
2.0E-06 SN4
SN5
1.E-07 time under bias.
0.0E+00
1.E-3 1.E-2 1.E-1 1.E+0 1.E+1 1.E+2
0 200 400 600 800 1000 1200
time, sec time, hr
Deliverable to NASA Electronic Parts and Packaging (NEPP) Program to be published on nepp.nasa.gov originally presented by Alexander Teverovskyat the NASA Electronic 10
Parts and Packaging Program (NEPP) Electronics Technology Workshop (ETW), NASA Goddard Space Flight Center in Greenbelt, MD, June 23-26, 2015.